Siloxane compositions for low-temperature bonding

Abstract

Organosiloxane compositions that cure by catalytic hydrosilylation are provided. These curable organosiloxane compositions exhibit excellent adhesion at low temperatures to various substrates in contact with the composition during curing.

Description

[Technical Field] 【0001】 This application claims priority to U.S. Provisional Patent Application No. 63 / 469,849, filed on 31 May 2023, the disclosure of which is incorporated herein by reference in whole. 【0002】 Polyorganosiloxane elastomers, adhesives, and gels, such as polydimethylsiloxane-based elastomers, are frequently used in the electronics industry due to their properties, including thermal stability, environmental stability, and ability to relieve stress over a wide temperature range. Curable organopolysiloxane compositions are widely used as protective compositions for electronic devices and components. The performance requirements in these applications typically involve adhesion of electronic assemblies to metal and plastic surfaces, protecting the assemblies from thermal, environmental, and mechanical stress. [Background technology] 【0003】 In modern society, electronic devices are now ubiquitous. Over time, new electronic devices are generally less expensive than when they were first invented. This has led to the use of thermoplastic elastomers in electronic device connectors and other applications not previously used. Many of these thermoplastic elastomers have low softening points below 100°C. Silicone elastomers, adhesives, and gels that have the ability to self-bond to electronic substrates typically require heating temperatures above 100°C to achieve adhesion to electronic substrates. Therefore, lower curing temperatures are required to ensure adhesion. [Overview of the Initiative] [Problems that the invention aims to solve] 【0004】 Numerous self-bonding platinum-catalyzed hydrosilylated polyorganosiloxane compositions that cure and exhibit adhesive properties by using heat to cure the composition have been reported in the past. Some examples include those described by Mine (US Patent No. 4,082,726), Schulz (US Patent No. 4,087,585), Pouchelon (US Patent No. 8,557,942), and Bohin (US Patent No. 6,562,180). Mine and Schulz use alkoxy, epoxy, and vinyl-functional oligomers as adhesive additives. Pouchelon uses a combination of vinyltrimethoxysilane (VTMO) and 3-glycidoxypropyltrimethoxysilane (GLYMO) to obtain adhesive properties. Bohin uses a similar silane blend with a metal-containing transesterification catalyst to obtain adhesive properties. All of these formulations typically require curing at temperatures above 100°C to obtain adhesive properties. 【0005】 Fujisawa (US Patent No. 11,555,118) and Jandke (US Patent No. 8,314,200) utilize diorganosiloxane additives with only two SiH functional groups as part of the adhesion promoter package in platinum-catalyzed hydrosilylated curing silicone formulations. Fujisawa also uses monosilicon hydride / alkoxy-functional oligomers in addition to other adhesion promoters. Jandke uses alkoxyalphasilane as a second adhesion promoter. Both types of compositions cure at room temperature and exhibit adhesive strength. However, Jandke's product has a very low durometer value, and Fujisawa's material takes more than 8 hours to cure at room temperature. Therefore, a low-curing temperature material without these drawbacks is desired. [Means for solving the problem] 【0006】 The aspects of this disclosure are as follows: (I) An organopolysiloxane / silicone resin blend comprising an organopolysiloxane having at least two alkenyl organic groups on average per molecule, and an MQ silicone resin having at least one alkenyl group per molecule. (II) Organohydrogenpolysiloxanes having more than two silicon-bonded hydrogen atoms on average per molecule, (III) Hydrosilylation catalyst, (IV) at least one alkoxy-functional adhesion promoter, and (V) Trialkoxy-containing siloxane having formula (1) HR 1 2SiOR 1 2Si(CH2) a Si(OR 2 )3(1) (In the formula, R 1 R is a linear or branched alkyl group containing 1 to about 10 carbon atoms, an aryl group containing about 6 to about 10 carbon atoms, or an arylalkyl group containing about 6 to about 12 carbon atoms. 2 (where a is a linear or branched alkyl group containing 1 to approximately 4 carbon atoms, and a is an integer between approximately 1 and 10) A curable organopolysiloxane composition comprising, The present invention relates to a curable organopolysiloxane composition in which the total amount of silicon-bonded hydrogen atoms derived from components (II) and (V) relative to the total number of alkenyl groups in the composition is about 0.3 to 10. 【0007】 Further aspects of this disclosure are: (I) 100 parts of an organopolysiloxane / silicone resin blend comprising an organopolysiloxane having an average of at least two alkenyl organic groups per molecule, and an MQ silicone resin having at least one alkenyl group per molecule (where the MQ resin is approximately 5% to 40% by mass of the composition), (II) Approximately 0.1 to 30 parts of organohydrogenpolysiloxane having an average of more than two silicon-bonded hydrogen atoms per molecule, (III) Hydrosilylation catalyst, (IV) At least one alkoxy-functional adhesion promoter, and (V) From about 0.05 parts to about 10 parts of a trialkoxy-containing siloxane having the formula (2) 【Chemical formula】 (where q is from about 2 to about 6) A curable organopolysiloxane composition comprising: A curable organopolysiloxane composition in which the total amount of silicon-bonded hydrogen atoms derived from components (II) and (V) is from about 0.3 to 10 with respect to the total number of alkenyl groups in the composition. 【0008】 Advantageous improvements of the present invention that can be carried out alone or in combination are defined in the dependent claims. 【0009】 In summary, the following embodiments are proposed as particularly preferred within the scope of the present invention. 【0010】 Embodiment 1: (I) An organopolysiloxane / silicone resin blend comprising an organopolysiloxane having on average at least two alkenyl organic groups per molecule and an MQ silicone resin having at least one alkenyl group per molecule, (II) An organohydrogenpolysiloxane having on average more than two silicon-bonded hydrogen atoms per molecule, (III) A hydrosilylation catalyst, (IV) At least one alkoxy-functional adhesion promoter, and (V) A trialkoxy-containing siloxane having the formula (1) HR 1 2SiOR 1 2Si(CH2)aSi(OR 2 )3(1) (where R 1R is a linear or branched alkyl group containing 1 to about 10 carbon atoms, an aryl group containing about 6 to about 10 carbon atoms, or an arylalkyl group containing about 6 to about 12 carbon atoms. 2 (where a is a linear or branched alkyl group containing 1 to approximately 4 carbon atoms, and a is an integer between approximately 1 and 10) A curable organopolysiloxane composition comprising, A curable organopolysiloxane composition in which the total amount of silicon-bonded hydrogen atoms derived from components (II) and (V) relative to the total number of alkenyl groups in the composition is about 0.3 to 10. 【0011】 Embodiment 2: The curable organopolysiloxane composition according to Embodiment 1, wherein MQ resin is contained in an amount of about 5% to about 40% by mass of the composition. 【0012】 Embodiment 3: A curable organopolysiloxane composition according to Embodiment 1 or 2, comprising about 100 parts by mass of component (I), about 0.1 to about 30 parts by mass of component (II), and about 0.05 to about 10 parts by mass of component (V). 【0013】 Embodiment 4: A curable organopolysiloxane composition according to any one of Embodiments 1 to 3, wherein component (III) is present in a catalytic amount. 【0014】 Embodiment 5: A curable organopolysiloxane composition according to any one of Embodiments 1 to 4, wherein component (V) has formula (2). [ka] (In the formula, q is approximately 2 to approximately 6.) 【0015】 Embodiment 6: The adhesion promoter (IV) is as follows: (IV-1)3-Glycidoxypropyltrimethoxysilane, (IV-2) Vinyltriethoxysilane, and (IV-3) Alkoxysilane-containing molecules having more than two trialkoxysilane groups per molecule A curable organopolysiloxane composition according to any one of Embodiments 1 to 5, comprising at least one selected from the following. 【0016】 Embodiment 7: (VI) A curable organopolysiloxane composition according to any one of Embodiments 1 to 6, further comprising a curing rate inhibitor. 【0017】 Embodiment 8: (VII) A curable organopolysiloxane composition according to any one of Embodiments 1 to 7, further comprising at least one inorganic filler. 【0018】 Embodiment 9: The curable organopolysiloxane composition according to Embodiment 8, wherein at least one inorganic filler is selected from the group consisting of fumed silica, quartz, aluminum oxide, and combinations thereof. 【0019】 Embodiment 10: A curable organopolysiloxane composition according to any one of Embodiments 1 to 9, which is curable at room temperature or by heat curing. 【0020】 Embodiment 11: A curable organopolysiloxane composition according to any one of Embodiments 1 to 10, comprising one or two parts. 【0021】 Embodiment 12: The curable organopolysiloxane composition according to Embodiment 11, comprising two parts, the first part comprising at least components (I) and (III), and the second part comprising at least components (I), (II), and (V). 【0022】 Embodiment 13: The curable organopolysiloxane composition according to Embodiment 12, wherein at least one of the first and second parts further comprises component (VI) and / or component (VII). 【0023】 Embodiment 14: The curable organopolysiloxane composition according to Embodiment 12, wherein at least one of the first and second parts further comprises component (IV). 【0024】 Embodiment 15: A curable organopolysiloxane composition according to Embodiment 11, comprising one portion. 【0025】 Embodiment 16: The curable organopolysiloxane composition according to Embodiment 15, wherein the hydrosilylation catalyst component (III) is encapsulated to prevent hydrosilylation of the components of the composition, and the composition is stable until exposure to a trigger. 【0026】 Embodiment 17: The curable organopolysiloxane composition according to Embodiment 16, wherein the trigger is heat or ultraviolet light. 【0027】 Embodiment 18: (I) 100 parts of an organopolysiloxane / silicone resin blend comprising an organopolysiloxane having an average of at least two alkenyl organic groups per molecule, and an MQ silicone resin having at least one alkenyl group per molecule (where the MQ resin is approximately 5% to 40% by mass of the composition), (II) Approximately 0.1 to 30 parts of organohydrogenpolysiloxane having an average of more than two silicon-bonded hydrogen atoms per molecule, (III) Hydrosilylation catalyst, (IV) at least one alkoxy-functional adhesion promoter, and (V) Approximately 0.05 to 10 parts of trialkoxy-containing siloxane having formula (2) [ka] (In the formula, q is approximately 2 to approximately 6.) A curable organopolysiloxane composition comprising, The total amount of silicon-bonded hydrogen atoms derived from components (II) and (V) relative to the total number of alkenyl groups in the composition is approximately 0.3 to 10. A curable organopolysiloxane composition. 【0028】 Embodiment 19: A protective agent for electronic components, devices, or assemblies, comprising a coating, potting material, encapsulating material, or adhesive, which includes a curable composition according to any of Embodiments 1 to 18. 【0029】 Embodiment 20: A protected electrical equipment component or electronic equipment component obtained by encapsulating, potting, or sealing an electrical equipment component or electronic equipment component using a curable organopolysiloxane composition according to any of Embodiments 1 to 18. [Modes for carrying out the invention] 【0030】 Aspects of the present disclosure relate to curable organosiloxane compositions that are cured by a catalytic hydrosilylation reaction. More specifically, aspects of the present disclosure relate to this type of curable organosiloxane composition that exhibits excellent adhesion at low temperatures to various substrates in contact with the composition during curing. 【0031】 The compositions described herein contain an organopolysiloxane polymer having an alkenyl group, an MQ organosiloxane resin, a silicon hydride-containing organopolysiloxane, an adhesion promoter, a catalyst, and a silicon hydride / alkoxysilane-containing organosiloxane. Conventional formulations such as these without the silicon hydride / alkoxysilane-containing organosiloxane typically require temperatures above 100°C to achieve adhesion to common electronic substrates. The inclusion of the silicon hydride / alkoxysilane-containing organosiloxane enables curing of the organopolysiloxane composition at temperatures below 100°C and allows for adhesion to the substrate surface. For the purposes of this disclosure, the terms “composition” and “formulation” are synonymous and interchangeable. 【0032】 Unless otherwise specified, any numerical value is understood to be modified by the term "approximately" in all examples. Therefore, the number usually includes ±10% of the stated value. For example, a temperature statement such as "10°C" or "approximately 10°C" includes 9°C, 11°C, and all temperatures in between. 【0033】 All numerical ranges expressed in this disclosure expressly include, unless the context explicitly indicates otherwise, all possible partial ranges, all individual numbers within those ranges, integers within such ranges, and fractions and decimals of those values. For example, alkyl groups having one to about four carbon atoms may be understood to include methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, and t-butyl, even if not all possible functional groups are specifically enumerated. 【0034】 More specifically, organosiloxane compositions according to the embodiments of this disclosure are prepared by mixing the following components: (I) An organopolysiloxane / silicone resin blend comprising an organopolysiloxane having at least two alkenyl organic groups on average per molecule, and an MQ silicone resin having at least one alkenyl group per molecule. (II) Organohydrogenpolysiloxanes having more than two silicon-bonded hydrogen atoms on average per molecule, (III) Hydrosilylation catalyst, (IV) at least one alkoxy-functional adhesion promoter, (V) Trialkoxy-containing siloxane having formula (1), HR 1 2SiOR 1 2Si(CH2) a Si(OR 2 )3(1) (VI) A curing rate inhibitor of any choice, and (VII) Optional fillers and additives for performance and function. 【0035】 In the composition, the total amount of silicon-bonded hydrogen atoms derived from components (II) and (V) relative to the total number of alkenyl groups in all components is about 0.3 to 10, more preferably 0.5 to about 3, and even more preferably about 0.65 to about 2.2. 【0036】 In equation (1), R 1R is a linear or branched alkyl group containing 1 to about 10 carbon atoms, an aryl group containing about 6 to about 10 carbon atoms, or an arylalkyl group containing about 6 to about 12 carbon atoms. 2 is a linear or branched alkyl group containing one to about four carbon atoms, and a is an integer between about 1 and 10. In preferred embodiments, as described below, component (V) is preferably a compound having formula (2). [ka] (In the formula, q is an integer between 2 and approximately 10.) 【0037】 Each of these components is described in detail below. The curable organopolysiloxane compositions described herein, containing compounds (I), (II), (III), (IV), (V) and optionally (VI) and (VII), are platinum-catalyzed hydrosilylated neutral curable elastomer compositions that self-bond (self-adhere) at low curing temperatures, have a durometer value greater than Shore A hardness 10, can cure rapidly at high temperatures, and have adhesive properties to metals and plastics used in electronic assemblies when properly cured. 【0038】 Component (I) Component (I) is an organopolysiloxane polymer or organopolysiloxane copolymer having at least two alkenyl groups per molecule, and an organopolysiloxane (MQ(preferably M) having at least one alkenyl group per molecule. Vi Q or MM ViQ) is an organopolysiloxane / silicone resin blend containing silicone resin. These terms are well understood in the art and do not need to be described. The composition preferably contains about 5% to 40% by mass of MQ silicone resin, more preferably about 10% to 30% by mass of silicone resin, and even more preferably about 12% to 22% by mass of silicone resin. Furthermore, the blend preferably has a viscosity of about 100 to about 100,000 mPa·s, more preferably about 3,000 to 60,000 mPa·s, and most preferably about 4,000 to 10,000 mPa·s. If the blend viscosity exceeds 100,000 mPa·s, wettability to the binding substrate will deteriorate, and insufficient adhesion may occur. If the blend viscosity is less than 100 mPa·s, physical properties such as elongation, tear strength, and toughness may deteriorate. 【0039】 The alkenyl groups in the organopolysiloxane polymer components of component (I) blend may be linear or branched and may contain about 2 to about 10 carbon atoms. Exemplary alkenyl groups include, but are not limited to, vinyl, allyl, butenyl, pentenyl, and hexenyl (currently vinyl and hexenyl are preferred). Exemplary bonding locations of these alkenyl groups may include, but are not limited to, the molecular chain ends or molecular chain side chains. The silicon atoms in the organosiloxane polymer may contain, but are not limited to, organic groups other than the bonded alkenyl groups, such as alkyl groups, cycloalkyl groups, aryl groups, aralkyl groups, halogenated alkyl groups, etc. (alkyl groups and aryl groups are preferred, and methyl and phenyl groups are particularly preferred), monovalent hydrocarbon groups that do not have aliphatic unsaturated bonds and contain about 1 to about 10 carbon atoms. The molecular structure of organopolysiloxane polymers is not particularly limited, but examples include linear structures, partially branched linear structures, branched structures, cyclic structures, and dendritic structures, and mixtures of two or more of these structures are also within the scope of this disclosure. In other words, organopolysiloxane may be a copolymer containing repeating units having two different molecular structures. Preferably, organopolysiloxane polymers are linear. 【0040】 Examples of organopolysiloxane polymers that may be included in component (I) include, but are not limited to, dimethylsiloxane / methylvinylsiloxane copolymers in which both ends of the molecular chain are blocked with trimethylsiloxy groups, dimethylsiloxane / methylvinylsiloxane / methylphenylsiloxane copolymers in which both ends of the molecular chain are blocked with trimethylsiloxy groups, dimethylpolysiloxane in which both ends of the molecular chain are blocked with dimethylvinylsiloxy groups, dimethylsiloxane / methylvinylsiloxane copolymers in which both ends of the molecular chain are blocked with dimethylphenylsiloxy groups, and dimethylpolysiloxane in which both ends of the molecular chain are blocked with methylvinylphenylsiloxy groups. 【0041】 The MQ silicone resin in component (I) blend preferably has an MQ silicone resin structure in which the M portion is dimethyl vinyl and optionally some of the trimethyl, dimethylphenyl, phenylvinylmethyl, diphenylvinyl and / or diphenylmethyl functional groups in the M portion of the resin. Vi Q Silicone Resin or MM Vi Q is silicone resin. 【0042】 Component (I) is present in the composition in an amount of 100 parts by mass relative to the other components. As described above, the composition contains about 5% to about 40% by mass of MQ silicone resin. 【0043】 Component (II) Component (II) is an organohydrogenpolysiloxane having three or more silicon-bonded hydrogen atoms per molecule. 【0044】 Component (II) may be a linear, partially branched linear, branched, cyclic, or dendritic organohydrogenpolysiloxane molecule. The structure of component (II) is not limited to these but is usually cyclic, linear, or resinous. [ka] 【0045】 In these general structures, R 3 R is selected from hydrogen, alkyl groups having 1 to about 10 carbon atoms, and aryl groups having about 6 to about 10 carbon atoms, preferably hydrogen, methyl, or phenyl. 4 n is selected from hydrogen and alkyl groups having 1 to about 10 carbon atoms, preferably hydrogen or methyl. The sum of n and m is such that, on average, there are more than two silicon-bonded hydrogen atoms per molecule. Component (II) siloxane preferably has a viscosity of about 10 to 10,000 mPa·s, preferably about 10 to 150 mPa·s, and most preferably about 10 to 50 mPa·s. 【0046】 Component (II) is present in the composition in an amount of about 0.1 to about 30 parts, preferably about 0.5 to about 8 parts, per about 100 parts of component (I). 【0047】 Ingredient (III) Component (III) is a hydrosilylation catalyst that promotes the hydrosilylation reaction from alkenyl groups to silicon-bonded hydrogen groups. A platinum catalyst is preferred, and Karstedt's catalyst is the most preferred. 【0048】 Suitable platinum catalysts are well known in the art and include, but are not limited to, those described in U.S. Patents No. 3,159,601, 3,159,602, and 3,220,972, European Patent No. 0057459, 0188978, and 0190530, as well as platinum complexes of organic materials. Other suitable platinum complexes of vinyl organosiloxanes include those described in U.S. Patents No. 3,419,593, 3,715,334, and 3,814,730. The use of rhodium, palladium, iron, ruthenium, and iron / cobalt catalysts is also within the scope of this disclosure. 【0049】 The components in the compositions described herein are typically provided as two-part compositions (e.g., kits, two-part containers, or other configurations), with the hydrosilylation catalyst and silicon-bonded hydrogen siloxane in separate sections. When mixed, the catalyst catalyzes the hydrosilylation reaction between alkenyl groups and silicon-bonded hydrogen atoms. However, these types of formulations can also be made as one-part formulations. 【0050】 While not limited to this, one example of a method for creating a one-part silicone formulation using an encapsulated platinum catalyst is described in Saruyama's U.S. Patent No. 5,887,237. As described by Saruyama, the platinum catalyst is encapsulated in a thermoplastic material to protect the catalyst from silicon-bonded hydrogen atoms until the formulation is heated and the catalyst is released. Alternatively, a ceramic-like structure may be used for encapsulation. The thermal expansion of the catalyst within the core of the encapsulation shell breaks the shell when the product is heated. This allows the hydrosilylation process to occur within the formulation. Another method for creating a one-part formulation with adhesive properties is to use a phosphine inhibitor, as described in George's U.S. Patent No. 7,494,694. 【0051】 As explained earlier, the inclusion of titanate or other highly effective transesterification catalysts can lead to shelf-life issues due to the premature reaction of the alkoxysilane component, and depends on how the product is formulated into parts, how it is packaged, how it is stored, the type of packaging, and especially whether the product is made into a single-part product. 【0052】 Unlike some of the aforementioned compositions, excellent transesterification catalysts, such as tetrabutyl titanate or other titanates, are preferably not included in the compositions described herein. This is because they can prematurely react the alkoxysilanes in the formulation with water present in the formulation at the time of packaging, or with water seeping into the packaging during storage. Including this type of catalyst, which is excellent for transesterification, would require more processing when packaging the formulation, and better packaging to prevent excess water in the formulation at the time of packaging, as well as water seeping into the formulation. 【0053】 Component (III) is present in the composition in a catalytic amount such as about 2 to about 100 ppm by mass of Pt, preferably about 5 to about 60 ppm by mass of Pt, and more preferably about 4 to about 20 ppm by mass of Pt, relative to the total mass of the composition. 【0054】 Component (IV) Component (IV) is an alkoxy-functional adhesion promoter, more specifically, preferably an alkoxy-functional silane having at least two alkoxysilyl groups per molecule. Suitable alkoxy-functional silanes include epoxy-functional alkoxysilanes and alkenyl-functional alkoxysilanes. It is also within the scope of this disclosure that the composition may contain more than one alkoxy-functional silane or more than one type of alkoxy-functional silane. 【0055】 Exemplary alkoxy-functional adhesion promoters include bis(trimethoxysilyl)ethane, 1,2-bis(trimethoxysilyl)ethane, 1,2-bis(triethoxysilyl)ethane, 1,2-bis(methyldimethoxysilyl)ethane, 1,2-bis(methyldiethoxysilyl)ethane, 1,1-bis(trimethoxysilyl)ethane, 1,4-bis(trimethoxysilyl)butane, 1,4-bis(triethoxysilyl)butane, 1-methyldimethoxysilyl-4-trimethoxysilylbutane, 1-methyldiethoxysilyl-4-triethoxysilylbutane, 1,4-Bis(methyldimethoxysilyl)butane, 1,4-Bis(methyldiethoxysilyl)butane, 1,5-Bis(trimethoxysilyl)pentane, 1,5-Bis(triethoxysilyl)pentane, 1,4-Bis(trimethoxysilyl)pentane, 1,4-Bis(triethoxysilyl)pentane, 1-Methyldimethoxysilyl-5-trimethoxysilylpentane, 1-Methyldiethoxysilyl-5-triethoxysilylpentane, 1,5-Bis(methyldimethoxysilyl)pentane, 1,5-Bis(methyldiethoxysilyl)pentane, 1,6- Bis(trimethoxysilyl)hexane, 1,6-bis(triethoxysilyl)hexane, 1,4-bis(trimethoxysilyl)hexane, 1,5-bis(trimethoxysilyl)hexane, 2,5-bis(trimethoxysilyl)hexane, 1-methyldimethoxysilyl-6-trimethoxysilylhexane, 1-phenyldiethoxysilyl-6-triethoxysilylhexane, 1,6-bis(methyldimethoxysilyl)hexane, 1,7-bis(trimethoxysilyl)heptane, 2,5-bis(trimethoxysilyl)heptane, 2,6-bis(tri(trimethoxysilyl))hexane Toxysilyl)heptane, 1,8-bis(trimethoxysilyl)octane, 2,5-bis(trimethoxysilyl)octane, 2,7-bis(trimethoxysilyl)octane, 1,9-bis(trimethoxysilyl)nonane, 2,7-bis(trimethoxysilyl)nonane, 1,10-bis(trimethoxysilyl)decane, 3,8-bis(trimethoxysilyl)decane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,This includes, but is not limited to, 4-epoxycyclohexyl)ethylmethyldimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane, tetramethoxysilane, tetraethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-acryloxypropyltrimethoxysilane and 3-acryloxypropylmethyldimethoxysilane, as well as their partial hydrolysis condensates. 【0056】 Preferably, component (IV) contains a combination of an epoxy-functionalized alkoxysilane and an optionally selected alkenyl-functionalized alkoxysilane. In preferred embodiments, the epoxy-functionalized alkoxysilane is 3-glycidoxypropyltrimethoxysilane or 3-glycidoxypropylmethyldimethoxysilane, and the alkenyl-functionalized alkoxysilane is vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, hexenyltrimethoxysilane, or hexenyltriethoxysilane. 【0057】 The adhesion promoter (IV) is applied to the substrate and is present in an amount that enables the adhesion of the cured organosiloxane composition when heated during curing. Component (IV) is present in the composition in an amount of about 0.3 to 0.67 parts by mass, more preferably about 1 to about 5 parts by mass, and most preferably about 1.5 to about 4 parts by mass, per about 100 parts of component (I). 【0058】 Component (V) Component (V) is a trialkoxysilyl-containing siloxane having formula (1), and functions as a secondary adhesion promoter. HR 1 2SiOR 1 2Si(CH2) a Si(OR 2 )3(1) 【0059】 In equation (1), R 1 R is a linear or branched alkyl group containing 1 to about 10 carbon atoms, an aryl group containing about 6 to about 10 carbon atoms, or an arylalkyl group containing about 6 to about 12 carbon atoms. 2 is a linear or branched alkyl group containing 1 to about 4 carbon atoms, and a is an integer from about 1 to 10. Preferably, R 1 R is methyl, ethyl, propyl, most preferably a methyl group, 2 is preferably methyl, ethyl, propyl, or isopropyl. In a preferred embodiment, R 1 and R 2 is methyl, and a is about 2 to about 10, most preferably about 6. In a preferred embodiment, component (V) is a compound having formula (2). [ka] In equation (2), q is an integer between approximately 2 and approximately 10, more preferably between approximately 2 and approximately 6, even more preferably between approximately 4 and approximately 6, and most preferably approximately 6. 【0060】 The adhesion promoter component (IV) is present in an amount that enables adhesion of the cured organosiloxane composition when applied to the substrate and heated during curing, and the secondary adhesion promoter (V) is present in an amount that allows the composition to still have adhesion to the desired substrate even at a curing temperature lower than the temperature required when component (IV) is present alone. In other words, the inclusion of component (V) lowers the temperature required to obtain cohesive bonding adhesion compared to a similar composition containing only the adhesion promoter component (IV). Component (IV) is present in the composition in an amount of about 0.05 to about 10 parts, preferably about 0.5 to about 6 parts, more preferably about 1 to about 5 parts, per about 100 parts of component (I). 【0061】 Component (VI) Optional component (VI) is a curing rate inhibitor, which may be a volatility inhibitor or a non-volatility inhibitor. Hydrosilylated curing silicone compositions need to cure at various rates. While the inclusion of a hydrosilylation catalyst usually allows for very fast curing, much of the use for such compositions requires the curing to be adjusted to accommodate use in specific manufacturing processes. Therefore, curing rate inhibitors (sometimes called curing rate controllers) are frequently added to hydrosilylated curing formulations so that the curing rate can be adjusted as needed. These raw materials are well known in the art. 【0062】 Examples of volatility inhibitors include vinyl-containing cyclic organosiloxanes described in Smith's U.S. Patent No. 3,923,705, acetylene alcohols such as 2-methyl-3-butyne-3-ol and 1-ethynylcyclohexanol described in Kookoosedes' U.S. Patent No. 3,445,420, and several heterocyclic amines such as pyridine disclosed in Chalk's U.S. Patent No. 3,188,299. 【0063】 Examples of non-volatile inhibitors include alkyl maleates described in Ekberg's U.S. Patent No. 4,256,870 and olefinic siloxanes described in Marko's U.S. Patent No. 3,989,667. Preferred inhibitors include 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and 1-ethynylcyclohexanol. 【0064】 Component (VI) is present in the composition in an amount of 0 to about 1 part, more preferably about 0 to about 0.6 parts, and most preferably about 0 to about 0.2 parts. 【0065】 Ingredients (VII) Optionally, this composition may contain one or more fillers and one or more additives to improve performance and function. Suitable fillers include reinforcing fillers, thermally conductive fillers, conductive fillers, electrical performance modifying fillers, flame retardants, lightweight fillers, or combinations thereof. 【0066】 Reinforcing fillers impart mechanical strength to cured silicone elastomers or gels and improve their performance as protective agents or adhesives. Examples of reinforcing fillers include inorganic fillers such as fumed silica, precipitated silica, fumed titanium dioxide, quartz (e.g., quartz powder), calcium carbonate, diatomaceous earth, aluminum oxide, aluminum hydroxide, zinc oxide, and zinc carbonate. These fillers may be treated with surface treatment agents to improve their compatibility for use in silicone formulations. Such filler treatments may include organoalkoxysilanes such as methyltrimethoxysilane, organohalosilanes such as trimethylchlorosilane, organosilazanes such as hexamethyldisilazane, and siloxane oligomers such as dimethylsiloxane oligomers blocked with α,ω-silanol groups, methylphenylsiloxane oligomers blocked with α,ω-silanol groups, and methylvinylsiloxane oligomers blocked with α,ω-silanol groups. In particular, the surface of component (VII) may be pretreated with a low-molecular-weight organopolysiloxane having silanol groups at both ends of the molecular chain (preferably a dimethylpolysiloxane blocked by α,ω-silanol groups that do not have reactive functional groups other than terminal silanol groups in the molecule). 【0067】 The formulations or compositions described herein may contain pigments to enable a user of the composition to distinguish between two parts of the formulation, or to enable the use of the product to conceal what is coated or what is encapsulated within the composition. 【0068】 Examples of thermally conductive additives include aluminum oxide, boron nitride, metal powders, aluminosilicates, and combinations thereof. Conductive fillers include graphite, graphene, silver filler, conductive carbon black, conductive metals, and combinations thereof. 【0069】 Component (VII) is present in the composition in an amount of 0 to about 65 parts, more preferably 0 to about 50 parts, and most preferably 0 to about 45 parts. 【0070】 In the compositions described herein, the total amount of silicon-bonded hydrogen atoms derived from components (II) and (V) relative to the total number of alkenyl groups in all components is about 0.3 to 10, more preferably about 0.5 to about 3, and even more preferably about 0.65 to about 2.2. 【0071】 Method for formulating a composition The methods for preparing the compositions described herein are not limited and can be carried out by any method commonly used or discovered in the art. 【0072】 As stated above, the compositions described herein are typically two-part formulations. The first part contains at least components (I) and (III), and usually component (VII), and the second part contains at least components (I), (II), and (V), and usually components (VI) and (VII). Component (IV) may be in either part of the two-part formulation, but is typically in the second part. 【0073】 The first part of the two-part formulation is prepared by adding component (I) and a portion of component (VII) to a container and then mixing them using a mixer that completely blends the components. Preferably, a triaxial mixer, dynamic mixing blade, centrifugal mixer, or planetary mixer is used, more preferably a triaxial mixer or centrifugal mixer, but any mixer known or developed in the art may be used. Component (VII) is further added and mixed until all of component (VII) is added and completely blended. The ratio of these components depends on the desired properties and the properties of the components. Once mixed, the blend is preferably left to cool to about 50°C or below. Subsequently, component (III) is added and the product is mixed while maintaining the temperature at about 50°C or below. In most hydrosilylation catalysts, the temperature is maintained at a low value because ligands on the catalyst may volatilize. However, this is generally recommended and not limiting, as some catalysts do not have this problem. 【0074】 The second part of the two-part formulation can be prepared by adding a portion of component (I) to a container, followed by the addition of component (VII). The mixing and further addition of each component may be carried out as described in the first part of the two-part formulation. After mixing and cooling, component (VI) is preferably added to the formulation. Mixing is preferably carried out while maintaining the temperature at about 50°C or below. Once the components are completely mixed, (II), (IV), and (V) may be added and mixed while maintaining the temperature at about 50°C or below. 【0075】 Preferably, equal amounts of filler (VII) are added to both the first and second parts of the two-part formulation. This ensures that when the two parts are mixed, equal amounts by mass or volume are added to the container. 【0076】 Once the two parts are combined, a portion of the first part, followed by an equal (or appropriate) mass of the second part, may be added to the container. The product may be mixed by hand, using a triaxial mixer, a dynamic mixer blade, a centrifugal mixer, or a planetary mixer. 【0077】 If possible, the blend may be mixed at a vacuum level of approximately 0.5–10 mmHg during mixing, or the product may be degassed after mixing before being injected into the housing of the electronic device or onto the electronic equipment. 【0078】 After degassing the blend, it is injected into or onto the housing of an electronic device containing an electronic device, or onto the electronic device or sensor. The potting compound blend is then heated at an appropriate temperature for an appropriate time to cure the product and obtain adhesive properties. The heating temperature and time may be as low as about 30 minutes at about 80°C. The required temperature and time depend on the materials to be bonded and the mass of the parts to be encapsulated or bonded. In some embodiments, the composition is curable at room temperature. 【0079】 One part of the formulation may be formulated by mixing components (I) and (VII) together, as described above for the two-part formulation, and then mixing the components until the blend is completely mixed, while maintaining the mixing temperature at approximately 50°C or below. Components (II), (IV), and (V) may be added to the blend and mixed at approximately 50°C or below until the blend is completely mixed. Finally, the encapsulated hydrosilylation catalyst or a highly suppressed hydrosilylation catalyst (III) may be added to the formulation and mixed at approximately 50°C or below until the blend is completely mixed. 【0080】 These individual formulations are often stored at temperatures below room temperature to prevent moisture from entering the storage container. Refrigerated storage extends the product's shelf life. The use of encapsulated hydrosilylation catalyst components prevents hydrosilylation of the composition components, so the composition remains stable even when exposed to triggers such as heat or ultraviolet light. 【0081】 Next, one part of the product is injected into the casing of an electronic device or onto an electronic device, and then the potting compound is heated at an appropriate temperature for an appropriate time to cure the product and obtain adhesive strength. The heating temperature and heating time may be as low as about 30 minutes at approximately 80°C. The required temperature and time depend on the materials to be bonded, the amount of inhibitor used, and the mass of the parts to be encapsulated or bonded. 【0082】 The compositions described herein have high durometer values ​​for use as potting materials, tough coatings, and adhesives for electronic devices and other applications. Furthermore, they may be used as soft gels, thus offering a wider range of applications than previously reported formulations. Because the compositions of the present invention can cure very quickly at high temperatures, they are readily adoptable and usable by electronic devices and other customers requiring faster production processes. Moreover, they cure very quickly upon heating, maintain adhesive strength at low temperatures if necessary, and can also cure very quickly at high temperatures for applications where low-temperature TPE materials are not available for assembly. 【0083】 In some embodiments, further aspects of the present disclosure relate to protective agents for electronic components, devices, or assemblies, including coatings, potting materials, encapsulating materials, or adhesives comprising the curable compositions described herein. In some embodiments, further aspects of the present disclosure relate to protected electrical or electronic components obtained by encapsulating, potting, or sealing electrical or electronic components using the curable organopolysiloxane compositions described herein. 【0084】 The present invention will now be described in relation to the following non-limiting embodiments. [Examples] 【0085】 Components for preparing compositions 1 to 16 The following components were used to prepare a series of the present invention and comparative compositions. The compositions of the present invention are numbered 2, 3, 4, 6, 7, 8, 9, 10, 11, 12, 13 and 14, and the comparative compositions are numbered 1, 5, 15 and 16. Except for component (V), which is prepared by a proprietary method, all components described herein are commercially available from Gelest, Sigma-Aldrich, or DeWolf Chemical, among others. 【0086】 Component (I) is M Vi Q is a polyorganosiloxane blended with silicone resin, having an average of at least two unsaturated organic groups per molecule. It has a viscosity of 5310 mPa·s and a vinyl content of 0.24 mmol / g, and the blend contains 16% by mass of M. Vi Contains Q silicone resin. 【0087】 Component (II) is an α,ω-trimethylsiloxy-terminated methylhydrosiloxane-dimethylsiloxane copolymer. Its viscosity is 31.6 mPa·s, and the molar percentage of methylhydrosiloxane in the polymer is 28.15%. 【0088】 Component (III) is a platinum Karstedt's catalyst with a platinum metal content of 3.2%. 【0089】 Component (IV) contains 3-glycidoxypropyltrimethoxysilane and allyltriethoxysilane. 【0090】 Component (V) has the following structure. [ka] (Here, q ranges from 2 to 6) 【0091】 Components (V-1), (V-2), and (V-3) have the following structures. [ka] 【0092】 Component (VI) is 1-ethynylcyclohexanol. 【0093】 Component (VII) consists of two fillers and one pigment: surface area 200 m² 2 It consists of fumed silica treated with trimethylsiloxy at a concentration of / g, pulverized quartz filler with an average particle size of 2 microns, and a blue pigment made from FD&C Blue #1 aluminum lake high (28-31%) powder. 【0094】 Adhesive substrates for test compositions 1-16 The adhesive substrates used for testing the compositions of the present invention and comparative compositions include aluminum, copper, epoxy-fiberglass, and steel. Specifically, the aluminum is milled 3003 H14 aluminum. The copper surface is a 1.5 mm FR4 epoxy-fiberglass single-sided printed circuit board panel. One side was used for adhesion testing to copper, and the other side was used for adhesion testing to epoxy-fiberglass. The steel substrate is flat polished cold-rolled steel. The substrates were commercially obtained from Q-Lab, Uxcell, and McMaster-Carr. 【0095】 Example 1: Preparation of pre-blend part A-1 To determine the curing temperature of the hydrosilylated curing silicone composition for coagulation-stop type adhesion, pre-blends Part A were prepared and tested with pre-blend Part B and various additive components. 22.5 grams of fumed silica were added to a 300-gram plastic MAX Speed ​​Mixer cup purchased from FlackTek Manufacturing, Inc. 48 grams of fumed silica were added, followed by 228.84 grams of vinylsiloxane / M ViQ silicone resin blend, then 0.1 grams of pigment was added to the same cup. This blend was thoroughly mixed in a FlackTek Manufacturing Inc. DAC 600 VAC Speed ​​Mixer (centrifugal mixer). After this portion was thoroughly mixed and the temperature was below 50°C, 0.36 grams of platinum Karstedt's catalyst was added and immediately thoroughly mixed by hand with a spatula. The blend was then mixed again in the FlackTek Manufacturing Inc. DAC 600 VAC Speed ​​Mixer. In all examples described herein, other mixers may also be used as appropriate. 【0096】 Example 2: Preparation of pre-blend part B-1 To determine the curing temperature of the hydrosilylated curing silicone composition for coagulation-stop type adhesion, pre-blends Part B were prepared and tested with pre-blend Part A-1 and various additive components. 22.5 grams of fumed silica were added to a 300-gram plastic MAX Speed ​​Mixer cup purchased from FlackTek Manufacturing, Inc. 48 grams of fumed silica were added, followed by 184.38 grams of vinylsiloxane / M Vi The Q silicone resin blend was added to the same cup. This blend was thoroughly mixed in a FlackTek Manufacturing Inc. DAC 600 VAC Speed ​​Mixer (centrifuge mixer). Once this portion was thoroughly mixed and the temperature was below 50°C, 38.1 grams of hydrate methyl / dimethyl silicone copolymer, 3.45 grams of 3-glycidoxypropyltrimethoxysilane, 3.45 grams of vinyltriethoxysilane, and 0.12 grams of 1-ethynylcyclohexanol were added to the cup and immediately thoroughly mixed by hand with a spatula. Then, it was mixed again in a FlackTek Manufacturing Inc. DAC 600 VAC Speed ​​Mixer. 【0097】 Example 3: Preparation of Pre-Blend Part B-2 To determine the curing temperature of the hydrosilylated curing silicone composition for aggregation-stop type adhesion, pre-blends Part B were prepared and tested with pre-blend Part A-1 and various additive components. 7.5 grams of fumed silica were added to a 100 GRAM MAX Speed ​​Mixer plastic cup purchased from FlackTek Manufacturing, Inc. 16 grams of fumed silica were added, followed by 61.14 grams of vinylsiloxane / M Vi The Q silicone resin blend was added to the same cup. This blend was thoroughly mixed in a FlackTek Manufacturing Inc. DAC 600 VAC Speed ​​Mixer (centrifugal mixer). Once this portion was thoroughly mixed and the temperature was below 50°C, 12.67 grams of hydrate methyl / dimethyl silicone copolymer, 1.5 grams of 3-glycidoxypropyltrimethoxysilane, 1.15 grams of vinyltriethoxysilane, and 0.04 grams of 1-ethynylcyclohexanol were added to the cup and immediately thoroughly mixed by hand with a spatula. Then, it was mixed again in a FlackTek Manufacturing Inc. DAC 600 VAC Speed ​​Mixer. 【0098】 Example 4: Preparation of pre-blend part B-3 To determine the curing temperature of the hydrosilylated curing silicone composition for coagulation-stop type adhesion, pre-blends Part B were prepared and pre-blend Part A-1 and various additive components were tested. 7.5 grams of fumed silica were added to a 100-gram plastic MAX Speed ​​Mixer cup purchased from FlackTek Manufacturing, Inc. 16 grams of fumed silica were added, followed by 60.58 grams of vinylsiloxane / M ViThe Q silicone resin blend was added to the same cup. This blend was thoroughly mixed in a FlackTek Manufacturing Inc. DAC 600 VAC Speed ​​Mixer (centrifuge mixer). Once this portion was thoroughly mixed and the temperature was below 50°C, 13.23 grams of hydrate methyl / dimethyl silicone copolymer, 1.15 grams of 3-glycidoxypropyltrimethoxysilane, 1.5 grams of vinyltriethoxysilane, and 0.04 grams of 1-ethynylcyclohexanol were added to the cup and immediately thoroughly mixed by hand with a spatula. Then, it was mixed again in a FlackTek Manufacturing Inc. DAC 600 VAC Speed ​​Mixer. 【0099】 Test substrate and test method All adhesives were tested using a high-throughput gradient curing method, with the test composite materials placed between gradient-heated aluminum plates. One end of each plate was heated, and the other end was cooled. Both plates were heated and cooled as similarly as possible. Temperature was measured along the plates, and as the plates were heated, the relationship between distance and temperature was linear. Therefore, the temperature at any point along the plates could be determined by the distance. The method for curing composite material samples between gradient-heated plates is described in Macromolecules, 2007, Vol. 40, No. 11, pp. 3904–3906 (Contact the Editor, Supplementary Materials). 【0100】 For testing of the compositions of the present invention and comparative compositions, the adhesive substrates included aluminum, copper, epoxy-fiberglass, and steel. 【0101】 The aluminum substrate was milled 3003 H14 aluminum. The aluminum substrate was obtained from Q-Lab as Q-Lab Stock No. A-46, with a width of 102 mm, a length of 152 mm, and a thickness of 0.6 mm. For testing, these were cut in half to create test substrates approximately 51 mm wide and 152 mm long. 【0102】 For copper and epoxy-fiberglass substrates, the copper surface is on a 1.5 mm FR4 epoxy-fiberglass single-sided printed circuit board panel. One side is used for adhesion testing to copper, and the other side is used for testing adhesion to epoxy-fiberglass. For testing copper and epoxy-fiberglass substrates, Uxcell FR4 epoxy-fiberglass printed circuit board (PCB) stocks with one side covered in copper were used. These PCB stocks were 150 mm wide, 200 mm long, and 1.5 mm thick, with copper deposited only on one side of the FR4 epoxy-fiberglass laminate. These were cut into test substrates measuring 50 mm wide and 150 mm long. 【0103】 Finally, the steel substrate was flat polished cold-rolled steel obtained from Q-Lab, Q-Lab stock No. S-36, 76 mm wide, 150 mm long, and 0.8 mm thick. These substrates were used as received. 【0104】 A thick aluminum foil, 0.15 mm thick and 1100 alloy, was used to create a peel test sample by sandwiching the test silicone composition between the foil and the adhesive test substrate. A controlled bond line thickness was maintained by placing 1.28 mm spacers at both ends of the sandwich. The test was completed by placing the test substrate from one long end to the other using a thermal gradient. 【0105】 In the test, a liquid composition was applied in a width of approximately 5 mm to 10 mm along the length of the adhesive test substrate, from one end to the other, ensuring no air was trapped. A spacer was placed, and then aluminum foil was placed on top of it. This sandwich was placed on a gradient plate, and another gradient plate was placed on top of it (the same temperature was used from one end to the other of each gradient plate). Pressure was applied to push the foil down to the level of the spacer. The spacer maintained a reproducible thickness of the silicone composition between the test substrate and the foil. The two plates with the sandwiched substrate / silicone / foil were held for a known time, and the temperature against distance was measured, thus determining the temperature on the test substrate. The temperature at one end of each test substrate was also measured, and thus, by measuring the distance from that end, the temperature at any point along the length of the test substrate could be determined by calculating the temperature gradient against distance. 【0106】 Cleaning and priming to ensure adhesion of flexible foil to the test surface for repeated use. The test substrate and 0.8 mm foil were first thoroughly cleaned by vigorously wiping them with isopropyl alcohol using AA Wipes' nonwoven cleanroom wipes (55% cellulose / 45% polyester). Next, this process was repeated using the same type of wipe with heptane. 【0107】 The flexible foil attached to the above test substrate was primed with Dow Performance Silicone Silguard Primecoat by wiping it with a cleanroom wipe, then quickly wiping the surface of the foil again, and finally gently wiping off the excess primer. To prepare the laminates of the test samples, they were left at a temperature between 21°C and 25°C and a RH of 40% to 56% for 30 minutes and no longer than 4 hours before use. 【0108】 Example 5: Preparation of compositions 1-16 Compositions 1-16 were prepared using pre-blended part A, pre-blended part B, and various amounts of any (V-1), (V-2), or (V-3) component, as shown in Tables 1-5 (all amounts: grams). Compositions were first prepared by adding pre-blended part B to a FlackTek Manufacturing Inc. 40GRAM MAX TALL plastic cup. Next, the appropriate (V) component (V-1, V-2, or V-3) was added to the cup. The blend was thoroughly mixed using a FlackTek Manufacturing Inc. DAC 600VAC Speed ​​Mixer (centrifugal mixer). Next, the appropriate part A was added to the cup, and the blend was thoroughly mixed again using the FlackTek Manufacturing Inc. DAC 600VAC Speed ​​Mixer (centrifugal mixer). After mixing, the composition was applied as described above to prepare test laminates / sandwiches. The coated foil was cut to a width of 12.7 mm, leaving an additional length (approximately 178 mm) that hung over the cold edge of the test substrate. 【0109】 90-degree peel test method A 12.7 mm wide foil was cut along its side, ensuring that only the adhesive strength from one side to the other was available for testing. The foil was then slowly pulled back by hand over a short distance, creating a cut between the cured silicone and the test substrate. 【0110】 Next, the test substrate was attached to the sled of an Instron 3345 tensile testing machine, and the testing force was measured using a 1000N load cell. The foil was pulled at a speed of 50.8 mm / min at a 90-degree angle to the test substrate. The force and distance during the pulling of the sample were recorded. 【0111】 The test data was downloaded and converted from force and distance to force and temperature by measuring the temperature gradient with respect to distance from the heating plate and the distance from the hot end to the point where cutting begins on the substrate. Once the tests are complete, the measurement of the distance from the hot end to the point where agglomeration and adhesion stoppage begins also provides the temperature at which agglomeration stops, taking into account the heating time used for each test sample. 【0112】 It should be noted that no cessation was observed with the cured silicone adhesive applied to the foil. All samples exhibiting adhesive strength showed cessation of bulk aggregation at the temperatures and heating times shown in Tables 1-5. 【0113】 Table 1 shows an evaluation of the effectiveness of various hydride / alkoxy component (V) type additives in lowering the temperature at which bulk agglomeration is stopped in aluminum. Table 2 shows an evaluation of the effectiveness of various hydride / alkoxy component (V) type additives in lowering the temperature at which bulk agglomeration is stopped in steel. Table 3 shows a comparison of the performance of a single component (V) type additive on different substrates. Table 4 shows the effect of the amount of component (V) additive on the bonding temperature required to stop bulk agglomeration after 2 hours of heating. Finally, Table 5 shows the superior performance of component (V) additives compared to simply increasing the amount of bonding promoter. 【0114】 Considering the data in Tables 1-5, it can be seen that component (V-3) is the best component (V) additive for lowering the bonding temperature within the given time. All molecules of component (V) lowered the required curing temperature compared to the control group which did not contain component (composition 1). [Table 1] [Table 2] [Table 3] [Table 4] [Table 5] 【0115】 Those skilled in the art will understand that modifications can be made to the above embodiments without departing from the broad concept of the present invention. Therefore, it will be understood that the present invention is not limited to the specific embodiments disclosed, but is intended to encompass modifications within the spirit and scope of the invention as defined by the appended claims.

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