Printed circuit board and manufacturing method for the same
The method addresses the challenges of adhesion and transmission losses in printed circuit boards by using reduced-pressure plasma treatment and plating, resulting in cost-effective and high-quality boards suitable for high-speed communication.
Patent Information
- Application Number
- JP2023162457
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-26
- Publication Date
- 2025-04-07
AI Technical Summary
Existing methods for manufacturing printed circuit boards using low dielectric constant materials like liquid crystal polymers or fluororesins face challenges such as poor adhesion, high transmission losses, and increased manufacturing costs, making them unsuitable for high-speed communication applications.
A method involving reduced-pressure plasma treatment of the substrate surface, followed by printing a base layer and subsequent plating to form a circuit, which enhances adhesion and reduces transmission losses while maintaining low manufacturing costs.
The method effectively improves the adhesion of the circuit to the substrate, reduces surface unevenness, and lowers manufacturing costs, enabling the use of printed circuit boards in high-speed communication applications.