Micro-controlled environment carrier with pedestals

EP4523246A1Pending Publication Date: 2025-03-19BOSCHMAN TECH
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Patent Information

Application Number
EP2023722412
Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-05-13
Filing Date
2023-05-02
Publication Date
2025-03-19

AI Technical Summary

Technical Problem

The sintering process for components like power ICs and other metallic parts is hindered by rapid oxidation at high temperatures, leading to degraded quality and contamination due to oxygen and contaminants in the atmosphere, and the frequent atmosphere changes in processing chambers are time-consuming.

Method used

A component carrier with movable pedestals and a gas-impermeable foil that creates a closed cavity around components, allowing for continuous inert gas flow and thermal contact, reducing oxidation and contamination while optimizing processing time.

Benefits of technology

This solution reduces processing time, minimizes contamination, and prevents undesired chemical reactions by maintaining a consistent inert gas atmosphere around components during the sintering process, enhancing the quality of processed components.

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Abstract

The invention provides a component carrier (200) and a method thereof for carrying one or more components (20) to be processed in a component processing apparatus like a press sintering apparatus, and comprising a component support (210). The component support (210) comprises one or more positioning openings (213) formed through the component support (210) from a top surface (210a) of the component support to a bottom surface (210b) of the component support, wherein each positioning opening (213) defines a component position for holding a component to be processed and a component held in the component position is exposed at the top surface (210a) of the component support, and, one or more movable pedestals (212) associated with the one or more positioning openings (213), respectively, wherein each movable pedestal (212) is received within the associated positioning openings (213) for moving along a direction A between the top and bottom surfaces of the component support (210) to bring a top end (212a) of the movable pedestal into and out of contact with a component held in the component position defined by the positioning opening (213), and wherein a bottom end (212b) of each pedestal is exposed at a bottom surface (210b) of the component support for contacting a heat source for heating the pedestal (212) and the respective component when in contact with the pedestal (212).
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