Pachinko machine

Abstract

To provide a game machine equipped with an electronic board mounted with a surface mounting electronic component, capable of suppressing deterioration in reliability.SOLUTION: A front board surface of a first board equipped with main control means for executing processing involved in the progress of a game has formed therein an insulation film and a notation part for specifying each of a plurality of electronic components on the insulation film. The front board surface is mounted with surface mounting type electronic components and insertion mounting type electronic components, and has formed therein a thermal pattern for connecting a specific connection part of a plurality of connection parts where the electronic components are soldered, to a solid ground. A front board surface of a second board arranged ahead of the first main board has formed therein an insulation film, but not a notation part, is mounted only with the surface mounting type electronic components, and has not formed therein a thermal pattern for connecting a specific connection part of a plurality of connection parts where the electronic components are soldered, to a solid ground.SELECTED DRAWING: Figure 129

Claims

【Claim 1】 A gaming machine including a plurality of substrates on which a plurality of electronic components are mounted, wherein the plurality of substrates include: a first substrate including main control means for executing processing related to the progress of the game; a second substrate that is electrically connected to the first substrate and disposed on the front side of the gaming machine closer to the player than the first substrate; an insulating film is formed on the front substrate surface of the first substrate, and identification portions for identifying each of the plurality of electronic components are formed on the insulating film; an insulating film is formed on the front substrate surface of the second substrate, but identification portions for identifying each of the plurality of electronic components are not formed on the insulating film; a solid ground pattern is formed on the first substrate, and no solid ground pattern is formed on the second substrate; on the front substrate surface of the first substrate, a surface mount type electronic component and an insertion mount type electronic component are mounted, and a specific pattern is formed that connects a specific connection portion among a plurality of connection portions where at least the insertion mount type electronic component is soldered, and the solid ground pattern; further, the surface mount type electronic component includes an integrated circuit component related to the progress of the game, and in the vicinity of the integrated circuit component, a specific discrete component soldered to the specific connection portion among the insertion mount type electronic components is disposed without sandwiching other of the electronic components between the integrated circuit component; the specific discrete component includes lead terminals soldered to the specific connection portion, and the lead terminals have two or more bent portions; in a state where the specific discrete component and the integrated circuit component are mounted on the first substrate, the height of the specific discrete component from the front substrate surface of the first substrate is higher than that of the integrated circuit component; at least one of the integrated circuit components is disposed between two of the specific discrete components without sandwiching other of the electronic components between the integrated circuit component and each of the specific discrete components; A gaming machine characterized by the above.

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