Air orientation intake for heat sinks and UV-C devices

Abstract

The air sterilization device (100) installed in the HVAC duct (200) comprises an air intake body (110) disposed on the surface of the HVAC duct (200), having an inlet end (110a) and an outlet end (110b), and having brackets (111a, 112a) extending distally from the air intake body (110); a UV light module (140) fixed to the brackets (111a, 112a) and having a temperature sensor; a heat sink (130) fixed to the UV light module (140) and disposed in close proximity to the outlet end (110b); and a control board (155) that communicates with the UV light module (140). The control board (155) has a microcontroller (302) that communicates with an ambient temperature sensor (315) and a heat source temperature sensor (314) disposed in close proximity to an external heat source. The microcontroller (302) communicates with the temperature sensor of the UV light module (140).

Description

【Technical Field】 【0001】 (Cross - reference to related applications) This application claims the benefits under Articles 4 and 8 of the Stockholm Revision of the Paris Convention for the Protection of Industrial Property with respect to U.S. Patent Application No. 18 / 328,315, filed on June 2, 2023, and the entire content of the said application is incorporated herein by reference. 【0002】 The present invention relates to an apparatus arranged to fix a UV - C (ultraviolet) light module within an HVAC (heating, ventilation, and air conditioning) duct, and the apparatus is configured to direct the air flow within the duct towards a heat sink device arranged in the UV light module. 【Background Art】 【0003】 Indoor air filtration is well - known in the art. In expensive filtration devices, mechanical filtration such as the use of filters is commonly used. It is also well - known that light of UV wavelengths has the effect of filtering air as radiation. 【0004】 Unlike other air filtration systems that rely on HEPA (High - Efficiency Particulate Air) filters or similar devices to capture dust and other particles, UV air filtration uses state - of - the - art ultraviolet technology to prevent viruses and other microorganisms from growing and infecting in homes, offices, or other indoor spaces. Ultraviolet light damages the genetic material that controls the growth of these organisms, making their reproduction impossible. UV light stops the action of the microorganisms that cause these diseases and prevents the spread of various diseases and other problems. 【0005】 UV purification is most effective when microorganisms are in prolonged contact with a UV lamp. The longer a virus or other organism is exposed to UV light, the greater the damage to its DNA and its ability to self-replicate. There are three types of UV light: UV-A, UV-B, and UV-C, which are distinguished by their wavelength. UV-A light has the longest wavelength of 315-400 nm. UV-C light has the shortest wavelength of 100-280 nm. Because UV-C light has the shortest wavelength, it has the highest energy among the types of UV light. This means that UV-C light has the highest ability to destroy genetic material in viruses and other microorganisms. UV-C light at a specific wavelength of approximately 254 nm has been shown to be effective in killing coronaviruses such as severe acute respiratory syndrome virus (SARS-CoV) and Middle East respiratory syndrome (MERS-CoV), as well as other viruses such as H1N1 influenza, and the optimal wavelength for obtaining the best results is approximately 267 nm. The UV light used for disinfection generates UV-C with wavelengths in the range of approximately 250-280 nm. UV light in the range of approximately 250-280 nm is generally recognized as the germicidal UV-C range. 【0006】 Conventional attempts utilizing UV treatment have employed devices that treat duct air using a negative oxygen intensifier. This device includes a baffle configured to direct incoming air toward the negative oxygen intensifier. A temperature sensor within the device is configured to measure the temperature of the incoming air, and the negative oxygen intensifier is programmed to shut down if the measured temperature falls below a predetermined temperature. The negative oxygen intensifier further includes a UV light device that irradiates water released from a water tank and introduced into the air passing through the duct, treating the air before it is discharged from the device. 【0007】 In other attempts utilizing UV treatment, the air filtration / purification system includes a housing defined by an inlet and an outlet end. A fan for moving air within the system is located near the inlet end. Near the outlet end are a VOC (volatile organic compound) filter, a final particulate filter, and a humidifier. At least one UV lamp is located within the system to assist in filtering the air passing through it. 【0008】 UV wavelengths, particularly UV-C wavelengths emitted from LEDs, generate a considerable amount of heat from one or more light sources. Prolonged exposure to heat degrades light sources such as LEDs, and excessive heat alters the wavelength of emitted light, reducing the lifespan of the light-emitting device. 【0009】 Therefore, there has long been a demand for a device that processes the air flowing through an HVAC system using UV-C, which is configured to guide the airflow to a heat dissipation device installed in a UV-C light module, and further manages the heat of the UV-C system by measuring the incoming airflow and selectively turning the UV-C light module on or off based on the measured variables. 【0010】 Furthermore, UV-C light modules that include multiple individual heatsinks to manage the heat dissipation of each UV LED light have long been desired. 【0011】 Furthermore, there has long been a demand for UV light-based air treatment devices that can be installed in existing HVAC structures while requiring minimal modifications to the existing HVAC system and using a minimum number of components. [Overview of the project] 【0012】 The present invention is configured to be installed in commercial and residential air duct systems and to purify the air moving within such air duct systems. The present invention aims to function as an alternative, economical alternative, or complementary means to typical air filtration systems or other air transport systems in existing HVAC structures by providing cleaner air while reducing the frequency of maintenance required through UV radiation. 【0013】 In a broad sense, the present invention includes an air sterilization device installed in an HVAC duct. The air sterilization device comprises an air intake (air scoop) installed on the surface of the HVAC duct, a UV light module fixed to a bracket and having a temperature sensor, a heat sink fixed to the UV light module and installed close to the outlet end, and a control board that communicates with the UV light module. The air intake (air scoop) has an inlet end and an outlet end, and a bracket extending away from the air intake. The control board has a microprocessor that communicates with an ambient temperature sensor and a heat source temperature sensor installed near an external heat source. The microprocessor communicates with the temperature sensor of the UV light module. 【0014】 The present invention further includes a printed circuit board on which a UV light module is fixed. The UV light module includes a plurality of LED light modules. Each of the plurality of LED light modules is configured to emit UV-C. 【0015】 The heat sink of the present invention further includes a plurality of heat dissipation fins arranged to extend beyond the UV light module. The plurality of heat dissipation fins have an upper portion and a lower portion. The upper and lower portions of the plurality of heat dissipation fins are fixed to a bracket and are arranged perpendicular to a pair of mounting surfaces of the bracket. The upper portion of the plurality of heat dissipation fins is located within the air intake, and the lower portion of the plurality of heat dissipation fins extends beyond the outlet end of the air intake. 【0016】 The UV light module of the present invention further includes a plurality of individual heatsinks fixed to a printed circuit board. Each of the plurality of individual heatsinks is arranged adjacent to each of the plurality of LED light modules. Each of the plurality of individual heatsinks includes a plurality of fins. 【0017】 As mentioned above, the main objective of the present invention is to provide an air sterilization device that utilizes UV radiation. 【0018】 Another object of the present invention is to provide an air sterilization device that has minimal installation components for existing HVAC systems. 【0019】 A further object of the present invention is to initiate the power-on or power-off function of a UV light module using a temperature comparison protocol. This protocol improves the lifespan of individual LEDs in the UV light module and optimizes the energy consumption of the device, particularly the UV light module, in response to airflow in an HVAC duct or air passage. 【0020】 Another object of the present invention is to provide a heat suppression device that directs air passing through an HVAC system to a heat sink. 【0021】 Another object of the present invention is to provide individual heat suppression devices arranged adjacent to individual LEDs in a UV light module. 【0022】 A further object of the present invention is to provide an air sterilization device having a fault detection protocol. The fault detection protocol is communicated to an onboard microcontroller, i.e., a control module, and the protocol is stored within the module or, alternatively, communicates with an external device. 【0023】 The above and other purposes, features and advantages will be readily apparent by referring to the following detailed description of the invention, taking into account the attached drawings and claims. 【0024】 Various embodiments described below are disclosed for illustrative purposes only, with reference to the accompanying drawings. In the drawings, corresponding reference numerals indicate corresponding parts. [Brief explanation of the drawing] 【0025】 [Figure 1A] Figure 1A is a perspective view of an HVAC duct. [Figure 1B] Figure 1B is a front view of the present invention. [Figure 2A]Figure 2A is a top view of the HVAC duct shown in Figure 1A. [Figure 2B] Figure 2B is a cross-sectional view of the HVAC duct cut substantially along line 2B-2B of Figure 2A, showing the state in which the present invention is installed inside. [Figure 3A] Figure 3A is an upper perspective view of the UV-C air intake device 100 of the present invention. [Figure 3B] Figure 3B is a lower perspective view of the UV-C air intake device 100 of the present invention. [Figure 4A] Figure 4A is a front view of the UV-C air intake device 100 of the present invention. [Figure 4B] Figure 4B is a cross-sectional view of the UV-C air intake device 100 cut substantially along line 4B-4B of Figure 4A. [Figure 5] Figure 5 is an exploded view of the UV-C air intake device 100. [Figure 6] Figure 6 is a partially exploded view of the printed circuit board 142 taken from Figure 5, including an enlarged view showing the LED heat sink 161. [Figure 7A] Figure 7A is a perspective view of the control module 150. [Figure 7B] Figure 7B is a side view of Figure 7A. [Figure 7C] Figure 7C is a perspective view of the control module 150 with the cover 152 removed. [Figure 8] Figure 8 is a schematic diagram of the high-level circuit of the present invention. [Figure 9] Figure 9 is a cross-sectional view of the HVAC duct cut substantially along line 2B-2B of Figure 2A, specifically showing the airflow path passing through the HVAC duct 200. [Figure 10] Figure 10 is a high-level flowchart regarding the operation of the present invention. [Figure 11] Figure 11 is a cross-sectional view cut substantially along line 4B-4B of Figure 4A. 【Mode for Carrying Out the Invention】 【0026】 In the opening, please understand that elements with the same part number in different drawings represent the same or functionally similar structural elements. Furthermore, please understand that the claims are not limited to the disclosed embodiments. 【0027】 Furthermore, it should be understood that this disclosure is not limited to the specific methods, materials, and modifications described herein, and that this disclosure may, of course, be modified. Also, the terms used herein are used solely for the purpose of describing specific embodiments and are not intended to limit the scope of the claims. Accordingly, those skilled in the art should understand that any suitable materials currently known or to be developed in the future may be used to form the present invention and / or its components, as described herein. 【0028】 Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by a person of ordinary skill in the art to which this disclosure pertains. It should be understood that similar or equivalent methods, apparatus, or materials described herein may be used in carrying out or testing the examples. 【0029】 The term "substantially" is synonymous with terms such as "almost," "very close," "about," "approximately," "around," "essentially," "neighborhood," and "vicinity," and should be understood as being interchangeable when used in the specification and claims. Similarly, the term "proximity" is synonymous with terms such as "nearby," "approaching," "adjacent," "neighboring," "most recent," and "adjacent," and should be understood as being interchangeable when used in the specification and claims. 【0030】 It should be understood that the use of “or” in this application relates to “non-exclusive” configurations unless otherwise stated. For example, when it is stated that “item x is A or B,” it should be understood that this statement may mean either (1) item x is either A or B alone, or (2) item x is either A or B. In other words, the word “or” is not used to define “exclusive OR.” For example, in the exclusive OR configuration of the statement “item x is A or B,” x must be either A or B alone. Furthermore, as used herein, “and / or” means a grammatical conjunction indicating that one or more of the enumerated elements or conditions may be included or occur. For example, a device including a first element, a second element and / or a third element is intended to be interpreted as any of the following: a device including only the first element, a device including only the second element, a device including only the third element, a device including the first and second elements, a device including the first and third elements, a device including the first, second and third elements, or a device including the second and third elements. 【0031】 Furthermore, the phrases “including at least one” and “comprising at least one” as used herein are intended to mean, when used in combination with a system or element, that system or element includes one or more of the elements listed after the phrase. For example, a device including at least one of the first, second, and third elements is intended to be interpreted as a device including only the first element, only the second element, only the third element, the first and second elements, the first and third elements, the first, second, and third elements, or the second and third elements. The same interpretation is intended when the phrases “used in at least one” or “one” are used herein. 【0032】 Please understand that the illustrated embodiments represent only one possible embodiment of the claimed invention. Furthermore, please understand that directional adjectives such as "up," "down," "right," and "left," and similar expressions, should be interpreted by referring to the corresponding drawings and are intended as illustrative examples. 【0033】 The terms “to have,” “to possess,” “to include,” “to contain,” “to encompass,” and “to encompass” are intended to be interpreted as substantially synonymous with the terms “to include” and / or “to contain.” 【0034】 It will be understood that various aspects and other features and functions of the above disclosure, or their substitutes, can be suitably combined with a variety of other systems or applications. Various substitutes, changes, modifications or improvements that may be subsequently made by those skilled in the art and are not currently foreseen or anticipated are also intended to be included in the following claims. 【0035】 Next, refer to the drawings. The following explanation should be understood with reference to Figures 1A and 2B. Figure 1A shows a perspective view of the HVAC duct 200. Figure 1B shows a front view of the duct with the UV-C air intake device 100 attached to the HVAC duct shown in Figure 1A. Figure 2A shows a top view of the HVAC duct 200 with the UV-C air intake device 100 attached. Figure 2B is a cross-sectional view of the duct cut substantially along line 2B-2B in Figure 2A. 【0036】 Figures 1A to 2B show an HVAC duct 200 having a substantially rectangular structure. However, it should be understood that the HVAC duct 200 may include a circular or tubular structure, and that the UV-C air intake device 100 may be configured to include curvature corresponding to the curved structure of the HVAC duct. It should be understood that the figures of the HVAC duct 200 represent only a part of the entire HVAC duct system, and ducts of other shapes are also included in the scope of the attached claims. 【0037】 The HVAC duct 200 is generally formed by an upper member 210, a first side member 211, a second side member 212, and a lower member 213. The HVAC duct 200 has an inlet end 214 and an outlet end 215. The inlet end 214 is defined as the end into which air flows into the HVAC duct 200. The outlet end 215 is defined as the end out which air flows out of the HVAC duct 200. In other words, the inlet end 214 represents the inlet of the HVAC duct 200, i.e., a section of the HVAC duct system connected to or beginning with an air source such as heating, ventilation, and / or air conditioning. On the other hand, the outlet end 215 represents the outlet of the HVAC duct 200, i.e., a section of the HVAC duct system ending at an outlet vent or exhaust port. 【0038】 In a preferred embodiment, the UV-C air intake device 100 is configured to be detachably fixed to the inner surface 210a of the upper member 210 of the HVAC duct 200. In a preferred embodiment, the UV-C air intake device 100 is fixed to the inner surface 210a by a plurality of screws. However, those skilled in the art will understand that other detachable fastening means technically known may be used to fix the device to the wall or ceiling of the duct. A control module 150 (shown in Figure 1B) of the UV-C air intake device 100 is also provided in the HVAC duct 200. The control module 150 may be detachably fixed to the inner surface 212a of the second side member 212, or it may be detachably fixed to the outer surface 212b of the second side member 212. Alternatively, the control module 150 may be provided within the second side member 212 through a notched through-hole configured to receive the control module 150. 【0039】 As shown in Figure 2B, the UV-C air intake device 100 is configured to split the incoming air from the inlet end 214 between the inner surface 210a and the inner surface 213a. With this configuration, the incoming airflow is separated into an upper flow UF and a lower flow LF in the plane shown by B. Furthermore, a portion of the upper flow UF enters the UV-C air intake device 100 so as to be guided across the heat sink of the UV-C air intake device 100, as will be described later. 【0040】 Please refer to Figures 3A and 3B for the following explanation. Figure 3A shows an upward perspective view of the UV-C air intake unit 100 removed from the HVAC duct 200. Figure 3B shows a downward perspective view of the same UV-C air intake unit 100. The UV-C air intake unit 100 generally includes an air intake body (air scoop) 110, a heat sink 130, and a UV light module 140. The air intake body 110 includes a first side panel 111 and a second side panel 112. The air orientation portion 113 of the air intake body 110 is defined by three sections: a mounting portion 113a, a curved portion 113b, and an outlet portion 113c. The air intake body 110 has two ends, namely an inlet end 110a and an outlet end 110b. These ends define the preferred orientation of the UV-C air intake device 100 when it is installed within the HVAC duct 200. The inlet end 110a is the end of the UV-C air intake device 100 configured to receive incoming air. The outlet end 110b is the end from which the incoming air flows out of the UV-C air intake device 100. 【0041】 The air intake 110 may be made of heat-resistant plastic, polymer, or molded plastic. Alternatively, the air intake 110 may be made of various lightweight metals. In a preferred embodiment, the heat sink 130 may be made of aluminum. Alternatively, the heat sink 130 may be made of copper-nickel, stainless steel (e.g., 316, 304, or other suitable stainless steel species), copper, Heresite P413 coated aluminum, E-coated aluminum, or other suitable steel alloy. 【0042】 Please refer to Figures 4A and 4B for the following description. Figure 4A is a front view of the UV-C air intake unit 100 removed from the HVAC duct 200. Figure 4B is a cross-sectional view substantially along line 4B-4B in Figure 4A. The heat sink 130 is mounted on the heat sink mounting surface 121 of the mounting bracket 120, which is fixed to the air intake unit 110 (shown in Figure 5). The heat sink 130 includes a plurality of fins 131. The plurality of fins 131 include an upper portion 133 and a lower portion 134. The upper portion 133 of the plurality of fins 131 is mounted inside the air intake unit 110. The lower portion 134 of the plurality of fins 131 extends outward from the outlet end 110b. That is, the lower portion 134 is located outside the air intake unit 110. The plurality of fins 131 are preferably heat dissipation fins. The heat dissipation fins have surfaces that extend from the heat sink 130 to increase the rate of heat transfer from the UV-C air intake device 100 by increasing convection. Those skilled in the art will understand that in alternative embodiments where higher heat transfer is required, the multiple fins 131 may include a heat pipe, i.e., a fully enclosed, passive two-phase heat transfer device that utilizes the high latent heat of vaporization of the fluid. As shown in Figure 4B, a space may exist between the internal surface 113e and the multiple fins 131. 【0043】 The air intake 110 includes an air orientation section 113. The air orientation section 113 is configured to introduce incoming air into the air intake 110 at its inlet end 110a, pass it over a plurality of fins 131 of the heat sink 130, and discharge it through its outlet end 110b. The air orientation section 113 includes three sections: a mounting section 113a, a curved section 113b, and an outlet section 113c. The mounting section 113a is defined as a region of the air intake 110 that is detachably fixed to the inner surface 210a of the upper member 210 of the HVAC duct 200, as shown in Figures 1B and 2B. The mounting section 113a is continuous with the curved section 113b. The curved section 113b curves its mounting surface 113d and inner surface 113e substantially downward toward the heat sink 130 and the UV light module 140. The curved portion 113b is continuous with the exit portion 113c which terminates at the exit end 110b. The heat sink 130 and the UV light module 140 are preferably disposed near the exit portion 113c. 【0044】 As shown in Figure 11 illustrating an alternative configuration of the present invention shown in Figure 4B, there is no space (the space shown in Figure 4B) between the internal surface 113e and the multiple fins 131. This alternative configuration is generally referred to as a "closed" configuration. The closed configuration increases the air pressure in front of the heatsink, i.e., near the surface with the LEDs, thereby increasing the airflow rate through the heatsink or the multiple fins of the heatsink, and consequently improving the temperature reduction characteristics of the heatsink. Specifically, the closed configuration prevents incoming air from bypassing the multiple fins through the space (the space shown in Figure 4B) between the fins and the internal surface of the air intake. This increases the differential pressure in front of the heatsink (i.e., the surface close to the LEDs) and behind the heatsink, increasing the net airflow rate through the heatsink, and consequently significantly lowering the temperature at the LED junction, i.e., the UV light module 140. 【0045】 Figure 5 is an exploded perspective view of the UV-C air intake device 100. The air intake body 110 includes a mounting bracket 111a for the first side panel 111 and a mounting bracket 112 for the second side panel 112, which extend from the corresponding side panels. The mounting brackets 111 and 112 are preferably arranged to engage with the first mounting end 123 and the second mounting end 124 of the mounting plate 120 by screws, but other acceptable mounting means may be used. The heat sink 130 is disposed on the heat sink mounting surface 121 (shown in Figure 4B) of the mounting bracket 120. The UV light module 140 is preferably disposed to be fixed to the UV light module mounting surface 122, specifically the printed circuit board 142, by screws, but other acceptable mounting means may be used. The printed circuit board 142 is equipped with a plurality of LED heat sinks 160 and a plurality of UV LEDs 140. Multiple UV LEDs 140 each have individual LED elements 141a, 141b, 141c, etc. 【0046】 In a preferred embodiment, the LED heatsinks 160 are formed from copper. Alternatively, the LED heatsinks 160 may be made of a copper-nickel alloy, stainless steel (e.g., 316, 304, or other suitable stainless steel species), Heresite P413 coated aluminum, E-coated aluminum, aluminum, or other suitable steel alloy. 【0047】 Multiple UV LEDs 141 may include any suitable LEDs rated to a wavelength of approximately 270nm to 280nm. Possible LEDs may include single LEDs, chip-on-board LEDs, LED strips, or complete LED light sources. Examples of suitable LEDs include part numbers E275-3, E275-3-S, ILT-PWRTYLED.3W, E275-10, E275-10-S, E275-60-Strip, or ILT-PWR-12600P5, provided by International Light Technologies. Please understand that the examples of LEDs listed above do not limit the scope of the claims. 【0048】 Figure 6 shows a partial view of the printed circuit board 142 of Figure 5. Figure 6 further shows an enlarged view of the LED heatsink 161. Multiple UV LEDs 140 and multiple LED heatsinks 160 are arranged on the mounting surface 142a of the printed circuit board 142. The mounting surface 142 includes multiple input sections, which include an LED input section 142b and a heatsink input section 142c. Input sections 142b and 142c are electronically and power-wise connected to the printed circuit board 142, and the printed circuit board 142 is electronically and power-wise connected to a control module 150 (shown in Figures 7A to 7C). Input sections 142b and 142c are arranged to receive LEDs and LED heatsinks, respectively. Input section 142c may also be configured as a mounting position for multiple LED heatsinks 160, and does not necessarily have to be electronically and power-wise connected to the printed circuit board 142. 【0049】 Each LED heatsink 161 of the multiple LED heatsinks 160 is configured to work in cooperation with the heatsink 130 (shown in Figure 5) to collectively provide additional heat dissipation for both the heat generated by the multiple UV LEDs 140 and the heat of the incoming air that flows toward and through the HVAC duct 200. Each LED heatsink 161 generally includes a base 163 and a plurality of fins 162. The plurality of fins 162 are arranged to extend from the base 163. The plurality of fins 162 are preferably heat dissipation fins. The heat dissipation fins are surfaces that extend to increase the rate of heat transfer from the LED heatsink 161 by increasing convection. The mounting surface 164 of the base 163 is arranged to engage with one of the heatsink input portions 142c on the printed circuit board 142, and the outer surface 165 of the base 163 is arranged on the opposite side of the mounting surface 164. 【0050】 Please refer to Figures 7A to 7C for the following explanation. Figure 7A shows a perspective view of the control module 150, Figure 7B shows a side view of the control module 150, and Figure 7C shows a perspective view of the control module 150 with the cover 152 removed. The control module 150 is configured to receive power from an external power source and transmit power to the UV light module 140. The UV-C air intake device 100 is configured to be connected to a power source, preferably an AC voltage power source (VAC). The UV-C air intake device 100 is also configured to perform a DC voltage power source conversion (VAC to VDC), and further has a VAC bypass that allows power to be supplied to the components of the present invention by VAC current in addition to VDC current. The control module 150 includes an internal cavity 153 in the main body 151. The internal cavity 153 is sealed by a cover 152. A control board 155 is disposed inside the internal cavity 153. The control board 155 is configured to execute and control the UV-C air intake device 100 and external components described later. The control module 150 receives power from the power supply 300 via a 2-pin connector 329, and this power is VAC, which is converted to VDC by the power supply 300. Figure 7C also shows the sensor board 301. The sensor board 301 is illustrated in detail in Figure 8 and described later. 【0051】 Figure 8 is a high-level schematic diagram of the components of the UV-C air intake device 100. Specifically, Figure 8 shows the control module 150, control board 155, UV light module 140, sensor board 301, and power supply 300. The power supply 300 is configured to receive VAC current and convert the VAC current to VDC current. In a preferred embodiment, the power supply 300 receives a minimum input of approximately 120VAC, 60Hz with a variation range of approximately 10%. In an alternative embodiment, the power supply 300 may have a universal input range of, for example, 90VAC to 277VAC at both 60Hz and 50Hz to allow installation of the UV-C air intake device 100 in all regions. The power supply 300 provides an output voltage of 24VDC ± 5% under full load conditions. Depending on the power consumption of the multiple UV LEDs 141, the output power rating of the power supply 300 can vary in the range of 100W to 300W for multiple UV LEDs 141 having a power consumption of approximately 75W to 225W. The control board 155 includes a buck regulator 328. The buck regulator 328 is configured to step down 24VDC to approximately 5VDC, thereby supplying a 5VDC power supply to selected components within the control board 155 and / or the UV light module 140. 【0052】 In a preferred embodiment, the microcontroller 302 includes three pulse-width modulation (PWM) generators 307, 308, and 309. The PWMs 307, 308, and 309 are connected to a low-pass filter 305, an alarm 313, and a low-pass filter 303, respectively. 【0053】 In a preferred embodiment, the microcontroller 302 is an AVR® AVR32DA48. The AVR® AVR32DA48 includes an AVR® processor with a hardware multiplier, is capable of operating at up to 24 MHz, has 32 KB of flash memory, 4 KB of SRAM, and 512 bytes of EEPROM, and may be supplied in a 48-pin package with TQFP and VQFN package options. It should be understood that the microcontroller 302 may be composed of any alternative microcontroller capable of providing the functions described herein. 【0054】 In a preferred embodiment, the microcontroller 302 is provided with a dedicated communication interface for communicating with the PCB MCU 317 of the UV light module 140 via I2C311 (from I2C311 through 14-pin connector 320 and 14-pin connector 321 to I2C318 of the PCB MCU 317). A UART (Universal Asynchronous Receiver / Transmitter) 327 may also be provided to enable communication from the microcontroller 302 to an external computing device, such as a mobile phone. The PCB MCU 317 is primarily configured to record faults related to the multiple UV LEDs 141, which will be described later, and these faults are communicated to the microcontroller 302. Depending on the specific fault that occurs, an alarm 313 or an indicator 312, or both, are activated. The indicator 312 is configured to provide a visual warning, such as an indicator light, and is connected to three PWM 310s of the microcontroller 302. In a preferred embodiment, the indicator 312 is configured to display multiple colors corresponding to multiple different faults. Alarm 313 is configured to provide an audible alert and is connected to PWM308. 【0055】 In a preferred embodiment, the PCB MCU317 may be an AVR® ATtiny404 microcontroller. The AVR® ATtiny404 microcontroller includes an 8-bit AVR® processor with a hardware multiplier, is capable of operating up to 20MHz, has 4KB of flash memory, 256B of SRAM, and 128B of EEPROM, and is housed in a 14-pin package. It should also be understood that the PCB MCU317 may include any alternative microcontroller capable of providing the functions described herein. 【0056】 The variable boost converter 304 is connected to the low-pass filter 303 and the PWM 309 of the microcontroller 302. The variable boost converter 304 is configured to supply the voltage necessary to start current flowing to the multiple UV LEDs 141 until the maximum voltage is reached. The variable boost converter 304 is preferably configured to have a maximum output voltage of about 60V ± 5%. However, it should be understood that this maximum output voltage is illustrative and alternative configurations are possible in the implementation of the present invention. The microcontroller 302 is configured to control the output of the variable boost converter 304 so that a minimum return voltage of preferably about 250mV is maintained in the circuitry associated with the multiple UV LEDs 141, thereby ensuring maximum efficiency and minimizing heat generation from the linear current control 306. However, it should be understood that this minimum return voltage is merely illustrative and alternative configurations are possible in the implementation of the present invention. 【0057】 The linear current control 306 is connected to the PWM 307 and low-pass filter 305 of the microcontroller 302. The linear current control 306 is configured to adjust the current flowing to each of the multiple UV LEDs 141, maintaining high current accuracy for each individual LED and protecting each individual LED. The PWM 307 of the microcontroller 302 is used as a single filtered PWM output to each linear current control circuit of the linear current control 306, and this output drives each individual current control circuit with the same reference. The linear current control 306 is configured to maintain the LED current within a range of approximately 10mA or less relative to the reference input. The reference input is programmably adjusted by the microcontroller 302. 【0058】 The control board 155 within the control module 150 is configured to control the current flowing through the UV light module 140. Furthermore, the control board 155 is configured to provide an on / off protocol for the multiple UV LEDs 141 of the UV light module 140 based on whether the air flowing through the HVAC duct is at approximately 200 fpm or higher. The on / off protocol is primarily executed by the microcontroller 302, which is determined by calculating an approximate airflow rate based on temperature measurements communicated from the NTC thermistor and resistor 314 (heat source temperature sensor and external heat source) and the NTC thermistor 315 (ambient temperature sensor). In a preferred embodiment, the on / off protocol of the microcontroller 302 is configured to turn on the multiple UV LEDs 141 of the UV light module 140 when an airflow of approximately 200 fpm or higher is detected, and to turn off the multiple UV LEDs 141 of the UV light module 140 when an airflow of approximately 175 fpm or lower is detected. 【0059】 The negative temperature coefficient (NTC) thermistor and resistor 314 and the NTC thermistor 315 are all mounted on the sensor board 301. The sensor board 301 is connected to the control board 155 via 4-pin connectors 323 and 322. Specifically, one of the 4-pin connectors is connected to an ADC 326 with two inputs in the microcontroller 302. The 4-pin connectors 323 and 322 connect the NTC thermistor and resistor 314 and the NTC thermistor 315 to the control board 155. The NTC thermistor and resistor 314 is configured such that the resistor is used as a heat source and the NTC thermistor measures the heat emitted from the resistor. The NTC thermistor 315 is configured to measure the ambient temperature, and the measurement is communicated to the microcontroller 302 for comparison. By comparing the ambient temperature measurement from the NTC thermistor 315 with the temperature measurement from the NTC thermistor and resistor 314, the microcontroller 302 can determine whether or not airflow is present, thereby initiating an on / off protocol. For example, if the temperature measurements from 314 and 315 are close to each other, it is determined that airflow is present; if the temperature measurements from 314 and 315 are far apart, it is determined that airflow is not present. 【0060】 The UV light module 140 includes a printed circuit board 142. Multiple UV LEDs 141 are arranged and connected to the printed circuit board 142. The control board 155 is connected to the printed circuit board 142 via 18-pin connectors 320 and 321. This configuration allows for easy replacement of the printed circuit board 142 in the event of damage. The 18-pin connector 320 is connected to a variable boost converter 304, an ADC (analog-to-digital converter) 324 with 12 inputs in a microcontroller 302, and an I2C 311 (interintegrated circuit) of the microcontroller 302, thereby connecting the aforementioned components to the UV light module 140. The printed circuit board 142 includes a PCB MCU 317, which includes an ADC 319 and an I2C 318. Specifically, the I2C318 is connected to an 18-pin connector 321, which is connected to an 18-pin connector 320, which is connected to the I2C311 of the microcontroller 302, and communication is relayed between the microcontroller 302 and the PCB MCU317. The printed circuit board 142 further includes an NTC thermistor 316. The NTC thermistor 316 is configured to provide the microcontroller 302 with temperature readings of the printed circuit board 142 and / or a number of UV LEDs 141 for safe shutdown. 【0061】 The ADC325 (analog-to-digital converter with three inputs) in the microcontroller 302 has three inputs configured to monitor values ​​for the fault logging protocol of the microcontroller 302. The three inputs of the ADC325 are +24V SENSE, VLED+ SENSE, and IOUT. The first input, +24V SENSE, is configured to monitor the power supply 300, specifically the main power supplied from the power supply 300 to the control board 155. In a preferred embodiment, a target range of power is programmed into the microcontroller 302. If the +24V SENSE input of the ADC325 with three inputs detects an input power that is not within the target range, the microcontroller 302 records the detection and determines whether to shut off the multiple UV LEDs 141 based on the detected range. The second input, VLED+ SENSE, is configured to monitor the output provided by the variable boost converter 304. The variable boost converter 304 is configured to have a pre-selected output. If VLED+ SENSE detects an output different from a pre-selected output, the microcontroller 302 may be programmed to turn off multiple UV LEDs 141 and / or trigger an alarm via indicator 312 and / or alarm 313. A third input, IOUT, is configured to monitor the total current through the multiple UV LEDs 141. In a preferred embodiment, a target range for the current is programmed into the microcontroller 302. If the IOUT input of the ADC325, which has three inputs, detects that the current through the multiple UV LEDs 141 is not within the target range, the microcontroller 302 records the detection, identifies the out-of-range signal among the VRTN1-12 signals, and shuts off the individual LED string corresponding to that signal. 【0062】 Figure 9 is a cross-sectional view of the present invention substantially along line 2B-2B in Figure 2A, and specifically shows the airflow path within the HVAC duct 200 with the UV-C air intake device 100 installed. Inflow air IA flows in from the inlet end 214 of the HVAC duct 200. The inflow air IA is treated by ultraviolet UV radiation emitted from the UV-C air intake device 100. The ultraviolet UV radiation emitted from the UV-C air intake device 100 treats the inflow air IA before it reaches the UV-C air intake device 100. When the inflow air IA reaches the inlet end 110a of the UV-C air intake device 100, the inflow air IA is branched into an upper flow UF and a lower flow LF. As described above, the UV-C air intake device 100 includes the mounting portion 113a, the curved portion 113b, and the outlet portion 113c of the air orientation portion 113. The upper flow UF of the incoming air IA, treated with ultraviolet UV light, performs two functions. Specifically, a portion of the incoming air IA enters the mounting portion 113a, the curved portion 113b, and the outlet portion 113c of the air orientation section 113, guiding the treated incoming air IA onto the heat sink 130 and assisting in the heat reduction of the UV-C air intake device 100. On the other hand, another portion of the incoming air IA passes directly through the lower fins of the heat sink 130, also assisting in the heat reduction of the UV-C air intake device 100. Both the upper treated airflow UTA and the lower treated airflow LTA continue to flow through the duct 200 toward the outlet end 215. 【0063】 Figure 10 is a high-level flow diagram of the on / off control protocol for the UV-C air intake device 100. An external VAC power supply 300a supplies VAC current to power supply 300. Power supply 300 converts or rectifies the VAC current to VDC current, supplying power to the UV-C air intake device 100 and the entire control module 150 (showing the state in which power is supplied to the control board 155). Figure 10 shows the state in which the UV light module 140 and the PCB MCU 317 receive VDC from the control board 155. A heater drive signal is transmitted from the control board 155 to the NTC thermistor and resistor 314, specifically resistor 314a. Resistor 314a generates heat H1. Heat H1 is detected by the NTC thermistor 314b and sent from the NTC thermistor and resistor 314 to the control board 155. The NTC thermistor 315 detects the heat / airflow temperature H2 from the incoming air of the HVAC system. The NTC thermistor 315 sends the measured heat H2 temperature to the control board 155. The control board 155 measures the temperature difference between the NTC thermistor 315 and the NTC thermistor and resistor 314 to determine whether or not airflow exists in the HVAC duct. That is, if the temperature difference is small, it is determined that airflow exists, and if the temperature difference is large, it is determined that airflow does not exist. The PCB MCU 317 communicates with the control board 155 about fault conditions caused by either the UV light module 140 or the control module 150. The fault is stored in the memory of the control module 150's microcontroller. 【0064】 (Failure monitoring) The following explanation should be understood by referring to Figure 8. Figure 8 relates to fault monitoring and fault notification performed by the microcontroller 302 or the PCB MCU 317 or both. 【0065】 If one of the multiple LEDs 141 becomes open, a UV-C LED open-circuit failure occurs. If this fault is detected, a signal is sent to the microcontroller 302. The fault is recorded in the memory of the microcontroller 302 and is further indicated by the alarm 313 and indicator 312. 【0066】 If one of the multiple LEDs 141 short-circuits, a short-circuit fault occurs in the UV-C LED. When this fault is detected, a signal is sent to the microcontroller 302. The fault is recorded in the microcontroller 302's memory and is further indicated by the alarm 313 and indicator 312. 【0067】 If a current deviation exceeding 10% from the drive value persists for more than approximately 100ms in one of the multiple LEDs 141, an LED current fault occurs. When this fault is detected, a signal is sent to the microcontroller 302. The fault is recorded in the memory of the microcontroller 302 and is further indicated by the alarm 313 and indicator 312. 【0068】 If the output of the boost converter 304 exceeds approximately 24V + 5%, a boost converter failure occurs. When this failure is detected, a signal is sent to the microcontroller 302. This failure is recorded in the memory of the microcontroller 302 and is further indicated by the alarm 313 and indicator 312. 【0069】 If the input voltage to the control board 155 exceeds approximately 24V + 5%, a high-voltage input fault occurs. When this fault is detected, a signal is sent to the microcontroller 302. This fault is recorded in the memory of the microcontroller 302 and is further indicated by the alarm 313 and indicator 312. 【0070】 If the input voltage to the control board 155 is less than approximately 24V-5%, a low-voltage input fault occurs. When this fault is detected, a signal is sent to the microcontroller 302. This fault is recorded in the memory of the microcontroller 302 and is further indicated by the alarm 313 and indicator 312. 【0071】 An airflow detection fault occurs if the NTC thermistor 315 (ambient air thermometer) detects a temperature above approximately 85°C or below approximately -20°C. When this fault is detected, a signal is sent to the microcontroller 302. This fault is recorded in the microcontroller 302's memory and further indicated by the alarm 313 and indicator 312. An airflow detection fault also occurs if the temperature of the NTC thermistor and the thermistor of resistor 314 is approximately 10°C or more lower than the temperature detected by the NTC thermistor 315. In this case, the microcontroller 302 communicates, the fault is recorded in the microcontroller 302's memory, and further indicated by the alarm 313 and indicator 312. 【0072】 If communication between the microcontroller 302 and the PCB MCU 317 is lost, an external MCU communication failure occurs. When this failure is detected, the microcontroller 302 and / or the PCB MCU 317 record the failure in their respective memories and indicate the failure with an alarm 313 and an indicator 312. 【0073】 If the NTC thermistor 316 detects a temperature exceeding approximately 60°C, an LED stick over-temperature fault occurs. In this case, the microcontroller 302 turns off multiple LEDs 141. This fault is recorded in the memory of the microcontroller 302 and / or the PCB MCU 317, and is further indicated by the alarm 313 and indicator 312. 【0074】 As described above, it is understood that the objectives of the present invention are efficiently achieved. However, it should be understood that modifications and changes to the present invention are readily conceivable to those skilled in the art. These modifications and changes are intended to fall within the spirit and scope of the claimed invention. Furthermore, it should be understood that the foregoing description is illustrative of the invention and should not be construed as limiting. Accordingly, other embodiments of the present invention are possible without departing from the spirit and scope of the invention. [Explanation of Symbols] 【0075】 100 UV-C Air Intake Device 110 Air intake 110a Inlet end of air intake 110 110b Outlet end of air intake 110 111 First side panel of air intake 110 111a Mounting bracket for the first side panel 111 112 Second side panel of air intake 110 112a Mounting bracket for the second side panel 112 113 Air orientation section of air intake body 110 113a Mounting portion of air orientation section 113 113b Curved portion of air orientation section 113 113c Outlet portion of air orientation section 113 113d Mounting surface of mounting part 113a 113e Inner surface of air orientation section 113 120 Mounting plate 121 Mounting surface of mounting plate 120 for heat sink 122 Mounting surface of mounting plate 120 for UV light module 123 First mounting end of mounting plate 120 124 Second mounting end of mounting plate 120 130 Heat sink for air intake 110 131 Multiple fins on heatsink 130 132 Mounting surface of heatsink 130 133 Multiple fins 131 upper part 134 Multiple fins 131 lower part 140 UV light module for air intake 110 141 Multiple UV LEDs 141a, 141b, ... Individual UV LEDs 142 UV light module 140 printed circuit board 142a Mounting surface of printed circuit board 142 142b LED input section 142c LED heatsink input section 150 control modules 151 Main body of control module 150 152 Cover of main body 151 153 Internal space of the main body 151 155 Control board 160 Multiple LED Heatsinks 161 Multiple LED heatsinks 160 LED heatsinks 162 LED Heatsink 161 Multiple Fins 163 LED heatsink 161 base 164 Mounting surface of base 163 165 Outer surface of base 163 200 HVAC duct 210 Upper component of duct 200 210a Inner surface of upper member 210 211 First side member of duct 200 212 Second side member of duct 200 212a Inner surface of the second side member 212 212b External surface of the second side member 212 213 Lower component of duct 200 213a Inner surface of lower member 213 214 Inlet end of duct 200 215 Outlet end of duct 200 300 power supply 300a external VAC power supply 301 Sensor board 302 Microcontroller 303 Low-pass filter 304 Variable Boost Converter 305 Low-pass filter 306 Linear current control 307 Pulse Width Modulation (PWM) Signal Generator 308 PWM 309 PWM 310 3-channel PWM 311 Interintegrated Circuit (I2C) 312 Indicators 313 Alarm 314 NTC Thermistors and Resistors 314a resistance 314b NTC Thermistor 315 NTC Thermistor 316 NTC Thermistor 317 MCU for PCB (Printed Circuit Board) 318 I2C 319 Analog-to-Digital Converter (ADC) 320 18-pin connector 321 18-pin connector 322 4-pin connector 323 4-pin connector ADC with 324 12 inputs 325 ADC with 3 inputs 326 ADC with two inputs 327 Universal Asynchronous Transceiver (UART) 328 5V Step-Down Regulator 329 2-pin connector B Branch plane of UV-C air intake device 100 H1 heat H2 Heat / Airflow Temperature IA incoming air Lower flow of incoming air from LF branch B LTA lower treatment air Upper flow of incoming air from UF branch B UTA Top Treatment Air UV ultraviolet light

Claims

[Claim 1] An air sterilization device installed inside an HVAC duct, An air intake body disposed on the surface of the HVAC duct, having an inlet end and an outlet end, and comprising an air intake body having a bracket extending distally from the air intake body, A UV light module having a temperature sensor is fixed to the bracket, A heat sink fixed to the UV light module and positioned close to the outlet end, A control board that communicates with the UV light module, Equipped with, The control board has a microcontroller that communicates with a heat source temperature sensor and an ambient temperature sensor, which are located in close proximity to an external heat source. An air sterilization device installed in an HVAC duct, characterized in that the microcontroller communicates with the temperature sensor of the UV light module. [Claim 2] The UV light module is fixed to a printed circuit board (PCB), The air sterilization device installed in an HVAC duct according to claim 1, characterized in that the UV light module includes a plurality of LED light modules, each of which is configured to emit UV-C. [Claim 3] The heat sink further comprises a plurality of heat dissipation fins arranged to extend beyond the UV light module, The plurality of heat dissipation fins have an upper portion and a lower portion, The upper and lower portions of the plurality of heat dissipation fins are fixed to the bracket and are arranged perpendicular to the pair of mounting surfaces of the bracket. The air sterilization device installed in an HVAC duct according to claim 1, characterized in that the upper portion of the plurality of heat dissipation fins is disposed within the air intake body, and the lower portion of the plurality of heat dissipation fins extends beyond the outlet end of the air intake body. [Claim 4] The UV light module further comprises a plurality of individual heat sinks fixed to the printed circuit board, The air sterilization device installed in an HVAC duct according to claim 2, characterized in that each of the plurality of individual heat sinks is arranged adjacent to each of the plurality of LED light modules. [Claim 5] The air intake body is configured to partially block the air passing through the duct and to guide the blocked air to the heat sink, as described in claim 1, for an air sterilization device disposed in an HVAC duct. [Claim 6] The air sterilization device installed in an HVAC duct according to claim 1, characterized in that when the temperatures obtained by the ambient temperature sensor and the heat source temperature sensor are close together, the microcontroller communicates with the UV light module to turn it on. [Claim 7] The air sterilization device installed in an HVAC duct according to claim 6, characterized in that, if the temperatures obtained by the ambient temperature sensor and the heat source temperature sensor are different, the microcontroller communicates with the UV light module to turn it off. [Claim 8] The control board is housed within a control module, and the control module is installed in the HVAC duct. The air sterilization device installed in an HVAC duct according to claim 1, characterized in that the control module is electrically connected to an external power supply and electrically connected to the UV light module. [Claim 9] An air sterilization device installed inside an HVAC duct, An air intake body disposed on the surface of the HVAC duct, having an inlet end and an outlet end, and comprising an air intake body having a bracket extending distally from the air intake body, A UV light module having a temperature sensor is fixed to the bracket, A heat sink fixed to the UV light module and positioned close to the outlet end, A control board that communicates with the UV light module, Equipped with, The control board has a microcontroller that communicates with a heat source temperature sensor and an ambient temperature sensor, which are located in close proximity to an external heat source. The microcontroller communicates with the temperature sensor of the UV light module. The air intake is configured to partially block the air passing through the duct and guide the blocked air onto the heat sink. An air sterilization device installed in an HVAC duct, characterized in that when the temperatures obtained by the ambient temperature sensor and the heat source temperature sensor are close together, the microcontroller communicates with the UV light module to turn it on. [Claim 10] The UV light module is fixed to a printed circuit board (PCB), The UV light module includes a plurality of LED light modules, each of which is configured to emit UV-C. The air intake body is configured to partially block the air passing through the duct and to guide the blocked air to the heat sink, as described in claim 9, for an air sterilization device disposed in an HVAC duct. [Claim 11] The heat sink further comprises a plurality of heat dissipation fins arranged to extend beyond the UV light module, The plurality of heat dissipation fins have an upper portion and a lower portion, The upper and lower portions of the plurality of heat dissipation fins are fixed to the bracket and are arranged perpendicular to the pair of mounting surfaces of the bracket. The air sterilization device installed in an HVAC duct according to claim 9, characterized in that the upper portion of the plurality of heat dissipation fins is disposed within the air intake body, and the lower portion of the plurality of heat dissipation fins extends beyond the outlet end of the air intake body. [Claim 12] The UV light module further comprises a plurality of individual heat sinks fixed to the printed circuit board, The air sterilization device installed in an HVAC duct according to claim 10, characterized in that each of the plurality of individual heat sinks is arranged adjacent to each of the plurality of LED light modules. [Claim 13] An air sterilization device installed inside an HVAC duct, An air intake body having an inlet end and an outlet end, and an air intake body having a bracket extending distally from the air intake body, A UV light module mounted on a printed circuit board (PCB) fixed to the bracket, the UV light module having a temperature sensor and a plurality of individual heat sinks, A heat sink fixed to the UV light module and positioned close to the outlet end, A control board that communicates with the UV light module, Equipped with, The control board has a microcontroller that communicates with a heat source temperature sensor and an ambient temperature sensor, which are located in close proximity to an external heat source. An air sterilization device installed in an HVAC duct, characterized in that the microcontroller communicates with the temperature sensor of the UV light module. [Claim 14] The air sterilization device installed in an HVAC duct according to claim 13, characterized in that the air intake body is disposed on the surface of the HVAC duct. [Claim 15] The heat sink is equipped with multiple fins, The air sterilization device installed in an HVAC duct according to claim 13, characterized in that some of the plurality of fins are disposed inside the air intake body, and the other portion of the plurality of fins is disposed outside the outlet end. [Claim 16] The air sterilization device installed in an HVAC duct according to claim 13, characterized in that each of the plurality of individual heat sinks is provided with a plurality of fins. [Claim 17] The UV light module further comprises a plurality of individual heat sinks fixed to the printed circuit board, The air sterilization device installed in an HVAC duct according to claim 15, characterized in that each of the plurality of individual heat sinks is installed adjacent to each of the plurality of LED light modules. [Claim 18] When the ambient temperature sensor and the heat source temperature sensor obtain temperatures close together, the microcontroller communicates with the UV light module to turn it on. The air sterilization device installed in an HVAC duct according to claim 13, characterized in that, if the temperatures obtained by the ambient temperature sensor and the heat source temperature sensor are different, the microcontroller communicates with the UV light module to turn it off. [Claim 19] The control board is housed in the control module, The control module is installed in the HVAC duct, The air sterilization device installed in an HVAC duct according to claim 13, characterized in that the control module is electrically connected to an external power supply and electrically connected to the UV light module. [Claim 20] A method for sterilizing the airflow inside an HVAC duct, The steps of exposing the incoming air in the HVAC duct to UV light using the apparatus described in claim 1, The steps include: branching the incoming air with the air intake of the device; The steps include: guiding the incoming air, which has been branched by the air intake, to the heat sink of the apparatus; A method for sterilizing the airflow in an HVAC duct, characterized by including the following:

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