Pump with pressure chamber and cooling system

JP2025508225A5Pending Publication Date: 2026-03-23KNF NEUBERGER
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Patent Information

Application Number
JP2024555163
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-03-16
Filing Date
2023-03-16
Publication Date
2026-03-23

AI Technical Summary

Technical Problem

Existing pump cooling systems are inefficient and require complex configurations, which can lead to reduced pump output and increased mechanical stress due to inadequate heat dissipation, especially at high volume flow rates and pressures.

Method used

The use of at least one heat tube with a housing contact area for thermal conductivity with the pump housing and a cooling body contact area for thermal conductivity with a cooling body, allowing for efficient heat transfer from the housing to the cooling body, thereby enhancing cooling efficiency.

Benefits of technology

This configuration achieves high cooling efficiency, allowing for higher volume flow rates and power density while maintaining temperature limits, thus preventing mechanical stress and optimizing pump performance.

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Abstract

The present invention relates to a pump 1 having a housing 3 surrounding a pressure chamber 2. The pressure chamber 2 has a pressure chamber intake pipe 4 and a pressure chamber exhaust pipe 5 arranged at a distance therefrom. A fluid flowing into the pressure chamber 2 through the pressure chamber intake pipe 4 is pressurized by a displacement part arranged displaceably in the pressure chamber 2, and flows out of the pressure chamber 2 through the pressure chamber exhaust pipe 5. The pump 1 further has a cooling system for cooling the housing 3. The cooling system has at least one heat pipe 12 with a heat transfer medium fluid and at least one cooling body 8. The at least one heat pipe 12 has a housing contact area 13 for bringing the heat pipe 12 into thermally conductive contact with the housing 3, and a cooling body contact area 14 arranged at a distance from the housing contact area 13 for bringing the heat pipe 12 into thermally conductive contact with the at least one cooling body 8. Heat of the housing 3 is transferred from the housing 3 to the at least one cooling body 8 through the at least one heat pipe 12 during a given use of the cooling system.
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