Game machine
Patent Information
- Application Number
- JP2023134962
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-08-22
- Publication Date
- 2025-07-28
- Estimated Expiration
- 2043-08-22
Abstract
Claims
【Claim 1】 A gaming machine having a plurality of substrates on which a plurality of electronic components are mounted, comprising a specific substrate having a solid ground and substantially the entire surface of the substrate on which the plurality of electronic components are mounted being covered with a resist film, wherein on the specific substrate, a plurality of test points used for inspecting the electronic components to be mounted, a signal wiring pattern, a wiring connection through-hole for electrically connecting the signal wiring pattern formed on the front substrate surface of the specific substrate and the signal wiring pattern formed on the back substrate surface of the specific substrate, and a wiring connection land portion formed so as to be positioned around the wiring connection through-hole and connected to the signal wiring pattern configured with a constant pattern width are formed, wherein a specific test point among the plurality of test points includes a specific land portion for testing and a thermal pattern formed so as to be positioned around the specific land portion for testing and connecting the specific land portion for testing and the solid ground of the specific substrate, wherein a special test point among the plurality of test points has a special land portion for testing connected to the signal wiring pattern configured with a constant pattern width, wherein at least a part of the wiring connection land portion and the special land portion for testing has a soldering-impossible portion that is covered with the resist film and is made impossible to solder, furthermore, a plurality of the specific test points are provided on at least one substrate surface of the specific substrate, among the plurality of solid ground through-holes formed on the specific substrate and electrically connecting the front solid ground formed on the front substrate surface of the specific substrate and the back solid ground formed on the back substrate surface of the specific substrate, at least one of the solid ground through-holes is formed in the vicinity without sandwiching the electronic components and the signal wiring pattern between the solid ground through-hole and the specific test point A gaming machine characterized by the above.