Power supply module

Abstract

A power supply module is adapted for use in a server cabinet. The power supply module includes a water-cooled tray and a plurality of power supplies. The water-cooled tray has a first surface and a second surface opposite to the first surface. The power supplies are arranged side by side on the first surface. Each of the power supplies includes a heat dissipation surface. The heat dissipation surface has a profile corresponding to a profile of the first surface and is adapted to abut against the first surface. Based on this configuration, heat energy of the power supplies can be more efficiently conducted to the water-cooled tray, thereby improving heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to a power supply module, and more particularly to a power supply module installed in a server rack. Background Technology

[0002] Nowadays, with the development of data centers, server hosts consume more and more power, and the power supplies installed on server racks are also developing towards higher power.

[0003] However, as the power supply (PSU) power increases, the demand for heat dissipation also increases, and traditional fan cooling methods are gradually becoming insufficient.

[0004] Therefore, how to propose a power supply module that can effectively solve the above problems is one of the issues that the industry is currently eager to address by investing research and development resources. Utility Model Content

[0005] In view of this, one objective of this disclosure is to propose a power supply module that can solve the above-mentioned problems.

[0006] To achieve the above objectives, according to one embodiment of this disclosure, a power supply module suitable for a server rack includes a water-cooled plate and a plurality of power supplies. The water-cooled plate has a first surface and a second surface opposite to the first surface. The power supplies are arranged side-by-side on the first surface. Each power supply includes a heat-dissipating surface. The contour of the heat-dissipating surface corresponds to the contour of the first surface and is adapted to abut against the first surface.

[0007] In one or more embodiments disclosed herein, a plurality of first fins are provided on the first surface of the water-cooling plate. A plurality of second fins are provided on the heat dissipation surface of each power supply. The second fins are arranged alternately with the first fins.

[0008] In one or more embodiments disclosed herein, the power supply module further includes thermal paste filled between the first fin and the second fin.

[0009] In one or more embodiments disclosed herein, the power supply further includes a first slot and a first substrate. A second fin is disposed on the first substrate, and the first substrate is detachably mounted in the first slot.

[0010] In one or more embodiments disclosed herein, the power supply further includes a thermally conductive interface material disposed and adjacent to the side of the first substrate away from the second fin.

[0011] In one or more embodiments disclosed herein, the power supply is provided with a plurality of third fins on the side away from the water cooling plate.

[0012] In one or more embodiments disclosed herein, the power supply further includes a second slot and a second substrate on the side away from the water cooling plate. A third fin is disposed on the second substrate, and the second substrate is detachably mounted in the second slot.

[0013] In one or more embodiments disclosed herein, the power supply module further includes another water-cooling plate. The other water-cooling plate has a third surface. A plurality of fourth fins are provided on the third surface, and the fourth fins are arranged alternately with the third fins.

[0014] In one or more embodiments disclosed herein, the power supply module further includes another power supply. The other power supply is adjacent to the second surface of the water cooling plate, and the second surface of the water cooling plate is provided with a plurality of fifth fins.

[0015] In one or more embodiments disclosed herein, another power supply includes a plurality of sixth fins. The sixth fins are disposed on one side of the other power supply adjacent to the second surface and are configured to be staggered with the fifth fins on the second surface.

[0016] In one or more embodiments disclosed herein, the power supply module further includes a plurality of balls rotatably disposed between the first surface of the water cooling plate and the power supply.

[0017] In one or more embodiments disclosed herein, the server rack is defined with a unit height. The power supply enclosure includes two opposing narrow plates and two opposing wide plates. The width of the narrow plates is equal to the unit height. The width of the wide plates plus the thickness of the water cooling pads is equal to twice the unit height.

[0018] In one or more embodiments disclosed herein, the server rack is defined with a unit height. The power supply enclosure includes two opposing narrow plates and two opposing wide plates. The width of the narrow plates is equal to the unit height. The width of the wide plates plus twice the thickness of the water cooling pads equals twice the unit height.

[0019] In one or more embodiments disclosed herein, the heat dissipation surface is located on a narrow plate.

[0020] In summary, in the power supply module disclosed herein, by arranging the fins of the power supply and the water cooling plate in an alternating manner, the heat conduction contact area can be increased, thereby improving heat transfer efficiency. By placing the fins on the wide or narrow plates of the power supply, the arrangement of the power supply in the server rack can be changed according to the location of high-power components, allowing the water cooling plate to be closer to these components. By simultaneously placing fins on both the first and second surfaces of the water cooling plate, the utilization efficiency of the water cooling plate can be maximized, and the usable space in the server rack can be increased.

[0021] The above description is only used to illustrate the problem to be solved by this disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of this disclosure will be described in detail in the following implementation method and related drawings. Attached Figure Description

[0022] To make the above and other objects, features, advantages and embodiments disclosed herein more apparent and understandable, the accompanying drawings are described below:

[0023] Figure 1 A perspective view of a power supply module according to one embodiment of the present disclosure is provided.

[0024] Figure 2 For illustration Figure 1 A partial enlarged view of part A of the power supply module in the image;

[0025] Figure 3 A perspective view of a power supply module according to another embodiment of this disclosure is provided.

[0026] Figure 4 To illustrate a perspective rear view of a power supply according to another embodiment of this disclosure;

[0027] Figure 5 To illustrate a perspective rear view of a power supply according to yet another embodiment of this disclosure;

[0028] Figure 6 A perspective view of a power supply module according to another embodiment of this disclosure is provided.

[0029] Figure 7 A perspective view of a power supply module according to another embodiment of this disclosure is provided.

[0030] [Symbol Explanation]

[0031] 10, 20, 30, 40: Power Supply Module

[0032] 11: Thermal paste

[0033] 12: Ball bearing

[0034] 100, 100A, 100B: Water-cooled plates

[0035] 110: First Surface

[0036] 120: Second Surface

[0037] 130: Third Surface

[0038] 140: Fourth Surface

[0039] 200, 200A, 200B, 200C, 200D, 200D', 200E: Power supplies

[0040] 210: First substrate

[0041] 220: Second substrate

[0042] 230: Grip section

[0043] 240: Thermal interface material

[0044] 250: Wide Plate

[0045] 260: Narrow board

[0046] A: Partial view of the power supply module

[0047] F1: First fin

[0048] F2: Second fin

[0049] F3: Third fin

[0050] F4: Fourth fin

[0051] F5: Fifth fin

[0052] F6: Sixth fin

[0053] F': Heat dissipation fins

[0054] G1, G2: Gap

[0055] S1: First slot

[0056] S2: Second slot

[0057] T: Slide rail

[0058] X: First direction

[0059] Y: Second direction

[0060] Z: Third-party direction Detailed Implementation

[0061] The following description, with reference to the accompanying drawings, illustrates several embodiments of this disclosure. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, in some embodiments of this disclosure, these practical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and elements will be shown in the drawings in a simplified schematic manner.

[0062] To help readers better understand the interrelationships and orientations of the various components, the accompanying diagram indicates the coordinate axes X as the first direction, Y as the second direction, and Z as the third direction. Furthermore, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0063] Please refer to Figure 1 This is a perspective view illustrating a power supply module 10 according to one embodiment of the present disclosure. Figure 1 As shown, in this embodiment, the power supply module 10 includes a water-cooling plate 100 and a power supply 200 disposed on the water-cooling plate 100. The water-cooling plate 100 has a first surface 110 and a second surface 120 opposite to the first surface 110, and a first fin F1 is provided on the first surface 110. The power supply 200 includes a second fin F2, and the second fin F2 is disposed on the side of the power supply 200 facing the water-cooling plate 100. In this embodiment, the first fin F1 and the second fin F2 are arranged alternately to increase the contact area between the water-cooling plate 100 and the power supply 200, thereby improving the heat dissipation efficiency of the power supply 200. The heat energy of the power supply 200 can be conducted to the second fin F2 through the first fin F1, and finally absorbed and carried away by the coolant or coolant in the water-cooling plate 100.

[0064] like Figure 1 As shown, in this embodiment, the power supply 200 is arranged side-by-side on the first surface 110. The power supply 200 includes a heat dissipation surface (such as...). Figure 1 The contour of the heat dissipation surface (the side where the second fin F2 is located) corresponds to the contour of the first surface 110, so that the power supply 200 is adapted to abut against the first surface 110.

[0065] In some embodiments, the first fin F1 and the second fin F2 are integrally formed or manufactured by aluminum extrusion. This method not only allows for the production of profiles with complex cross-sections (such as fins) but also offers advantages such as light weight, high strength, and good thermal conductivity. However, this disclosure is not limited to this method. In some embodiments, the first fin F1 and the second fin F2 can also be manufactured by die casting, forging, powder metallurgy, metal 3D printing, deep drawing, isothermal forging, or a combination of the above methods.

[0066] like Figure 1As shown, in this embodiment, the power supply module 10 can be installed in a server rack (not shown), such as a general-purpose server rack, network rack, telecommunications rack, and high-performance computing rack, but this disclosure is not limited thereto. In some embodiments, the power supply module 10 can also be applied to any electronic device having a water-cooling plate 100 and a power supply 200. In this embodiment, in order to conform to the current height specification (2U) of each layer of the server rack, the overall height of the water-cooling plate 100 and the power supply 200 combined corresponds to the height specification (2U) of one layer of the server rack, but this disclosure is not limited thereto. In some embodiments, the water-cooling plate 100 and the power supply 200 can also be applied to server racks with different height specifications.

[0067] like Figure 1 As shown, in this embodiment, the server rack (not shown) is defined with a unit height (U). The housing of the power supply 200 includes two opposing narrow plates 260 and two opposing wide plates 250. The width of the narrow plates 260 is equal to the unit height (U), and the width of the wide plates 250 plus the thickness of the water cooling plate 100 is equal to twice the unit height (2U). In this embodiment, the heat dissipation surface of the power supply 200 (e.g., Figure 1 The side where the second fin F2 is located is on the narrow plate 260. By setting the side where the narrow plate 260 is located on the water cooling plate 100, the width of the wide plate 250 plus the thickness of the water cooling plate 100 can be adapted to the height specification (2U) in the server rack.

[0068] Please refer to Figure 2 It is a drawing Figure 1 A partially enlarged view of part A of the power supply module 10. (See attached image.) Figure 1 and Figure 2 As shown, in this embodiment, the first fins F1 are separated by a gap G1, the size of which is designed to fit each second fin F2. Similarly, the second fins F2 are separated by a gap G2, the size of which is designed to fit each first fin F1. In other words, gap G1 corresponds to the second fin F2, and gap G2 corresponds to the first fin F1, thereby increasing the contact area between the first fins F1 and the second fins F2. In this embodiment, the first fins F1 and the second fins F2 are trapezoidal structures, and the fins are arranged at equal intervals, but this disclosure is not limited to this. In some embodiments, the first fins F1 and the second fins F2 may also be other shapes or structures that increase the contact area, and the distance between the fins may not be equal.

[0069] like Figure 2As shown, in this embodiment, the first fin F1 and the second fin F2 are composed of a metal material with thermal conductivity, but this disclosure is not limited thereto. In some embodiments, the materials of the first fin F1 and the second fin F2 may also be other compositions with thermal conductivity. In this embodiment, the power supply module 10 further includes thermal paste 11, which is filled between the first fin F1 and the second fin F2, but this disclosure is not limited thereto. In some embodiments, the first fin F1 and the second fin F2 may also conduct heat through direct contact. Specifically, the thermal paste 11 is uniformly applied between the interface of the first fin F1 and the second fin F2. The thermal paste 11 can fill the small gaps between the first fin F1 and the second fin F2 after they are staggered, thereby improving the efficiency of heat conduction. In this embodiment, the thermal paste 11 is a metal-based thermal paste, a ceramic-based thermal paste, a silicon-based thermal paste, or a combination thereof, but this disclosure is not limited thereto. In some embodiments, the thermal paste 11 may also be any material or composition with thermal conductivity.

[0070] like Figure 1 as well as Figure 2 As shown, in this embodiment, the power supply module 10 further includes a ball bearing 12, which is rotatably disposed between the first surface 110 of the water cooling plate 100 and the power supply 200. Specifically, the ball bearing 12 is disposed on a slide rail T of the water cooling plate 100, and the slide rail T has a blocking design (not shown) to prevent the ball bearing 12 from disengaging from the water cooling plate 100 when rolling on the slide rail T. In this embodiment, the power supply 200 includes a grip portion 230, which allows an operator to hold and remove the power supply 200 from the water cooling plate 100. Specifically, when the power supply 200 is mounted on the water cooling plate 100, the operator can hold the grip portion 230 and apply a pulling force to the power supply 200 along the second direction Y, thereby causing the power supply 200 to detach from the water cooling plate 100 due to the rolling design of the ball bearing 12. Conversely, when installing the power supply 200 on the water-cooling plate 100, the power supply 200 can be installed by applying a pushing force to the power supply 200 in the opposite direction of the second direction Y through the grip 230. Since the first fin F1 and the second fin F2 have corresponding structural designs, the contact area between them is relatively large, and the power supply 200 in the server rack usually needs to be hot-swappable. This disclosure overcomes the friction that may be generated when the first fin F1 and the second fin F2 are arranged in an alternating manner through the design of the ball bearing 12, thereby facilitating the operator to quickly replace the power supply 200.

[0071] Please refer to Figure 3 This is a perspective view illustrating a power supply module 20 according to another embodiment of this disclosure. Figure 3 As shown, in this embodiment, the power supply 200A has a third fin F3 on the side away from the water-cooling plate 100. The third fin F3 may have the same structure or composition as the second fin F2, but this disclosure is not limited thereto. In this embodiment, the power supply module 20 further includes a water-cooling plate 100A, which has a third surface 130, and the third surface 130 includes a fourth fin F4. The fourth fin F4 can be arranged alternately with the third fin F3 of the power supply 200A for heat conduction. In other words, the power supply 200A is disposed between the water-cooling plate 100 and the water-cooling plate 100A. By simultaneously arranging the water-cooling plates 100 and 100A on both sides of the power supply 200A, it is beneficial to improve the heat dissipation efficiency of the power supply module 20.

[0072] like Figure 3 As shown, and in conjunction with reference Figure 1 In this embodiment, the server rack (not shown) is defined with a unit height (U). The housing of the power supply 200 includes two opposing narrow plates 260 and two opposing wide plates 250. The width of the narrow plates 260 is equal to the unit height (U), and the width of the wide plates 250 plus the thickness of the water cooling pads 100 and 100A is equal to twice the unit height (2U). In other words, the width of the wide plates 250 plus the thickness of the water cooling pads 100 and 100A can be adapted to the height specification (2U) in the server rack.

[0073] In some embodiments, the water-cooled plate 100A has a fourth surface 140 opposite to the third surface 130, and the fourth surface 140 includes heat dissipation fins F', which facilitate faster heat dissipation by the power supply 200A. In this embodiment, the heat dissipation fins F' may have the same structure or composition as the first fins F1 on the water-cooled plate 100, but this disclosure is not limited thereto.

[0074] Please refer to Figure 4 This is a perspective rear view illustrating a power supply 200B according to another embodiment of this disclosure. Figure 4 As shown, in this embodiment, power supply 200B and power supply 200 (see reference) Figure 1 The difference is that the power supply 200B includes a first slot S1 and a first substrate 210, and the second fin F2 is disposed on the first substrate 210 facing the water cooling plate 100 (see reference). Figure 1The first substrate 210 is detachably mounted in the first slot S1. The detachable first substrate 210 improves the maintenance efficiency of the power supply 200B and increases the flexibility when replacing the second fin F2. In this embodiment, the power supply 200B further includes a thermal interface material 240, which is disposed and adjacent to the side of the first substrate 210 away from the second fin F2. Specifically, since most of the heat energy of the power supply 200B is generated by high-power components (not shown), by bringing the thermal interface material 240 close to the high-power components in the power supply 200B, the gap between the high-power components and the first substrate 210 can be filled to improve heat conduction efficiency. When the high-power components in the power supply 200B generate heat, the thermal interface material 240 can absorb the heat and conduct it to the second fin F2 disposed on the first substrate 210. The second fin F2 can then be transferred through the first fin F1 of the water cooling plate 100 (see reference). Figure 1 It absorbs and carries away heat energy.

[0075] Please refer to Figure 5 This is a perspective rear view illustrating a power supply 200C according to another embodiment of this disclosure. Figure 5 As shown, and in conjunction with reference Figure 4 In this embodiment, the power supply 200C differs from the power supply 200B in that the power supply 200C is located away from the water cooling pan 100 (see reference). Figure 1 The first substrate 210 further includes a second slot S2 and a second substrate 220 on one side. A third fin F3 is disposed on the second substrate 220, which is detachably mounted in the second slot S2. In this embodiment, a thermal interface material 240 is disposed and adjacent to the side of the second substrate 220 away from the third fin F3. By attaching the thermal interface material 240 close to the first substrate 210 and the second substrate 220, high-power components (not shown) can be simultaneously disposed in the power supply 200C on both the side near the first substrate 210 and the side near the second substrate 220. The thermal interface material 240 can absorb the heat generated by the high-power components and conduct it to the second fin F2 on the first substrate 210 and the third fin F3 on the second substrate 220. The third fin F3 can then be transferred through the water cooling plate 100A (see reference). Figure 3 The fourth fin F4 absorbs and carries away heat energy.

[0076] In some embodiments, the thermal interface material 240 is thermally conductive silicone, thermally conductive pad, phase change material, thermally conductive adhesive, thermally conductive graphite film / metal sheet or a combination thereof, but this disclosure is not limited thereto.

[0077] Please refer to Figure 6This is a perspective view illustrating a power supply module 30 according to another embodiment of this disclosure. Figure 6 As shown, and in conjunction with reference Figure 1 In this embodiment, the power supply module 30 differs from the power supply module 10 in that the second surface 120 of the water cooling plate 100B includes a fifth fin F5, and the power supply 200D can be disposed on the first surface 110 of the water cooling plate 100B in a horizontal rather than vertical manner. Specifically, the power supply 200 and the power supply 200D have a wide plate 250 and a narrow plate 260. In the power supply module 10, the power supply 200 has the side containing the narrow plate 260 disposed on the water cooling plate 100. Conversely, in the power supply module 30, the power supply 200D has the side containing the wide plate 250 disposed on the water cooling plate 100B. In this embodiment, when the water cooling plate 100 and the water cooling plate 100B have the same size, the power supply module 30 has a shorter height than the power supply module 10. The increased height space can be used to place other power supplies or other water cooling plates, and the number of power supplies 200D placed on the water cooling plate 100B by the power supply module 30 is less than the number of power supplies 200 placed on the water cooling plate 100 by the power supply module 10.

[0078] like Figure 6 As shown, in this embodiment, the power supply module 30 may further include a power supply 200D'. The power supply 200D' differs from the power supply 200D in that it can form a U-shaped base consisting of two opposing narrow plates 260 and a wide plate 250 that contacts the water-cooling plate 100B. The upper cover of the U-shaped base is composed of another wide plate 250 opposite the wide plate 250 that contacts the water-cooling plate 100B. In this embodiment, by designing the power supply 200D' as a U-shaped base and a detachable upper cover, operators can remove the upper cover to perform maintenance on the power supply 200D', facilitating assembly or disassembly.

[0079] Please refer to Figure 7 This is a perspective view illustrating a power supply module 40 according to another embodiment of this disclosure. Figure 7 As shown, and in conjunction with reference Figure 6In this embodiment, the power supply module 40 differs from the power supply module 30 in that the power supply module 40 further includes a power supply 200E, which is adjacent to the second surface 120 of the water-cooling plate 100B. In this embodiment, the power supply 200E includes a sixth fin F6, which is disposed on the side of the power supply 200E adjacent to the second surface 120, and is arranged to alternate with the fifth fin F5 on the second surface 120. In other words, the water-cooling plate 100B is located between the power supply 200D and the power supply 200E. By simultaneously providing fins on both the first surface 110 and the second surface 120 of the water-cooling plate 100B, the utilization efficiency of the water-cooling plate 100B and the usable space of the server rack can be maximized, thereby maintaining the heat dissipation effect of the power supply module 40 even with the addition of power supplies 200D and 200E.

[0080] From the detailed description of the specific embodiments disclosed above, it is clear that in the power supply module of this disclosure, by arranging the fins of the power supply and the water cooling plate in an alternating manner, the heat conduction contact area can be increased, thereby improving heat transfer efficiency. By setting the fins on the wide or narrow plates of the power supply, the arrangement of the power supply in the server rack can be changed according to the location of high-power components, allowing the water cooling plate to be closer to the high-power components. By simultaneously setting fins on both the first and second surfaces of the water cooling plate, the utilization efficiency of the water cooling plate can be maximized, and the usable space of the server rack can be increased.

[0081] Although the present disclosure has been described above with reference to embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various modifications and refinements without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims.

Claims

1. A power supply module, suitable for a server rack, characterized in that, This power supply module includes: A water-cooled tray having a first surface and a second surface opposite to the first surface; and Multiple power supplies are arranged side by side on the first surface, each power supply including a heat dissipation surface whose contour corresponds to the contour of the first surface and is adapted to abut against the first surface.

2. The power supply module as described in claim 1, characterized in that, The first surface of the water cooling plate is provided with a plurality of first fins, and the heat dissipation surface of each power supply is provided with a plurality of second fins, the plurality of second fins being arranged alternately with the plurality of first fins.

3. The power supply module as described in claim 2, characterized in that, Each power supply module further includes a thermal paste filled between the plurality of first fins and the plurality of second fins.

4. The power supply module as described in claim 2, characterized in that, Each power supply further includes a first slot and a first substrate, the plurality of second fins being disposed on the first substrate, and the first substrate being detachably mounted in the first slot.

5. The power supply module as described in claim 4, characterized in that, The power supply further includes a thermally conductive interface material disposed on and adjacent to the side of the first substrate away from the plurality of second fins.

6. The power supply module as described in claim 4, characterized in that, Each power supply unit has multiple third fins on the side away from the water cooling plate.

7. The power supply module as described in claim 6, characterized in that, The power supply further includes a second slot and a second substrate on the side away from the water cooling plate, the plurality of third fins being disposed on the second substrate, and the second substrate being detachably mounted in the second slot.

8. The power supply module as described in claim 6, characterized in that, The power supply module further includes another water cooling plate having a third surface with a plurality of fourth fins arranged alternately with the plurality of third fins.

9. The power supply module as described in claim 1, characterized in that, The power supply module further includes another power supply adjacent to the second surface of the water cooling plate, and the second surface of the water cooling plate is provided with a plurality of fifth fins.

10. The power supply module as described in claim 9, characterized in that, The other power supply includes a plurality of sixth fins disposed on one side of the other power supply adjacent to the second surface and configured to be staggered with the plurality of fifth fins on the second surface.

11. The power supply module as claimed in claim 1, characterized in that, The power supply module further includes a plurality of balls that are rotatably disposed between the first surface of the water cooling plate and each of the power supplies.

12. The power supply module as claimed in claim 1, characterized in that, The server rack is defined with a unit height. The power supply enclosure includes two opposing narrow plates and two opposing wide plates. The width of the narrow plates is equal to the unit height, and the width of the wide plates plus the thickness of the water cooling plate is equal to twice the unit height.

13. The power supply module as described in claim 1, characterized in that, The server rack is defined with a unit height. The power supply enclosure includes two opposing narrow plates and two opposing wide plates. The width of the narrow plates is equal to the unit height, and the width of the wide plates plus twice the thickness of the water cooling plate equals twice the unit height.

14. The power supply module as described in claim 12 or 13, characterized in that, The heat dissipation surface is located on the narrow plate.

Images