TRANSFER TOOL AND METHOD FOR TRANSFERRING SEMICONDUCTOR CHIPS
DE112019005434B4Active Publication Date: 2025-03-27OSRAM OPTO SEMICON GMBH & CO OHG
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Patent Information
- Application Number
- DE112019005434
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2018-10-30
- Filing Date
- 2019-10-24
- Publication Date
- 2025-03-27
- Estimated Expiration
- 2039-10-24
Abstract
Transfer tool (1) for transferring a large number of semiconductor chips (2) with - an adhesive stamp (3) which has a plurality of adhesion surfaces (4) for receiving semiconductor chips (2), and - a device (15) for adjusting the area of the adhesion surfaces (4), wherein - the adhesive stamp (3) is designed to be deformable, - the adhesion surfaces (4) are formed by a part of the outer surface of the adhesive stamp (3), - the surface area of the adhesive surfaces (4) is adjustable by deformation of the adhesive stamp (3), and - the adhesion surfaces (4) are formed without interruption.
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