Gaming machine

Abstract

To provide a game machine equipped with an electronic board mounted with a surface mounting electronic component, capable of suppressing deterioration in reliability.SOLUTION: A front board surface of a first board equipped with main control means for executing processing involved in the progress of a game has formed therein an insulation film and a notation part for specifying each of a plurality of electronic components on the insulation film. The front board surface is mounted with surface mounting type electronic components and insertion mounting type electronic components, and has formed therein a thermal pattern for connecting a specific connection part of a plurality of connection parts where the electronic components are soldered, to a solid ground. A front board surface of a second board arranged ahead of the first main board has formed therein an insulation film, but not a notation part, is mounted only with the surface mounting type electronic components, and has not formed therein a thermal pattern for connecting a specific connection part of a plurality of connection parts where the electronic components are soldered, to a solid ground.SELECTED DRAWING: Figure 129

Claims

【Claim 1】 A gaming machine comprising a plurality of substrates on which a plurality of electronic components are mounted, The plurality of substrates include: A first substrate having main control means for executing processing related to the progress of the game; A second substrate electrically connected to the first substrate and disposed on the front side of the gaming machine closer to the player than the first substrate; An insulating film is formed on the front substrate surface of the first substrate, and identification portions for identifying each of the plurality of electronic components are formed on the insulating film. An insulating film is formed on the front substrate surface of the second substrate, but identification portions for identifying each of the plurality of electronic components are not formed on the insulating film. A solid ground pattern is formed on the first substrate, and no solid ground pattern is formed on the second substrate. On the front substrate surface of the first substrate, surface mount type electronic components and insertion mount type electronic components are mounted, and a specific pattern connecting a specific connection portion among a plurality of connection portions where at least the insertion mount type electronic components are soldered and the solid ground pattern is formed. Further, the surface mount type electronic components include integrated circuit components related to the progress of the game, and in the vicinity of the integrated circuit components, a specific discrete component soldered to the specific connection portion among the insertion mount type electronic components is disposed without sandwiching other electronic components between the integrated circuit components. The specific discrete component includes lead terminals soldered to the specific connection portion, and the lead terminals have two or more bent portions. When the specific discrete component and the integrated circuit component are mounted on the first substrate, the height of the specific discrete component from the front substrate surface of the first substrate is higher than that of the integrated circuit component. At least one of the integrated circuit components has four side surfaces, and the specific discrete component has at least one of the lead terminals in addition to one lead terminal soldered to the specific connection part. The specific discrete component is arranged such that the arrangement of the lead terminals is parallel to two opposing side surfaces of the integrated circuit component. The integrated circuit component is arranged between two of the specific discrete components without sandwiching other electronic components between the integrated circuit component and each of them. A gaming machine characterized by the above.

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