A leak-proof plating structure for a plastic metallized waveguide antenna

Abstract

This utility model discloses an anti-leakage plating structure for a plastic metallized waveguide antenna, relating to the field of waveguide antenna technology. The anti-leakage plating structure for a plastic metallized waveguide antenna includes a waveguide groove disposed on the waveguide antenna body. Each right-angle section inside the waveguide groove has a guiding surface to direct the flow of electroplating solution. This utility model, by setting guiding surfaces in the form of arcs, slopes, or a combination of both at the right angles inside the waveguide groove, completely eliminates dead zones in the flow of electroplating solution, guiding the plating solution smoothly and comprehensively covering the bottom and corners of the waveguide groove. This effectively solves the plating leakage problem that easily occurs in traditional inner right-angle structures, ensuring that the plating layer is complete and of uniform thickness, thus guaranteeing the stability and reliability of the antenna's core conductivity. Simultaneously, it eliminates the need for multiple electroplating operations and increased plating solution flow rates, simplifying the production process, reducing sensitivity to equipment parameters and debugging difficulty, improving production efficiency, and reducing electroplating costs.

Description

Technical Field

[0001] This utility model belongs to the field of waveguide antenna technology, specifically, it relates to a leak-proof plating structure for a plastic metallized waveguide antenna. Background Technology

[0002] During the electroplating process of plastic waveguide antennas, the bottom of the waveguide cavity is usually designed with an inner right angle shape. Due to the presence of the inner right angle structure, the electroplating solution is difficult to evenly cover the bottom area during the electroplating process, which makes it easy for the plating solution to be missed in this area, affecting the antenna's conductivity and reliability.

[0003] Existing technologies typically employ multiple electroplating steps or increased plating solution flow rate to address plating incompleteness issues. However, these methods not only increase production costs but also reduce production efficiency. The purpose of this invention is to provide an improved waveguide antenna plating structure that effectively avoids plating incompleteness at the bottom of the waveguide, while simultaneously improving plating efficiency and reducing production costs. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a leak-proof plating structure for plastic metallized waveguide antennas that can overcome or at least partially solve the above problems.

[0005] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is as follows: A leak-proof plating structure for a plastic metallized waveguide antenna includes a waveguide groove disposed on the waveguide antenna body, wherein each right-angle structure inside the waveguide groove is provided with a guide surface to guide the flow of electroplating liquid.

[0006] As a preferred embodiment of this utility model, the guide surface is a concave arc structure.

[0007] As a preferred embodiment of this utility model, the radius of the concave arc structure is 0.1mm-0.2mm.

[0008] As a preferred embodiment of this utility model, the guide surface is an inclined structure.

[0009] As a preferred embodiment of this utility model: the included angle between the two surfaces of the inclined plane and the right-angle structure is 135°.

[0010] As a preferred embodiment of this utility model: a concave arc structure is provided at the junction of the inclined structure and the right-angle structure.

[0011] After adopting the above technical solution, this utility model has the following beneficial effects compared with the prior art: By setting a flow guide surface in the form of an arc, a slope, or a combination of a slope and an arc at the right angle in the waveguide groove, this utility model completely eliminates the dead angle of electroplating solution flow, guides the plating solution to flow smoothly and fully cover the bottom and corners of the waveguide groove, effectively solves the problem of missed plating that is prone to occur in traditional inner right angle structures, and ensures that the plating layer is complete and uniform in thickness, which not only ensures the stability and reliability of the antenna core's conductivity performance; at the same time, it eliminates the need for multiple electroplating operations and increasing the flow rate of the plating solution, simplifies the production process, reduces the sensitivity to equipment parameters and the difficulty of debugging, improves the efficiency of large-scale mass production, and reduces the consumption of electroplating consumables and the cost of reworking defective products. It achieves the optimal balance between product performance, production efficiency and overall cost without increasing the processing difficulty.

[0012] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0013] In the attached diagram: Figure 1 This is a three-dimensional structural diagram of the anti-leakage plating structure of a plastic metallized waveguide antenna proposed in this utility model. Figure 2 This is a front view of the anti-leakage plating structure of a plastic metallized waveguide antenna proposed in this utility model; Figure 3 This is a cross-sectional view of the anti-leakage plating structure of a plastic metallized waveguide antenna proposed in this utility model. Figure 4 This invention provides a schematic diagram of the flow-guiding surface of a leak-proof plating structure for a plastic metallized waveguide antenna. Figure 1 ; Figure 5 This invention provides a schematic diagram of the flow-guiding surface of a leak-proof plating structure for a plastic metallized waveguide antenna. Figure 2 ; Figure 6 This invention provides a schematic diagram of the flow-guiding surface of a leak-proof plating structure for a plastic metallized waveguide antenna. Figure 3 .

[0014] In the figure: 1. Waveguide antenna body; 2. Waveguide groove; 21. Guide surface. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0016] Example 1: Refer to Figures 1-4 A leak-proof plating structure for a plastic metallized waveguide antenna includes a waveguide groove 2 disposed on the waveguide antenna body 1. Each right-angle structure inside the waveguide groove 2 is provided with a guide surface 21 for guiding the flow of electroplating liquid. The guide surface 21 is designed as a concave arc structure with a radius of 0.1mm-0.2mm.

[0017] To address the issue that the inner right-angle structure inside the waveguide groove 2 of the plastic metallized waveguide antenna easily obstructs the flow of electroplating solution and makes it difficult to evenly cover the bottom, a concave arc structure with a radius of 0.1mm-0.2mm is set at all inner right angles. The arc surface eliminates dead angles in the flow of electroplating solution, guiding the electroplating solution to flow smoothly through the bottom area of ​​the waveguide groove 2 and adhere evenly, thereby avoiding incomplete plating. At the same time, it eliminates the need to rely on multiple electroplating or increasing the flow rate of electroplating solution. While ensuring the antenna's conductivity and reliability, it improves plating efficiency and reduces production costs.

[0018] Example 2: Refer to Figures 1-3 and Figure 5 A leak-proof plating structure for a plastic metallized waveguide antenna includes a waveguide groove 2 disposed on the waveguide antenna body 1. Each right-angle structure inside the waveguide groove 2 is provided with a guide surface 21 for guiding the flow of electroplating liquid. The guide surface 21 is designed as an inclined structure, and the included angle between the two surfaces of the inclined surface and the right-angle structure is 135°.

[0019] To address the problem of obstructed electroplating solution flow and easy plating leakage at the bottom caused by the inner right angles inside the waveguide groove 2, a sloping guide surface 21 is set at all the inner right angle structures, and the angle between the guide surface 21 and the two sides of the right angle is designed to be 135°. The sloping surface at this angle eliminates dead angles in the flow of electroplating solution, guides the electroplating solution to flow smoothly along the guide surface 21 to the bottom of the waveguide groove 2 and evenly adheres, thereby effectively avoiding plating leakage and ensuring the conductivity and reliability of the antenna. At the same time, there is no need to increase the number of electroplating cycles or increase the flow rate of the electroplating solution, achieving the dual effect of reducing production costs and improving electroplating efficiency.

[0020] Compared to Example 1, the linear structure of the inclined guide surface 21 can guide the electroplating solution to form a more stable laminar flow, completely avoiding the local eddies that are easily generated by the curvature radius limitation of the curved surface. This allows the electroplating solution to flow more smoothly and comprehensively through the bottom and corners of the waveguide tank 2, resulting in a better effect in eliminating dead zones. The uniformity of electroplating coverage is significantly improved, and the standard deviation of the coating thickness is smaller, effectively avoiding the problem of insufficient coverage that may occur on the curved surface. Especially in waveguide cavities with a large depth-to-width ratio, the integrity of coverage is better guaranteed. At the same time, it is less sensitive to electroplating equipment parameters such as current density and plating solution flow rate, and can stably achieve uniform electroplating without complex process adjustments. In large-scale production, it can reduce electroplating defects caused by parameter fluctuations, further ensuring the consistency and stability of electroplating quality.

[0021] Example 3: Refer to Figures 1-3 and Figure 6 A leak-proof plating structure for a plastic metallized waveguide antenna includes a waveguide groove 2 disposed on the waveguide antenna body 1. The right-angle structure inside the waveguide groove 2 is provided with a guide surface 21 for guiding the flow of electroplating liquid. The guide surface 21 is designed as a sloping structure. The included angle between the two surfaces of the sloping surface and the right-angle structure is 135°. A concave arc structure is provided at the junction of the sloping surface structure and the right-angle structure.

[0022] To address the issues of obstructed electroplating solution flow and missed plating caused by inner right angles, the 135° inclined plane provides stable linear flow guidance, directing the electroplating solution to form a laminar flow covering the bottom of the tank. The concave arc at the junction eliminates the tiny flow blind zone that may exist when the simple inclined plane connects to the original right angle, making the electroplating solution transition smoother and preventing missed plating. To address the issue of easy cracking and peeling of the plating layer, the arc transition replaces the sharp edge connection, dispersing the stress concentration of the plating layer in key areas and improving the adhesion and durability of the plating layer. To address the issues of processing burrs affecting pre-plating treatment and batch production parameter fluctuations causing uneven quality, the arc structure avoids processing sharp edge burrs, allowing for more thorough pre-treatment such as roughening and sensitization, while reducing the impact of electroplating parameter fluctuations on the connection area, ensuring production consistency. To address the electroplating layer failure that may be caused by structural deformation, the arc transition also disperses the mechanical stress of the waveguide tank 2, improving resistance to deformation and fatigue, maintaining the integrity of the flow guiding structure in the long term, and ensuring the prevention of missed plating and stable conductivity.

[0023] Compared to Example 2, in this embodiment, a concave arc structure is added at the junction of the 135° inclined plane and the right-angle structure, forming a composite design of linear flow guidance and arc transition. This retains the core advantages of the inclined plane in stabilizing laminar flow and eliminating electroplating dead corners, while completely solving the small flow blind zone that may exist at the junction of simple inclined planes. This makes the transition of the electroplating solution smoother, further improving the uniformity of coverage. At the same time, the arc transition replaces the sharp edge junction, significantly reducing stress concentration in key parts of the coating, avoiding cracking and peeling of the coating during long-term use. It can also avoid burr problems during processing, optimize the pretreatment effect of electroplating, reduce the impact of electroplating parameter fluctuations in mass production, and disperse structural mechanical stress, improving resistance to deformation and fatigue. This further enhances the anti-missing plating effect, coating durability, and production quality consistency.

[0024] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A leak-proof plating structure of a plastic metallized waveguide antenna, comprising a waveguide groove body (2) provided on a waveguide antenna body (1), characterized in that, The waveguide groove body (2) is internally provided with a flow guide surface (21) for guiding the flow of electroplating solution.

2. The leak prevention plating structure of a plastic metallized waveguide antenna according to claim 1, wherein The flow guide surface (21) is a concave arc structure.

3. The structure for preventing plating leakage of a plastic metallized waveguide antenna according to claim 2, wherein The radius of the concave arc structure is 0.1mm-0.2mm.

4. The structure for preventing plating leakage of a plastic metallized waveguide antenna according to claim 1, wherein The flow guide surface (21) is a bevel structure.

5. The structure for preventing plating leakage of a plastic metallized waveguide antenna according to claim 4, wherein The included angle between the bevel and the two faces of the right angle structure is 135°.

6. The structure for preventing plating leakage of a plastic metallized waveguide antenna according to claim 4, wherein The junction of the bevel structure and the right angle structure is provided with a concave arc structure.

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