PVD coating apparatus

Abstract

This application provides a PVD coating apparatus, including a process chamber assembly; a conveying assembly disposed inside the process chamber assembly, with a substrate carrier disposed on the conveying assembly; and a discharge assembly disposed inside the process chamber assembly and corresponding to the conveying assembly. The discharge assembly includes a conductive structure and a mounting base structure, the conductive structure being connected to the mounting base structure, and the mounting base structure being grounded. The technical solution of this application effectively solves the problem in the prior art where excessive electrons adhering to the substrate surface during silicon wafer coating leads to arcing on the substrate.

Description

Technical Field

[0001] This application relates to the technical field of coating equipment, and more particularly to a PVD coating equipment. Background Technology

[0002] PVD (Physical Vapor Deposition) is a technique that uses physical methods under vacuum conditions to vaporize the surface of a material source into gaseous atoms or molecules, and then deposits a thin film with specific functions onto a substrate surface through a low-pressure gas (or plasma) process. PVD technology is mainly divided into vacuum evaporation deposition, vacuum sputtering deposition, and vacuum ion plating, encompassing methods such as vacuum evaporation, sputtering deposition, arc plasma deposition, ion plating, and molecular beam epitaxy.

[0003] PVD vacuum coating equipment is a key process in photovoltaic cell production. Using magnetron sputtering or RPD (reactive ion deposition) technology, it deposits a transparent metal oxide conductive film (TCO), primarily ITO (indium tin oxide), on the front and back sides of amorphous silicon passivated heterojunction cells. This film collects charge carriers vertically and transports them laterally to the electrodes, while also reducing incident light reflection. In current production, during the PVD process, an automated wafer loading mechanism accurately places the silicon wafer onto a PVD carrier. The carrier then enters the PVD equipment for processing. After coating, the carrier is transferred to the unloading area, where an automated unloading mechanism removes the silicon wafer. The carrier is then returned to the loading area via a transport mechanism for the next production cycle.

[0004] Currently, in the PVD process, carriers need to be reused due to capacity requirements and cost control requirements. Throughout the magnetron sputtering process, the carrier is also exposed to the sputtering area, and a TCO thin film is deposited on the carrier surface. At the same time, some electrons also adhere to the carrier surface. If they cannot be removed in time, arcing will occur in the carrier chamber, leading to silicon wafer damage. Utility Model Content

[0005] One of the technical problems this application aims to solve is that during the silicon wafer coating process, there is a problem of arcing on the carrier board due to the large number of electrons adhering to the carrier board surface.

[0006] To address the aforementioned technical problems, this application provides a PVD coating apparatus.

[0007] A PVD coating apparatus according to this application includes: a process chamber assembly; a conveying assembly disposed inside the process chamber assembly, and a substrate carrier disposed on the conveying assembly; and a discharge assembly disposed inside the process chamber assembly and corresponding to the conveying assembly. The discharge assembly includes a conductive structure and a mounting base structure, the conductive structure being connected to the mounting base structure, and the mounting base structure being grounded.

[0008] In some embodiments, the discharge assembly further includes a spring-loaded structure connected to the conductive structure and the mounting base structure.

[0009] In some embodiments, the height of the conductive structure in the vertical direction is greater than the height of the conveying component in the vertical direction.

[0010] In some embodiments, the mounting structure includes a first mounting base and a rotating shaft, the rotating shaft being connected to the first mounting base, the spring-loaded structure including a torsion spring sleeved on the rotating shaft, and a conductive structure sleeved on the rotating shaft and rotatably connected to the rotating shaft, the torsion spring being connected to the conductive structure.

[0011] In some embodiments, the conductive structure includes a conductive wheel and a first connecting portion, the conductive wheel being rotatably connected to the first connecting portion, the first connecting portion being connected to a torsion spring, and the first connecting portion being rotatably connected to a rotating shaft.

[0012] In some embodiments, the mounting structure further includes a second mounting base having a first positioning hole, and the spring structure further includes a spring, a first end of which is connected to the second mounting base and located within the first positioning hole, and a second end of which is connected to a conductive structure.

[0013] In some embodiments, the conductive structure further includes a second connecting portion, the conductive wheel being rotatably connected to the second connecting portion, the second connecting portion having a second positioning hole, the inner diameter of the second positioning hole being larger than the outer diameter of the second mounting base, the second mounting base being movably disposed within the second positioning hole, and the spring being connected to the second positioning hole.

[0014] In some embodiments, the process chamber assembly has an inlet structure and an outlet structure, and the conductive structure includes two, one of which is located between the inlet structure and the conveying assembly, and the other of which is located between the outlet structure and the conveying assembly.

[0015] In some embodiments, the conductive structure includes a plurality of conductive structures, which are uniformly distributed inside the process cavity assembly along the conveying direction of the conveying assembly.

[0016] In some embodiments, the conveying assembly includes a plurality of conveying structures, and a conductive structure is provided between adjacent conveying structures.

[0017] Through the above technical solution, the PVD coating equipment provided in this application has a substrate carrier placed on a conveying assembly. The conveying assembly moves the substrate carrier within the process chamber assembly for coating. During the movement, the substrate carrier passes through a discharge assembly, and then comes into contact with a conductive structure. Electrons accumulated on the substrate carrier are transferred to the conductive structure and discharged through a grounded mounting structure. This technical solution effectively solves the problem in the prior art where excessive electrons adhering to the carrier surface during silicon wafer coating leads to arcing on the carrier. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This paper shows a schematic diagram of the main structure of the discharge assembly of the PVD coating equipment disclosed in Embodiment 1 of this application;

[0020] Figure 2 It shows Figure 1 A schematic diagram of the discharge assembly of a PVD coating equipment from the left.

[0021] Figure 3 It shows Figure 1 A schematic diagram of the main cross-sectional structure of a PVD coating equipment;

[0022] Figure 4 This paper shows a schematic diagram of the main cross-sectional structure of the discharge component of the PVD coating equipment disclosed in Embodiment 2 of this application.

[0023] Explanation of reference numerals in the attached figures:

[0024] 10. Process chamber assembly; 11. Inlet structure; 12. Outlet structure; 20. Conveying assembly; 30. Discharge assembly; 31. Conductive structure; 311. Conductive wheel; 312. First connecting part; 313. Second connecting part; 3131. Second positioning hole; 32. Mounting base structure; 321. First mounting base; 322. Rotating shaft; 323. Second mounting base; 3231. First positioning hole; 33. Springback structure; 331. Torsion spring; 332. Spring. Detailed Implementation

[0025] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application. This application can be implemented in many different forms and is not limited to the specific embodiments of the application herein, but includes all technical solutions falling within the scope of the claims.

[0026] These embodiments are provided to make the application thorough and complete, and to fully express the scope of the application to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​illustrated in these embodiments should be interpreted as merely exemplary and not as limiting.

[0027] It should be noted that, in the description of this application, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0028] Furthermore, the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well.

[0029] It should also be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.

[0030] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0031] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0032] like Figures 1 to 3As shown, the PVD coating equipment disclosed in Embodiment 1 of this application includes: a process chamber assembly 10, a conveying assembly 20, and a discharge assembly 30. The conveying assembly 20 is disposed inside the process chamber assembly 10, and the substrate carrier is disposed on the conveying assembly 20. The discharge assembly 30 is disposed inside the process chamber assembly 10 and is disposed corresponding to the conveying assembly 20. The discharge assembly 30 includes a conductive structure 31 and a mounting base structure 32. The conductive structure 31 is connected to the mounting base structure 32, and the mounting base structure 32 is grounded.

[0033] Using the technical solution of Embodiment 1, the substrate carrier is placed on the conveying assembly 20. The conveying assembly 20 moves the substrate carrier inside the process cavity assembly 10 for film deposition. During the movement, the substrate carrier passes through the discharge assembly 30 and comes into contact with the conductive structure 31. Electrons accumulated on the substrate carrier are transferred to the conductive structure 31 and discharged through the grounded mounting base structure 32. The technical solution of Embodiment 1 effectively solves the problem in the prior art where a large number of electrons adhering to the surface of the carrier cause arcing during the silicon wafer deposition process.

[0034] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the discharge assembly 30 further includes a spring-loaded structure 33, which is connected to the conductive structure 31 and the mounting base structure 32. Under the action of the spring-loaded structure 33, the conductive structure 31 has a reset capability, avoiding problems such as deformation of the conductive structure 31 under pressure, which would lead to poor contact between the conductive structure 31 and the substrate, affecting electron discharge and failing to solve the problem of arcing on the substrate.

[0035] like Figure 3 As shown, in the technical solution of Embodiment 1, the vertical height of the conductive structure 31 is higher than the vertical height of the conveying component 20. The vertical heights of the conductive structure 31 and the conveying component 20 refer to the vertical heights of their highest points. The substrate carrier is conveyed by the conveying component 20, at which time the bottom surface of the substrate carrier is in contact with the conveying component 20. Since the vertical height of the conductive structure 31 is higher than that of the conveying component 20, when the substrate carrier moves to the conductive structure 31, under the action of gravity, the bottom of the substrate carrier will inevitably contact the conductive structure 31, achieving grounding of the substrate carrier and electron discharge from the substrate carrier.

[0036] like Figure 1 and Figure 2As shown, in the technical solution of Embodiment 1, the mounting base structure 32 includes a first mounting base 321 and a rotating shaft 322. The rotating shaft 322 is connected to the first mounting base 321. The springback structure 33 includes a torsion spring 331, which is sleeved on the rotating shaft 322. The conductive structure 31 is sleeved on the rotating shaft 322 and rotatably connected to it. The torsion spring 331 is connected to the conductive structure 31. When the substrate carrier passes the conductive structure 31, the conductive structure 31 rotates under the gravity of the substrate carrier, and the torsion spring 331 deforms. Under the elastic force of the torsion spring 331, the conductive structure 31 is pressed tightly against the bottom of the substrate carrier, ensuring close contact between the conductive structure 31 and the substrate carrier, and ensuring good conductivity. When the substrate carrier leaves, the conductive structure 31 returns to a position higher than the conveying assembly 20 under the action of the torsion spring 331, until the subsequent substrate carrier moves to the conductive structure 31.

[0037] like Figures 1 to 3 As shown, in the technical solution of Embodiment 1, the conductive structure 31 includes a conductive wheel 311 and a first connecting part 312. The conductive wheel 311 and the first connecting part 312 are rotatably connected. The first connecting part 312 is connected to a torsion spring 331 and a rotating shaft 322. The outer surface of the conductive wheel 311 is a smooth arc surface. Therefore, when the substrate carrier moves to the conductive wheel 311, the substrate carrier moves smoothly. When the conductive wheel 311 is slowly pressed down, it will not hinder the movement of the substrate carrier. When the substrate carrier passes the conductive wheel 311, the conductive wheel 311 rotates, reducing the friction force on the substrate carrier during movement, reducing frictional loss between the substrate carrier and the conductive wheel 311, improving their service life, and reducing poor contact between them.

[0038] like Figure 3 As shown, in the technical solution of Embodiment 1, the process cavity assembly 10 has an inlet structure 11 and an outlet structure 12. Two conductive structures 31 are included, one located between the inlet structure 11 and the conveying assembly 20, and the other located between the outlet structure 12 and the conveying assembly 20. The substrate carrier enters the process cavity assembly 10 from the inlet structure 11, contacts the first conductive structure 31, undergoes a first discharge, and then moves to the conveying assembly 20 for the coating process, avoiding residual electrons on the substrate carrier. After processing, the substrate carrier moves to the second conductive structure 31 for a second discharge, preventing static electricity from affecting the operator when removing the substrate. Figure 1 As shown, the mounting base structure 32 also includes a mounting bracket, which is connected to the first mounting base and to either the inlet structure 11 or the outlet structure 12. Figure 2 The mounting bracket is omitted to show the conductive structure 31.

[0039] like Figure 4 As shown, the difference between the technical solution of Embodiment 2 and Embodiment 1 is that the mounting base structure 32 further includes a second mounting base 323, which has a first positioning hole 3231. The spring-loaded structure 33 also includes a spring 332. The first end of the spring 332 is connected to the second mounting base 323 and located within the first positioning hole 3231, while the second end of the spring 332 is connected to the conductive structure 31. When the substrate passes through the conductive structure 31, the spring 332 is compressed under the gravity of the substrate, and the conductive wheel 311 is pressed against the bottom of the substrate, ensuring good contact and conductivity. The first positioning hole 3231 positions the spring 332, preventing it from shifting radially and causing the conductive structure 31 above to tilt or fall.

[0040] like Figure 4 As shown, in the technical solution of Embodiment 2, the conductive structure 31 further includes a second connecting portion 313. The conductive wheel 311 is rotatably connected to the second connecting portion 313. The second connecting portion 313 has a second positioning hole 3131, the inner diameter of which is larger than the outer diameter of the second mounting base 323. The second mounting base 323 is movably disposed within the second positioning hole 3131, and the spring 332 is connected to the second positioning hole 3131. The way the second positioning hole 3131 cooperates with the second mounting base 323 guides the movement of the second connecting portion 313 in the vertical direction, ensuring that the second connecting portion 313 moves in the vertical direction and avoiding the problem of the upper conductive wheel 311 shifting position and failing to contact the substrate carrier.

[0041] The difference between the technical solution of Embodiment 3 and that of Embodiment 1 is that the conductive structure 31 includes multiple conductive structures 31, which are evenly distributed inside the process cavity assembly 10 along the conveying direction of the conveying assembly 20. This even distribution of multiple conductive structures 31 inside the process cavity assembly 10 enables multiple discharges to the substrate carrier, further avoiding the problem of arcing on the substrate carrier and preventing damage to the substrate that could lead to low production capacity.

[0042] In the technical solution of Embodiment 3, the conveying assembly 20 includes multiple conveying structures, and a conductive structure 31 is provided between adjacent conveying structures. Mounting positions for the conductive structure 31 are reserved between the multiple conveying structures. By rationally setting the mounting positions of the conductive structure 31 according to the conveying speed of the conveying assembly 20, timed discharge can be achieved, thereby better controlling the amount of electrons on the substrate and avoiding arcing.

[0043] In summary, this application designs a discharge mechanism (discharge assembly 30) installed inside the equipment cavity (process cavity assembly 10). This mechanism better conducts the charge on the carrier plate to the ground, while solving the arcing phenomenon that occurs in the PVD equipment after repeated use of the carrier plate. This conductive mechanism (discharge assembly 30) includes: a mounting mechanism (mounting bracket), a mechanism base (first mounting seat 321), a connecting mechanism (first mounting seat 321), a conductive wheel 311, a conductive wheel mounting mechanism (first connecting part 312), and a springback mechanism (springback structure 33). The mounting mechanism is used to connect the discharge mechanism to the equipment. The mounting mechanism is installed at the inlet and outlet of the PVD equipment process cavity by bolts. The carrier plate is first discharged before entering the PVD process cavity for production. After the process flow is completed, a second discharge is performed. The entire discharge mechanism is mounted on the mounting mechanism. The base of the mechanism is used to mount the main body of the discharge mechanism, which consists of a connecting mechanism, a conductive wheel 311, a conductive wheel mounting mechanism, and a spring mechanism. The connecting mechanism is used to connect the conductive wheel mounting mechanism and the base of the mechanism. The conductive wheel 311 is the core component of the mechanism, which contacts the PVD carrier plate and is used for charge discharge. The conductive wheel mounting mechanism is used to mount the conductive wheel 311 and connect to the connecting mechanism. The spring mechanism is mounted on the connecting mechanism and uses a spring mechanism to achieve the spring function. Its function is to maintain the state of the main body of the discharge mechanism. Under normal conditions, the conductive wheel 311 of the main body of the discharge mechanism is in the raised state. When the PVD carrier plate passes along the tangential direction of the conductive wheel 311, the weight of the carrier plate itself presses down the conductive wheel 311. The spring mechanism, due to its elasticity, keeps the conductive wheel 311 in contact with the carrier plate at all times. After the carrier plate passes, the main body of the discharge mechanism returns to the raised state of the conductive wheel 311 under the action of the spring mechanism. This mechanism utilizes the conductivity of metals to ensure effective grounding of the PVD carrier during the production process through a spring-loaded discharge mechanism, thereby ensuring the stability of the PVD process.

[0044] The embodiments of this application have now been described in detail. To avoid obscuring the concept of this application, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions of this application based on the above description.

[0045] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any manner.

Claims

1. A PVD coating equipment, characterized in that, include: Process cavity assembly (10); A conveying assembly (20) is disposed inside the process cavity assembly (10), and a substrate carrier is disposed on the conveying assembly (20); The discharge assembly (30) is disposed inside the process cavity assembly (10) and is disposed corresponding to the conveying assembly (20). The discharge assembly (30) includes a conductive structure (31) and a mounting base structure (32). The conductive structure (31) is connected to the mounting base structure (32), and the mounting base structure (32) is grounded.

2. The PVD coating equipment according to claim 1, characterized in that, The discharge assembly (30) further includes a spring structure (33), which is connected to the conductive structure (31) and the mounting base structure (32).

3. The PVD coating equipment according to claim 1, characterized in that, The height of the conductive structure (31) in the vertical direction is higher than the height of the conveying assembly (20) in the vertical direction.

4. The PVD coating equipment according to claim 2, characterized in that, The mounting base structure (32) includes a first mounting base (321) and a rotating shaft (322). The rotating shaft (322) is connected to the first mounting base (321). The spring-loaded structure (33) includes a torsion spring (331). The torsion spring (331) is sleeved on the rotating shaft (322). The conductive structure (31) is sleeved on the rotating shaft (322) and rotatably connected to the rotating shaft (322). The torsion spring (331) is connected to the conductive structure (31).

5. The PVD coating equipment according to claim 4, characterized in that, The conductive structure (31) includes a conductive wheel (311) and a first connecting part (312). The conductive wheel (311) is rotatably connected to the first connecting part (312). The first connecting part (312) is connected to the torsion spring (331). The first connecting part (312) is rotatably connected to the rotating shaft (322).

6. The PVD coating equipment according to claim 5, characterized in that, The mounting base structure (32) further includes a second mounting base (323), the second mounting base (323) having a first positioning hole (3231), the spring structure (33) further includes a spring (332), the first end of the spring (332) being connected to the second mounting base (323) and located in the first positioning hole (3231), and the second end of the spring (332) being connected to the conductive structure (31).

7. The PVD coating equipment according to claim 6, characterized in that, The conductive structure (31) further includes a second connecting part (313), the conductive wheel (311) is rotatably connected to the second connecting part (313), the second connecting part (313) has a second positioning hole (3131), the inner diameter of the second positioning hole (3131) is larger than the outer diameter of the second mounting base (323), the second mounting base (323) is movably disposed in the second positioning hole (3131), and the spring (332) is connected to the second positioning hole (3131).

8. The PVD coating equipment according to any one of claims 1 to 7, characterized in that, The process chamber assembly (10) has an inlet structure (11) and an outlet structure (12). The conductive structure (31) includes two, one of which is located between the inlet structure (11) and the conveying assembly (20), and the other is located between the outlet structure (12) and the conveying assembly (20).

9. The PVD coating equipment according to any one of claims 1 to 7, characterized in that, The conductive structure (31) includes a plurality of conductive structures (31), which are uniformly distributed inside the process cavity assembly (10) along the conveying direction of the conveying assembly (20).

10. The PVD coating equipment according to claim 9, characterized in that, The conveying assembly (20) includes multiple conveying structures, and the conductive structure (31) is disposed between adjacent conveying structures.

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