Power electronics substrate, power module comprising the power electronics substrate, and method for producing an ultrasonic joint of an electrical component on the power electronics substrate
The use of a ferromagnetic-backed power electronics substrate with a magnetic clamping system addresses inefficiencies in ultrasonic bonding by providing robust clamping and vibration damping, improving connection quality and production efficiency.
DE102023136785A1Pending Publication Date: 2025-07-03SEMIKRON DANFOSS GMBH
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Patent Information
- Application Number
- DE102023136785
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2025-07-03
AI Technical Summary
Technical Problem
Existing clamping systems for ultrasonic bonding in power electronics substrates face limitations in providing sufficient clamping force, vibration damping, and substrate deformation compensation, leading to inefficient energy transfer and reduced connection quality.
Method used
A power electronics substrate with a ferromagnetic back layer embedded in a non-magnetic matrix, supported by a magnetic clamping system, which provides high clamping forces and uniform support, minimizing vibrations and substrate deformation.
Benefits of technology
Enhances connection quality by distributing shear forces evenly, reducing energy losses, and increasing production efficiency while minimizing substrate warpage and vibration-related damage.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to a power electronics substrate having a front layer on which electronic components can be electrically connected to each other or to the front layer using an ultrasonic joining process. A ferromagnetic material forms a back layer, or the ferromagnetic material is embedded in the substrate.
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