A kind of gas flow precision control device in semiconductor etching process

Abstract

This utility model discloses a precise gas flow control device in a semiconductor etching process, relating to the field of flow control technology. It includes a fixed tube for guiding gas; a vacuum pump mounted on the fixed tube for pumping gas; and a gas flow monitoring component disposed inside the fixed tube and positioned behind the vacuum pump along the gas flow direction for real-time monitoring of gas flow. The component includes a support frame fixed to the inner wall of the fixed tube and a sliding frame that passes through and slides on the support frame. This application achieves dual monitoring of gas flow through the synergistic effect of an infrared rangefinder and a pressure sensor. The infrared rangefinder reflects the flow rate through the relative displacement of the sliding frame and the support frame, while the pressure sensor directly senses the airflow pressure. The signals from both are compared and verified at a terminal, effectively reducing the error interference from a single sensor and significantly improving the accuracy of flow monitoring.

Description

Technical Field

[0001] This utility model relates to the field of flow control technology, specifically a device for precise control of gas flow in a semiconductor etching process. Background Technology

[0002] In semiconductor manufacturing, the etching process is one of the key steps determining chip precision and performance. Its core lies in precisely controlling the flow rate of etching gases (such as fluorine-based and chlorine-based gases) to selectively remove material from the wafer surface. The stability and precision of the gas flow rate directly affect the etching rate, pattern dimensional accuracy, and wafer surface uniformity. If flow rate fluctuations exceed the allowable range, it may lead to over-etching, under-etching, or pattern distortion, severely impacting the yield and reliability of semiconductor devices.

[0003] In the existing technology, gas flow control devices mostly adopt a single monitoring method (such as only through a flow meter or pressure valve), which has the following shortcomings: a single sensor is easily affected by environmental factors such as airflow disturbance and temperature changes, resulting in a large monitoring error; in the structural design, the coordination between the monitoring components and the airflow guiding components is not reasonable enough, which can easily generate local turbulence and further affect the stability of flow monitoring.

[0004] Therefore, developing a precise gas flow control device for semiconductor etching processes is of great significance for improving the level of semiconductor etching technology. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a device for precise control of gas flow in a semiconductor etching process.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows:

[0007] A device for precise control of gas flow in a semiconductor etching process includes:

[0008] Fixed tube, used for guiding gas;

[0009] An air pump, installed on a fixed pipe, is used for air extraction;

[0010] A gas flow monitoring component, installed inside a fixed pipe and positioned behind the pump along the gas flow direction, is used for real-time monitoring of gas flow. It includes:

[0011] The support frame is fixed to the inner wall of the fixed tube;

[0012] The sliding frame slides through the support frame;

[0013] The elastic element forms an elastic compression on the sliding frame in the opposite direction of gas flow;

[0014] An infrared rangefinder is fixed on a sliding frame, and the laser emitted by it illuminates the support frame.

[0015] The pressure sensor slides and presses against the infrared rangefinder along the gas flow direction;

[0016] The terminal, wherein the infrared rangefinder and the pressure sensor are both electrically connected to the terminal, and are used to receive signals from the infrared rangefinder and the pressure sensor to form a comparison;

[0017] The controller, including the terminal and the air pump, is electrically connected to the controller to control the air pumping rate.

[0018] Preferably, the support frame includes a disc-shaped central portion, a columnar connecting portion, and an annular support portion. The disc-shaped central portion and the annular support portion are coaxially arranged and fixed by the columnar connecting portion. The sliding frame includes an arc-shaped through portion and two disc-shaped ends. The arc-shaped through portion is fixed between the two disc-shaped ends and passes through the gap between the disc-shaped central portion and the annular support portion. The laser emitted by the infrared rangefinder illuminates the center position of the disc-shaped central portion.

[0019] Preferably, it also includes a gas source storage box, one end of the fixing pipe is fixedly inserted into the inside of the gas source storage box, and the end of the fixing pipe away from the gas source storage box is fixedly connected to a flexible tube.

[0020] Preferably, the sliding frame has a through hole through which the laser emitted by the infrared rangefinder passes.

[0021] Preferably, a guide plate is fixed on the sliding frame, a guide groove is formed on the guide plate, and a guide block adapted to the guide groove is fixed on the pressure sensor.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] This application achieves dual monitoring of gas flow rate through the synergistic effect of an infrared rangefinder and a pressure sensor. The infrared rangefinder reflects the flow rate through the relative displacement of the sliding frame and the support frame, while the pressure sensor directly senses the airflow pressure. The signals from both are compared and verified at the terminal, effectively reducing the error interference of a single sensor and significantly improving the accuracy of flow monitoring.

[0024] The gas flow monitoring component of this application captures airflow changes in real time, the terminal quickly processes the signal and feeds it back to the controller, and the controller adjusts the pump speed in real time, forming a closed-loop control of "monitoring-feedback-adjustment", which can quickly respond to flow fluctuations and ensure that the gas flow is always maintained within the set range during the etching process. Attached Figure Description

[0025] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein:

[0026] Figure 1 This is a schematic diagram of the structure of a precise gas flow control device in a semiconductor etching process according to the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of the gas flow monitoring component of this utility model;

[0028] Figure 3 This is a front view of the gas flow monitoring component of this utility model;

[0029] Figure 4 This is an exploded view of the gas flow monitoring component of this utility model.

[0030] The diagram shows the following components: 1. Gas source storage box; 2. Fixed pipe; 3. Air pump; 4. Gas flow monitoring component; 41. Support frame; 42. Sliding frame; 43. Elastic element; 44. Through hole; 45. Infrared rangefinder; 46. Guide plate; 47. Pressure sensor; 5. Hoses. Detailed Implementation

[0031] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0032] Example

[0033] like Figure 1-4 As shown, a precise gas flow control device for a semiconductor etching process includes:

[0034] Fixed tube 2 is used for gas guidance. As a gas guiding channel, it provides a closed and stable flow path for the gas flow, avoids gas leakage or turbulence, ensures stable gas flow, lays the foundation for subsequent flow monitoring and control, and ensures that the etching gas is accurately delivered to the etching process along the preset path.

[0035] The air pump 3 is installed on the fixed pipe 2 and is used for air extraction. As an actuator for flow regulation, the air extraction rate can be adjusted in real time by the controller, directly changing the flow speed of the gas in the fixed pipe, realizing active control of gas flow rate, and meeting the requirements of semiconductor etching for dynamic flow rate changes.

[0036] The gas flow monitoring component 4 is located inside the fixed pipe 2 and positioned behind the pump 3 along the gas flow direction. It is used for real-time monitoring of gas flow. As the core monitoring unit, its internal structure works in synergy to achieve high-precision flow sensing. It includes:

[0037] The support frame 41 is fixed to the inner wall of the fixed tube 2. Through the coaxial structure of "disc-shaped center part + column-shaped connecting part + annular support part", it provides stable sliding support for the sliding frame. The column-shaped connecting part reduces the obstruction of airflow, and the gap between the annular support part and the disc-shaped center part provides movement space for the arc-shaped through part of the sliding frame, effectively reducing airflow disturbance, ensuring airflow stability, and reducing interference with monitoring.

[0038] The sliding frame 42 slides through the support frame 41. The structural design of "arc-shaped through part + disc-shaped end" not only achieves stable sliding cooperation with the support frame through the arc-shaped through part, but also increases the contact area with the airflow through the disc-shaped end, thereby improving the sensitivity to airflow thrust. It can convert small flow changes into measurable mechanical displacement and enhance the sensitivity of monitoring.

[0039] The elastic element 43 forms an elastic compression on the sliding frame 42 in the opposite direction of gas flow, and applies a reverse elastic force to the sliding frame, so that the displacement of the sliding frame and the airflow thrust form a dynamic balance. When the flow rate increases, the sliding frame moves against the elastic force, and when the flow rate decreases, the elastic force pushes it back to its original position, ensuring that the displacement change can reflect the increase or decrease of the flow rate in real time and accurately, and improving the monitoring response speed.

[0040] An infrared rangefinder 45 is fixed to a sliding frame 42, and its emitted laser beam illuminates a support frame 41, which is also fixed to the sliding frame. Non-contact distance measurement is achieved by illuminating the center of the disc-shaped center of the support frame with the laser. The measured distance change directly corresponds to the displacement of the sliding frame, thus reflecting the flow rate. It features high accuracy and no mechanical wear. The laser beam is focused at the center position, reducing measurement errors caused by sliding frame sway and further improving data reliability.

[0041] Pressure sensor 47 slides and presses against infrared rangefinder 45 along the gas flow direction;

[0042] The terminal, with both the infrared rangefinder 45 and the pressure sensor 47 electrically connected, receives signals from the infrared rangefinder 45 and the pressure sensor 47 for comparison. The pressure sensor is directly compressed by the airflow along the airflow direction and acts on the infrared rangefinder, directly reflecting the flow rate through the pressure value. This forms a dual monitoring mode of "displacement + pressure" with the infrared rangefinder. The data from both are compared and verified by the terminal, effectively reducing the error risk of a single measurement. The guide groove and guide block of the guide plate 46 constrain the pressure sensor to slide only along the airflow direction, avoiding lateral force interference and ensuring the accuracy of pressure measurement. The controller, with both the terminal and the air pump 3 electrically connected, controls the pumping rate of the air pump 3.

[0043] The terminal receives and compares the signals from the infrared rangefinder and the pressure sensor. After ensuring that the dual monitoring results are consistent, the controller adjusts the air pump rate to achieve closed-loop flow control. This mechanism can correct flow deviations in real time, ensuring that the gas flow rate remains stable within the set range, ultimately improving the uniformity and accuracy of semiconductor etching patterns and reducing the risk of device scrapping due to flow fluctuations.

[0044] The device described in this application is designed to meet the stringent requirements of semiconductor etching. It can precisely control minute changes in gas flow rate, effectively improve the uniformity and accuracy of the etched pattern, reduce the scrap rate of devices caused by flow deviation, and provide strong support for the manufacturing of high-reliability semiconductor products.

[0045] in:

[0046] The airflow squeezes the sliding frame 42, causing the elastic element 43 to elastically contract. The distance of the laser emitted by the infrared rangefinder 45 illuminating the support frame 41 is compared with the gas flow rate to determine the gas flow rate. At the same time, the gas squeezes the pressure sensor 47, causing the pressure sensor 47 to squeeze the infrared rangefinder 45. The pressure value on the pressure sensor 47 is compared with the gas flow rate to determine the gas flow rate. If the distance measured by the infrared rangefinder 45 and the pressure value of the pressure sensor 47 both match the gas flow rate, the controller controls the air pump 3.

[0047] The matching structure of the support frame and sliding frame in this application, such as the cooperation of the disc-shaped center part, the annular support part and the arc-shaped through part, reduces airflow disturbance. The setting of the guide plate and guide block ensures that the pressure sensor slides stably along the airflow direction. The elastic element provides a stable restoring force for the sliding frame. The overall structure reduces the impact of mechanical vibration on monitoring and improves the long-term operational stability of the device.

[0048] It also includes a gas source storage box 1. One end of the fixed pipe 2 is fixedly inserted into the inside of the gas source storage box 1. The end of the fixed pipe 2 away from the gas source storage box 1 is fixedly connected to a flexible hose 5. The gas source storage box 1 provides a continuous and stable gas source for the device, ensuring the continuity of gas supply in the etching process and avoiding the impact of gas source fluctuations on flow stability. The flexible hose 5 achieves docking between the fixed pipe and the etching equipment through flexible connection, adapting to the flexibility of equipment layout, reducing the obstruction of gas flow by hard connection, and ensuring smooth airflow.

[0049] The sliding frame 42 has a through hole 44 through which the laser emitted by the infrared rangefinder 45 passes;

[0050] A guide plate 46 is fixed on the sliding frame 42, and a guide groove is provided on the guide plate 46. A guide block that matches the guide groove is fixed on the pressure sensor 47.

[0051] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. A device for precise control of gas flow rate in a semiconductor etching process, characterized in that: include: Fixed tube, used for guiding gas; An air pump, installed on a fixed pipe, is used for air extraction; A gas flow monitoring component, installed inside a fixed pipe and positioned behind the pump along the gas flow direction, is used for real-time monitoring of gas flow. It includes: The support frame is fixed to the inner wall of the fixed tube; The sliding frame slides through the support frame; The elastic element forms an elastic compression on the sliding frame in the opposite direction of gas flow; An infrared rangefinder is fixed on a sliding frame, and the laser emitted by it illuminates the support frame. The pressure sensor slides and presses against the infrared rangefinder along the gas flow direction; The terminal, wherein the infrared rangefinder and the pressure sensor are both electrically connected to the terminal, and are used to receive signals from the infrared rangefinder and the pressure sensor to form a comparison; The controller, including the terminal and the air pump, is electrically connected to the controller to control the air pumping rate.

2. The device according to claim 1, wherein: The support frame includes a disc-shaped central part, a columnar connecting part, and an annular support part. The disc-shaped central part and the annular support part are coaxially arranged and fixed by the columnar connecting part. The sliding frame includes an arc-shaped through part and two disc-shaped ends. The arc-shaped through part is fixed between the two disc-shaped ends and passes through the gap between the disc-shaped central part and the annular support part. The laser emitted by the infrared rangefinder illuminates the center position of the disc-shaped central part.

3. The device according to claim 2, wherein: It also includes a gas source storage box, one end of which is fixedly inserted into the inside of the gas source storage box, and the end of which is away from the gas source storage box is fixedly connected to a flexible tube.

4. The precise gas flow control device in a semiconductor etching process according to claim 3, characterized in that: The sliding frame has through holes through which the laser emitted by the infrared rangefinder can pass.

5. The precise gas flow control device in a semiconductor etching process according to claim 4, characterized in that: A guide plate is fixed on the sliding frame, and a guide groove is formed on the guide plate. A guide block that matches the guide groove is fixed on the pressure sensor.

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