Element manufacturing method and wafer cutting device

By forming a concave groove in the wafer and using image correction, the method addresses the challenge of reduced accuracy in cutting elements with sides near the wafer thickness, enhancing both accuracy and cutting efficiency.

JP7647111B2Active Publication Date: 2025-03-18FUJIFILM BUSINESS INNOVATION CORP
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Patent Information

Application Number
JP2021005192
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-01-15
Publication Date
2025-03-18
Estimated Expiration
2041-01-15

AI Technical Summary

Technical Problem

The accuracy of correcting the feed amount of a rotating blade in cutting elements from a wafer is reduced when the length of one side of the cutting element is less than or equal to the thickness of the wafer, leading to potential blade instability and changes in the gap between the cut-out and uncut elements.

Method used

A method where the rotating blade forms a concave groove in the wafer intersecting the direction of one side of the element, images this groove, and corrects the feed amount based on the captured image to improve accuracy and stability.

Benefits of technology

This method enhances the accuracy of blade feed correction and improves cutting efficiency by stabilizing the blade and maintaining consistent gap measurements, even when the element's side length is near or below the wafer thickness.

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Abstract

To improve accuracy of compensation of a feed rate of a rotating blade that cuts the wafer.SOLUTION: A method for manufacturing a semiconductor element 30 by cutting a semiconductor wafer 22 in a grid shape with a blade 46 to cut out a rectangular semiconductor element 30 whose length on one side is less than or equal to a thickness of the semiconductor wafer 22 comprises a step for forming a concave groove 110 in the semiconductor wafer 22 by moving the blade 46 relatively in a Y direction and taking an image of the concave groove 110, a step for cutting the semiconductor wafer 22 at the concave groove 110 by moving the blade 46 relatively in the Y direction, and a step for feeding the blade 46 in one side direction by correcting a feed amount of the blade 46 in one side direction from the image taken of the concave groove 110.SELECTED DRAWING: Figure 1
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