Laminated header for a microchannel heat exchanger

The laminated header design for microchannel heat exchangers addresses maldistribution issues by ensuring uniform fluid flow and consistent mixing of phases, improving heat transfer efficiency and reducing pressure drop.

EP4617604A1Active Publication Date: 2025-09-17CARRIER CORP
4 Cites 0 Cited by

Patent Information

Application Number
EP2025162319
Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-11
Filing Date
2025-03-07
Publication Date
2025-09-17
Estimated Expiration
2045-03-07

AI Technical Summary

Technical Problem

Maldistribution of two-phase flow at the inlet of heat exchange tubes in microchannel heat exchangers leads to uneven refrigerant distribution and variations in local heat transfer rates, particularly in vertical headers where gravity affects the mixing of liquid and vapor.

Method used

A laminated header design for microchannel heat exchangers, comprising stacked plates with specific bore-holes, cut-out sections, and slots, which ensures uniform fluid flow into microchannel tubes by maintaining consistent mass flow rates and preventing liquid separation under gravity, achieved through parallel stacking and brazing of plates to form a leak-proof connection.

Benefits of technology

The laminated header design ensures uniform fluid distribution to microchannel tubes, maintaining consistent mixing of liquid and vapor, reducing pressure drop, and enhancing the overall performance and efficiency of the heat exchanger while being cost-effective and easy to manufacture.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

A laminated header (100) for a microchannel heat exchanger comprises a first plate (102) comprising a first bore-hole (102-1), a second plate (104) comprising a first cut-out section (104-1), wherein a volume of the first cut-out section (104-1) along the length decreases in a direction away from the first bore-hole (102-1), a third plate (106) comprising a plurality of second bore-holes (106-1), a fourth plate (108) comprising a plurality of second cut-out sections (108-1), and a fifth plate (110) comprising a plurality of slots (S). The second plate (104) is parallel and between the first plate (102) and the third plate (106), and the fourth plate (108) is parallel and between the third plate (106) and the fifth plate (110). The first cut-out section (104-1) fluidically connects the first bore-hole (102-1) to each of the second bore-holes (106-1) and the second cut-out sections (108-1) fluidically connects the second bore-holes (106-1) to the second slots (S). The stacked header (100) is configured to fluidically connect the first bore-hole (102) to microchannel tubes (112).
Need to check novelty before this filing date? Find Prior Art