Laminate, method for manufacturing printed circuit board, printed circuit board and antenna
The laminate structure combining a non-thermoplastic polyimide layer with a tetrafluoroethylene polymer layer addresses the issues of water absorption and heat resistance in printed circuit boards, resulting in improved dielectric stability and reduced transmission losses.
JP7647549B2Active Publication Date: 2025-03-18AGC INC
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Patent Information
- Application Number
- JP2021514914
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2019-10-25
- Filing Date
- 2020-04-09
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2040-04-09
AI Technical Summary
Technical Problem
Printed circuit boards using non-thermoplastic polyimides as dielectric layers face issues with unstable dielectric properties due to water absorption, insufficient heat resistance, and peeling or swelling during solder float processes.
Method used
A laminate structure comprising a non-thermoplastic polyimide layer and a tetrafluoroethylene polymer layer, with the tetrafluoroethylene polymer layer having a low water absorption rate and excellent dielectric properties, is used to enhance the stability and performance of printed circuit boards.
Benefits of technology
The proposed laminate structure achieves reduced transmission losses, improved heat resistance, and enhanced adhesion, resulting in a printed circuit board with superior physical and electrical properties.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention provides a laminate (metal clad laminate) which comprises a dielectric layer that has a low water absorption rate and excellent dielectric characteristics, heat resistance, and adhesion, and a metal foil layer, and which has excellent properties as materials or the like of printed circuit boards such as flexible printed circuit boards and rigid printed circuit boards. The laminate has at least a three-layer structure and includes the metal foil layer, a non-thermoplastic polyimide layer P, and a tetrafluoroethylene polymer layer F, at least one of the outermost layers being the metal foil layer. The layer F is present on at least one surface of the layer P. The layer P has a water absorption rate of less than 1.5%, and the absolute value of the coefficient of linear expansion thereof is 25 ppm / °C or less.
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