Game machine
Patent Information
- Application Number
- JP2023134963
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-08-22
- Publication Date
- 2025-07-28
- Estimated Expiration
- 2043-08-22
Abstract
Claims
【Claim 1】 A gaming machine having a plurality of substrates on which a plurality of electronic components are mounted, comprising a specific substrate having a solid ground and having substantially the entire surface of the substrate on which the plurality of electronic components are mounted covered with a resist film, wherein on the specific substrate, a plurality of test points used for inspecting the mounted electronic components, a signal wiring pattern, a wiring connection through-hole for electrically connecting the signal wiring pattern formed on the front substrate surface of the specific substrate and the signal wiring pattern formed on the back substrate surface of the specific substrate, a wiring connection land portion formed so as to be positioned around the wiring connection through-hole and connected to the signal wiring pattern configured with a constant pattern width are formed, a specific test point among the plurality of test points includes a test-specific land portion and a thermal pattern formed so as to be positioned around the test-specific land portion and connecting the test-specific land portion and the solid ground of the specific substrate, a special test point among the plurality of test points has a test-specific special land portion connected to the signal wiring pattern configured with a constant pattern width, the wiring connection land portion and the test-specific special land portion have a soldering-impossible portion at least partially covered with the resist film and made impossible to solder, furthermore, on the specific substrate, a plurality of solid ground through-holes for electrically connecting the front solid ground formed on the front substrate surface of the specific substrate and the back solid ground formed on the back substrate surface of the specific substrate are formed, and at least one of the solid ground through-holes is formed in the vicinity without sandwiching the electronic components and the signal wiring pattern between it and the specific test point, a notation portion indicating a test point is provided in the vicinity of the special test point, and a notation portion of the same form is also provided in the vicinity of the specific test point A gaming machine characterized by the above.