An OWS micro-speaker

By designing solder clearances and filling them with insulating glue in the OWS miniature speaker, the problem of short circuit between the lower magnetic plate and the solder pads was solved, improving the speaker's reliability and bass performance.

CN224385688UActive Publication Date: 2026-06-19DONGGUAN RUIDA ACOUSTIC TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN RUIDA ACOUSTIC TECH CO LTD
Filing Date
2025-07-25
Publication Date
2026-06-19

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    Figure CN224385688U_ABST
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Abstract

This utility model relates to the field of OWS loudspeaker technology, specifically to an OWS miniature loudspeaker. It comprises a bracket, a lower magnetic plate connected to the bottom of the bracket, an inner magnetic ring attached to the lower magnetic plate, an upper magnetic ring attached to the inner magnetic ring, a diaphragm covering the top of the bracket, a voice coil fixedly connected to the bottom of the diaphragm and extending to the outer periphery of the upper magnetic ring and the inner magnetic ring, a solder pad embedded in the side wall of the bracket, and an FPC board fixedly connected to the bottom of the lower magnetic plate. One end of the solder pad extends out of the bracket and is soldered to a solder hole in the FPC board. The side of the lower magnetic plate near the solder pad is recessed into the bracket, creating a solder gap between the lower magnetic plate and the FPC board. This solder gap increases the distance between the recessed area of ​​the lower magnetic plate and the solder hole in the FPC board, thereby preventing solder from easily flowing down the solder hole during soldering and causing a short circuit between the lower magnetic plate and the solder pad.
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Description

Technical Field

[0001] This utility model relates to the field of OWS loudspeaker technology, specifically to an OWS miniature loudspeaker. Background Technology

[0002] OWS stands for OpenWearable Stereo, a fully open, ear-free audio solution referring to fully open-ear wearable headphones. OWS speakers are open-back headphone speakers. OWS speakers use directional sound transmission technology to conduct sound directly to the ear canal, eliminating the need to insert them into the ear. This design avoids the pressure on the ear canal caused by traditional in-ear headphones, reduces bacterial growth, and improves comfort during extended wear.

[0003] In order to provide a higher sound pressure level at low voltage, existing loudspeakers often need to increase the size of the magnet. This will result in an increase in the size of the lower magnetic plate at the bottom of the magnet. The lower magnetic plate is usually made of iron, and the bottom of the lower magnetic plate is attached to an FPC board that needs to be soldered to the pads. During the soldering process, the solder can easily flow down along the solder holes of the FPC board, causing the lower magnetic plate and the pads to short-circuit easily through the solder connection. Summary of the Invention

[0004] In order to overcome the shortcomings and deficiencies of the existing technology, the purpose of this utility model is to provide an OWS miniature speaker.

[0005] The objective of this utility model is achieved through the following technical solution: an OWS miniature loudspeaker, comprising a bracket, a lower magnetic plate connected to the bottom of the bracket, an inner magnetic ring attached to the lower magnetic plate, an upper magnetic ring attached to the inner magnetic ring, a diaphragm covering the top of the bracket, a voice coil fixedly connected to the bottom of the diaphragm and extending to the outer periphery of the upper magnetic ring and the outer periphery of the inner magnetic ring, a solder pad embedded in the side wall of the bracket, and an FPC board fixedly connected to the bottom of the lower magnetic plate. One end of the solder pad extends out of the bracket and is welded to the solder hole of the FPC board. The side of the lower magnetic plate near the solder pad is recessed into the bracket to form a welding clearance between the lower magnetic plate and the FPC board.

[0006] Preferably, there is a filling gap between the FPC board and the bracket, and both the filling gap and the welding clearance are filled with insulating glue.

[0007] Preferably, the FPC board has an overflow notch on its outer side.

[0008] Preferably, the bottom of the bracket is provided with a relief groove for accommodating the recess of the lower magnetic plate.

[0009] Preferably, the OWS miniature loudspeaker further includes an outer magnet ring attached to the lower magnetic plate and an outer magnetic plate attached to the outer magnet ring. There is a first flow gap between the outer magnetic plate and the upper magnetic ring, and a second flow gap between the outer magnet ring and the inner magnet ring. The voice coil passes through the first flow gap and extends into the second flow gap.

[0010] Preferably, the lower magnetic guide plate has a plurality of spaced-apart vent holes, which are connected to the second flow gap.

[0011] Preferably, the vent hole is shaped like a racetrack.

[0012] Preferably, the bottom of the vent hole of the lower magnetic plate is fitted with a first tuning mesh.

[0013] Preferably, a tuning through hole is provided in the middle of the lower magnetic plate, and the tuning through hole, the inner magnetic ring and the upper magnetic ring are connected in sequence; a second tuning mesh is attached to the bottom of the tuning through hole of the lower magnetic plate.

[0014] The beneficial effects of this utility model are as follows: The OWS miniature speaker of this utility model adopts a bracket, a lower magnetic plate connected to the bottom of the bracket, an inner magnetic ring attached to the lower magnetic plate, an upper magnetic ring attached to the inner magnetic ring, a diaphragm covering the top of the bracket, a voice coil fixedly connected to the bottom of the diaphragm and extending to the outer periphery of the upper magnetic ring and the inner magnetic ring, a solder pad embedded in the side wall of the bracket, and an FPC board fixedly connected to the bottom of the lower magnetic plate. One end of the solder pad extends out of the bracket and is soldered to the solder hole of the FPC board. The side of the lower magnetic plate near the solder pad is recessed into the bracket, forming a soldering clearance between the lower magnetic plate and the FPC board. By utilizing the soldering clearance, the distance between the recess of the lower magnetic plate and the solder hole of the FPC board is increased, thereby preventing solder from easily flowing down along the solder hole of the FPC board during the soldering process, which could easily cause a short circuit between the lower magnetic plate and the solder pad due to solder connection. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a bottom view of the present invention;

[0017] Figure 3 yes Figure 2 Schematic diagram of the cross section of AA;

[0018] Figure 4 This is an exploded view of the present invention;

[0019] Figure 5 This is an exploded view of the present invention from another perspective;

[0020] Figure 6This is the sound pressure level frequency response diagram of this utility model; where the horizontal axis represents the frequency point in Hz and the vertical axis represents the sound pressure level in decibels in dB.

[0021] The attached diagram is labeled as follows: 1. Bracket; 2. Lower magnetic plate; 3. Inner magnetic ring; 4. Upper magnetic ring; 5. Diaphragm; 6. Voice coil; 7. Solder pad; 8. FPC board; 9. Solder clearance; 10. Filling gap; 11. Glue overflow notch; 12. Clearance groove; 13. Outer magnetic ring; 14. Outer magnetic plate; 15. First flow gap; 16. Second flow gap; 17. Vent hole; 18. First tuning mesh; 19. Tuning through hole; 20. Second tuning mesh. Detailed Implementation

[0022] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention.

[0023] like Figure 1-5 As shown, an OWS miniature loudspeaker includes a bracket 1, a lower magnetic plate 2 connected to the bottom of the bracket 1, an inner magnetic ring 3 attached to the lower magnetic plate 2, an upper magnetic ring 4 attached to the inner magnetic ring 3, a diaphragm 5 covering the top of the bracket 1, a voice coil 6 fixedly connected to the bottom of the diaphragm 5 and extending to the outer periphery of the upper magnetic ring 4 and the inner magnetic ring 3, a solder pad 7 embedded in the side wall of the bracket 1, and an FPC board 8 fixedly connected to the bottom of the lower magnetic plate 2. One end of the solder pad 7 extends out of the bracket 1 and is welded to the solder hole of the FPC board 8. The side of the lower magnetic plate 2 near the solder pad 7 is recessed into the bracket 1 to form a welding clearance 9 between the lower magnetic plate 2 and the FPC board 8.

[0024] The OWS miniature speaker utilizes the recess of the lower magnetic plate 2 near the pad 7 to form a soldering clearance 9 between the lower magnetic plate 2 and the FPC board 8, increasing the distance between the recess of the lower magnetic plate 2 and the solder hole of the FPC board 8. This prevents solder from easily flowing down the solder hole of the FPC board 8 during the soldering process, causing the lower magnetic plate 2 and the pad 7 to short-circuit due to easy solder connection.

[0025] Furthermore, there is a filling gap 10 between the FPC board 8 and the bracket 1, and both the filling gap 10 and the welding clearance 9 are filled with insulating glue (not shown in the figure). The welding clearance 9 also provides sufficient space for glue to pass through. Filling the filling gap 10 and the welding clearance 9 with insulating glue more effectively plays an isolation role, preventing the solder pad 7 from contacting the lower magnetic plate 2 and short-circuiting after the solder hole of the FPC board 8 is soldered.

[0026] Preferably, the FPC board 8 has an overflow notch 11 on its outer side to provide an overflow position.

[0027] Preferably, the bottom of the bracket 1 is provided with a relief groove 12 for making way for the recess of the lower magnetic plate 2, which not only serves to make way for the recess, but also facilitates quick positioning and installation of the recess of the lower magnetic plate 2 with the relief groove 12.

[0028] Preferably, the OWS miniature loudspeaker further includes an outer magnet ring 13 attached to the lower magnetic plate 2 and an outer magnetic plate 14 attached to the outer magnet ring 13. There is a first flow gap 15 between the outer magnetic plate 14 and the upper magnetic ring 4, and a second flow gap 16 between the outer magnet ring 13 and the inner magnet ring 3. The voice coil 6 passes through the first flow gap 15 and extends into the second flow gap 16.

[0029] Preferably, the lower magnetic guide plate 2 has a plurality of spaced-apart vent holes 17, which communicate with the second flow gap 16. Furthermore, the vent holes 17 are racetrack-shaped, which facilitates airflow and improves bass response.

[0030] Preferably, the bottom of the vent hole 17 of the lower magnetic plate 2 is fitted with a first tuning mesh 18.

[0031] Preferably, a tuning through hole 19 is provided in the middle of the lower magnetic plate 2, and the tuning through hole 19, the inner magnetic ring 3 and the upper magnetic ring 4 are connected in sequence; a second tuning mesh 20 is attached to the bottom of the tuning through hole 19 of the lower magnetic plate 2.

[0032] The OWS miniature loudspeaker in this embodiment was tested for its sound pressure level output capability at different frequencies, and the sound pressure level frequency response diagram is shown below. Figure 6 As shown, it can meet the sound pressure level requirements.

[0033] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this utility model are within the protection scope of this utility model.

Claims

1. An OWS miniature loudspeaker, characterized in that: The device includes a bracket, a lower magnetic plate connected to the bottom of the bracket, an inner magnetic ring attached to the lower magnetic plate, an upper magnetic ring attached to the inner magnetic ring, a diaphragm covering the top of the bracket, a voice coil fixedly connected to the bottom of the diaphragm and extending to the outer periphery of the upper magnetic ring and the inner magnetic ring, a solder pad embedded in the side wall of the bracket, and an FPC board fixedly connected to the bottom of the lower magnetic plate. One end of the solder pad extends out of the bracket and is welded to the solder hole of the FPC board. The side of the lower magnetic plate near the solder pad is recessed into the bracket to form a welding clearance between the lower magnetic plate and the FPC board.

2. The OWS miniature loudspeaker according to claim 1, characterized in that: There is a filling gap between the FPC board and the bracket, and both the filling gap and the welding clearance are filled with insulating glue.

3. The OWS miniature loudspeaker according to claim 2, characterized in that: The FPC board has an overflow notch on its outer side.

4. The OWS miniature loudspeaker according to claim 1, characterized in that: The bottom of the bracket has a recess for accommodating the recess of the lower magnetic plate.

5. An OWS miniature loudspeaker according to claim 1, characterized in that: The OWS miniature loudspeaker also includes an outer magnet ring attached to the lower magnetic plate and an outer magnetic plate attached to the outer magnet ring. There is a first flow gap between the outer magnetic plate and the upper magnetic ring, and a second flow gap between the outer magnet ring and the inner magnet ring. The voice coil passes through the first flow gap and extends into the second flow gap.

6. An OWS miniature loudspeaker according to claim 5, characterized in that: The lower magnetic plate has multiple spaced ventilation holes, which are connected to the second flow gap.

7. An OWS miniature loudspeaker according to claim 6, characterized in that: The vent is shaped like a racetrack.

8. An OWS miniature loudspeaker according to claim 6, characterized in that: The bottom of the vent hole of the lower magnetic plate is fitted with a first tuning mesh.

9. An OWS miniature loudspeaker according to claim 1, characterized in that: A tuning through hole is provided in the middle of the lower magnetic plate, and the tuning through hole, the inner magnetic ring and the upper magnetic ring are connected in sequence; a second tuning mesh is attached to the bottom of the tuning through hole of the lower magnetic plate.