Resin film, conductive laminate, and circuit board
By adding graphite particles of specific particle size and distribution to the polyarylene aldehyde ketone resin film, the problem of difficulty in simultaneously improving the adhesion, mechanical strength and reducing the dimensional shrinkage rate of the film in the prior art is solved, and the high performance characteristics of the film are achieved.
JP7653340B2Active Publication Date: 2025-03-28SHIN ETSU POLYMER CO LTD
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Patent Information
- Application Number
- JP2021160442
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-09-30
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2041-09-30
AI Technical Summary
Technical Problem
The prior art is difficult to simultaneously improve the adhesion and mechanical strength of the polyarylene etherketone resin film, while reducing the dimensional shrinkage rate of the film after etching.
Method used
Films are prepared using molding materials containing at least polyarylene aldehyde ketone resin and graphite. The particle size of graphite particles is 1 micron or more, and the proportion of graphite particles in the total graphite particles is 0.1% or more. The specific surface area and particle size distribution are within a specific range.
Benefits of technology
The film is achieved with high adhesion and mechanical strength, while the film size shrinkage rate is reduced after etching, avoiding the film's fragility.
✦ Generated by Eureka AI based on patent content.
Abstract
To provide a resin film, a conductive laminate and a circuit board which can achieve both improvement of adhesion and mechanical strength, and reduction of dimensional shrinkage after etching.SOLUTION: A resin film 1 is melted, extruded and molded by a molding material containing a polyarylene ether ketone resin that is a thermoplastic crystalline resin and mica, and is formed into a material of a conductive laminate and a circuit board, wherein as for a composition volume ratio of the molding material, the polyarylene ether ketone resin is 70 vol.% or more and 95 vol.% or less, and mica is 5 vol.% or more and 30 vol.% or less, an amount of the mica occupied by mica particles with a particle diameter of 1 μm or less is 20% or less of the total mica particles, and the mica contains mica particles having a median diameter D50 of 2.0 μm or more and 10 μm or less.SELECTED DRAWING: Figure 1
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