integrated chip

Abstract

The utility model provides a kind of integrated chip including semiconductor waveguide layer.The core part of semiconductor waveguide layer protrudes upwards from the base part of semiconductor waveguide layer.First heat radiator, spaced apart above semiconductor waveguide layer and laterally spaced apart from core part in first direction.Second heat radiator, spaced apart above semiconductor waveguide layer and laterally spaced apart from core part in second direction.First dielectric layer, between first heat radiator and semiconductor waveguide layer and between second heat radiator and semiconductor waveguide layer.The distance between first heat radiator and semiconductor waveguide layer is less than the distance between first heat radiator and core part.The distance between second heat radiator and semiconductor waveguide layer is less than the distance between second heat radiator and core part.