Electronic device and method for manufacturing the same

By using a sealing material containing glass to join metal substrates and glass frames in electronic devices, the method addresses the challenge of maintaining a reliable airtight structure while ensuring efficient light transmission in ultraviolet LED devices.

JP7648986B2Active Publication Date: 2025-03-19NIPPON ELECTRIC GLASS CO LTD
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Patent Information

Application Number
JP2021159194
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-09-29
Publication Date
2025-03-19
Estimated Expiration
2041-09-29

AI Technical Summary

Technical Problem

The challenge is to improve the reliability of the airtight structure in electronic devices, particularly those using ultraviolet LEDs, where the joining of metal substrates and glass frames is difficult and often compromises airtightness.

Method used

A method involving a bonding preparation step where a sealing material containing glass is interposed between the substrate and the frame, followed by a bonding step where the sealing material is softened and deformed by laser irradiation to join the components, thereby simplifying the joining process and enhancing airtightness.

Benefits of technology

This approach enhances the reliability of the airtight structure by simplifying the joining process, reducing the risk of airtightness compromise, and ensuring efficient light transmission in ultraviolet LED devices.

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Abstract

To improve the reliability of an airtight structure in an electronic device.SOLUTION: A method for manufacturing an electronic device 1 including an electronic component 2, a base material 3 on which the electronic component 2 is mounted, a frame member 6 made of glass surrounding the electronic component 2 with one end opening joined to the base material 3, and a lid member 7 directly joined to the frame member 6 so as to close the other end opening of the frame member 6 includes a joining preparation step of interposing a sealing material layer 5 containing a glass material between the base material 3 and the opening at one end of the frame member 6, and a main bonding step of bonding the base material 3 and the one end opening of the frame member 6 by irradiating the sealing material layer 5 with the laser L to soften and deform the sealing material layer after the joining preparation step.SELECTED DRAWING: Figure 8
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