Emboss film
The embossed polybutylene terephthalate film maintains surface unevenness shape integrity under heat loading by ensuring the peak temperature of the endothermic reaction occurs at or below the melting point, addressing the challenge of shape retention in heat-loaded conditions.
JP2025037728APending Publication Date: 2025-03-18KOHJIN FILM & CHEM
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Patent Information
- Application Number
- JP2023144829
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-06
- Publication Date
- 2025-03-18
AI Technical Summary
Technical Problem
Existing embossed polybutylene terephthalate films struggle to maintain surface unevenness shape integrity under heat loading conditions, such as those encountered in heating pressing processes.
Method used
An embossed film with a peak temperature of the endothermic reaction occurring at or below the melting point temperature, produced using a differential scanning calorimeter (DSC) analysis, which ensures the film maintains its surface unevenness even under high heat loads.
Benefits of technology
The embossed film effectively retains its surface irregularity shape during heat loading, ensuring consistent performance in applications like decorative transfer films, shaping process films, and semiconductor encapsulating release films.
✦ Generated by Eureka AI based on patent content.
Abstract
To provide an embossed film made of polybutylene terephthalate film with minimal change in shape of surface irregularities due to a thermal load during processing or use.SOLUTION: An embossed film 2 has irregularities on at least one surface of a polybutylene terephthalate film, wherein a peak temperature of an endothermic reaction that is developed at a temperature of the endothermic reaction associated with melting at the melting point of the film or lower is 150°C or higher in a temperature rise analysis by a differential scanning thermal analyzer (DSC) at a rate of 10°C / min. The embossed film can be suitably used as a base material such as a transfer film for heating, a process film for forming, and a semiconductor sealing release film.SELECTED DRAWING: Figure 1
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