Semiconductor device

Abstract

To reduce the spread of peeling of a sealing member inside a case.SOLUTION: A connection terminal (internal wiring portion 17a) has an upper surface 17a5, a lower surface 17a6, and an outer portion, and includes a wire connection area to which a bonding wire 20 is connected, a recess 17a2 offset from a part of the inner wall portion 17a4 and a part of the upper surface 17a5, and a protrusion 17a3 adjacent to the recess 17a2 on a creeping surface extending from the recess 17a2 to the wire connection area at one end of the upper surface 17a5. A case (arrangement portion 16d) includes a fixing portion 16f that contacts the lower surface 17a6, the outer portion, and the recess 17a2 of the connection terminal 17 and extends from the inner wall portion 17a4 through the recess 17a2 above the upper surface 17a5 and the protrusion 17a3 of the internal wiring portion 17a, and arranges the wire connection area, the recess 17a2, and the protrusion 17a3 inside.SELECTED DRAWING: Figure 4