Thermal storage unit status monitoring system
The condition monitoring system for heat storage units in semiconductor manufacturing systems addresses the lack of monitoring capabilities by using temperature sensors and a monitoring unit to detect deterioration, thereby maintaining efficiency and reducing chiller load.
JP2025043006APending Publication Date: 2025-03-28CKD CORP
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Patent Information
- Application Number
- JP2023150272
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-15
- Publication Date
- 2025-03-28
AI Technical Summary
Technical Problem
Existing heat storage units in semiconductor manufacturing systems lack a monitoring system to detect deterioration, leading to reduced heat exchange efficiency and increased load on chiller devices.
Method used
A condition monitoring system that includes a return circuit with a heat storage unit, temperature sensors to measure fluid temperature changes, and a monitoring unit that determines the state of the heat storage unit based on temperature changes, allowing for early detection of deterioration.
Benefits of technology
The system effectively monitors the condition of the heat storage unit, enabling early detection of deterioration, maintaining heat exchange efficiency, and reducing the load on chiller devices.
✦ Generated by Eureka AI based on patent content.
Abstract
To monitor the status of a heat storage unit disposed in a return circuit that returns a heat medium from a controlled object to a chiller device, and to detect deterioration of the heat storage unit in advance.SOLUTION: A monitoring system 30 is used for a heat exchange system 1 in which a low-temperature heat storage unit 4A is disposed in a low-temperature fluid return circuit L62 that returns a temperature control fluid from a temperature control member 110 to a low-temperature chiller device 120A, and a high-temperature heat storage unit 4B is disposed in a high-temperature fluid return circuit L72 that returns the temperature control fluid from the temperature control member 110 to a high-temperature chiller device 120B. The monitoring system 30 uses a low-temperature inflow temperature sensor 32, a low-temperature outflow temperature sensor 33, a high-temperature inflow temperature sensor 34, and a high-temperature outflow temperature sensor 35 to measure fluid temperature of the temperature control fluid flowing through a low-temperature heat storage unit 4A and a high-temperature heat storage unit 4B, and determines the status of the low-temperature heat storage unit 4A and the high-temperature heat storage unit 4B based on the temperature change.SELECTED DRAWING: Figure 1
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