Process Management System

The process management system addresses the issue of inconsistent parameter settings by classifying and verifying processing parameters, ensuring uniformity and consistency in semiconductor manufacturing.

JP2026095944APending Publication Date: 2026-06-12SUMCO CORP

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SUMCO CORP
Filing Date
2024-12-02
Publication Date
2026-06-12

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    Figure 2026095944000001_ABST
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Abstract

The system also provides a simple way to verify whether the input information is correct for processing parameters that must be changed sequentially within the recipe set in the processing unit. [Solution] When the recipe management device 5 checks whether each processing parameter of recipe R stored in the processing device 2 matches each processing parameter of the regular recipe R, it reads each processing parameter of recipe R stored in the processing device 2 to be checked, and also reads the fixed parameter FP stored in the database 3 and the variable parameter VP stored in the electronic form 4, which is associated with the matrix data MD, and compares these processing parameters to check whether they match.
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Description

【Technical Field】 【0001】 The present invention relates to a process management system having a recipe management function. 【Background Art】 【0002】 A process management system such as a semiconductor device manufacturing system is configured to execute a process according to a recipe in order to produce semiconductor device products. A recipe refers to individual processing conditions of a device regarding a process sequence and control parameters. A recipe prepared in advance by a designer or the like of a semiconductor device product is stored in the process management system, and subsequent process control is executed according to the stored recipe. 【0003】 In order to improve the efficiency of recipe creation work, when creating a new recipe or editing an existing recipe, recipe setting information highly relevant to specified conditions is retrieved from information in an existing recipe file and know-how information on accumulated recipe settings, and a recipe file is created and edited based on the retrieved recipe file information and recipe setting know-how information. A recipe setting support method for a semiconductor inspection device is known (Patent Document 1). 【Prior Art Documents】 【Patent Documents】 【0004】 【Patent Document 1】 Japanese Unexamined Patent Application Publication No. 2011-134931 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0005】 The conventional technology described above allows for quick access to existing recipe file information, and enables efficient creation of new recipes and editing of existing ones. However, some recipes set in processing equipment such as semiconductor inspection devices have processing parameters that must be changed sequentially due to variations between machines or changes in conditions caused by maintenance. However, the conventional technology cannot verify whether the input parameters are the latest and correct information, and therefore, there is a problem in that uniform products cannot be mass-produced due to variations between machines or variations in the condition of the processing equipment. 【0006】 The problem that this invention aims to solve is to provide a process management system that has a recipe management function that can easily verify whether the input information is correct, even for processing parameters that must be changed sequentially as described above, within the recipe set in the processing device. [Means for solving the problem] 【0007】 The present invention comprises a plurality of processing devices, a database, an electronic form that can change the latest information within a predetermined range, and a recipe management device. A process management system that controls the operation of each of the plurality of processing devices based on a recipe that defines the processing parameters of each of the plurality of processing devices, The processing parameters of the aforementioned recipe are classified into either fixed parameters that cannot be changed or variable parameters whose information can be changed within a predetermined range. The processing items corresponding to the variable parameters stored in the database are associated with the variable parameters of the electronic form. The aforementioned recipe management device is The processing parameters of the recipe stored in the processing device to be compared are read, and the fixed parameters stored in the database are compared with the processing parameters classified as fixed parameters to determine whether they match. The above problem is solved by a process management system that reads the variable parameters of the electronic document and compares them with processing parameters classified as such stored in a database to determine whether they match. 【0008】 In the above invention, matrix data of processing parameters, including the fixed parameters and the variable parameters, can be stored in the database. 【0009】 In the above invention, the variable parameter can be modified to change information within a predetermined numerical range. 【0010】 In the above invention, the processing apparatus is If the processing parameters classified as fixed parameters in the recipe stored in the processing device to be compared do not match the fixed parameters stored in the database, the fixed parameters stored in the processing device to be compared are set to the fixed parameters stored in the database. If the processing parameters classified as variable parameters in the recipe stored in the processing device to be compared do not match the variable parameters stored in the electronic document, it is more preferable to set the variable parameters stored in the processing device to be compared to the fixed parameters stored in the electronic document. 【0011】 In the above invention, it is more preferable that the recipe management device performs a matching process until the processing parameters classified as fixed parameters of the recipe stored in the processing device to be matched match the fixed parameters stored in the database. 【0012】 In the above invention, it is more preferable that the recipe management device performs a matching process until the processing parameters classified as variable parameters of the recipe stored in the processing device to be matched match the variable parameters stored in the electronic form. 【0013】 The above problems can also be solved by a method for managing a semiconductor process that uses the process management system according to the above invention to manage the semiconductor process. 【0014】 The above problems can also be solved by a method for manufacturing an epitaxial wafer that uses the process management system according to the above invention to manufacture the epitaxial wafer. 【Advantages of the Invention】 【0015】 According to the present invention, among the recipes set in the process management system, it is possible to easily verify whether the processing parameters that must be sequentially changed due to changes in conditions caused by differences between machines, maintenance, etc. are correct. Therefore, it is possible to suppress differences between machines and variations in the conditions of processing apparatuses and mass-produce uniform products. 【Brief Description of the Drawings】 【0016】 [Figure 1] It is a block diagram showing a process management system according to an embodiment of the present invention. [Figure 2] It is a diagram showing a recipe of a processing apparatus according to an embodiment of the present invention. [Figure 3] It is a diagram showing matrix data of a recipe stored in a database according to an embodiment of the present invention. [Figure 4] It is a diagram showing variable parameters of a recipe stored in an electronic form according to an embodiment of the present invention. [Figure 5] It is a diagram showing a screen displayed on a terminal device during the verification process executed by a recipe management device according to an embodiment of the present invention. [Figure 6] It is a conceptual diagram for explaining the verification process executed by a recipe management device according to an embodiment of the present invention. 【Embodiments for Carrying Out the Invention】 【0017】 Hereinafter, exemplary embodiments for implementing the present invention will be described while referring to the drawings. FIG. 1 is a block diagram showing a process management system according to an embodiment of the present invention. The process management system 1 of the present embodiment includes a plurality of processing devices 2, a database 3, an electronic form 4, and a recipe management device 5. 【0018】 As the processing device 2, for example, a manufacturing device for semiconductor devices can be exemplified. However, any device that controls its operation using a recipe that defines various processing parameters (information regarding processing conditions) of the processing device 2 is included in the processing device of the present invention. In the following embodiments, the present invention will be described by taking a single wafer type chemical vapor deposition device (CVD device) as an example of the processing device 2. 【0019】 The single wafer type chemical vapor deposition device for manufacturing a silicon epitaxial wafer exemplified in the present embodiment mounts silicon single crystal wafers one by one on a susceptor provided in a reaction furnace, heats and controls the inside of the reaction furnace so that the temperature of the surface of the silicon single crystal wafer is within a predetermined temperature range, rotates the silicon single crystal wafer at a constant speed via the susceptor, dilutes a silicon reaction gas such as trichlorosilane with a carrier gas such as hydrogen gas, and supplies a mixed gas in which a dopant such as diborane (B2H6) is mixed in a trace amount into the reaction furnace as needed, thereby growing a silicon epitaxial layer on the surface of the silicon single crystal wafer by vapor phase growth. Hereinafter, it is also simply referred to as the processing device 2. 【0020】 FIG. 2 is a diagram showing a recipe R of the processing device 2 (a single wafer type chemical vapor deposition device for manufacturing a silicon epitaxial wafer) according to an embodiment of the present invention. In the recipe R shown in FIG. 2, the step numbers are defined as 1 to 6 in the first row, and the names of the respective steps are defined as purge (pre-exhaust in the reaction furnace), lamp (start-up of the heater), bake (heating and holding), deposition (vapor phase growth process), post purge (post-exhaust in the reaction furnace), and cool (cooling of the reaction furnace) in the second row. Also, the processing time for each step from step 1 to 6 is defined in the third row, and the flow rate of the reaction gas in the deposition step of step 4 is defined in the fourth row. 【0021】 Furthermore, in the fifth row of recipe R shown in Figure 2, the dopant flow rates for step 3 (bake) and step 4 (deposition) are specified, and in the sixth row, the hydrogen carrier gas flow rates for each step from step 1 to 6 are specified. In addition, in the seventh row, the operation of the reactor exhaust valve (vent and deposit) for each step from step 1 to 6 is specified, and in the eighth row, the susceptor rotation speed (i.e., wafer rotation speed) for each step from step 1 to 6 is specified. Note that in the matrix data shown in the figure, the data filled in gray is called fixed parameter FP, which is determined for each product being manufactured and cannot be changed, while the data enclosed in a bold frame is called variable parameter VP, which is a parameter that can be changed depending on the number of processing unit 2, or even between units or depending on the conditions of the same processing unit 2. 【0022】 For example, in the third row of recipe R shown in Figure 2, the step times for each of the steps—purge (pre-emption of the reactor), ramp (startup of the heater), bake (heating and holding), post-purge (post-emption of the reactor), and cool (cooling of the reactor)—are fixed parameters FP that cannot be changed, while the step time for the deposition (vapor phase growth treatment) step is a variable parameter VP that can be changed only between 100 and 160 seconds. 【0023】 Similarly, the reaction gas flow rate in the deposition (vapor phase growth treatment) step in the 4th row of recipe R shown in Figure 2, the dopant flow rate in the bake (heating and holding) and deposition (vapor phase growth treatment) steps in the 5th row, the hydrogen carrier gas flow rate in the bake (heating and holding), deposition (vapor phase growth treatment), and post-purge (reactor exhaust) steps in the 6th row, and the susceptor rotation speed in the bake (heating and holding), deposition (vapor phase growth treatment), post-purge (reactor exhaust), and cool (reactor cooling) steps in the 7th row are variable parameters VP that can be changed within a predetermined range shown in the same figure. 【0024】 Returning to Figure 1, the database 3 of this embodiment stores a matrix data MD of processing parameters, including fixed parameters FP, for each processing unit R, which is a recipe R for each processing unit 2. Furthermore, processing items corresponding to variable parameters VP among the matrix data MD stored in database 3 are stored in database 3 in association with the variable parameters VP described in electronic form 4. The information in electronic form 4 is rewritable, and the information of the variable parameters VP that is considered correct is entered when maintenance of the processing unit 2 is completed or when a product is switched over. In addition, the information in electronic form 4 can be changed even in the process of manufacturing the product due to changes in product quality, etc. Figure 3 is a diagram showing the matrix data MD of recipe R stored in database 3 according to one embodiment of the present invention. 【0025】 As shown in Figure 3, among the matrix data MD stored in database 3, the fixed parameter FP contains specific processing conditions, such as numerical values ​​(time, flow rate, rotational speed, etc.) or specific control signals (Vent or Deps). These processing items are read directly into the controller of the corresponding processing unit 2 and set. 【0026】 In contrast, for the variable parameter VP in the matrix data MD stored in database 3, no specific numerical values ​​or specific control signals representing the processing conditions are entered. Since the specific numerical values ​​or specific control signals representing the processing conditions of the variable parameter VP are described in electronic document 4, instead of entering specific parameters for the variable parameter VP in the matrix data MD stored in database 3, keywords that associate with the variable parameter VP described in electronic document 4 are entered. 【0027】 For example, as shown in the matrix data MD in Figure 3, the step time in step 4 is entered with the keyword "growth time", the reaction gas flow rate in step 4 is entered with the keyword "TCS set value", the dopant flow rates in steps 3 and 4 are entered with the keyword "Dopant set value", the hydrogen gas flow rates in steps 3 to 5 are entered with the keyword "hydrogen set value", and the susceptor rotation speed in steps 3 to 6 is entered with the keyword "rotation set value". 【0028】 Returning to Figure 1, the electronic form 4 of this embodiment lists the variable parameters of the recipe R for each processing unit 2. Figure 4 is a diagram showing the variable parameters VP of the recipe R listed in the electronic form 4 according to one embodiment of the present invention. The left side of Figure 4 shows the variable parameters VP of processing unit A, and the right side of Figure 4 shows the variable parameters VP of processing unit B, which is different from processing unit A. As shown in Figure 4, the variable parameters VP listed in the electronic form 4 are stored with the setting values ​​of the variable parameters VP for five items, that is, numerical values ​​or specific control signals that are specific processing conditions. These items, growth time, TCS setting value, Dopant setting value, hydrogen setting value, and rotation setting value, correspond to the keywords shown in Figure 3. The variable parameters VP of the recipe R stored in the electronic form 4 are not only set for each processing unit 2, but are also modified sequentially at times such as when setting manufacturing conditions after maintenance. For example, the growth time for processing unit A is entered as 120 in Figure 4, but can be modified to 118 after maintenance. 【0029】 Next, we will explain the procedure for verifying processing parameters. The recipe management device 5 of this embodiment can verify whether each processing parameter of recipe R stored in the processing device 2 matches each processing parameter of the regular recipe R. In this verification procedure, first, the recipe management device 5 reads each processing parameter of recipe R stored in the processing device 2 to be verified, and verifies whether the fixed parameter FP of the matrix data MD stored in the database 3 matches the value corresponding to the fixed parameter of the read recipe R. If the result of this verification does not match, the processing device 2 re-verifies recipe R and sets the correct recipe R. After setting the correct recipe R, the recipe management device 5 verifies again whether each processing parameter of recipe R stored in the processing device 2 matches each processing parameter of the regular recipe R. This verification process is carried out until the values ​​corresponding to the fixed parameters of recipe R match. 【0030】 If, as a result of the above comparison, the fixed parameter FP of the matrix data MD stored in database 3 matches the fixed parameter of recipe R read from processing unit 2, then the recipe management device 5 reads the variable parameter VP stored in electronic form 4 and associated with the same matrix data MD as the fixed parameter FP, and compares whether the variable parameter VP of the matrix data MD matches the value corresponding to the variable parameter of recipe R read from processing unit 2. If, as a result of this comparison, the variable parameter VP of the matrix data MD stored in database 3 matches each processing parameter of recipe R stored in processing unit 2, processing unit 2 executes processing according to the currently set processing parameters of recipe R. On the other hand, if the comparison does not result in a match, processing unit 2 replaces the value corresponding to the variable parameter of recipe R with the value of the variable parameter VP stored in electronic form 4. After replacing the value of the variable parameter VP, a re-comparison is performed. This comparison process is continued until the values ​​corresponding to the variable parameters of recipe R match. 【0031】 However, due to manufacturing variations in the processing unit 2, it may be necessary to tune the variable parameters VP written to recipe R before or during operation. If the variable parameters VP of recipe R are changed from the initial settings due to maintenance or other reasons, the processing unit 2 sends the changed variable parameters VP to electronic report 4, and the electronic report 4, upon receiving it, updates the variable parameters VP along with the update date and time. 【0032】 Furthermore, the update process for the variable parameter VP of the electronic form 4 may be forgotten, and processing parameters, including the fixed parameter FP set in the processing unit 2, may be changed for some reason. Therefore, before manufacturing a product based on the recipe R in each processing unit 2, it is necessary to check whether the set processing parameters are the latest and correct parameters. For this purpose, a processing parameter verification process is performed using a terminal device such as the one shown in Figure 5. 【0033】 Figure 5 shows a screen displayed on a terminal device during a matching process performed by a recipe management device 5 according to one embodiment of the present invention, and Figure 6 is a conceptual diagram illustrating the matching process performed by a recipe management device 5 according to one embodiment of the present invention. As shown in Figure 5, when the matching function program of the recipe management device 5 is executed, a matching window 51 appears, and when the processing device 2 displayed there is selected and the recipe matching button is clicked, the matching process described above is started (matching window 52 during matching). 【0034】 Specifically, as shown in Figure 6, the recipe management device 5 reads each processing parameter of recipe R1 stored in the processing device 2 to be compared, and compares whether the fixed parameters of the matrix data MD stored in the database 3 match the values ​​of the fixed parameters of recipe R1 stored in the processing device 2. Furthermore, it reads the variable parameter VP associated with the same matrix data MD as the fixed parameter FP described in the electronic form 4. Then, it compares whether the variable parameter VP of recipe R1 stored in the processing device 2 matches the regular recipe R variable parameter VP associated with the same matrix data MD as the fixed parameter FP described in the electronic form 4. 【0035】 If the processing parameters FP and VP of recipe R1 stored in the processing unit 2 perfectly match the regular processing parameters FP and VP stored in database 3 and electronic document 4, the matching window 53 will display "Match OK" and "Production Possible," as shown in Figure 5. Conversely, if the processing parameters FP and VP of recipe R1 stored in the processing unit 2 do not perfectly match the regular processing parameters FP and VP stored in database 3 and electronic document 4, that is, if even one processing parameter is different, the matching window 54 will display "Match NG" and a message prompting reconfirmation, as shown in Figure 5. 【0036】 As described above, the process management system 1 of this embodiment allows for easy verification of whether the variable parameter VP, which must be changed sequentially in response to changes in the condition of the processing unit 2, is entered with the latest and correct information by comparing it with the electronic form 4. This suppresses variations in condition and enables mass production of uniform products. Furthermore, by storing the fixed parameter FP and the variable parameter VP as the same matrix data MD, the fixed parameter FP and the variable parameter VP can be managed using the same interface. [Explanation of Symbols] 【0037】 1…Process Management System 2… Processing device 3…Database 4…Electronic forms 5… Recipe management device 51-54... Matching window R... Recipe FP…Fixed parameters VP… Variable parameter MD... Matrix Data

Claims

[Claim 1] It comprises multiple processing units, a database, electronic forms that can change the latest information within a predetermined range, and a recipe management device. A process management system that controls the operation of each of the plurality of processing devices based on a recipe that defines the processing parameters of each of the plurality of processing devices, The processing parameters of the aforementioned recipe are classified into either fixed parameters that cannot be changed or variable parameters whose information can be changed within a predetermined range. The processing items corresponding to the variable parameters stored in the database are associated with the variable parameters of the electronic form. The aforementioned recipe management device is The processing parameters of the recipe stored in the processing device to be compared are read, and the fixed parameters stored in the database are compared with the processing parameters classified as fixed parameters to determine whether they match. A process management system that reads the variable parameters of the aforementioned electronic document and compares them with processing parameters classified as such stored in a database to determine whether they match. [Claim 2] The process management system according to claim 1, wherein a matrix data of processing parameters, including the fixed parameters and the variable parameters, is stored in the database. [Claim 3] The process management system according to claim 1, wherein the variable parameters can be modified within a predetermined numerical range. [Claim 4] The aforementioned processing apparatus is If the processing parameters classified as fixed parameters in the recipe stored in the processing device to be compared do not match the fixed parameters stored in the database, the fixed parameters stored in the processing device to be compared are set to the fixed parameters stored in the database. The process management system according to claim 1, wherein if the processing parameters classified as variable parameters in the recipe stored in the processing device to be compared do not match the variable parameters stored in the electronic form, the variable parameters stored in the processing device to be compared are set to the fixed parameters stored in the electronic form. [Claim 5] The process management device according to claim 4, wherein the recipe management device performs a matching process until the processing parameters classified as fixed parameters of the recipe stored in the processing device to be matched match the fixed parameters stored in the database. [Claim 6] The process management device according to claim 4, wherein the recipe management device performs a matching process until the processing parameters classified as variable parameters of the recipe stored in the processing device to be matched match the variable parameters stored in the electronic form. [Claim 7] A method for managing a semiconductor process, which involves managing a semiconductor process using the process management system described in any one of claims 1 to 6. [Claim 8] A method for manufacturing an epitaxial wafer, comprising manufacturing an epitaxial wafer using the process management system described in any one of claims 1 to 6.