Pachinko machine

Abstract

To provide a game machine capable of improving prevention of return of a game ball which entered a game area to a guide area.SOLUTION: When a distance from a tip part to an outer rail is a specific distance, a game ball guided from a guide area to a game area is one game ball, and a game ball returning from the game area to the guide area is the other game ball, a first state is a state in which the specific distance is shorter than that in a second state, the second state is a state in which the specific distance is longer than that in the first state, and a third state is a state in which the one game ball is in contact with a side face part, the outer rail, and the other game ball, and the other game ball is in contact with the tip part, the outer rail, and the one game ball, so that the specific distance is longer than that in the first state and shorter than that in the second state, and is shorter than the distance from the lowermost point of the other game ball to the outer rail.SELECTED DRAWING: Figure 53

Description

Technical Field

[0001] The present invention relates to a gaming machine.

Background Art

[0002] As a gaming machine, a pachinko gaming machine is known, which includes a gaming area where game balls (game values) move, a launching device that launches game balls into the gaming area, and the like. The pachinko gaming machine is provided with a start port provided in the gaming area, and when the entry of a game ball into the start port is detected, a special symbol lottery is performed. When the result of the special symbol lottery is a big win, the gaming state shifts to a special gaming state, and a plurality of special games are executed in the special gaming state. In each special game, a large winning port provided in the gaming area operates in an open state, and game balls are paid out based on the entry of game balls into the large winning port.

[0003] Also, as a gaming machine, a slot machine is known, which includes a plurality of reels having a plurality of symbols arranged on the outer peripheral surface, a start lever, a stop button, and the like. In the slot machine, when the rotation of the reels is started based on a game start operation, an internal lottery using a lottery table is performed. When the reels stop, a symbol combination corresponding to the winning combination selected in the internal lottery is displayed. When the winning combination wins, as a process corresponding to the winning combination, for example, a medal payout process for paying out medals (game values) or a re-game process that enables a new game without consuming medals again is performed.

[0004] Some gaming machines such as slot machines and pachinko gaming machines include a substrate on which various electronic components are arranged and a substrate case that houses the substrate (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] By the way, in a gaming machine, it is required to suppress a decrease in visibility of information described on a sticker.

[0007] The present invention has been made in view of the above circumstances, and an object thereof is to provide a gaming machine in which a decrease in visibility of information described on a sticker is suppressed.

Means for Solving the Problems

[0008] In order to achieve the above object, a gaming machine of the present invention includes a substrate and a case that houses the substrate, the case includes a first member that covers one surface of the substrate and a second member that covers the other surface of the substrate, a sticker on which predetermined information can be written is attached to the first member, the first member is formed of an ABS resin, the second member is formed of a polycarbonate resin. If the first member is formed of a polycarbonate resin and the sticker is attached to the first member, bubbles may be formed in the sticker due to gas generation, and unevenness may be formed on the surface of the sticker. In this case, it becomes difficult to write predetermined information on the sticker, and when predetermined information is written on the sticker, it becomes difficult to visually recognize the predetermined information. In the present invention, since the first member to which the sticker is attached is formed of an ABS resin that generates less gas than a polycarbonate resin, it is possible to suppress the formation of unevenness on the surface of the sticker. Thereby, it is possible to suppress the difficulty of writing predetermined information on the sticker and the difficulty of visually recognizing the predetermined information described on the sticker. Further, by forming the second member not of an ABS resin but of a polycarbonate resin having higher strength than an ABS resin, it is possible to improve anti-tampering performance.

[0009] Further, in the configuration of the present invention, A component that generates heat is provided around the case. The seal is not attached to the second member. The volume of the second member is larger than the volume of the first member. According to this configuration, although a component that generates heat is provided around the case, the seal is attached to the first member made of ABS, and the seal is not attached to the second member made of PC. Therefore, it is possible to prevent unevenness from being formed on the surface of the seal. In addition, the second member, which has a larger volume than the first member, is formed of PC resin, which has higher strength than ABS resin. By forming a member with a larger volume (the second member) from a material with high strength, the anti-tampering performance can be improved.

Effect of the Invention

[0010] According to the present invention, it is possible to suppress a decrease in the visibility of the information described on the seal.

Brief Description of the Drawings

[0011]

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Mode for Carrying Out the Invention

[0012] (First Embodiment) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. In this embodiment, a pachinko game machine, which is one of the game machines, will be described, but other game machines may also be used. In the following description, basically, "front and back" means that when a player is on the front side of the game machine, the player side is "front" and the game machine side is "back", "up and down" means that the upper surface side of the game machine is "up" and the lower surface side is "down", and "left and right" means that the left hand side of the player playing the game on the game machine is "left" and the right hand side is "right".

[0013] FIG. 1 is a perspective view showing the external configuration of the gaming machine according to the present embodiment. The gaming machine according to the present embodiment is configured to play a game using game balls (game media) rented from a game arcade, and includes an outer frame 2 forming the outer surface of the gaming machine, a game board 6 provided inside the gaming machine and forming a game area 4 in which the game balls move, an inner frame 7 holding the game board 6, a glass unit 8 that allows the player to view the game board 6 but not touch it, and a front frame 10 to which the glass unit 8 is attached. The inner frame 7 is attached to the outer frame 2 via a hinge mechanism so as to be openable and closable. Further, the front frame 10 is attached to the inner frame 7 via a hinge mechanism so as to be openable and closable. Then, the inner frame 7 (and the front frame 10) can be opened and closed between a closed position (closed state) that closes the opening of the outer frame 2 and an open position (open state) that opens the opening of the outer frame 2.

[0014] The portion of the front frame 10 surrounding the glass unit 8 is made of a translucent material that transmits light, and inside the portion made of the translucent material, a plurality of front frame lamps 12 that output illumination light or the like for enlivening the game are provided. Further, speakers 14 (acoustic devices) that output sound effects or the like for enlivening the game are provided on the upper left and right and lower left and right of the upper part of the front frame 10.

[0015] An upper tray 16 for storing game balls is provided at the center of the lower part of the front frame 10, and a payout port 18 for paying out game balls from the gaming machine to the player is provided at the left part of the inner side surface of the upper tray 16. Further, a grip unit 20 is provided on the lower right side of the front frame 10. When the player rotates the grip unit 20 clockwise toward the gaming machine, a launching device (not shown) provided inside the gaming machine operates, and game balls are launched into the game area 4. Note that the launching device according to the present embodiment can launch 99 game balls per minute (1.65 game balls per second).

[0016] On the right part of the inner side surface of the upper tray 16, a supply port 22 for supplying game balls from the upper tray 16 to the launching device is provided. Also, below the upper tray 16, a lower tray 24 for storing surplus game balls when the upper tray 16 cannot store all the game balls is provided.

[0017] Also, on the front side of the edge of the upper tray 16, an effect button 26 (effect operation means) is provided. When the player operates the effect button 26, the effects performed on the gaming machine change.

[0018] FIG. 2 is a front view showing the external configuration of the game board 6 shown in FIG. 1. As shown in FIG. 2, an outer rail 28 is provided in a circular shape on the game board 6, and the area surrounded by the outer rail 28 is the game area 4 where the game balls move. Also, at the left end of the game area 4, an inner rail 30 is provided in an arc shape along the outer rail 28. The outer rail 28 and the inner rail 30 guide the game balls launched from a launching device (not shown) provided below the game board 6 into the game area 4.

[0019] In the central part of the game board 6, an effect unit 36 including a liquid crystal display 32 (effect display device) for displaying an effect image or the like for enlivening the game and a display frame 34 formed so as to surround the liquid crystal display 32 is provided. And on the display frame 34, above the center of the liquid crystal display 32, a display frame lamp 38 for outputting an effect light or the like for enlivening the game is provided.

[0020] In this embodiment, the front side of the liquid crystal display 32 is made impassable for the game balls, and the game balls launched from the launching device fall into either the game area 4a on the left side or the game area 4b on the right side of the liquid crystal display 32. Also, in the game area 4, a large number of game pins (not shown) are struck so as to intersect the surface of the game board 6, and the moving direction of the game balls moving in the game area 4 changes randomly.

[0021] On the left part of the display frame 34, an opening 40 through which a game ball falling in the left game area 4a of the liquid crystal display 32 can pass is formed. The game ball passing through this opening 40 passes through a passage 42 provided in the display frame 34 and falls onto a stage 44 provided below the liquid crystal display 32. The upper surface of this stage 44 is a smooth curved surface, and a gap is formed between the stage 44 and the glass unit 8 through which the game ball can fall downward from the stage 44. The game ball that has fallen onto the stage 44 from the passage 42 reciprocates left and right on the stage 44 and then falls downward from near the central part of the stage 44.

[0022] Below the central part of the stage 44, a first start port 46 into which a game ball falling downward from near the central part of the stage 44 can enter is provided. Also, in the first start port 46, a first start port switch 100 (see FIG. 4) for detecting a game ball that has entered the first start port 46 is disposed. When the first start port switch 100 detects a game ball (entry of a game ball into the first start port 46), it outputs a detection signal to the main control board 200. Further, based on the input of the detection signal from the first start port switch 100, the main control board 200 executes a first special symbol lottery as a special symbol lottery. Also, based on the input of the detection signal from the first start port switch 100, the main control board 200 causes the payout device 130 to execute the payout of prize balls. Also, the game ball that has entered the first start port 46 is collected inside the gaming machine.

[0023] To the left of the first start port 46 in the gaming area 4, a plurality (three) of general winning ports 47 (upper left general winning port 47a, middle left general winning port 47b, and lower left general winning port 47c) are provided. Also, on the game board 6, a general winning port switch 101 (see FIG. 4) for detecting a game ball that has entered the upper left general winning port 47a, the middle left general winning port 47b, or the lower left general winning port 47c is disposed. When the general winning port switch 101 detects a game ball (entry of a game ball into the upper left general winning port 47a, the middle left general winning port 47b, or the lower left general winning port 47c), it outputs a detection signal to the main control board 200. Further, based on the input of the detection signal from the general winning port switch 101, the main control board 200 causes the payout device 130 to execute a prize ball payout operation. Note that one general winning port switch 101 may be provided for each of the upper left general winning port 47a, the middle left general winning port 47b, and the lower left general winning port 47c, or only one general winning port switch 101 may be provided for a plurality (for example, three) of general winning ports 47. Also, in addition to the upper left general winning port 47a, the middle left general winning port 47b, and the lower left general winning port 47c, general winning ports 47 and general winning port switches corresponding to these general winning ports may be provided.

[0024] Also, in the gaming area 4b on the right side of the liquid crystal display 32, a passage gate 48 through which a game ball passes without being collected inside the gaming machine is provided. Also, inside the passage gate 48, a gate switch 102 (see FIG. 4) for detecting that a game ball has passed is disposed. When the gate switch 102 detects a game ball (passage of a game ball through the passage gate 48), it outputs a detection signal to the main control board 200. Further, based on the input of the detection signal from the gate switch 102, the main control board 200 executes a normal symbol lottery for determining the success or failure of a normal win.

[0025] In addition, in the game area 4b on the right side of the liquid crystal display 32, a second starting port 49 is provided below the passing gate 48. Also, inside the second starting port 49, a second starting port switch 103 (see FIG. 4) for detecting a game ball that has entered the second starting port 49 is disposed. When the second starting port switch 103 detects a game ball (entry of a game ball into the second starting port 49), it outputs a detection signal to the main control board 200. Further, based on the input of the detection signal from the second starting port switch 103, the main control board 200 executes a second special symbol lottery as a special symbol lottery. Also, based on the input of the detection signal from the second starting port switch 103, the main control board 200 causes the payout device 130 to execute the payout of prize balls. Also, the game balls that have entered the second starting port 49 are collected inside the gaming machine.

[0026] The second starting port 49 is provided with a normal accessory 54 (assisting means) that can operate between a reduced state (a state that does not assist entry, a non-assisting state) in which it is difficult for a game ball to enter the second starting port 49 and an enlarged state (a state that assists entry, an assisting state) in which a game ball can easily enter. The normal accessory 54 incorporates a driving device such as a solenoid and is controlled to enter an enlarged state under predetermined conditions when a normal win is won in a normal symbol lottery.

[0027] In addition, a big winning port 50 is provided in the game area 4b on the right side of the liquid crystal display 32. Also, inside the big winning port 50, a count switch 104 (see FIG. 4) for detecting a game ball that has entered the big winning port 50 is disposed. When the count switch 104 detects a game ball (entry of a game ball into the big winning port 50), it outputs a detection signal to the main control board 200. Further, based on the input of the detection signal from the count switch 104, the main control board 200 causes the payout device 130 to execute a payout operation of prize balls. Also, based on the input of the detection signal from the count switch 104, the main control board 200 counts the number of game balls that have entered the big winning port 50. Also, the game balls that have entered the big winning port 50 are collected inside the gaming machine.

[0028] The large winning opening 50 is provided with a special accessory 56 that can operate between a closed state (second state, non-entry state) in which game balls cannot enter the large winning opening 50 and an open state (first state, entry possible state) in which game balls can enter. The special accessory 56 incorporates a driving device such as a solenoid and is controlled to be in the open state under predetermined conditions in a special game state that starts when winning a jackpot in a special symbol lottery (first special symbol lottery or second special symbol lottery).

[0029] Also, at the lowermost part of the game area 4, an out port 62 is provided to collect game balls that have fallen in the game area 4 without entering any of the winning openings 46, 47, 49, 50 into the game machine. Here, inside the game machine, a discharge path (not shown) through which the game balls collected (discharged) from the game area 4 pass is provided. In this game machine, all the game balls launched into the game area 4 (all the game balls collected from the game area 4) are configured to pass through the discharge path. That is, the game balls launched into the game area 4 are collected from the game area 4 and flow into the discharge path by entering any of the winning openings 46, 47, 49, 50 or passing through the out port 62. Specifically, the game balls that have entered each winning opening 46, 47, 49, 50 are detected by switches 100, 101, 103, 104 disposed inside the winning opening and then guided to the discharge path. Also, the game balls collected from the out port 62 are guided to the discharge path. Further, an out switch 106 (see FIG. 4) is disposed in the discharge path. When the out switch 106 detects a game ball passing through the discharge path (discharge of game balls from the game area 4), it outputs a detection signal to the main control board 200. Also, based on the input of the detection signal from the out switch 106, the main control board 200 counts the number of game balls discharged from the game area 4.

[0030] The game ball launching device is configured such that the shooting power of the game ball changes by adjusting the rotation amount of the grip unit 20 shown in FIG. 1. When the rotation amount of the grip unit 20 is small, the game ball is launched so that it falls into the game area 4a on the left side of the liquid crystal display 32. When the rotation amount of the grip unit 20 is large, the game ball is launched so that it falls into the game area 4b on the right side of the liquid crystal display 32.

[0031] Therefore, the player adjusts the rotation amount of the grip unit 20 according to the game situation, and launches the game ball so that the game ball falls into the game area 4a on the left side, or passes through the opening 40, the passage 42, and the stage 44 and wins the first starting port 46 (left shot), or the game ball falls into the game area 4b on the right side, and the game ball passes through the passing gate 48, or the game ball wins the second starting port 49, or the game ball wins the big winning port 50 (right shot).

[0032] In the gaming machine of this embodiment, when the game ball falls into the game area 4a on the left side, the game ball does not pass through the passing gate 48, and the game ball does not enter (win) the second starting port 49 and the big winning port 50. Also, when the game ball falls into the game area 4b on the right side, the game ball does not win the first starting port 46, the upper left general winning port 47a, the upper middle general winning port 47b, and the lower left general winning port 47c.

[0033] At the lower right part of the game board 6 and outside the game area 4, a state display unit 70 for indicating various states of the gaming machine by lighting and extinguishing a lamp or the like is provided.

[0034] FIG. 3 is a front view showing the external configuration of the state display unit 70. As shown in FIG. 3, the state display unit 70 is provided with a normal symbol display unit 72, a normal hold display unit 74, a first special symbol display unit 76, a first special hold display unit 78, a second special symbol display unit 80, a second special hold display unit 82, and a game state display unit 84.

[0035] The normal symbol display section 72 is composed of two lamps, and when a normal symbol lottery is conducted, the normal symbol is variably displayed by flashing the two lamps, and the normal symbol is stopped and displayed by turning the two lamps on or off, thereby displaying the result of the normal symbol lottery.

[0036] The normal hold display section 74 is composed of two lamps, and when a normal symbol lottery cannot be conducted even if a random number value for normal symbol lottery is obtained, such as when the normal symbol is already being variably displayed or stopped being displayed when a game ball passes through the through gate 48, and the random number value for normal symbol lottery is held, it displays a normal hold number corresponding to the number of held random number values for normal symbol lottery. By combining turning the two lamps on, off, or flashing, it displays 0 to 4 normal hold numbers.

[0037] The first special symbol display section 76 is composed of a 7-segment display. When a first special symbol lottery is conducted when a game ball enters the first start port 46, the first special symbol is variably displayed by flashing the 7-segment display, and the first special symbol is stopped and displayed by lighting the 7-segment display in any one of a plurality of modes, thereby displaying the result of the first special symbol lottery.

[0038] The first special hold display section 78 is composed of two lamps, and when a special symbol lottery cannot be conducted even if a random number value for special symbol lottery (lottery information) is obtained, such as when the first special symbol or the second special symbol is already being variably displayed or stopped being displayed when a game ball enters the first start port 46, and the random number value for special symbol lottery is held as the first special random number value, it displays a first special hold number corresponding to the number of held first special random number values. By combining turning the two lamps on, off, or flashing, it displays 0 to 4 first special hold numbers.

[0039] The second special symbol display unit 80 is composed of a 7-segment display. When a second special symbol lottery is conducted due to a game ball entering the second start port 49, the second special symbol is variably displayed by blinking the 7-segment display, and the second special symbol is stopped and displayed by lighting the 7-segment display in any one of a plurality of modes, thereby displaying the result of the second special symbol lottery.

[0040] The second special hold display unit 82 is composed of two lamps. When the first special symbol or the second special symbol is already being variably displayed or stopped being displayed at the time when a game ball enters the second start port 49, etc., and thus a special symbol lottery cannot be conducted even when a random number value for special symbol lottery is obtained, and the random number value for special symbol lottery is held as the second special random number value, it displays the second special hold number corresponding to the number of the held second special random number values, and displays 0 to 4 second special hold numbers by a combination of lighting, turning off, or blinking the two lamps.

[0041] The game state display unit 84 is composed of six lamps, and displays the type of the currently set game state by a combination of lighting, turning off, or blinking the six lamps. In the present embodiment, four types of game states can be set: a normal state (low probability state), a probability variation state (high probability state, special state) in which the winning probability of a big win is set higher than that in the normal state, a special game state that starts when winning a big win in a special symbol lottery, and a time shortening state (special state) in which the variation time of the first special symbol or the second special symbol is shortened to frequently bring about an opportunity to execute a special symbol lottery, and it is displayed which game state is set by a combination of lighting, turning off, or blinking the six lamps.

[0042] FIG. 4 is a functional block diagram of the gaming machine according to the present embodiment. The gaming machine according to the present embodiment is controlled by a control board including a main control board 200 (main control means) and a sub-control board 202 (sub-control means). The functions of each board such as the main control board 200 and the sub-control board 202 are realized by hardware such as various processors (CPU, DSP, etc.), ASIC (gate array, etc.), ROM (an example of an information storage medium), or RAM, or software consisting of a given program stored in advance in a ROM or the like.

[0043] The main control board 200 controls the progress of the game. The main control board 200 receives input signals from input means such as a first start port switch 100, a general winning port switch 101, a gate switch 102, a second start port switch 103, a count switch 104, or an out switch 106, performs various calculations for executing the game, and based on the calculation results, controls the operations of output means such as a status display unit 70, a normal accessory 54, a special accessory 56, or a payout device 130.

[0044] The sub-control board 202 controls the execution of the effect based on the information transmitted from the main control board 200. The sub-control board 202 receives a signal sent from the main control board 200 and an input signal from an effect button switch 150 that detects an operation on the effect button 26, performs various calculations for executing an effect according to the progress of the game, and based on the calculation results, controls the operations of effect devices such as a liquid crystal display 32, a lighting device, a speaker 14, and an effect object driving device.

[0045] The main control board 200 includes a random number generation means 210, a normal symbol lottery means 220, a normal display control means 222, a normal accessory control means 224, a special symbol lottery means 230, a special display control means 240, a game state transition control means 250, a special game execution means 260, a payout instruction means 270, a communication control means 280, and a main memory 290.

[0046] The random number generation means 210 is means for generating a random number value for lottery, and is realized by a random number generator that generates a hardware random number or a program that generates a software random number. The software random number can be generated based on, for example, the count value of an increment counter (a counter that counts numerical values so as to circulate within a predetermined count range). Note that in the present embodiment, the "random number value" includes not only a value that randomly occurs in a mathematical sense, but also a value that can function as a random number substantially because its acquisition timing or the like is irregular even though its generation itself is regular.

[0047] The normal symbol lottery means 220 acquires a normal symbol lottery random number value from the random number generation means 210 based on the input of a detection signal from the gate switch 102 that detects each game ball passing through the passage gate 48, and stores it in the normal random number storage means 2912 of the main memory 290, and performs a normal symbol lottery for determining the winning or losing of a normal win etc. for the normal symbol lottery random number value read from the normal random number storage means 2912. Specifically, the normal symbol lottery means 220 performs a normal win determination process etc. as the normal symbol lottery.

[0048] The normal win determination process is a process for determining the winning or losing of a normal win. In the normal win determination process, the normal symbol lottery means 220 selects which normal symbol lottery table among a plurality of types of normal symbol lottery tables stored in the lottery table storage means 2910 of the main memory 290 to refer to for performing a random number determination process according to the game state. Here, each normal symbol lottery table has a normal win or a loss associated with each of 100 normal symbol lottery random number values from 0 to 99. Then, the normal symbol lottery means 220 determines whether a normal win has been won by determining whether one normal symbol lottery random number value read from the normal random number storage means 2912 is associated with a normal win by referring to the selected normal symbol lottery table. And when a normal win is won, the normal symbol lottery means 220 sets the normal win winning flag to the ON state in the flag storage means 2916 of the main memory 290, and when it is a loss, sets the normal win winning flag to the OFF state.

[0049] In addition, the normal symbol lottery table selected when the game state is a probability variation state or a time shortening state has a higher probability of winning a normal win set compared to the normal symbol lottery table selected when the game state is neither a probability variation state nor a time shortening state. In other words, the normal symbol lottery conducted when the game state is a probability variation state or a time shortening state has a higher probability of winning a normal win compared to the normal symbol lottery conducted when the game state is neither a probability variation state nor a time shortening state.

[0050] The normal display control means 222 is means for controlling the display of the state display unit 70 based on the lottery result of the normal symbol lottery, and performs normal symbol display control processing and normal hold display control processing.

[0051] In the normal symbol display control processing, the normal display control means 222 causes the two lamps of the normal symbol display unit 72 to blink until a predetermined variation time elapses, thereby variably displaying the normal symbol, and depending on whether a normal win is won in the normal win determination processing, the two lamps of the normal symbol display unit 72 are turned on or off, thereby stopping the display of the normal symbol, and the result of the normal symbol lottery is displayed on the normal symbol display unit 72.

[0052] Specifically, in the present embodiment, when the game state at the time when the normal symbol lottery is conducted is neither a probability variation state nor a time shortening state, the variation time of the normal symbol is set to 20 seconds, and when the game state at the time when the normal symbol lottery is conducted is a probability variation state or a time shortening state, the variation time of the normal symbol is set to 1 second. The opportunity to execute the normal symbol lottery comes more frequently when the game state is a probability variation state or a time shortening state.

[0053] In the normal hold display control processing, the normal display control means 222 displays 0 to 4 normal hold numbers by a combination of turning on, turning off, or blinking the two lamps of the normal hold display unit 74 according to the number of normal symbol lottery random number values stored in the normal random number storage means 2912.

[0054] The normal accessory control means 224 is means for controlling the normal accessory 54 based on the lottery result of the normal symbol lottery. When the gaming state is neither the probability variable state nor the time shortening state, the normal accessory control means 224 performs control to operate the normal accessory 54 so that after the normal accessory 54 becomes in the enlarged state until 0.1 second elapses and then returns to the reduced state, triggered by the normal symbol stopping and displaying in a mode indicating a normal win. Further, when the gaming state is the probability variable state or the time shortening state, the normal accessory control means 224 performs control to operate the normal accessory 54 so that after the normal accessory 54 becomes in the enlarged state until 20 seconds elapse and then returns to the reduced state, triggered by the normal symbol stopping and displaying in a mode indicating a normal win.

[0055] Therefore, when a normal win occurs in the normal symbol lottery, if the gaming state is neither the probability variable state nor the time shortening state, the normal accessory 54 operates so that the easiness of entry of the game ball into the second start port 49 hardly increases, but if the gaming state is the probability variable state or the time shortening state, the normal accessory 54 operates so that the easiness of entry of the game ball into the second start port 49 increases.

[0056] The special symbol lottery means 230 acquires a special symbol lottery random number value from the random number generation means 210 based on a detection signal being input from the first start port switch 100 that detects each game ball entering the first start port 46, and stores it as a first special random number value in the special random number storage means 2914 of the main memory 290. Further, the special symbol lottery means 230 acquires a special symbol lottery random number value from the random number generation means 210 based on a detection signal being input from the second start port switch 103 that detects each game ball entering the second start port 49, and stores it as a second special random number value in the special random number storage means 2914. Then, the special symbol lottery means 230 performs a special symbol lottery for determining the winning or losing of a big win etc. using the first special random number value or the second special random number value read from the special random number storage means 2914. Specifically, the special symbol lottery means 230 performs a big win determination process, a symbol determination process, etc. as the special symbol lottery.

[0057] The jackpot determination process is a process of reading out one jackpot determination random number value included in the first special random number value or the second special random number value stored in the special random number storage means 2914 and determining whether it is a jackpot. Here, one jackpot determination random number value is obtained from 65,536 jackpot determination random number values from 0 to 65,535 based on the detection signal being input from the first start port switch 100 or the second start port switch 103, and is stored as the first special random number value or the second special random number value in the special random number storage means 2914.

[0058] In the jackpot determination process, the special symbol lottery means 230 selects which of the plurality of types of jackpot lottery tables stored in the lottery table storage means 2910 of the main memory 290 to refer to for the random number determination process according to the game state. Here, each jackpot lottery table has a jackpot or a loss associated with each of the 65,536 jackpot determination random number values from 0 to 65,535. Then, the special symbol lottery means 230 determines whether the selected jackpot lottery table is referred to and whether the read one jackpot determination random number value is associated with a jackpot, thereby determining whether a jackpot has been won. Further, when the special symbol lottery means 230 wins a jackpot, it sets the jackpot winning flag to the ON state in the flag storage means 2916, and when it results in a loss, it sets the jackpot winning flag to the OFF state.

[0059] In addition, the jackpot lottery table selected when the game state is a probability-variable state is set to have a higher probability of winning a jackpot than the jackpot lottery table selected when the game state is a normal state or a time-saving state. In other words, the jackpot determination process (special symbol lottery) performed when the game state is a probability-variable state has a higher probability of winning a jackpot than the jackpot determination process (special symbol lottery) performed when the game state is a normal state or a time-saving state.

[0060] The symbol determination process is a process that is performed when a jackpot is won in the jackpot determination process. It reads out one symbol determination random number value included in the first special random number value or the second special random number value stored in the special random number storage means 2914, and determines whether the jackpot symbol (type of jackpot) is to be a 16-round sure-win symbol, a 4-round sure-win symbol, a 16-round normal symbol, or a 4-round normal symbol. Here, one symbol determination random number value is obtained from 100 symbol determination random number values from 0 to 99 based on the input of a detection signal from the first start port switch 100 or the second start port switch 103, and is stored as the first special random number value or the second special random number value in the special random number storage means 2914.

[0061] In the symbol determination process, the special symbol lottery means 230 selects which of the multiple types of symbol lottery tables stored in the lottery table storage means 2910 to refer to for the random number determination process according to whether the read one symbol determination random number value is stored as the first special random number value or the second special random number value. Here, each symbol lottery table has one of a 16-round sure-win symbol, a 4-round sure-win symbol, a 16-round normal symbol, and a 4-round normal symbol associated with each of the 100 symbol determination random number values from 0 to 99. Then, the special symbol lottery means 230 refers to the selected symbol lottery table and determines which of the multiple types of jackpot symbols the read one symbol determination random number value is associated with, thereby determining which of the multiple types of jackpot symbols has won. Also, the special symbol lottery means 230 sets the winning flag corresponding to the winning jackpot symbol to the ON state in the flag storage means 2916.

[0062] The special display control means 240 is means for controlling the display of the state display unit 70 based on the lottery result of the special symbol lottery, and performs a first special symbol display control process, a second special symbol display control process, a first special hold display control process, and a second special hold display control process.

[0063] The first special symbol display control process is a process that is performed when a first special random number value is read from the special random number storage means 2914 and a special symbol lottery is conducted. The special display control means 240 causes the 7-segment display of the first special symbol display unit 76 to blink until a predetermined variable time elapses, thereby variably displaying the first special symbol, and then causes the 7-segment display of the first special symbol display unit 76 to light up in a predetermined manner, thereby stopping the display of the first special symbol.

[0064] In this embodiment, the display modes of the 7-segment display are predetermined for each of the four types of jackpot symbols and losing symbols. The special display control means 240 causes the 7-segment display of the first special symbol display unit 76 to light up in a manner corresponding to whether or not a jackpot is won in the jackpot determination process, and when a jackpot is won in the jackpot determination process, in a manner corresponding to the jackpot symbol determined in the symbol determination process, thereby stopping the display of the first special symbol and displaying the result of the special symbol lottery on the first special symbol display unit 76.

[0065] The second special symbol display control process is a process that is performed when a second special random number value is read from the special random number storage means 2914 and a special symbol lottery is conducted. The special display control means 240 causes the 7-segment display of the second special symbol display unit 80 to blink until a predetermined variable time elapses, thereby variably displaying the second special symbol, and then causes the 7-segment display of the second special symbol display unit 80 to light up in a predetermined manner, thereby stopping the display of the second special symbol.

[0066] Then, the special display control means 240 causes the 7-segment display of the second special symbol display unit 80 to light up in a manner corresponding to whether or not a jackpot is won in the jackpot determination process, and when a jackpot is won in the jackpot determination process, in a manner corresponding to the jackpot symbol determined in the symbol determination process, thereby stopping the display of the second special symbol and displaying the result of the special symbol lottery on the second special symbol display unit 80.

[0067] In the first special hold display control process, the special display control means 240 causes the two lamps of the first special hold display unit 78 to be turned on, off, or blink in combination according to the number of first special random numbers stored in the special random number storage means 2914, thereby displaying 0 to 4 first special hold numbers.

[0068] In the second special hold display control process, the special display control means 240 causes the two lamps of the second special hold display unit 82 to be turned on, off, or blink in combination according to the number of second special random numbers stored in the special random number storage means 2914, thereby displaying 0 to 4 second special hold numbers.

[0069] As shown in FIG. 5, the game state transition control means 250 performs a game state transition control process for transitioning the game state among the normal state, the special game state, the probability-variable state, and the time-reduced state based on the establishment of a predetermined transition condition. The transition condition of the game state may be one condition or a plurality of conditions. When a plurality of conditions are defined, the game state can be transitioned to another game state based on the establishment of one of the plurality of predetermined conditions or the establishment of all of the plurality of predetermined conditions.

[0070] The normal state is a game state corresponding to the initial state among a plurality of types of game states, and it is possible to transition from the normal state to the special game state. In the normal state, a normal symbol lottery is performed with reference to a normal symbol lottery table in which the winning probability of a normal win is set to approximately 1 / 20, and a special symbol lottery is performed with reference to a big win lottery table in which the winning probability of a big win is set to 1 / 319.

[0071] In the normal state, the winning probability of a normal win in the normal symbol lottery is as low as approximately 1 / 20, the variation time of the normal symbol is set long, and the period during which the normal accessory 54 is in the enlarged state is as short as 0.1 second. Therefore, it is difficult for the game ball to enter the second start port 49.

[0072] The special game state is started based on winning a jackpot in the special symbol lottery in the normal state, sure-win state, or time-saving state, and ends when a special game of a predetermined number of rounds (execution times) is executed according to the type of jackpot symbol.

[0073] Specifically, when the special game state is started based on the winning flag of the 16-round sure-win symbol being set to the ON state in the special symbol lottery, the special game state ends on the condition that a 16-round special game from the 1st round to the 16th round has been executed.

[0074] Also, when the special game state is started based on the winning flag of the 4-round sure-win symbol being set to the ON state in the special symbol lottery, the special game state ends on the condition that a 4-round special game from the 1st round to the 4th round has been executed.

[0075] Also, when the special game state is started based on the winning flag of the 16-round normal symbol being set to the ON state in the special symbol lottery, the special game state ends on the condition that a 16-round special game from the 1st round to the 16th round has been executed.

[0076] Also, when the special game state is started based on the winning flag of the 4-round normal symbol being set to the ON state in the special symbol lottery, the special game state ends on the condition that a 4-round special game from the 1st round to the 4th round has been executed.

[0077] The probability variation state is started when the special game state started based on the winning flag of the 16-round probability variation symbol or the 4-round probability variation symbol (probability variation symbol) being set to the ON state ends, and it is possible to transition from the probability variation state to the special game state or the normal state. Also, in the probability variation state, the normal symbol lottery is conducted by referring to the normal symbol lottery table in which the winning probability of a normal win is set to approximately 19 / 20, and the special symbol lottery is conducted by referring to the jackpot lottery table in which the winning probability of a jackpot is set to 1 / 31, which is more advantageous to the player than the normal state. And the probability variation state ends on the condition that the number of times the special symbol lottery has been conducted in the probability variation state has reached 9999 times, and the state transitions to the normal state.

[0078] Specifically, when the special game state ends, the game state transition control means 250 writes a value (for example, 9999) corresponding to a predetermined number of game times (for example, 9999 times) to the probability variation end determination counter 2930 in the main memory 290, and performs a decrement update to subtract a value (for example, 1) corresponding to one game time from the stored value of the probability variation end determination counter 2930 each time the special symbol lottery is conducted in the probability variation state. Then, when the stored value of the probability variation end determination counter 2930 reaches the threshold value (for example, 0), the probability variation state is ended and the normal state is started. However, in the probability variation state, since the winning probability of a jackpot in the special symbol lottery is set to 1 / 31, it is almost impossible for the special game state to be started before the number of times the special symbol lottery has been conducted in the probability variation state reaches 9999 times, and thus it is almost impossible to transition from the probability variation state to the normal state.

[0079] Also, in the probability variation state, the winning probability of a normal win in the normal symbol lottery is as high as approximately 19 / 20, the variation time of the normal symbol is as short as 1 second, and the period during which the normal accessory 54 is in the enlarged state is as long as 20 seconds. Therefore, it is easier for the game balls to enter the second start port 49 than in the normal state, which is more advantageous to the player.

[0080] In addition, in the variable probability state, since a shorter variation time is often set as the variation time of the first special symbol or the second special symbol regardless of the number of holds, the opportunity to execute the special symbol lottery comes more frequently than in the normal state.

[0081] The short time state is started when the special game state started based on the winning flag of the 16-round normal symbol or the 4-round normal symbol being set to the ON state ends. From the short time state, it is possible to shift to the special game state or the normal state. Also, in the short time state, although the normal symbol lottery is conducted with reference to the normal symbol lottery table in which the winning probability of a normal win is set to approximately 19 / 20, similar to the variable probability state, the special symbol lottery is conducted with reference to the big win lottery table in which the winning probability of a big win is set to approximately 1 / 319, similar to the normal state, which is disadvantageous to the player compared to the variable probability state. And the short time state ends on the condition that the number of times the special symbol lottery has been conducted in the short time state reaches 100 times, and it shifts to the normal state.

[0082] Specifically, when the game state shifts to the short time state, the game state transition control means 250 writes a value (for example, 100) corresponding to a predetermined number of game times (for example, 100 times) to the short time end determination counter 2932 in the main memory 290, and performs a decrement update to subtract a value (for example, 1) corresponding to one game time from the stored value of the short time end determination counter 2932 each time the special symbol lottery is conducted in the short time state. When the stored value of the short time end determination counter 2932 reaches the threshold value (for example, 0), the short time state is ended.

[0083] Also, in the short time state, similar to the variable probability state, the winning probability of a normal win in the normal symbol lottery is as high as approximately 19 / 20, the variation time of the normal symbol is as short as 1 second, and the period during which the normal accessory 54 is in the expanded state is as long as 20 seconds. Therefore, it is advantageous to the player in that it is easier for the game ball to enter the second start port 49 than in the normal state.

[0084] In addition, in the time-saving state, similar to the probability-variable state, a shorter variation time is often set as the variation time of the first special symbol or the second special symbol regardless of the number of holds. Therefore, the opportunity to execute the special symbol lottery comes more frequently than in the normal state.

[0085] The special game execution means 260 is a means for executing a special game based on the lottery result of the special symbol lottery, and performs special game execution processes 1 to special game execution processes 4 and the like.

[0086] The special game execution process 1 is executed based on the fact that a 16-round probability-variable symbol is won in the special symbol lottery. The special game execution means 260 sets a value (for example, 16) corresponding to 16 times, which is the number of rounds predetermined for the 16-round probability-variable symbol, as the upper limit value of the round counter 2933. Each time the special accessory 56 completes its operation in a predetermined manner in each round, an increment update is performed by adding a value (for example, 1) corresponding to the number of rounds for one time to the stored value of the round counter 2933. When the stored value of the round counter 2933 reaches the upper limit value (for example, 16), the special game state ends.

[0087] Specifically, in the special game execution process 1, in the special game of each round from the first round to the 16th round, when the opening timer 2934 counts 29 seconds after the special accessory 56 becomes open, or when the count switch 104 detects the entry of one game ball, a value (for example, 1) corresponding to one game ball is added, and when the value of the big winning count counter 2936 reaches the upper limit value (for example, 10), the special accessory 56 is driven to be in the closed state. Then, assuming that the end condition for one round is satisfied, "1" is added to the value of the round counter 2933.

[0088] The special game execution process 2 is executed based on the fact that the 4-round guaranteed variable symbols are won in the special symbol lottery. The special game execution means 260 sets a value (for example, 4) corresponding to 4 times, which is the number of rounds predetermined for the 4-round guaranteed variable symbols, as the upper limit value of the round counter 2933. Each time the special accessory 56 completes its operation in a predetermined manner in each round, an increment update is performed by adding a value (for example, 1) corresponding to the number of rounds for one time to the stored value of the round counter 2933. When the stored value of the round counter 2933 reaches the upper limit value (for example, 4), the special game state ends.

[0089] Specifically, in the special game execution process 2, in the special game of each round from the first round to the fourth round, when the special accessory 56 is in the open state and the release timer 2934 counts 29 seconds, or when the value of the big winning count counter 2936 reaches the upper limit value (for example, 10), the drive control of the special accessory 56 is performed so that the special accessory 56 becomes the closed state. Then, assuming that the end condition of one round is satisfied, "1" is added to the value of the round counter 2933.

[0090] The special game execution process 3 is executed based on the fact that the 16-round normal symbols are won in the special symbol lottery. The special game execution means 260 sets a value (for example, 16) corresponding to 16 times, which is the number of rounds predetermined for the 16-round guaranteed variable symbols, as the upper limit value of the round counter 2933. Each time the special accessory 56 completes its operation in a predetermined manner in each round, an increment update is performed by adding a value (for example, 1) corresponding to the number of rounds for one time to the stored value of the round counter 2933. When the stored value of the round counter 2933 reaches the upper limit value (for example, 16), the special game state ends.

[0091] Specifically, in the special game execution process 3, in the special game of each round from the 1st round to the 16th round, after the special accessory 56 becomes open, the release timer 2934 counts 29 seconds, or when the value of the big winning count counter 2936 reaches the upper limit value (for example, 10), the drive control of the special accessory 56 is performed so that the special accessory 56 becomes closed. Then, assuming that the end condition of one round is satisfied, "1" is added to the value of the round counter 2933.

[0092] The special game execution process 4 is executed based on the fact that 4 rounds of normal symbols are won in the special symbol lottery. The special game execution means 260 sets a value (for example, 4) corresponding to 4 times, which is the number of rounds predetermined for 4 rounds of normal symbols, as the upper limit value of the round counter 2933. Each time the special accessory 56 completes its operation in a predetermined manner in each round, an increment update is performed by adding a value (for example, 1) corresponding to the number of rounds of one round to the stored value of the round counter 2933. When the stored value of the round counter 2933 reaches the upper limit value (for example, 4), the special game state ends.

[0093] Specifically, in the special game execution process 4, in the special game of each round from the 1st round to the 4th round, after the special accessory 56 becomes open, the release timer 2934 counts 29 seconds, or when the value of the big winning count counter 2936 reaches the upper limit value (for example, 10), the drive control of the special accessory 56 is performed so that the special accessory 56 becomes closed. Then, assuming that the end condition of one round is satisfied, "1" is added to the value of the round counter 2933.

[0094] The payout instruction means 270 performs control to cause the payout device 130 to pay out a number of game balls corresponding to the number of prize balls predetermined for each detection signal based on the detection signal input from the first start port switch 100, the general winning port switch 101, the second start port switch 103, or the count switch 104. Specifically, the payout instruction means 270 transmits a payout command instructing the payout device 130 to pay out a number of game balls corresponding to the number of prize balls determined for each input detection signal. Note that the number of prize balls may be any number of 1 or more, and the number of prize balls paid out may be different for each of the first start port switch 100, the general winning port switch 101, the second start port switch 103, or the count switch 104, or may be set to the same number of prize balls.

[0095] The payout device 130 performs an operation of paying out the number of game balls indicated by the payout instruction means 270. The payout device 130 includes a payout control board 400, a game ball tank for storing game balls, a payout motor for paying out the game balls stored in the game ball tank as prize balls to the player, a payout count switch for detecting the passage of the paid-out game balls, and the like.

[0096] The payout control board 400 controls the payout of prize balls. The payout control board 400 is equipped with a CPU, ROM, RAM, etc., and is connected to the main control board 200 so as to be capable of two-way communication. Also, a payout motor is connected to the payout control board 400. Then, the payout control board 400 controls the payout motor based on the payout command transmitted from the main control board 200 and the detection signal from the payout counting switch, and causes a predetermined number of prize balls to be paid out to the player. Specifically, the payout control board 400 starts energizing the payout motor based on the payout command transmitted from the main control board 200. And while the payout motor is energized and rotating, the game balls are paid out one by one. At this time, the payout counting switch detects the passage of the paid-out game balls and transmits a detection signal to the payout control board 400. The payout control board 400 grasps the number of game balls paid out based on the detection signal, and when the number of game balls corresponding to the instruction from the main control board 200 is paid out, it stops energizing the payout motor and ends the payout of the game balls.

[0097] The communication control means 280 controls the transmission of various commands generated according to various calculation results in the main control board 200 to the sub-control board 202, the payout control board 400, etc. In the gaming machine of the present embodiment, only one-way communication from the main control board 200 to the sub-control board 202 is possible between the main control board 200 and the sub-control board 202, and they are communicatively connected so that the sub-control board 202 cannot transmit information to the main control board 200.

[0098] Next, the sub-control board 202 will be described. The sub-control board 202 includes an effect control means 300 and a sub-memory 310.

[0099] The performance control means 300 causes the performance device to execute performances for livening up or assisting the game, such as causing the liquid crystal display 32 to display a performance image, turning on or flashing lighting devices such as the front frame lamp 12 and the display frame lamp 38, outputting performance sound from the speaker 14, or driving the performance object driving device to operate the performance object, based on various commands transmitted from the main control board 200, input signals from the performance button switch 150, and performance data stored in the performance data storage means 3110 of the sub-memory 310.

[0100] FIG. 6 is a perspective view of a payout control board unit 401 including a payout control board 400 and a board case 402 as viewed from the front side. In the present embodiment, the payout control board 400 is arranged such that its front surface faces the back side (rear) of the gaming machine and its back surface faces the front side (front) of the gaming machine.

[0101] In the present embodiment, all the components mounted on the payout control board 400 are mounted on the front surface side of the payout control board 400. Hereinafter, the surface (front surface) on which the components of the payout control board 400 are mounted may be referred to as the mounting surface. Note that there may be components mounted on the back surface side of the payout control board 400.

[0102] The dispensing control board 400 has an area (mass production mounting component arrangement area (first component arrangement area) A: the area outside the two-dot chain line in FIG. 6) where electronic components (mass production mounting components) to be mounted during mass production are arranged, and an area (mass production non-mounted component arrangement area (second component arrangement area) B: the area inside the two-dot chain line in FIG. 6) where electronic components not to be mounted during mass production (mass production non-mounted components) are arranged. Specifically, the mass production non-mounted component arrangement area B is the range occupied by the mass production non-mounted component when the mass production non-mounted component is arranged at a predetermined position on the dispensing control board 400 (the range occupied by the mounting part 405 (such as lands and through holes) for attaching (soldering) the mass production non-mounted component), and the range occupied by the silk 406 related to the mass production non-mounted component. Note that mass production refers to the production of a large quantity of products to be provided to the market. In other words, in products (gaming machines) circulating in the market, basically no components (mass production non-mounted components) are arranged in the mass production non-mounted component arrangement area B. Note that a plurality of mass production mounting component arrangement areas A and mass production non-mounted component arrangement areas B may be prepared respectively, or they may be one integrated area. Note that the electronic components are, for example, ICs (including main ICs), LEDs, passive components (resistors, capacitors, inductors, etc.), switches, connectors, etc.

[0103] Examples of components not mounted during mass production include: (1) development components (such as development connectors, development ICs, and development passive components) that are used only during development and not mounted during mass production; (2) electronic components that will be mounted when additional functions (specifications) are determined for later models and are not mounted during mass production (for the current model), such as function expansion components (function expansion connectors, function expansion ICs, and function expansion passive components); and (3) test components (such as test connectors, test ICs, and test passive components) that are used in a predetermined test conducted to provide the gaming machine to the market and are not mounted during mass production. In this embodiment, the area B for components not mounted during mass production is an area where development components as components not mounted during mass production are arranged. And in the area B for components not mounted during mass production, mounting parts 405 (such as lands and through holes) for attaching (soldering) the development components are provided.

[0104] The payout control board 400 is housed in a board case 402. The board case 402 has a front case 402a and a back case 402b. The front case 402a has a rectangular box shape with an open front side. Also, the back case 402b has a rectangular box shape with an open back side. Further, the front case 402a and the back case 402b are formed of a transparent synthetic resin. And the front case 402a and the back case 402b are combined to form a transparent box-shaped board case 402. Also, the payout control board 400 is housed inside the board case 402 in a state where the front case 402a faces the front surface of the payout control board 400 and the back case 402b faces the back surface of the payout control board 400.

[0105] In this embodiment, among the surfaces of the board case 402, the surface facing the front surface of the payout control board 400 is called the top surface, and the surface facing the back surface of the payout control board 400 is called the bottom surface. That is, the top surface of the board case 402 is formed by the front case 402a, and the bottom surface of the board case 402 is formed by the back case 402b.

[0106] In addition, in the present embodiment, a portion of the substrate case 402 (the top surface of the substrate case 402) facing the mass-production mounting component arrangement area A (the area outside the two-dot chain line in FIG. 6) is defined as the case-side first area A', and a portion facing the non-mounted component arrangement area B during mass production (the area inside the two-dot chain line in FIG. 6) is defined as the case-side second area B'.

[0107] In this embodiment, in the case-side second region B', there is a visibility-reducing portion C (the region indicated by hatching in FIG. 6) that reduces the visibility of the unmounted component placement region B during mass production. The visibility-reducing portion C is a portion that overlaps with the unmounted component placement region B in a direction orthogonal to the board surface (front surface) of the dispensing control board 400, and when viewing the dispensing control board 400 (the front surface of the dispensing control board 400) from a direction orthogonal to the board surface (front surface) of the dispensing control board 400, it is a portion that inhibits the visibility of the unmounted component placement region B during mass production. In other words, the visibility-reducing portion C is a portion that reduces the visibility of at least a part of the mounting portion 405 (such as lands and through holes) for mounting the unmounted components during mass production arranged in the unmounted component placement region B during mass production or the silk 406 related to the unmounted components during mass production. Note that "reducing (inhibiting) visibility" means that as long as the unmounted component placement region B during mass production (the portion overlapping with the visibility-reducing portion C of the unmounted component placement region B during mass production) (the mounting portion 405 and silk 406 related to the unmounted components during mass production) becomes difficult to see when viewed from the said direction, and here "becoming difficult to see" includes the case of becoming completely invisible. Also, the visibility-reducing portion C only needs to reduce the visibility of at least a part of the unmounted component placement region B during mass production (the mounting portion 405 and silk 406 related to the unmounted components during mass production), but it may also reduce the visibility of the entire unmounted component placement region B during mass production. In other words, it is also possible that all the mounting portions 405 for mounting the unmounted components during mass production provided on the dispensing control board 400 are located at positions overlapping with the visibility-reducing portion C (at least a part of them). Note that the portion whose visibility is reduced by the visibility-reducing portion C can also be said to be a portion whose visibility is reduced compared to a specific mass production mounting component placement region A (a specific region within the mass production mounting component placement region A, for example, the region where the main IC 500 described later is arranged or the region where the LED is arranged).

[0108] The visibility - reducing portion C may be, for example, a portion (character portion) with a predetermined character attached. That is, the substrate case 402 may have a predetermined character attached, and the visibility of the unmounted component placement area B during mass production may be reduced by this character. Specifically, the visibility - reducing portion C may be a portion with a character attached regarding a predetermined operation means (such as a button) provided on the dispensing control board 400. More specifically, the visibility - reducing portion C may be a portion with a character such as the character "RAM clear button" attached, which explains the type of a predetermined operation means (the function of the operation means). In addition, when the visibility - reducing portion C is a predetermined character portion, the character portion may be formed by printing a character on the substrate case 402, may be formed by attaching a seal or the like with a printed character, or may be formed by the uneven shape of the substrate case 402 or the like.

[0109] Also, the visibility - reducing portion C may be a portion with a seal of a predetermined size attached. That is, the substrate case 402 may have a predetermined seal attached, and the visibility of the unmounted component placement area B during mass production may be reduced by this seal. The seal may be a seal that is partially transparent and partially colored, or may be a seal that is entirely colored. In other words, for example, it may be a seal with a predetermined character, figure (graphic), etc. printed on a transparent sheet (film), or a seal with a predetermined character, figure (graphic), etc. printed on a white sheet (film). In the case of a seal with a predetermined print on a transparent sheet, the visibility of the unmounted component placement area B during mass production is reduced by the portion where the predetermined print is made and a predetermined color is attached (printing portion: colored portion).

[0110] Further, the visibility reduction portion C may be, for example, a portion (concavo-convex shape portion) where a predetermined concavo-convex shape is formed. That is, the substrate case 402 may have a predetermined concavo-convex shape formed thereon, and the visibility of the unmounted component arrangement region B during mass production may be reduced by the concavo-convex shape. Further, the concavo-convex shape may have predetermined information (predetermined character string, date mark, predetermined symbol, etc.), or may not have predetermined information such as a stepped shape.

[0111] In the present embodiment, as shown in FIG. 7, the visibility reduction portion C is formed by the seal 410. Further, the seal 410 is attached to the seal attachment region 412 of the substrate case 402 (the top surface of the substrate case 402).

[0112] The seal attachment region 412 is a region for attaching the seal 410. In the present embodiment, the seal attachment region 412 is a region indicated by a concavo-convex shape (predetermined shape) formed on the substrate case 402. Specifically, as shown in FIGS. 7 and 8(a), on the top surface of the substrate case 402, as a predetermined shape portion 413, a convex portion protruding in a rectangular frame shape toward the inner surface side (substrate side) is provided. And the rectangular region surrounded by the convex portion as the predetermined shape portion 413 is the seal attachment region 412. That is, in the present embodiment, the region partitioned by the predetermined shape portion 413 can be recognized as the seal attachment region 412, and an operator (working device) attaching the seal can discriminate the seal attachment region 412. Note that in the present embodiment, the seal 410 is attached to the outer surface side of the substrate case 402, but it may be attached to the inner surface side. Note that FIGS. 8(a) and 8(b) are schematic cross-sectional views showing a case where the payout control substrate unit 401 is cut along a plane orthogonal to the payout control substrate 400 and extending in the left-right direction (and the front-rear direction) (horizontal plane), and the cross-section is viewed from above. Note that not only the cross-section cut along the horizontal plane but also the cross-section cut along a vertical plane (a plane extending in the up-down direction and the front-rear direction) will be as shown in FIGS. 8(a) and 8(b).

[0113] In this embodiment, as shown in FIG. 8(a), the concavo-convex shape as the predetermined shape portion 413 is formed on the inner surface of the substrate case 402, and the portion corresponding to the predetermined shape portion 413 on the outer surface of the substrate case 402 is flat. However, as shown in FIG. 8(b), as the predetermined shape portion 413, a recess (concave groove) recessed in a rectangular frame shape from the outer surface side toward the inner surface side may be formed (together with a convex portion protruding in a rectangular frame shape toward the inner surface side). Further, the seal attachment region 412 may be a region recessed from the outer surface side toward the inner surface side (protruding toward the inner surface side) compared to the peripheral portion of the seal attachment region 412. In other words, the predetermined shape portion 413 does not have to be in a rectangular frame shape, and may be a portion recessed in a rectangular shape. Further, the predetermined shape portion 413 may be a portion protruding toward the outer surface side in a rectangular frame shape or a rectangular shape. Further, the predetermined shape portion 413 is one or a plurality of L-shaped convex portions or concave portions, and the corners of the seal attachment region 412 may be indicated by the L-shaped convex portions or concave portions. When there is one such L-shaped convex portion or concave portion, the range in which at least a part of the seal 410 exists within the range of the virtual triangle formed by connecting the three vertices (both ends and the corner) of the L (and the range in which the seal 410 does not straddle the L-shaped convex portion or concave portion) is defined as the seal attachment region 412.

[0114] The seal 410 is a seal of a predetermined size. Also, the size (area) of the seal attachment region 412 is larger than the size (area) of the seal 410. That is, when the substrate case 402 is viewed from a direction orthogonal to the plate surface (surface) of the payout control substrate 400 (the top surface of the substrate case 402), the area of the seal attachment region 412 is wider than the area of the seal 410. As a result, the required accuracy for the attachment operation of the seal 410 is relaxed. That is, the operator (working device) only needs to attach the seal 410 at an arbitrary position within the seal attachment region 412, so it is not necessary to perfectly align the center of the seal attachment region 412 and the center of the seal 410, and it is allowed to arrange them at a slightly deviated position.

[0115] Further, on the payout control board 400 (the surface of the payout control board 400), there is a seal attachment area facing area 420 (the area inside the two-dot chain line in FIG. 7) as an area facing the seal attachment area 412 of the board case 402. Also, the size (area) of the seal attachment area facing area 420 and the size (area) of the seal attachment area 412 are the same. In other words, when viewed from a direction orthogonal to the board surface (the surface) of the payout control board 400, the seal attachment area facing area 420 completely overlaps with the seal attachment area 412. Further in other words, when viewed from that direction, the seal attachment area 412 does not protrude from the payout control board 400 and is located inside the outer edge of the payout control board 400.

[0116] Here, an electronic component mounted on the payout control board 400, which is within the range of the seal attachment area facing area 420 and fits within this range without protruding from it (an electronic component whose entirety exists within this range) is called a specific electronic component. In the present embodiment, regardless of where the seal 410 is attached within the range of the seal attachment area 420, at least a part of the specific electronic component faces the seal 410. That is, in the present embodiment, although there are a plurality of electronic components as specific electronic components, regardless of where the seal 410 is attached within the range of the seal attachment area 412, any one of the plurality of specific electronic components faces the seal 410. Note that there is one or more electronic components as specific electronic components, and all of the specific electronic components (all electronic components that fit within the range of the seal attachment area facing area 420 without protruding from it) may be such that at least a part faces the seal 410 and the visibility is reduced by the seal 410, regardless of where the seal 410 is attached within the range of the seal attachment area 412. Note that "regardless of where it is attached within the range of the seal attachment area 412" means the case where the seal 410 is attached at an arbitrary position within the range of the seal attachment area 412 without protruding from this range. Note that "within the range of the seal attachment area 412" is a range that does not cross (exceed) the outer edge of the predetermined shaped portion 413 (the range inside the dashed-dotted line f in FIGS. 8(a) and 8(b)). However, "within the range of the seal attachment area 412" may be defined as a range that does not cross (exceed) the inner edge of the predetermined shaped portion 413 (the range inside the dashed-dotted line g in FIGS. 8(a) and 8(b)). The same applies to "within the range of the seal attachment area facing area 420".

[0117] That is, in the present embodiment, the seal 410 as the visibility reduction part C reduces the visibility of the non-mounted component arrangement area B during mass production, and even when it is pasted at any position (any position) within the range of the seal pasting area 412, it faces the specific electronic component and reduces the visibility of the specific electronic component. Further, the seal 410 as the visibility reduction part C is configured to reduce the visibility of at least a part of the non-mounted component arrangement area B during mass production even when it is pasted at any position (any position) within the range of the seal pasting area 412. Note that the non-mounted component arrangement area B (the mounting part 405, the silk 406, etc. related to the non-mounted components during mass production) may not exist within the range of the area facing the seal pasting area 420 (the position facing the seal 410).

[0118] Here, the reduction in the visibility of the electronic component (specific electronic component) by the seal 410 as the visibility reduction part C will be described in more detail. In the present embodiment, the seal 410 is formed by a printed part (colored part) on which predetermined characters and figures (graphs) are printed on a seal body (transparent part) as a transparent sheet.

[0119] In this embodiment, as shown in FIG. 9, the seal 410 has, as a printed portion, characters of "Payout Control Board" printed in white characters, a white rectangular filled (printed) area for filling in the opener of the substrate case 402, characters of "Opener" printed in white characters that are printed together with the opener entry area and indicate that it is the opener entry area, a white rectangular filled (printed) area for filling in the opening date of the substrate case 402, characters of "Opening Date" printed in white characters that are printed together with the opening date entry area and indicate that it is the opening date entry area, a white character string as a description of information regarding the components mounted on the payout control board 400, and a white frame line covering these various characters and areas. And in the direction orthogonal to the board surface (front surface) of the payout control board 400, this printed portion overlaps with the specific electronic components and the unmounted component placement area B during mass production, thereby reducing the visibility of the specific electronic components and the unmounted component placement area B during mass production. Note that each of the prints shown here as the printed portion (colored portion) is an example, and the seal 410 may include a part of each of the prints shown here or other prints. Note that the "information regarding the components mounted on the payout control board 400" may be, for example, an explanation of information indicated by the lighting state of an LED as the component (for example, a character string explaining what is indicated when a certain LED is lit (for example, the type of error indicated by the lighting state of the LED)), an explanation of the type (function of the operating means) of the operating means (such as a button) as the component, or information indicating the location of the component (such as an arrow symbol indicating the location).

[0120] Regarding the substrate case 402, there may be a plurality of seals 410 and seal attachment areas 412. Also, when there are a plurality of seals 410 and seal attachment areas 412, a plurality (all) of the seals 410 may have each feature related to the reduction in visibility of the aforementioned specific electronic components or the unmounted component placement area B during mass production. Further, a predetermined seal 410 may have each feature related to the reduction in visibility of the aforementioned specific electronic components, and another seal 410 may have each feature related to the reduction in visibility of the unmounted component placement area B during mass production. Also, for example, a predetermined seal 410 may be a seal containing information about the components mounted on the dispensing control board 400 (for example, a seal printed with the type of error indicated by the lighting state of an LED, etc.), and another seal 410 may be a seal related to the opening of the substrate case 402 (a seal printed with characters such as "opener", "opening date", an opener entry column, and an opening date entry column, etc.). Also, regarding the plurality of seals 410 and seal attachment areas 412 that exist, the sizes (areas) of the seals 410 and the sizes (areas) of the seal attachment areas 412 may be different. By making the sizes (areas) different, it is possible to prevent misattachment of the seals 410.

[0121] Note that the seal 410 may not be a transparent sheet with predetermined printing, but may be, for example, a white sheet with predetermined printing. In other words, the seal 410 may be entirely a colored part, and the visibility of the specific electronic components or the unmounted component placement area B may be reduced by the colored part.

[0122] (Modification example) In the gaming machine of this modification example, as shown in FIG. 10, the payout control board 400 has a specific connector mounting portion 430 as a mounting portion for attaching (soldering) a specific connector (such as a development connector, a function expansion connector, or a test connector) as a non-mounted component during mass production. The specific connector mounting portion 430 is composed of a plurality (four) of through holes 430a having lands, and the terminals of the specific connector are inserted into the through holes 430a and joined with solder so that the specific connector can be mounted. Note that during mass production, although no specific connector is mounted on the specific connector mounting portion 430, all the through holes of the specific connector mounting portion 430 are filled with solder and are in a non-penetrating state.

[0123] Further, the specific connector mounting portion 430 is covered by a board case 402 (front case 402a). Also, an opening for exposing the specific connector to the outside of the board case 402 is not provided in the portion of the board case 402 facing the specific connector mounting portion 430 (specific connector mounting portion facing area). In other words, when the specific connector is mounted, the board case 402 cannot be closed, and the payout control board 400 cannot be housed in the board case 402. Also, a ventilation hole or the like is not provided in the specific connector mounting portion facing area. In other words, no through holes are provided in the specific connector mounting portion facing area. And by not providing an opening or a ventilation hole or the like for exposing the specific connector in this way, it is possible to prevent fraud through the specific connector mounting portion 430. Also, since no opening for exposing the specific connector is provided, it is easy to understand that there is no problem even if no connector is mounted on the specific connector mounting portion 430.

[0124] In addition, the specific connector is arranged along a predetermined side (upper side) of the payout control board 400 so as to be arranged substantially in a line with other connectors (here, "substantially in a line" includes the case of being completely in a line). Specifically, in the present embodiment, a plurality (four) of connectors are provided at substantially equal intervals (here, "substantially equal intervals" includes the case of being completely equal intervals) with the specific connector. The plurality of connectors are components to be mounted during mass production. Specifically, the plurality of connectors are mounting component connection connectors used for connection with components (game machine-mounted components) mounted on the game machine, such as a control device (main control board 200) and other boards (including control boards such as the main control board 200). Note that, along the predetermined side (with an interval greater than the interval between these connectors), connectors other than the specific connector and the four mounting component connection connectors (for example, other mounting component connection connectors, etc.) may be provided.

[0125] The substrate case 402 is provided with openings 432 for exposing each of the four mounting component connection connectors to the outside at portions facing each of the four mounting component connection connectors. That is, for each of the four mounting component connection connectors, a corresponding opening 432 is provided. In FIG. 10, the illustration of the mounting component connection connector is omitted. Further, the substrate case 402 (front case 402a) is formed with one recess 434 that is recessed from the outer surface side toward the inner surface side. And in the recess (the bottom surface of the recess 434), four openings 432 corresponding to each of the four mounting component connection connectors and a facing area of the specific connector mounting portion are arranged. In other words, when viewed from a direction orthogonal to the board surface (surface) of the payout control board 400, the four openings 432 and the facing area of the specific connector mounting portion are within the range of the bottom surface of the recess 434 and are contained without protruding from the range. Thus, in the present embodiment, by arranging the mounting component connection connector (opening 432 for exposing the mounting component connection connector) and the facing area of the specific connector mounting portion in one recess 434, it is easier to notice when an unauthorized component is attached to the specific connector mounting portion 430. In addition, in the present embodiment, the payout control board 400 has mounting component connection connectors (not shown) in addition to the four mounting component connection connectors arranged in the recess 434. And, in the board case 402, a recess 438 for exposing the other mounting component connection connector is formed separately from the recess 434, and an opening 436 for exposing the other mounting component connection connector is arranged in the recess 438.

[0126] Also, the terminals of the specific connector (the through holes 430a through which the terminals are inserted) are arranged more inward (inward in the plane direction of the payout control board 400, that is, at a position away from the upper side) than the terminals of any of the four mounting component connection connectors arranged in the recess 434 (the through holes through which the terminals are inserted). For this reason, it is easy to understand that there is no problem even if no connector is mounted on the specific connector mounting portion 430.

[0127] Note that the specific connector (specific connector mounting portion 430) does not have to be arranged substantially in a line with other connectors along a predetermined side (upper side) of the payout control board 400. For example, it may be arranged at a position away from the peripheral edge, such as the central portion of the payout control board 400. Further, the specific connector may be a surface mount component, and the specific connector mounting portion 430 may be constituted by lands having no through holes (through holes).

[0128] The gaming machine of this embodiment includes a substrate 400 and a substrate case 402 for housing the substrate 400. In the substrate 400, the area where electronic components to be mounted during mass production are mounted is defined as the mass production mounting component arrangement area (first component arrangement area) A, and the area where electronic components not to be mounted during mass production can be mounted is defined as the mass production non-mounted component arrangement area (second component arrangement area) B. In the substrate case 402, the area facing the mass production mounting component arrangement area A is defined as the first area A', and the area facing the mass production non-mounted component arrangement area B is defined as the second area B'. Then, in the second area B', there is a visibility reduction part C that reduces the visibility of at least a part of the mass production non-mounted component arrangement area B. According to such a configuration, the visibility reduction part C will overlap with the mass production non-mounted component arrangement area B where no electronic components are mounted in the mass-produced product. For this reason, the range where the visibility reduction part C overlaps with the mass production mounting component arrangement area A can be reduced. Therefore, it is possible to prevent the reduction of the visibility of the part where the electronic components are mounted.

[0129] Further, the gaming machine of this embodiment includes a substrate 400 and a substrate case 402 for housing the substrate 400. There is a seal attachment area 412 on the substrate case 402 where a seal 410 is attached. If the area on the substrate 400 facing the seal attachment area 412 is defined as the seal attachment area facing area 320, the area of the seal attachment area 412 is larger than the area of the seal 410 and is the same as the area of the seal attachment area facing area 420. When viewed from a direction perpendicular to one surface of the substrate 400, if the electronic components that fit within the range of the seal attachment area facing area 420 without protruding from the range are defined as specific electronic components, then no matter at what arbitrary position within the range of the seal attachment area 412 the seal 410 is attached, at least a part of the specific electronic components will face the seal 410. According to such a configuration, by gathering the electronic components with no problem even if the visibility is reduced or the electronic components for which the visibility is desired to be reduced within the range of the seal attachment area facing area 420, it is possible to prevent the reduction of the visibility of the electronic components for which the reduction of visibility is desired to be avoided.

[0130] (Second Embodiment) Next, a second embodiment of the present invention will be described. The gaming machine of this embodiment has the same configuration as the gaming machine according to the first embodiment. Therefore, the description of the same configuration as that of the first embodiment will be omitted or simplified.

[0131] In this embodiment, all the components mounted on the payout control board 400 are mounted on the front side of the payout control board 400. Hereinafter, the surface on which the components of the payout control board 400 are mounted may be referred to as the mounting surface. Note that there may be components mounted on the back side of the payout control board 400.

[0132] In the following description, basically, the longitudinal direction (long side) of a component mounted on a board means the longitudinal direction (long side) when viewed from a direction perpendicular to the mounting surface, the short-side direction (short side) means the short-side direction (short side) when viewed from a direction perpendicular to the mounting surface, and the height direction means the direction perpendicular to the mounting surface. Also, for a component mounted on a board, the bottom surface means the surface on the mounting surface side, and the top surface means the surface facing the opposite side of the mounting surface.

[0133] The main IC 500 shown in FIG. 11 is mounted on the payout control board 400. The main IC 500 is an IC in which a CPU, a ROM, a RAM, etc. are integrated (monolithic). Also, the main IC 500 controls various processes by the payout control board 400.

[0134] The main IC 500 is mounted on the payout control board 400 via the socket 502 shown in FIG. 12. That is, the socket 502 is attached to the payout control board 400, and the main IC 500 is attached to the socket 502.

[0135] As shown in FIG. 11, the main IC 500 includes an IC body 510 that incorporates a CPU, a memory, etc. and is formed in a substantially rectangular plate shape, and a plurality of IC terminals P that are electrically connected to the circuits incorporated in the IC body 510. The plurality of IC terminals P are arranged in two rows along the longitudinal direction of the IC body 510 and extend from the IC body 510 toward the mounting surface side. In other words, the plurality of IC terminals P are arranged along both sides in the short-side direction of the IC body 510 along the longitudinal direction. Further in other words, the plurality of IC terminals P are arranged along each of the two opposing sides (two long sides) of the IC body 510. The package of the main IC 500 is a so-called DIP (Dual In-line Package).

[0136] In this embodiment, the main IC 500 has 71 terminals of IC terminals P1 to P71. Among the two rows, 35 terminals of IC terminals P1 to P35 are arranged on one side, and 36 terminals of IC terminals P36 to P71 are arranged on the other side. Note that each of the IC terminals P1 to P71 can also be said to be the first pin (first terminal) to the 71st pin (71st terminal) of the main IC 500, and can also be said to be the pins (terminals) with pin numbers (terminal numbers) 1 to 71.

[0137] The distance Px from the IC terminal P1 to the IC terminal P2 is 1 mm. Also, the distance Py from the IC terminal P2 to the IC terminal P3 is 1 mm. Also, the distance Pz from the IC terminal P1 to the IC terminal P3 is 2 mm. That is, the distance Px and the distance Py are equal. Also, the distance Pz is twice the distance Px and the distance Py. Also, the IC terminals P1 to P17 have equal intervals between adjacent IC terminals (1 mm), the IC terminals P18 to P35 have equal intervals between adjacent IC terminals (1 mm), the IC terminals P36 to P53 have equal intervals between adjacent IC terminals (1 mm), and the IC terminals P54 to P71 have equal intervals between adjacent IC terminals (1 mm). Also, the intervals between the IC terminal P17 and the IC terminal P18 and between the IC terminal P53 and the IC terminal P54 are longer than 1 mm. That is, for a continuous group of IC terminals P (IC terminals P1 to P17, IC terminals P18 to P35, IC terminals P36 to P53, or IC terminals P54 to P71), the intervals between adjacent IC terminals P are equal. Also, for a continuous group of IC terminals P (IC terminals P1 to P17, IC terminals P18 to P35, IC terminals P36 to P53, or IC terminals P54 to P71), the interval between every other IC terminal P (2 mm) is twice the interval between adjacent IC terminals P (1 mm). Note that the intervals between the IC terminal P17 and the IC terminal P18 and between the IC terminal P53 and the IC terminal P54 may be 1 mm.

[0138] As shown in FIG. 12, the socket 502 has a plurality of socket terminals Q to which the IC terminals P of the main IC 500 are respectively connected, a socket body (housing) 515 that holds the plurality of socket terminals Q and on which the main IC 500 is placed, and a plurality of legs 517. The socket body 515 is formed in a substantially rectangular parallelepiped shape from an insulating resin material. Also, the socket body 515 is formed from a transparent or translucent resin material and has translucency. Here, "having translucency" includes the case of being "transparent".

[0139] The socket body 515 has a top surface which is the surface on the side where the main IC 500 is placed (mounted). Note that the bottom surface of the main IC 500 does not have to contact the top surface of the socket body 515, and it is sufficient that the main IC 500 attached to the socket body 515 is located on the top surface side of the socket body 515. Also, one or a plurality of protrusions protruding toward the main IC 500 side may be provided on the top surface of the socket body 515, and the protrusion may be in contact with the bottom surface of the main IC 500.

[0140] Also, a plurality of legs 517 are provided on the socket body 515. The legs 517 protrude from the bottom surface of the socket body 515 toward the mounting surface side. In this embodiment, there are a total of six legs 517, namely, four legs 517 provided at the four corners of the socket body 515 and two legs 517 provided at intervals in the short side direction at the central portion in the longitudinal direction of the socket body 515. Also, the legs 517 are integrally formed with the socket body 515 from the same material (a material having insulating properties) as the socket body 515, but they may be formed from different materials. Note that the legs 517 are preferably provided at least at the four corners of the socket 502, but the number of legs may be less than four or more than four. Also, the height h (the protruding amount from the bottom surface of the socket body 515) of the legs 517 is 1 mm.

[0141] In this embodiment, the socket 502 has 71 terminals of socket terminals Q1 to Q71. Note that the socket terminals Q1 to Q71 can also be said to be the first pin (first terminal) to the 71st pin (71st terminal) of the socket 502, and can also be said to be the pins (terminals) with pin numbers (terminal numbers) 1 to 71. Also, in a state where the main IC 500 is attached to the socket 502, each of the socket terminals Q1 to Q71 is electrically connected to the IC terminals P1 to P71 with the corresponding pin numbers (the same pin numbers).

[0142] The socket terminal Q has an IC terminal contact portion 520 on the side away from the mounting surface (top surface side) that contacts the IC terminal P, and a board joining portion 521 on the mounting surface side (bottom surface side) that is joined to the payout control board 400. The upper end of the IC terminal contact portion 520 (socket terminal Q) is located on the mounting surface side rather than the top surface of the socket body 515. Also, the IC terminal contact portion 520 has a shape into which the IC terminal P can be inserted. In other words, in the socket body 515, a plurality (71) of holes 518 into which each of the socket terminals Q is embedded are formed, and by inserting each of the IC terminals P into each of the holes 518, the main IC 500 is attached to the socket 502 in a state where the IC terminal P and the IC terminal contact portion 520 are in contact. Also, the board joining portion 521 protrudes on the mounting surface side (board side) rather than the bottom surface of the socket body 515. Also, the board joining portion 521 protrudes on the mounting surface side (board side) rather than the leg 517. Then, the board joining portion 521 of each socket terminal Q is inserted into each through hole 504 of the payout control board 400 described later and joined by soldering, so that the socket 502 is attached to the payout control board 400. Also, the IC terminal contact portion 520 and the board joining portion 521 are integrally formed of a conductive metal. And, the socket terminal Q electrically connects the IC terminal P (main IC 500) and the through hole 504 (payout control board 400).

[0143] Note that each IC terminal contact portion 520 may have a shape that allows each IC terminal P of the main IC 500 to be connected. Also, each IC terminal contact portion 520 may have a shape that can suppress the detachment of the main IC 500 attached to the socket 502. In the present embodiment, as shown in FIG. 13, the IC terminal contact portion 520 is formed by bending a metal into an elastic shape and sandwiches the IC terminal P by an elastic force. Note that the IC terminal contact portion 520 may have a hole into which the IC terminal P can be inserted, and the IC terminal P may be fitted into the hole, etc. Note that the board connection portion 521 is shaped to extend substantially linearly (where "substantially linearly" includes the case of being completely linear) in a direction (height direction) orthogonal to the mounting surface so as to be insertable into the through hole 504.

[0144] In the socket 502, as shown in FIG. 12, a plurality of socket terminals Q are arranged in two rows along the longitudinal direction of the socket body 515. And for the plurality of socket terminals Q arranged in two rows, 35 terminals of socket terminals Q1 to Q35 are arranged in one row, and 36 terminals of socket terminals Q36 to Q71 are arranged in the other row. Also, for the plurality of socket terminals Q, the ends on the main IC 500 side (the top surface side of the socket body 515) are arranged in two rows along the longitudinal direction of the socket body 515, while the ends on the payout control board 400 side (the bottom surface side of the socket body 515) are arranged in four rows along the longitudinal direction of the socket body 515. In other words, the IC terminal contact portion 520 is arranged in two rows along the longitudinal direction of the socket body 515. Also, the board connection portion 521 is arranged in four rows along the longitudinal direction of the socket body 515. Further in other words, the plurality of socket terminals Q are arranged in two rows along the longitudinal direction of the socket body 515, and the socket terminals Q in each row have their ends on the main IC 500 side arranged linearly and their ends on the payout control board 400 side arranged staggeredly.

[0145] As is clear from the fact that for the plurality of socket terminals Q, the main IC 500 side is arranged in two rows and the payout control board 400 side is arranged in four rows, at least a part of the plurality of socket terminals Q (for example, for every other socket terminal Q among the socket terminals Q arranged in one row) has different positions in the short side direction of the socket body 515 between the IC terminal contact portion 520 and the board connection portion 521. In other words, at least some of the socket terminals Q have a bent portion 522 that bends between the IC terminal contact portion 520 and the board connection portion 521 so as to make their positions in the short side direction different.

[0146] Regarding the bent portion 522 of the socket terminal Q in this embodiment, it will be described with reference to FIG. 13. FIG. 13 is a diagram showing the shape of the socket terminal Q when viewed from the direction (longitudinal direction) orthogonal to the short side direction and the height direction of the socket body 515. (a) is a diagram showing the socket terminal Q with an odd pin number, (b) is a diagram showing the socket terminal Q with an even pin number, and (c) is a diagram showing the positional relationship of the socket terminals Q shown in (a) and (b) in the state held by the socket body 515. Regarding the socket terminals Q arranged in two rows in the longitudinal direction, the socket terminals in one row are arranged in the direction shown in FIG. 13, and the socket terminals in the other row are arranged in a direction symmetric to the left and right with respect to the direction shown in FIG. 13.

[0147] The bent portion 522 has a first bent portion 523 located on the substrate bonding portion 521 side, a second bent portion 524 located on the IC terminal contact portion 520 side, and an intermediate portion 525 that connects the first bent portion 523 and the second bent portion 524 and is substantially linear (here, "substantially linear" includes the case of being completely linear). The first bent portion 523 is a portion that bends from the height direction to the short side direction of the socket body 515 (the surface direction of the payout control board 400) on the side (top surface side) away from the mounting surface of the substrate bonding portion 521 extending in the height direction. Also, the first bent portion 523 has a bending angle α (the angle formed by the substrate bonding portion 521 and the intermediate portion 525) of 120 degrees. The second bent portion 524 is a portion that bends from the short side direction of the socket body 515 (the surface direction of the payout control board 400) to the height direction on the side away from the substrate bonding portion 521 of the intermediate portion 525. Also, the second bent portion 524 has a bending angle β (the angle formed by the intermediate portion 525 and the portion on the IC terminal contact portion 520 side) of 120 degrees. The intermediate portion 525 extends in the short protruding direction of the socket body 515, specifically, in a direction extending in the short protruding direction and inclined at a predetermined angle with respect to the surface direction of the payout control board 400. That is, the bent portion 522 is in a crank shape (here, "crank shape" includes a substantially crank shape) when viewed from the longitudinal direction of the socket body 515.

[0148] Then, by the bending portion 522, the lateral positions of the substrate bonding portions 521 of adjacent socket terminals Q among the plurality of socket terminals Q arranged in a row (the positions in the direction perpendicular to the alignment direction and the height direction of the socket terminals Q) are made different (shifted), so that the number of rows of the substrate bonding portions 521 is larger than that of the IC terminal contact portions 520.

[0149] In this embodiment, socket terminals Q of two types of shapes are prepared. For the plurality of socket terminals Q arranged in a row, the shapes of adjacent socket terminals Q are made different, and the same shape is provided every other one, but all the socket terminals Q may have the same shape.

[0150] Also, in this embodiment, the socket terminal Q is integrally formed of a conductive metal including the IC terminal contact portion 520, the substrate bonding portion 521, and the bending portion 522, but it may be formed of a plurality of parts. In other words, for each socket terminal Q, in a state where the main IC 500 is attached to the socket 502, it is sufficient that the IC terminal contact portion 520 and the substrate bonding portion 521 are electrically connected.

[0151] The distance Qx from the board joining portion 521 (lower end) of socket terminal Q1 to the board joining portion 521 (lower end) of socket terminal Q2 is 2.5 mm (see Fig. 12). Also, the distance Qy from the board joining portion 521 (lower end) of socket terminal Q2 to the board joining portion 521 (lower end) of socket terminal Q3 is 2.5 mm. Further, the distance Qz from the board joining portion 521 (lower end) of socket terminal Q1 to the board joining portion 521 (lower end) of socket terminal Q3 is 2 mm. That is, the interval between the board joining portion 521 of socket terminal Q1 and the board joining portion 521 of socket terminal Q2 is longer than the interval between the board joining portion 521 of socket terminal Q1 and the board joining portion 521 of socket terminal Q3. In other words, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the intervals between the board joining portions 521 of adjacent socket terminals Q are equal (2.5 mm). Also, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the interval (2.5 mm) between the board joining portions 521 of adjacent socket terminals Q is longer than the interval (2 mm) between the board joining portions 521 of every other socket terminal Q. In other words, the interval (2.5 mm) between the board joining portions 521 of adjacent socket terminals Q is longer than 1 / 2 of the interval (2 mm) between the board joining portions 521 of every other socket terminal Q.

[0152] Also, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the intervals between adjacent socket terminals Q are equal (1 mm). Also, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the intervals between the IC terminal contact portions 520 of adjacent socket terminals Q are equal (1 mm). Also, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the intervals between every other socket terminal Q (IC terminal contact portions 520) are twice the intervals between adjacent socket terminals Q (IC terminal contact portions 520) (2 mm). Specifically, the distance from the IC terminal contact portion 520 (upper end) of socket terminal Q1 to the IC terminal contact portion 520 (upper end) of socket terminal Q2 is 1 mm, the distance from the IC terminal contact portion 520 (upper end) of socket terminal Q2 to the IC terminal contact portion 520 (upper end) of socket terminal Q3 is 1 mm, and the distance from the IC terminal contact portion 520 (upper end) of socket terminal Q1 to the IC terminal contact portion 520 (upper end) of socket terminal Q3 is 2 mm. That is, the socket terminals Q1 to Q71 (IC terminal contact portions 520) are arranged at the same intervals as the IC terminals P1 to P71.

[0153] Then, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the distance between adjacent socket terminals Q in each group (1 mm) is shorter than the distance between the board bonding portions 521 of adjacent socket terminals Q in each group (2.5 mm). Also, the distance between the board bonding portions 521 of adjacent socket terminals Q in each group (2.5 mm) is longer than the distance between the IC terminal contact portions 520 of adjacent socket terminals Q in each group (1 mm). In other words, the distance between the board bonding portions 521 of the socket terminals Q to which adjacent IC terminals P of the main IC 500 are connected (for example, the distance Qx between the board bonding portion 521 of socket terminal Q1 and the board bonding portion 521 of socket terminal Q2: 2.5 mm) is longer than the distance between adjacent IC terminals P of the main IC 500 (for example, the distance Px between IC terminal P1 and IC terminal P2: 1 mm). Thus, by widening the distance (distances Qx, Qy) between adjacent board bonding portions 521, it is possible to prevent adjacent socket terminals Q from short-circuiting.

[0154] The payout control board 400 is provided with a plurality (the same number as the socket terminals Q) of through-holes 504 through which the socket terminals Q are inserted. Also, the plurality of through-holes 504 are arranged in four rows along the long side direction of the payout control board 400 so that the board bonding portions 521 of the plurality of socket terminals Q can be inserted. And the board bonding portion 521 of each socket terminal Q is inserted into each through-hole 504. Note that the arrangement of the through-holes 504 is the same as the arrangement of the board bonding portions 521 of the socket terminals Q. In other words, the distance between the through-holes 504 is the same as the distance between the board bonding portions 521 of the corresponding socket terminals Q.

[0155] Each through-hole 504 has an annular land 526 on each of the front side and the back side of the dispensing control board 400. The through-hole 504 as viewed from the front side of the dispensing control board 400 is shown in FIG. 14. The diameter (φ: outer diameter) of each land 526 is 1.5 mm. In other words, the radius of the land 526 (the length from the center (central axis) of the hole of the through-hole 504 to the outer edge of the land 526) is 0.75 mm. Also, the width of the land 526 (the length from the outer edge of the hole of the through-hole 504 to the outer edge of the land 526 in the plane direction of the dispensing control board 400) is 0.35 mm. Also, the diameter of the hole of the through-hole 504 is 0.8 mm. Note that the diameter of the land 526 may be 1 mm or less. Also, the radius of the land 526 may be 0.5 mm or less. Also, the width of the land 526 may be 0.5 mm or less.

[0156] When attaching the socket 502 to the dispensing control board 400, each socket terminal Q (board joint 521) is inserted into each through-hole 504, and each through-hole 504 and each socket terminal Q (board joint 521) are joined by solder. Also, when attaching the socket 502 to the dispensing control board 400, since the leg 517 hits the dispensing control board 400, further pushing-in of the socket 502 is restricted, so the bottom surface of the socket body 515 is in a floating state from the dispensing control board 400 as shown in FIG. 15. Therefore, in the state where the socket 502 is attached to the dispensing control board 400, the leg 517 abuts (or is close to) the dispensing control board 400, and a gap Z is formed between the bottom surface of the socket body 515 and the dispensing control board 400. That is, the gap Z is formed by the leg 517. In this embodiment, the height of the leg 517 is 1 mm, and the gap Z is made to have a length (height) of 1 mm. Note that the height (length) of the gap Z, in other words, the height of the leg 517, may be, for example, 1 mm or more.

[0157] Further, the gap Z is such that the solder fillet that joins each socket terminal Q and each through-hole 504 does not contact the bottom surface of the socket body 515. Here, the solder fillet formed around the socket terminal Q will be described. In the soldering process of mounting the socket 502 on the payout control board 400, first, each socket terminal Q (board joint portion 521) is inserted into each through-hole 504. Then, molten solder is attached to and solidifies on the socket terminal Q (board joint portion 521) and the through-hole 504. As a result, the socket 502 is fixed to the payout control board 400 in a state where the socket terminal Q and the through-hole 504 (wiring pattern connected to the through-hole 504) are electrically connected. At this time, when soldering is properly performed, a solder fillet made of solidified solder is formed around the socket terminal Q (board joint portion 521).

[0158] The solder fillet formed on the surface side of the ejection control substrate 400 has a substantially conical shape as shown in FIG. 15. And it is preferable that the shape of the solder fillet has a contact angle θ (the angle formed by the tangent of the solder surface and the substrate surface at the point where the substrate surface and the solder surface intersect) between 15 degrees and 45 degrees. In this embodiment, since the height of the leg 517 is 1 mm, a solder fillet with such a good shape (contact angle θ of 15 degrees to 45 degrees) does not contact the socket body 515. Here, the diameter of the solder fillet is approximately equal to the diameter of the land 526. Therefore, when the height of the solder fillet (the length from the surface of the ejection control substrate 400 to the apex of the solder fillet) is substantially equal to the radius of the land 526, the angle formed by the line segment connecting the apex of the solder fillet and the outer edge of the solder fillet (the outer edge of the contact portion between the solder fillet and the ejection control substrate 400) and the line segment connecting the outer edge of the solder fillet and the center of the bottom surface of the solder fillet (the angle formed by the generatrix of the solder fillet and the ejection control substrate 400) is about 45 degrees. For this reason, in order to prevent a solder fillet with a good shape (contact angle θ of 15 degrees to 45 degrees) from contacting the socket body 515, it is preferable that the height of the leg 517 is equal to or greater than the radius of the land 526, and preferably at least equal to or greater than the width of the land 526. Also, the height of the leg 517 may be equal to or greater than the diameter of the land 526, in other words, may be equal to or greater than twice the width of the land 526.

[0159] In this embodiment, soldering is performed from the back side of the ejection control substrate 400. That is, in this embodiment, while performing soldering from the back side, soldering is performed so that solder fillets are formed on the surface side (and the back side) for at least some of the socket terminals Q. Note that solder fillets may be formed on the surface side for all the socket terminals Q.

[0160] In this embodiment, a plurality of legs 517 are provided on the socket body 515, and a gap Z is formed, so that the heat generated by the main IC 500 can be dissipated through the gap Z, and the heat dissipation performance can be improved. In addition, in this embodiment, the gap Z considering the shape of the solder fillet can prevent a solder fillet with a good shape from contacting the socket body 515.

[0161] Note that if the height of the gap Z is made too high, there is a risk that it will be easy to illegally attach components to the socket terminal Q. Therefore, the height of the leg 517 is preferably set to be 2 times or less the diameter of the land, and more preferably 1.5 times or less the diameter of the land.

[0162] Also, in this embodiment, at least a part of the bent portion 522 is located within the gap Z. Specifically, the socket terminal Q has a portion (first bent portion 523) that bends in the short side direction of the socket body 515 (the plane direction of the payout control board 400) on the side away from the mounting surface of the board joint portion 521, and this portion is located within the gap Z. Further, the socket terminal Q has a portion 527 (see FIG. 13) that protrudes in the height direction from the bottom surface of the socket body 515, and the second bent portion 524 is located within the gap Z. In other words, in this embodiment, the entire bent portion 522 is located within the gap Z. Further in other words, when the socket 502 of this embodiment is viewed from the longitudinal direction of the socket body 515 (the direction orthogonal to the short side direction and the height direction), the adjacent socket terminals Q (for example, socket terminal Q1 and socket terminal Q2) have a bifurcated portion (the point D portion shown in FIG. 13(c)), and this portion is located within the gap Z. In other words, when viewed from the long side direction of the socket body 515, the bifurcated portion of the adjacent socket terminals Q (for example, socket terminal Q1 and socket terminal Q2) (the point D portion shown in FIG. 13(c)) and the portion where the adjacent socket terminals Q overlap and one socket terminal is hidden (the portion 527 that protrudes in the height direction from the bottom surface of the socket body 515) are visible. Note that the distance from the mounting surface to the bottom surface of the socket body 515 (height of the gap Z) is 1.0 mm, but the distance from the mounting surface to the first bent portion 523 (height of the first bent portion 523) may be, for example, 0.8 mm, and the distance from the mounting surface to the second bent portion 524 (point D) (height of the second bent portion 524 (point D)) may be, for example, 0.8 mm.

[0163] Also, in this embodiment, at least a part of the bent portion 522 is located on the side farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (substrate bonding portion 521). Specifically, the second bent portion 524 is located on the side farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (substrate bonding portion 521). In other words, when viewed from the longitudinal direction of the socket body 515, the portion where the adjacent socket terminals Q (for example, socket terminal Q1 and socket terminal Q2) branch into two is located on the side farther from the mounting surface than the apex of the solder fillet. That is, the second bent portion 524 is formed at a position where the solder (solder fillet) joining the socket terminal Q and the through hole 504 does not hit. In order to prevent the solder from hitting in this way, the height of the second bent portion 524 is preferably equal to or greater than the radius of the land 526, and preferably at least equal to or greater than the width of the land 526. Also, the height of the second bent portion 524 may be equal to or greater than the diameter of the land, or in other words, may be equal to or greater than twice the width of the land 526. Note that the first bent portion 523 may be arranged on the side farther from the mounting surface (a position where the solder does not hit) than the apex of the solder fillet of the socket terminal Q (substrate bonding portion 521). In other words, the height of the first bent portion 523 may be equal to or greater than the radius of the land 526, and may be equal to or greater than the width of the land 526. Also, the height of the first bent portion 523 may be equal to or greater than the diameter of the land, or in other words, may be equal to or greater than twice the width of the land 526. That is, the entire bent portion 522 may be located on the side farther from the mounting surface than the apex of the solder fillet of the socket terminal Q (substrate bonding portion 521).

[0164] As shown in FIGS. 16 and 17, the height of the central portion of the socket 502 in the short side direction is lower along the long side direction than that of both end portions in the short side direction (the portion where the socket terminals Q1 to Q35 or the socket terminals Q36 to Q71 are arranged). In other words, the top surface side of the socket body 515 has a shape in which the central portion in the short side direction is recessed toward the mounting surface side along the long side direction. Further in other words, a first concave groove (first concave portion) 540 that is recessed toward the mounting surface side and extends along the long side direction is formed at the central portion in the short side direction on the top surface side of the socket body 515. Also, the bottom surface side of the socket 502 has a shape in which the central portion in the short side direction is recessed toward the top surface side along the long side direction. In other words, a second concave groove (second concave portion) 542 that is recessed toward the top surface side and extends along the long side direction is formed at the central portion in the short side direction on the bottom surface side of the socket body 515. That is, a substantially rectangular parallelepiped portion that holds the socket terminals Q1 to Q35 in the socket body 515 is defined as a first holding portion 544, a substantially rectangular parallelepiped portion that holds the socket terminals Q36 to Q71 is defined as a second holding portion 546, and a portion that connects the first holding portion 544 and the second holding portion 546 is defined as a connecting portion 548. The connecting portion 548 has a smaller thickness than the first holding portion 544 and the second holding portion 546. In other words, the connecting portion 548 is located above the bottom surfaces of the first holding portion 544 and the second holding portion 546 and below the top surfaces of the first holding portion 544 and the second holding portion 546. Also, in the present embodiment, a plurality (four) of connecting portions 548 are arranged side by side along the long side direction of the socket body 515, and a plurality of holes 549 that penetrate in the height direction and connect the first concave groove 540 and the second concave groove 542 are formed between adjacent connecting portions 548.

[0165] And a gap X is formed by a first concave groove 540 between the main IC 500 and the socket 502 (i.e., on the top surface side of the socket body 515). That is, a gap X penetrating in the long side direction of the socket 502 (main IC 500) is formed between the main IC 500 and the socket 502. Further, a gap Y is formed by a second concave groove 542 between the surface (mounting surface) of the dispensing control board 400 and the socket 502 (i.e., on the bottom surface side of the socket body 515). That is, a gap Y penetrating in the long side direction of the socket 502 (main IC 500) is formed between the surface (mounting surface) of the dispensing control board 400 and the socket 502. In the present embodiment, the gap Y exists integrally with the gap Z formed by the legs 517 of the socket 502, and one gap is constituted by the gap Y and the gap Z.

[0166] On the surface of the dispensing control board 400, as shown in FIG. 17, there is provided a ground pattern (first ground pattern 560: solid ground) that passes between the IC terminals P1 to P35 (socket terminals Q1 to Q35) and the IC terminals P36 to P71 (socket terminals Q36 to Q71) of the main IC 500 in a direction perpendicular to the surface and penetrates the main IC 500 in the longitudinal direction. Also, on the back surface of the dispensing control board 400, in the same direction view, there is provided a ground pattern (second ground pattern 561: solid ground) that passes between the IC terminals P1 to P35 and the IC terminals P36 to P71 of the main IC 500 and penetrates the main IC 500 in the longitudinal direction. That is, the first ground pattern 560 and the second ground pattern 561 are provided at positions overlapping the main IC 500 in the same direction view. Further, the dispensing control board 400 is provided with a plurality of through holes (main IC back through holes 562) that electrically connect the first ground pattern 560 and the second ground pattern 561. Also, these plurality of main IC back through holes 562 are provided at positions overlapping the main IC 500 in the same direction view and are provided in plurality along the longitudinal direction of the main IC 500. By providing such first ground pattern 560 and second ground pattern 561, the noise resistance of the main IC 500 can be increased and the heat dissipation performance can be improved.

[0167] Also, the first ground pattern 560, the second ground pattern 561, and the main IC back through holes 562 are respectively formed at positions corresponding to the gap X formed between the main IC 500 and the socket 502 and the gap Y formed between the surface (mounting surface) of the dispensing control board 400 and the socket 502. In other words, the first ground pattern 560, the second ground pattern 561, and the main IC back through holes 562 each have at least a part thereof overlapping the gap X and the gap Y respectively in a direction perpendicular to the surface of the dispensing control board 400. By providing such gaps X and Y, the heat dissipation performance can be improved.

[0168] Note that on at least one of the front or back surfaces of the dispensing control board 400, a ground pattern (for example, a ground pattern passing between IC terminals P17 and P18 of the main IC 500 and / or between IC terminals P53 to P54) that communicates with the first ground pattern 560 or the second ground pattern 561 may be formed in a direction perpendicular to the front surface of the dispensing control board 400, as viewed in the lateral direction of the main IC 500 (socket 502). That is, on at least one of the front or back surfaces of the dispensing control board 400, a ground pattern that passes between IC terminals P (socket terminals Q) arranged in a row in the longitudinal direction as viewed in this direction (intersecting the row of IC terminals P (socket terminals Q)) and is connected to the first ground pattern 560 or the second ground pattern 561 may be formed.

[0169] As shown in FIG. 18(a), the dispensing control board 400 is provided with a connector 570 to which a harness used for connection to another board is connected. The connector 570 has a housing 571 and a plurality of terminals 572. The housing 571 is formed in a substantially rectangular parallelepiped shape from an insulating resin material. Each terminal 572 is formed of a conductive metal, and the dispensing control board 400 and another board are electrically connected via the terminal 572. When the connector 570 is attached to the dispensing control board 400, each terminal 572 is inserted into each of a plurality of through-holes provided in the dispensing control board 400, and each through-hole and each terminal 572 are joined by solder. As a result, the connector 570 is fixed to the dispensing control board 400 in a state where each terminal 572 and each through-hole (wiring pattern connected to the through-hole) are electrically connected.

[0170] Further, the housing 571 is provided with positioning pins (protrusions for positioning) (legs) 574 that protrude from the bottom surface of the housing 571 toward the mounting surface side, and the payout control board 400 is provided with through holes (holes) (non-through holes) 575 corresponding to the positioning pins 574. The through holes 575 are through holes (non-conductive through holes) in which no copper foil (metal plating) is provided on the inner peripheral surface (inside) and that do not electrically connect one surface (front surface) and the other surface (back surface) of the board. When attaching the connector 570 to the payout control board 400, the positioning pins 574 are inserted into the corresponding through holes 575. In the present embodiment, since the connector 570 is attached by inserting the terminals 572 through through holes and soldering them, the connector 570 can be stably attached to the payout control board 400 even without the positioning pins 574. However, by providing the positioning pins 574, it is possible to attach the connector 570 without misaligning the attachment direction. In other words, the positioning pins 574 function as positioning when attaching the connector 570.

[0171] Also, the length (height) of the positioning pin 574 is equal to or less than the thickness of the payout control board 400. Specifically, the length of the positioning pin 574 is equal to or greater than half of the thickness (board thickness) of the payout control board 400 and less than half of the thickness (board thickness). The thickness of the payout control board 400 is approximately 2 mm. Also, the insertion amount of the positioning pin 574 into the through hole 575 is approximately 1.2 mm. The thickness of the payout control board 400 is greater than the insertion amount of the positioning pin 574 into the through hole 575 (the thickness of the payout control board 400 is equal to or greater than the insertion amount of the positioning pin 574 into the through hole 575). In other words, the insertion amount of the positioning pin 574 into the through hole 575 is less than the thickness of the payout control board 400. In a state where the connector 570 is attached to the payout control board 400, the positioning pin 574 does not protrude (pop out) from the back surface of the payout control board 400. Since the tip of the positioning pin 574 does not protrude from the back surface of the payout control board 400, it is possible to suppress the attachment of solder to the tip of the positioning pin 574 during soldering. That is, it is possible to suppress the attachment of solder to a location where solder should not be attached. The insertion amount of the positioning pin 574 into the through hole 575 (approximately 1.2 mm) is greater than half of the thickness of the payout control board 400 (approximately 1 mm) (the insertion amount of the positioning pin 574 into the through hole 575 is equal to or greater than half of the thickness of the payout control board 400). If the insertion amount of the positioning pin 574 is small, there is a possibility that the positioning pin 574 may not function as a positioning device. However, in this embodiment, since the insertion amount is ensured to be equal to or greater than half of the thickness of the board, it functions reliably as a positioning device. Thereby, the attachment position (fixed position) of the connector 570 can be stabilized, and highly accurate work can be realized. Also, if the positioning pin 574 is formed long and protrudes from the back surface of the payout control board 400, there is a possibility that problems such as damage to the positioning pin 574 may occur during soldering. Also, when assembling the payout control board 400, there is a possibility that some impact may be applied to the positioning pin 574, causing problems such as damage to the positioning pin 574 or the connector 570 coming off the payout control board 400. In this embodiment, since the positioning pin 574 does not protrude from the back surface of the payout control board 400, the occurrence of such problems can be suppressed. FIG. 18(b) is a view showing the periphery of the through hole 575 on the back surface of the payout control board 400. An area where no pattern is formed (insulation area NP) (insulation layer NP) (pattern non-formation area NP) is provided around the through hole 575. In other words, the insulation area NP is formed in an annular shape (circular shape) along the outer periphery of the through hole 575. Here, let the width of the ring of the insulation area NP (radial width) be the first width, and the diameter (diameter width) of the through hole 575 be the second width. The first width is about 1 mm. The second width is about 1 mm. In other words, the first width and the second width are the same or substantially the same width. Substantially the same means that the difference between one and the other is within about 0.3 mm (within ±0.3 mm). Even if the positioning pin 574 is formed long and protrudes from the back surface of the payout control board 400, since the insulation area NP is provided, the possibility of the positioning pin 574 coming into contact with the pattern (copper foil) is extremely low, and damage to the pattern can be prevented. Also, since the first width and the second width are the same or substantially the same width, the insulation area NP can be made into a region of a suitable size that prevents damage to the pattern and is less likely to prevent the provision of other wiring patterns.

[0172] Note that the positioning pin 574 is integrally formed with the housing 571 from the same material (material having insulation properties) as the housing 571, but it may be formed from a different material. Also, in this embodiment, the connector 570 has only one positioning pin 574, but it may have a plurality of them.

[0173] The back case 402b (lower case) is slidable relative to the front case 402a (upper case). Specifically, as shown in FIG. 7, an engaging protrusion is provided on one of the front case 402a and the back case 402b, and a groove 580 is provided on the other, into which the engaging protrusion is inserted and which extends in the left-right direction (a direction parallel to the top and bottom surfaces of the substrate case 402). When the front case 402a and the back case 402b are joined, the engaging protrusion is inserted into the groove 580, and the back case 402b is slid relative to the front case 402a so that the movement of the back case 402b in the front-back direction (and the up-down direction and the back side in the insertion direction) relative to the front case 402a is restricted. Then, in this state, the front case 402a and the back case 402b are caulked to each other so that the front case 402a and the back case 402b are joined. The back case 402b is slid relative to the front case 402a and locked. Note that the dispensing control board 400 is screwed (fastened) to the front case 402a and fixed.

[0174] In addition, the back case 402b is provided with a plurality of ribs 581 that protrude toward the inner surface side. The tips of the plurality of ribs 581 in the protruding direction are in contact with the back surface of the dispensing control board 400 housed between the back case 402b and the front case 402a. In other words, a predetermined space is formed between the surface of the back case 402b facing the dispensing control board 400 and the back surface of the dispensing control board 400 by the plurality of ribs 581. Further, the plurality of ribs 581 can contact a solid land portion (i.e., a resist covering the solid land) formed on the back surface of the dispensing control board 400. When the back case 402b is slid relative to the front case 402a with the dispensing control board 400 disposed between the back case 40b and the front case 402a, the ribs 581 can slide on the solid land portion formed on the back surface of the dispensing control board 400. The ribs 581 are in sliding contact with the back surface of the dispensing control board 400 when the back case 402b is slid relative to the front case 402a. Here, if the region on the back surface of the dispensing control board 400 where the ribs 581 are in sliding contact is defined as a sliding contact region (sliding area), the sliding contact region (sliding area) is formed only by the solid land (solid pattern), and no through holes or wiring patterns are formed. In other words, the ribs 581 are prevented from sliding on the through holes provided in the dispensing control board 400, the terminals (leads) of various electronic components protruding from the back surface of the dispensing control board 400, and the wiring pattern portions formed on the back surface of the dispensing control board 400. Further in other words, the ribs 581 are prevented from contacting any of the through holes, terminals, and wiring patterns when the back case 402b is slid relative to the front case 402a. Here, the "wiring pattern" excludes the ground pattern. That is, the "wiring pattern" here can also be referred to as a wiring pattern (signal line) through which a signal passes.

[0175] (Modification example) A modification example of the second embodiment will be described. In this modification example, the shape of the socket 502 is different from that described above.

[0176] In the socket 502 of this modification example, the height h of the leg 517 (the protruding amount from the bottom surface of the socket body 515) is 0.5 mm. And a gap Z is formed between the bottom surface of the socket body 515 and the ejection control substrate 400 by the leg 517.

[0177] Also, as shown in FIG. 19, the bottom surface of the socket body 515 has a shape in which the periphery of the socket terminal Q is recessed. In other words, a recess 550 recessed in a direction away from the mounting surface is formed in a portion of the bottom surface of the socket body 515 corresponding to the socket terminal Q. In this modification example, two rows of recesses (recessed grooves) 550 are formed corresponding to the socket terminals Q arranged in two rows along the longitudinal direction of the socket body 515. Also, each row of the recesses 550 is divided by the leg 517 provided at the central portion in the longitudinal direction of the socket body 515, and a total of four recesses 550 are formed on the bottom surface of the socket body 515. Note that the recesses (recessed grooves) 550 may be formed in four rows corresponding to the substrate bonding portions 521 arranged in four rows along the longitudinal direction of the socket body 515. Also, the recesses 550 may be provided one by one for each socket terminal Q.

[0178] And in this modification example, the height of the portion corresponding to the socket terminal Q in the gap Z is increased by the recess 550. That is, in this modification example, the distance from the bottom surface of the socket body 515 to the ejection control substrate 400 in the portion where the recess 550 does not exist is 0.5 mm due to the leg 517. Also, in the portion corresponding to the recess 550, the distance from the ejection control substrate 400 to the socket body 515 is longer, and the distance is 1.0 mm.

[0179] Here, in this modified example, since the height of the leg 517 is 0.5 mm and the diameter of the land 526 is 1.5 mm, if the recess 550 is not formed, there is a possibility that a good-shaped solder fillet (contact angle θ is 45 degrees) may contact the socket body 515. However, in this modified example, due to the recess 550, the height around the socket terminal Q in the gap Z is increased, so it is possible to prevent the solder fillet from contacting the socket body 515. That is, even when the distance from the bottom surface of the socket body 515 to the payout control board 400 is less than (less than) the radius of the land, by providing the recess 550, it is possible to prevent the contact between the solder fillet and the socket body 515.

[0180] Also, in this modified example, for the socket terminal Q, the bending angle α of the first bent portion 523 is 90 degrees, and the bending angle β of the second bent portion 524 is 90 degrees.

[0181] And the bent portion 522 (the boundary between the bent portion 522 and the board joint portion 521) is located on the side away from the payout control board 400 (mounting surface) than the gap Z. In other words, the socket terminal Q has a bent portion 522 that is bent so as to vary the positions in the short-out direction of the socket body 515 between the IC terminal contact portion 520 and the board joint portion 521, and the bent portion 522 is located on the side away from the mounting surface side (in other words, the inside of the socket body 515) than the bottom surface of the socket body 515.

[0182] In addition, in this modified example, the distance Qx from the board joining portion 521 (lower end) of the socket terminal Q1 to the board joining portion 521 (lower end) of the socket terminal Q2 is 2.0 mm. Also, the distance Qy from the board joining portion 521 (lower end) of the socket terminal Q2 to the board joining portion 521 (lower end) of the socket terminal Q3 is 2.0 mm. Further, the distance Qz from the board joining portion 521 (lower end) of the socket terminal Q1 to the board joining portion 521 (lower end) of the socket terminal Q3 is 2.0 mm. That is, the interval between the board joining portion 521 of the socket terminal Q1 and the board joining portion 521 of the socket terminal Q2 is equal to the interval between the board joining portion 521 of the socket terminal Q1 and the board joining portion 521 of the socket terminal Q3. In other words, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the intervals between the board joining portions 521 of adjacent socket terminals Q are equal (2.0 mm). Also, for a continuous group of socket terminals Q (socket terminals Q1 to Q17, socket terminals Q18 to Q35, socket terminals Q36 to Q53, or socket terminals Q54 to Q71), the interval (2.0 mm) between the board joining portions 521 of adjacent socket terminals Q is equal to the interval (2.0 mm) between the board joining portions 521 of every other socket terminal Q. Note that the arrangement of the through holes 504 is the same as the arrangement of the board joining portions 521 of the socket terminals Q. By arranging the board joining portions 521 (through holes 504) in this way, the socket 502 is stably held by the through holes 504. Note that in this embodiment, "equal" for each interval means the case where the designed lengths are equal, and there may be manufacturing errors or the like. In other words, "equal" in this embodiment includes cases where they are approximately equal.

[0183] The gaming machine of the present embodiment includes a substrate 400 and a substrate case 402 that houses the substrate 400. The substrate 400 has a plurality of through-holes 504 used for attaching a socket 502 to which an IC 500 is mounted. The through-holes 504 have lands 526. The socket 502 has a plurality of socket terminals Q that electrically connect the IC terminals P and the through-holes 504, a socket body 515 that holds the socket terminals Q, and a plurality of legs 517 that support the socket body 515. The plurality of legs 517 form a predetermined gap Z between the socket body 515 and the substrate surface (mounting surface) of the substrate 400. The gap Z is such that the distance from the socket body 515 to the substrate surface (mounting surface) is equal to or greater than the width of the land 526, and the solder that joins the socket terminal Q and the through-hole 504 does not contact the socket body 515. According to such a configuration, the heat dissipation performance of the IC 500 can be improved by the gap Z formed between the socket body 515 and the mounting surface. In addition, since the height of the gap Z in at least the portion corresponding to the socket terminal Q is equal to or greater than the width of the land 526 and the solder does not contact the socket body 515, the heat dissipation performance can be further improved and damage to the socket 502 can be prevented. Also, since the solder does not contact the socket body 515 in this way, an unexpected short circuit can be prevented.

[0184] In addition, in the gaming machine of the present embodiment, the IC terminal P includes a first terminal (IC terminal P1), a second terminal (IC terminal P2), and a third terminal (IC terminal P3) arranged continuously in a predetermined direction. The socket terminal Q includes a first socket terminal (socket terminal Q1) to which the first terminal is connected, a second socket terminal (socket terminal Q2) to which the second terminal is connected, and a third socket terminal (socket terminal Q3) to which the third terminal is connected. When the portion soldered to the through hole 504 in each socket terminal Q is defined as the substrate bonding portion 521, the distance from the first terminal P1 to the second terminal P2 and the distance from the second terminal P2 to the third terminal P3 are both equal to the first length, and the distance from the substrate bonding portion 521 of the first socket terminal Q1 to the substrate bonding portion 521 of the second socket terminal Q2 and the distance from the substrate bonding portion 521 of the first socket terminal Q1 to the substrate bonding portion 521 of the third socket terminal Q3 are both equal to the second length, and the second length is longer than the first length. According to such a configuration, the interval between the substrate bonding portions of adjacent socket terminals Q can be made wider than the interval between adjacent terminals P of the IC, the distance between the portions to be soldered can be ensured sufficiently, and a short circuit can be prevented. In addition, since the distance from the substrate bonding portion 521 of the first socket terminal Q1 to the substrate bonding portion 521 of the second socket terminal Q2 is equal to the distance from the substrate bonding portion 521 of the first socket terminal Q1 to the substrate bonding portion 521 of the third socket terminal Q3, the socket 502 is stably held by the through hole 504.

[0185] In addition, in the gaming machine of the present embodiment, a connector 570 is mounted on the substrate 400. The connector 570 has positioning pins 574, and holes 575 into which the positioning pins 574 are inserted are formed in the substrate 400. The length of the positioning pins 574 is equal to or less than the thickness of the substrate 400.

[0186] (Third Embodiment) Next, a third embodiment of the present invention will be described. The gaming machine of this embodiment has the same configuration as the gaming machines according to the first and second embodiments. Therefore, the description of the same configuration as that of the first and second embodiments will be omitted or simplified.

[0187] In this embodiment, the payout control board 400 has a rectangular plate shape that is long in the left-right direction. Also, in this embodiment, all the components mounted on the payout control board 400 are mounted on the front surface side of the payout control board 400. Hereinafter, the surface (front surface) on which the components of the payout control board 400 are mounted may be referred to as the mounting surface. Note that there may be components mounted on the back surface side of the payout control board 400.

[0188] In the present embodiment, as shown in FIG. 20, when facing the payout control board 400 (the surface of the payout control board 400), when the payout control board 400 is divided by two straight lines passing through the center of the payout control board 400 and perpendicular to each other (when viewed from a direction perpendicular to the board surface (the front surface)), the upper right region is called the first region R1, the upper left region is called the second region R2, the lower left region is called the third region R3, and the lower right region is called the fourth region R4. In other words, when facing the payout control board 400, in the XY plane where a virtual straight line passing through the center of the payout control board 400 and extending in the longitudinal direction (left - right direction) is defined as the X - axis, and a virtual straight line passing through the center of the payout control board 400 and extending in the short - hand direction (up - down direction) is defined as the Y - axis, the first quadrant corresponds to the first region R1, the second quadrant corresponds to the second region R2, the third quadrant corresponds to the third region R3, and the fourth quadrant corresponds to the fourth region R4. Also, when facing the payout control board 400, when the payout control board 400 is divided into two regions by a line (plane) passing through the center of the payout control board 400 (the center in the short - hand direction) and parallel to a predetermined side (the long side) of the payout control board 400, one region is called the first specific region S1, and the other region is called the second specific region S2. In the present embodiment, the first specific region S1 is composed of the first region R1 and the second region R2, and the second specific region S2 is composed of the third region R3 and the fourth region R4. For example, the first specific region S1 may be composed of the first region R1 and the fourth region R4, and the second specific region S2 may be composed of the second region R2 and the third region R3, etc. Note that the payout control board 400 may have a shape like a rectangular plate with a part missing. In such a case, the straight line (virtual straight line) passing through the center of the payout control board 400 and serving as the straight line (virtual straight line) for dividing each region described here can be understood as a straight line (virtual straight line) passing through the center of a virtual rectangle along the outer edge of the payout control board 400 (the virtual rectangle when assuming that the missing part is not missing) (see FIG. 21).

[0189] In addition, in the present embodiment, when facing the payout control board 400, the upper long side is referred to as the first long side, the lower long side is referred to as the second long side, the right short side is referred to as the first short side, and the left short side is referred to as the second short side. That is, the first specific area (the first area and the second area) can also be said to be the area on the first long side, and the second specific area (the third area and the fourth area) can also be said to be the area on the second long side. Also, the first area and the fourth area can also be said to be the areas on the first short side, and the second area and the third area can also be said to be the areas on the second short side.

[0190] As shown in FIG. 20, a plurality of connectors (mounted component connection connectors) 600 used for connecting components (game machine mounted components) mounted on the game machine, such as a control device (main control board 200) and other boards (including control boards such as the main control board 200), are mounted on the payout control board 400. The payout control board 400 is electrically connected to the game machine mounted components via each connector 600 and the harnesses connected to each connector 600. Note that the game machine mounted components may be a board or the like for connecting a device outside the game machine (for example, a so-called hall computer or a CR unit) to the game machine (payout control board 400). Also, the game machine mounted components may be, for example, various switches, sensors, motors, solenoids, and the like.

[0191] In this embodiment, a full - tank switch for detecting that the lower dish (receptacle) is full, a front - frame opening switch for detecting the opening of the front frame 10, an inner - frame opening switch for detecting the opening of the inner frame 7, a payout counting switch, a payout motor, a launching device, an external terminal board, etc., and a payout control board 400 are connected via a first predetermined board. On the payout control board 400, as a connector 600, a connector used for connection with the first predetermined board is mounted. The external terminal board is a board for connecting the gaming machine to external electronic devices (such as a data display device and a hall computer). From this external terminal board, various external information signals representing the state of the gaming machine and the like are output toward the external electronic devices. Also, a launch lever volume for detecting the rotation amount of the handle, a launch stop switch for detecting a launch stop operation for stopping the launch of the game ball, etc., and the payout control board 400 are connected via a second predetermined board. On the payout control board 400, as a connector 600, a connector used for connection with the second predetermined board is mounted. Further, on the payout control board 400, as a connector 600, a connector used for connection with the main control board 200 is mounted.

[0192] In the first specific region S1, a plurality of connectors 600 are arranged. Specifically, among the first specific region S1, near the edge facing the boundary with the second specific region S2, the connector 600 is arranged. In other words, among the first specific region S1, in the portion on the first long - side side, the connector 600 is arranged. Specifically, a plurality of connectors 600 are arranged along (in the vicinity of) the edge. Note that all the connectors 600 may be arranged along (in the vicinity of) the edge (see FIG. 21). Also, all the connectors 600 may be arranged in the first region R1.

[0193] In the second specific region S2, a main IC 500 and an unmounted component placement region B during mass production (the region inside the two-dot chain line in FIG. 20) are arranged. Specifically, the main IC 500 and the unmounted component placement region B during mass production are arranged in the third region R3. In this embodiment, the main IC 500 is mounted on the dispensing control board 400 via a socket 502, but it may be directly mounted (soldered) on the dispensing control board 400 without passing through the socket 502.

[0194] In this embodiment, the unmounted component placement region B during mass production is a region where test components (such as test connectors, test ICs, and test passive elements) as unmounted components during mass production are arranged. And in the unmounted component placement region B during mass production, a mounting part 405 (such as lands and through holes) for arranging (soldering) the test components and silk 406 related to the test components are provided. That is, test components can be mounted in the second specific region S2 (the third region R3). Note that the test components may be components to be mounted during mass production (mass production mounted components).

[0195] Also, a connector 600 is not arranged in the third region R3. Specifically, a connector 600 is not arranged in the second specific region S2. That is, in this embodiment, a connector 600 is arranged in one region (the upper region: the first specific region S1) when the dispensing control board 400 is divided into two in a predetermined direction (the vertical direction), and among the other region (the lower region: the second specific region S2), when further divided into two in a direction orthogonal to the predetermined direction (the left-right direction), on one side (the left side when facing the dispensing control board 400: the third region R3), the main IC 500 and test components can be mounted. Also, in the said one side (the third region R3), more specifically, in the said other region (the second specific region S2), a connector 600 is not arranged.

[0196] (Modification example) As shown in FIG. 21, in the gaming machine of the present embodiment, the main IC 500 and the collation terminal 602 may be arranged in the third region R3 (second specific region S2). In this case, test components may or may not be mountable in the third region R3 (second specific region S2). Here, the collation terminal 602 is a connector (terminal) used for a predetermined inspection, is a connector capable of outputting predetermined information, and is a connector connectable to an inspection terminal (inspection device). The collation terminal 602 is usually not connected to the inspection terminal and is connected to the inspection terminal only during inspection. By connecting the inspection terminal to the collation terminal, it becomes possible to inspect whether there is any unauthorized modification to the payout control board 400. Here, as the predetermined information output from the collation terminal 602, there is the ID of the payout control board 400 and the like. In the gaming machine of the present embodiment as a mass-produced product, all of the plurality of connectors 600 are connected by wiring (harness), and there is no connector on the payout control board 400 to which wiring (harness) is not connected other than the collation terminal 602. However, for example, there may be a connector to which wiring (harness) is not connected other than the collation terminal 602. For example, a test connector as a test component may also be mounted in the mass-produced product, and the test connector may be used as a connector to which wiring (harness) is not connected. Further, such a test connector may be arranged in the third region R3 (second specific region S2).

[0197] The main IC 500 and the collation terminal 602 are connected via electronic components and wiring patterns. Specifically, on the payout control board 400, there are predetermined signal lines 604, 604 connecting the main IC 500 and the collation terminal 602 as wiring patterns, and resistors 606, 606 as predetermined electronic components are provided on the signal lines 604, 604. The resistor 606 is a lead form resistor and has a resistor body and two leads (terminals: legs) extending from the resistor body. The resistor 606 is attached to the payout control board 400 by soldering with the two leads inserted into through holes provided in the payout control board 400.

[0198] The height of resistor 606 is lower than the height of main IC 500. Specifically, in the state of being mounted on the payout control board 400, the height of resistor 606 is 1 / 2 or less of the height of main IC 500. Also, the height of resistor 606 is lower than the height of the verification terminal 602. Specifically, in the state of being mounted on the payout control board 400, the height of resistor 606 is 1 / 2 or less of the height of the verification terminal 602. Here, the "height" of each electronic component refers to the distance in the height direction from the mounting surface of the payout control board 400 to the tip of the protruding direction of each electronic component (the part farthest from the mounting surface).

[0199] In this embodiment, there are two signal lines 604 connecting the main IC 500 and the verification terminal 602, and a resistor 606 is provided on each of the two signal lines 604. Also, in addition to the resistor 606, there are no electronic components provided on the signal line 604 connecting the main IC 500 and the verification terminal 602. In other words, on the payout control board 400, all the electronic components provided on the signal line 604 connecting the main IC 500 and the verification terminal 602 are lower in height than the main IC 500 and lower in height than the verification terminal 602. In this embodiment, the verification terminal 602 has four terminals, and signal lines 604, 604 are connected to two of the terminals, and a ground pattern is connected to the other two terminals.

[0200] In this embodiment, the payout control board 400 is mounted in the arrangement shown in FIG. 22. FIG. 22 is a view of the gaming machine seen from the back side (the rear side). As shown in FIG. 22, the payout control board 400 is arranged below the main control board 200. Also, the connector 600a used for connection with the main control board 200 is arranged at the upper part of the payout control board 400, and the payout control board 400 and the main control board 200 are electrically connected via the connector 600a.

[0201] Also, no other board is arranged below the payout control board 400. In other words, the payout control board 400 is the board arranged at the lowermost side among all the boards mounted on the gaming machine. Here, the phrase "no other board is arranged below (it is the board arranged at the lowermost side)" means that it is sufficient that the upper ends of all other boards are not located below the lower end of the payout control board 400, but the lower ends of all other boards may be located above the lower end of the payout control board 400 (at least above the position substantially the same as the lower end of the payout control board 400 in the vertical direction).

[0202] Also, the payout control board 400 is arranged so as to overlap with other boards in the front-rear direction (the direction orthogonal to the surface (board surface) of the payout control board 400). Specifically, a power supply board 610 as the other board is arranged in front of the payout control board 400. The power supply board 610 is a board connected to each board, and power is supplied from a commercial power supply to each board via the power supply board. Also, the payout control board 400 is arranged at the rearmost side among a plurality of boards arranged to overlap in the front-rear direction. In other words, when the gaming machine is viewed from the back side (when the inner frame 7 is in an open state and facing the payout control board 400), the payout control board 400 is located at the frontmost side (the observer side) among the boards that overlap in the front-rear direction. Further in other words, when the mounting surface of the payout control board 400 is viewed from the back side of the gaming machine (when the inner frame 7 is in an open state and the mounting surface of the payout control board 400 is viewed), the view is not blocked by other boards.

[0203] The gaming machine of this embodiment is a gaming machine including a substrate 400 on which electronic components are mounted. When the substrate 400 is divided into two parts in a predetermined direction, a connector 600 used for electrical connection with components mounted on the gaming machine is arranged in one region (first specific region S1). When the other region (second specific region S2) is further divided into two parts in a direction orthogonal to the predetermined direction, on one side (third region R3), there are arranged a control means (main IC 500) for controlling the processing on the substrate 400 and a mounting portion 405 capable of mounting a predetermined electronic component but on which the predetermined electronic component is not mounted, and the connector 600 is not arranged. According to such a configuration, the control means 500 is arranged in one region (third region R3) when the substrate 400 is divided into four parts, and the connector 600 used for electrical connection with components mounted on the gaming machine is not arranged in this region. Therefore, it is possible to prevent the visibility of the control means 500 from being reduced by a harness or the like connected to the connector 600. Also, by arranging the mounting portion 405 on which no electronic component is mounted in this region, the visibility of the control means 500 can be improved. Further, by arranging the mounting portion 405 in this region, while ensuring the visibility of the control means 500, the degree of freedom in arranging the connector 600 can be increased.

[0204] Further, the gaming machine of the present embodiment is a gaming machine including a substrate 400 on which electronic components are mounted. When the substrate 400 is divided into two parts in a predetermined direction, a connector 600 used for electrical connection with components mounted on the gaming machine is disposed in one region (first specific region S1). When the other region (second specific region S2) is further divided into two parts in a direction orthogonal to the predetermined direction, on one side (third region R3), a control means (main IC 500) for controlling processing on the substrate 400 and an inspection terminal (collation terminal 602) used for a predetermined inspection are disposed, and the connector 600 is not disposed. According to such a configuration, since the control means 500 is disposed in one region (third region R3) when the substrate is divided into four parts, and the connector 600 used for electrical connection with components mounted on the gaming machine is not disposed in the region, it is possible to prevent the visibility of the control means 500 from being reduced by a harness or the like connected to the connector 600. Further, by disposing the inspection terminal 602 used for a predetermined inspection, that is, a connector to which no harness is connected during normal times, in the region, it is possible to increase the degree of freedom in arranging the other connector 600 while ensuring the visibility of the control means.

[0205] (Fourth Embodiment) Next, a fourth embodiment of the present invention will be described. The gaming machine of the present embodiment basically has the same configuration as the gaming machine of the first embodiment. Therefore, the description of the same configuration as that of the gaming machine of the first embodiment will be omitted or simplified. Hereinafter, an ejection control substrate unit 700 including an ejection control substrate 400 (hereinafter, substrate 400) will be used for description, but the present invention is applicable to other predetermined substrate units included in the gaming machine.

[0206] FIG. 23 is an exploded perspective view of the dispensing control board unit 700. The dispensing control board unit 700 has a substantially rectangular shape (substantially rectangular). Specifically, the left-right direction is long, and the up-down direction is short. The dispensing control board unit 700 mainly includes a board 400 (dispensing control board, dispensing control means), a board case 701 that houses (stores, encloses) the board 400 inside, screws (not shown), and the like.

[0207] The board case 701 includes a first case 710 that covers the front side (first surface side) of the board 400 and a second case 720 that covers the rear side (second surface side) of the board 400. The first case 710 and the second case 720 each have a top surface (bottom surface) and a predetermined side surface (side wall), and have a substantially box shape. By assembling the first case 710 and the second case 720, a space is formed inside, and the board 400 is housed in that space. The board case 701 is formed of a transparent synthetic resin, and the board 400 disposed inside can be visually recognized from the outside.

[0208] Here, the front side (front side) surface of the board 400 is defined as the first surface (front surface), and the rear side (rear side) surface is defined as the second surface (back surface). The first surface of the board 400 faces the top surface portion (first top surface) of the first case 710. The second surface of the board 400 faces the top surface portion (second top surface) of the second case 720. Note that the top surface portion of the first case 710 may be referred to as the top surface portion of the board case 701, and the top surface portion of the second case 720 may be referred to as the bottom surface portion of the board case 701.

[0209] FIG. 24 is a schematic view of the first surface of the board 400 as viewed from the front side (front side). The board 400 has a rectangular plate shape, with the long side extending along the left-right direction, the short side extending along the up-down direction, and the board surface normal direction (plate thickness direction) arranged to be the front-rear direction. One of the long sides of the board 400 is located on the upper side, the other long side is located on the lower side, one of the short sides is located on the right side, and the other short side is located on the left side.

[0210] The substrate 400 is provided with a plurality of through-holes 450 that penetrate through the first surface and the second surface. In the present embodiment, the through-holes 450 are respectively formed at the four corners of the substrate 400. Note that four or more through-holes 450 may be provided. Also, the number of through-holes 450 may be less than four. For example, there may be two through-holes 450 provided at the diagonal corners of the substrate 400 respectively. In the present embodiment, the through-holes 450 include those used for fixing to the substrate case 701 (the first case 710) and those used for positioning the substrate 400 (described later).

[0211] Although not shown for simplicity (omitted), a plurality of components (various electronic components) are mounted (arranged) on the first surface of the substrate 400. Examples of the plurality of components include connectors, ICs, resistors, capacitors, diodes, and switches. Also, although not shown, identification information (identification codes) for identifying (specifying) each electronic component (enabling identification of each electronic component) is provided in the vicinity of the arrangement position of each electronic component on the substrate 400. The identification information is composed of a predetermined character or a predetermined character string (the character string may include numbers and symbols). For example, in the case of a connector to which the number "1" is assigned, it is a character string "CN1" formed by combining the alphabet "CN" representing the connector and the number "1". This identification information is formed (indicated) by silk printing and is white in the present embodiment. The identification information can also be referred to as silk characters. Also, in the present embodiment, the substrate 400 is a green substrate. In other words, the color of the resist on the substrate 400 is green. Also, although not shown, the substrate 400 is provided with a plurality of through-holes.

[0212] As shown in FIG. 23, the first case 710 is provided with two mounting holes 711 (substrate mounting portions). The mounting holes 711 are provided at positions corresponding to (opposite to) the through-holes 450 respectively provided at the diagonal corners of the substrate 400. By passing a screw (not shown) through the through-hole 450 from the second surface side (back side) of the substrate 400 and screwing (inserting) the screw into the mounting hole 711, the substrate 400 is fixed to the first case 710.

[0213] Also, the first case 710 includes two positioning pins 712. The positioning pins 712 are provided at positions corresponding (opposite) to through holes 450 provided at diagonal corners of the substrate 400, respectively. The positioning pins 712 project a predetermined length from the front side to the rear side, are formed in a columnar shape, and are formed with a diameter that can be inserted into the through holes 450. When the positioning pins 712 are inserted into the through holes 450, the rotation of the substrate 400 is regulated.

[0214] Here, with reference to FIGS. 25 to 27, another example of the substrate and the substrate case (fixing the substrate to the substrate case) is shown. The substrate 400 shown in FIG. 25 includes five through holes 450. The through holes 450 are provided at the four corners and at substantially the center in the left-right direction on the lower side.

[0215] FIG. 26 is a view of the first case 710 corresponding to the substrate 400 shown in FIG. 25 as seen from the back side. The first case 710 includes five bosses 715 (substrate attachment portions). The bosses 715 are provided at positions corresponding (opposite) to the through holes 450 of the substrate 400. The bosses 715 project a predetermined length from the front side to the rear side and are formed in a columnar (cylindrical) shape. The bosses 715 are provided with screw holes for inserting screws (for tightening screws). The diameter of this screw hole can also be referred to as the inner diameter of the boss 715. By passing screws through the five through holes 450 from the second surface side (back side) of the substrate 400 and further screwing (inserting) the screws into the screw holes of the bosses 715, the substrate 400 is fixed (fastened) to the first case 710.

[0216] When the screw is screwed in and the screw is inserted into the screw hole by a predetermined amount (predetermined length), the front end surface of the boss 715 comes into contact with the first surface of the substrate 400, and the head of the screw comes into contact with the second surface of the substrate 400. That is, the substrate 400 is sandwiched and fixed between the front end surface of the boss 715 and the head of the screw (fixed state). At this time, the screw is in a state where it does not rotate any further (the state where the screw is tightened without loosening). This may be referred to as the maximum insertion state of the screw. In the state where the substrate 400 is fixed, the head of the screw protrudes from the second surface of the substrate 400.

[0217] In the present embodiment, patterns made of copper foil are formed on the first surface and the second surface of the substrate 400 (copper foil is attached). Note that the patterns include a wiring pattern through which signals pass and a ground pattern (solid ground).

[0218] FIG. 27(a) is a diagram showing the second surface of the substrate 400 shown in FIG. 25. In the present embodiment, a predetermined region (predetermined range) including at least the periphery of the through hole 450 is a region where no pattern is formed (pattern non-formation region N: hatched portion in the figure). In the present embodiment, the periphery of each through hole 450 (five locations) and the peripheral edge of the substrate 400 (the edge of each side) are the pattern non-formation region N (insulation region), but it is sufficient that at least the periphery of each through hole 450 is the pattern non-formation region N. Each through hole 450 is provided in the pattern non-formation region N.

[0219] Figure 27(b) shows a state where screws are inserted into the respective through-holes 450 in Figure 27(a) and the heads of the screws are in contact with the substrate 400. The non-pattern formation region N has a size such that at least the heads of the screws do not protrude outside the non-pattern formation region N (a size such that the heads of the screws do not enter the pattern formation region). In other words, the heads of the screws are sized to fit inside the non-pattern formation region N. Specifically, the distance (shortest distance) between the end (outer peripheral part) of the head of the screw and the copper foil is, for example, about 1 mm to 2 mm. Therefore, when the screw is tightened, the part of the head of the screw that comes into contact is the non-pattern formation region N, and the head of the screw is prevented from coming into contact with the pattern (copper foil). This can prevent the screw and the pattern (such as a solid ground) from being electrically conductive and causing a short circuit or the like, resulting in component damage (malfunctions). Also, damage to the pattern due to contact of the head of the screw can be prevented.

[0220] Although not shown, in Figure 27(a), for example, through-holes 450 may be provided in the central part of the substrate 400, and a predetermined range around the through-holes 450 may be the non-pattern formation region N. In other words, the predetermined non-pattern formation region N may be provided so as not to be continuous with other non-pattern formation regions N (in an isolated state). Note that the non-pattern formation region N is a region where no pattern is provided but a resist is provided.

[0221] As the screw, in addition to a pan head screw, a flat head screw can be used. Since the seating surface part of the head of the flat head screw is conical, when using a flat head screw, the distance (shortest distance) from the copper foil can be made larger compared to when using a pan head screw. In other words, it can be made more difficult to come into contact with the copper foil.

[0222] Next, the first surface side will be described. The tip surface of the boss 715 (FIG. 26) is in contact with the first surface of the substrate 400, and the boss 715 (substrate mounting portion) also functions as a substrate support portion (contact surface, receiving surface) for supporting the substrate. As this substrate support portion, a predetermined shape other than the boss 715 may be provided on the first case 710. Examples of the predetermined shape include a protruding portion (convex portion) erected at a corner portion (a position facing the corner portion of the substrate) and a rib (convex portion) formed to extend inward from the case side surface (inner surface of the side wall) by a predetermined length. For example, in addition to the positions corresponding to the four corners of the substrate, when a substrate support portion (convex portion) is provided at a position corresponding to approximately the center in the left-right direction of the substrate, in addition to the four corners of the substrate, approximately the center in the left-right direction of the substrate is supported from the first surface side. Therefore, when a force is applied to the substrate from the second surface side, the substrate can be made less likely to bend (the bending of the substrate can be suppressed).

[0223] As shown in FIG. 25, in the present embodiment, a pattern non-formation region N (hatched portion) is also provided on the first surface of the substrate 400. The substrate support portion (boss 715) is in contact (abutment) with the pattern non-formation region N. In other words, at least the portion of the first surface of the substrate 400 that contacts the substrate support portion is the pattern non-formation region N. Further in other words, a predetermined range including the range of contact with the substrate support portion on the first surface of the substrate 400 is the pattern non-formation region N. In the present embodiment, regarding the pattern non-formation region N around the predetermined through hole 450, when comparing the first surface and the second surface, the area of the first surface is larger. This is because the diameter of the boss 715 is larger than the diameter of the head of the screw. Note that the shortest distance between the outer peripheral portion of the boss 715 and the copper foil on the first surface may be smaller than the shortest distance between the outer peripheral portion of the head of the screw and the copper foil on the second surface. Also, the pattern non-formation regions may be formed in the same manner (so as to be in the same range) on the first surface and the second surface. Also, predetermined information (such as the management number of the substrate) may be displayed in the pattern non-formation regions N on the first surface and the second surface.

[0224] The shapes of bosses, ribs, etc. as the substrate support part are made of resin and are not electrically conductive even if they come into contact with the pattern (copper foil). However, when they come into contact with the pattern (copper foil) and press the pattern, there is a risk of damaging the pattern or causing a disconnection. In this embodiment, since the substrate support part comes into contact with the non-pattern formation region N, damage to the pattern and disconnection due to pressing do not occur, and the occurrence of defects (damage to components) can be suppressed.

[0225] Although not shown in the figure, non-pattern formation regions N are also provided on the first surface and the second surface of the substrate 400 shown in FIG. 24, avoiding contact between the screw and the pattern, and also avoiding contact between the substrate support part (resin part) and the pattern.

[0226] At least one connector is arranged on the first surface of the substrate 400. As shown in FIG. 28, the portion of the first case 710 corresponding to a predetermined connector (and its periphery) is a recess 718 (concave shape) recessed (hollowed) on the inner side of the case (substrate 400 side). An opening is provided in this recess 718, and the connector is exposed to the outside through the opening.

[0227] In this embodiment, the bottom (bottom surface) of the recess 718 and the first surface of the substrate 400 (the portion around the connector) are in surface contact. However, the substrate 400 in this surface contact region may be a pattern formation region (a region with copper foil attached). In other words, a location (a location with a relatively large contact area) that can be in surface contact with the mating component, such as the bottom of the recess 718 in the substrate case 701 (the first case 710), may be a pattern formation region instead of the non-pattern formation region N. The contact area is large, and the load (stress) is dispersed and difficult to concentrate at one point. On the other hand, a location (a location with a relatively small contact area) that can be in point contact with the mating component, such as the tip of the boss 715 (FIG. 26) in the substrate case 701, is a non-pattern formation region N (a region without copper foil attached). This is because the contact area is small and the load (stress) is likely to concentrate.

[0228] FIG. 29 is a partially enlarged view showing a predetermined through hole 450 and its surroundings on a predetermined surface of the substrate 400. In the present embodiment, a plurality of ground through holes H are provided along the end portion in the pattern formation region at the boundary portion (boundary portion) between the pattern formation region (region where copper foil is attached) and the non-pattern formation region N (region where copper foil is not attached). Thereby, the ground is strengthened, the noise resistance of the substrate can be improved, and stable operation of the substrate can be realized. In the pattern formation region, a wiring pattern through which a signal passes is formed. Among the wiring patterns, a ground through hole H is provided further outside than the wiring pattern located on the outermost side (outer peripheral side) of the substrate. For this reason, it is possible to reduce the influence of the outermost wiring pattern being affected by noise. In addition, since a plurality of ground through holes H are provided at the outer end portion in the pattern formation region (a plurality of paths through which current flows are provided) and the ground is strengthened, for example, even when electricity (static electricity) flows in through a screw used for fixing the substrate, the electricity can be more reliably discharged. Note that the ground through holes H provided in this boundary portion include those in a state where solder has entered the inside (a state where it is filled with solder) and those in a state where solder has not entered the inside (a state where it is not filled with solder).

[0229] In the present embodiment, it is assumed that the substrate unit (payout control substrate unit 700) is arranged in the gaming machine such that the normal direction of the substrate surface is the front-rear direction, but it may be arranged in the gaming machine such that the normal direction of the substrate surface is the vertical direction (for example, the first surface faces upward).

[0230] FIG. 30 is a schematic cross-sectional view showing a state in which the substrate 400 is fixed to the first case 710 (boss 715). Note that in FIG. 30, the hatching indicating that it is a cross-section is partially omitted. FIG. 30 shows a state (specific state, first state) in which the screw α is tightened without loosening and the substrate 400 is properly fixed to the first case 710 (boss 715).

[0231] The first surface (front surface) of the substrate 400 faces the top surface of the first case 710 (upper case). Through the top surface of the first case 710, the first surface of the substrate 400 can be visually recognized. Specifically, various electronic components arranged on the first surface can be visually recognized. In FIG. 30, through the top surface of the first case 710, the lead component β and the connector γ can be visually recognized. The connector γ is a connector (non-exposed connector) covered by the top surface of the first case 710 without being exposed from the opening provided in the first case 710. As the non-exposed connector, for example, those for development that are only used during development and not during mass production, those for function expansion that are used when the function (specification) is added or the like is determined in later models and not during mass production of the current model, and those for testing that are used in a predetermined test conducted to provide the gaming machine to the market but not during mass production, etc.

[0232] The second surface (back surface) of the substrate 400 faces the top surface of the second case 720 (lower case). Through the top surface of the second case 720, the second surface of the substrate 400 can be visually recognized. In FIG. 30, through the top surface of the second case 720, the terminal of the lead component β and the head of the screw α can be visually recognized.

[0233] Among the electronic components arranged on the first surface of the substrate 400, there is one (lead component β) having a main body portion and lead terminal portions (leads) (terminals) extending from the main body portion. Examples of the lead component β (discrete component β) include a diode, an IC, a capacitor, a resistor, etc. The lead component β is soldered and fixed (mounted) to the substrate 400 with the lead terminal portions inserted into through holes (holes) formed in the substrate 400. The lead terminal portions protrude a predetermined length from the second surface of the substrate 400. Also, when the portion of the lead terminal portion on the side opposite to the main body portion connection side is defined as the tip side of the lead terminal portion, in the present embodiment, a bending process is performed on the tip side of the lead terminal portion. For example, in the case of a resistor having two leads, the tips of each terminal are bent so as to face inward. Note that among the electronic components arranged on the substrate 400, in addition to the lead components, chip components (chip-type components) may be included.

[0234] As shown in FIG. 30, let the height dimension of the boss 715 (substrate mounting portion) be dimension L. Dimension L is the dimension from the top surface (inner surface) of the first case 710 to the tip (first surface of the substrate 400) of the boss 715. Also, in the state shown in FIG. 30, let the height dimension of the connector γ (non-exposed connector) from the first surface of the substrate 400 be dimension M. When a plurality of non-exposed connectors such as the connector γ are arranged on the substrate 400, the height dimension of the one with the highest (largest) height from the first surface among them is taken as dimension M. Further, in the state shown in FIG. 30, let the dimension from the first surface of the substrate 400 to the tip of the screw α inserted into the boss 715 be dimension N. The tip of the screw α is the end on the side opposite to the head of the screw α.

[0235] In the present embodiment, dimension L (sixth dimension) is larger than dimension M (seventh dimension). When the screw α is tightened and the substrate 400 is attached to the first case 710 (boss 715), the connector γ does not come into contact with the top surface of the first case 710. Thereby, it is possible to prevent the connector γ from being damaged. Also, dimension N (eighth dimension) is smaller than dimension M (seventh dimension). If dimension N is larger than dimension M, there is a high possibility that the connector γ will come into contact with the top surface of the first case 710 as the screw α is inserted deeper into the boss 715. However, in the present embodiment, since dimension N is set smaller than dimension M, such a possibility can be reduced.

[0236] Also, in the state shown in FIG. 30, the dimension from the second surface (back surface) of the substrate 400 to the tip (top) of the head of the screw α is defined as dimension B (second dimension). Also, in the state shown in FIG. 30, the dimension (protrusion amount) from the second surface (back surface) of the substrate 400 to the tip of the lead terminal portion of the lead component β is defined as dimension A (first dimension). When a plurality of lead components β (such as diodes, ICs, capacitors, resistors, etc.) are arranged on the substrate 400, dimension A is the protrusion amount of the lead terminal portion having the largest height from the second surface. Note that the plurality of lead components β may be configured such that dimension A is the same for all of them. Also, in the state shown in FIG. 30, the dimension (distance) from the second surface (back surface) of the substrate 400 to the top surface (inner surface) of the second case 720 is defined as dimension C (third dimension).

[0237] In the present embodiment, dimension B is larger than dimension A. In the present embodiment, dimension C is larger than dimension B. In a state where the substrate 400 is attached to the first case 710, the head of the screw α and the tip of the lead terminal portion of the lead component β do not contact the top surface of the second case 720. Thereby, breakage of the second case 720, the lead component, etc. can be prevented.

[0238] Here, in the state shown in FIG. 30, the insertion amount (tightening amount of the screw) of the screw α into the boss 715 is defined as dimension E (fifth dimension). In other words, dimension E is the length (dimension) of the screw α inserted into the screw hole of the boss 715. Also, in the state shown in FIG. 30, the distance (dimension) from the tip (top) of the head of the screw α to the top surface (inner surface) of the second case 720 is defined as dimension D (fourth dimension). Note that dimension D can also be said to be the difference between dimension C and dimension B. In the present embodiment, dimension E is larger than dimension D.

[0239] Here, consider the case where loosening occurs in the tightening of screw α due to the influence of vibration or the like, and the substrate 400 moves toward the second case 720 together with screw α. When dimension E is smaller than dimension D (when dimension D is larger than dimension E), dimension E becomes 0 before the head of screw α contacts the top surface of the second case 720, and screw α falls off from the boss 715. In this case, due to the absence of screw α, the terminal of the lead component β may contact the top surface of the second case 720, and the lead component β may come off (become detached) from the substrate 400 or the lead component β may be damaged.

[0240] In the present embodiment, dimension E is larger than dimension D. Therefore, when the head of screw α contacts the top surface of the second case 720 (that is, when dimension D = 0), dimension E>0 (the insertion amount of screw α is ensured), and screw α does not fall off from the boss 715. Therefore, even when the head of screw α contacts the top surface of the second case 720, since screw α exists, the terminal of the lead component β does not contact the top surface of the second case 720 (a gap is ensured between the terminal of the lead component β and the top surface of the second case 720). Therefore, when loosening occurs in the tightening of screw α, it is possible to prevent the terminal of the lead component β from contacting the top surface of the second case 720, the lead component β from coming off from the substrate 400, or the lead component β from being damaged.

[0241] The gaming machine of the present embodiment includes a substrate 400, a substrate case 701, and a screw. The substrate case includes a first case 710 that covers the first surface side of the substrate and a second case 720 that covers the second surface side of the substrate. The substrate is inserted with the screw from the second surface side, screw-tightened to the substrate mounting portion of the first case, and fixed to the first case. The terminal of the electronic component inserted from the first surface side of the substrate protrudes a predetermined length from the second surface. The electronic component is visible through the top surface of the first case facing the first surface of the substrate. Through the top surface portion of the second case facing the second surface of the substrate, the terminal of the electronic component and the head of the screw are visible. In a state where the screw is tightened without loosening and the substrate is fixed to the first case, Let the dimension from the second surface of the substrate to the tip of the terminal of the electronic component be the first dimension. Let the dimension from the second surface of the substrate to the tip of the head of the screw be the second dimension. When the dimension from the second surface of the substrate to the top surface portion of the second case is the third dimension, the third dimension is larger than the second dimension, and the second dimension is larger than the first dimension.

[0242] In a state where the screw is tightened without loosening and the substrate is fixed to the first case, the third dimension is larger than the second dimension, and the second dimension is larger than the first dimension. For this reason, the tip of the head of the screw and the tip of the terminal of the lead component do not contact the top surface portion of the second case. Thereby, breakage of the second case, the lead component, etc. can be prevented.

[0243] Also, the gaming machine of this embodiment includes a substrate 400, a substrate case 701, and a screw. The substrate case includes a first case 710 that covers the first surface side of the substrate and a second case 720 that covers the second surface side of the substrate. The substrate is inserted with the screw from the second surface side and is screwed to the substrate mounting portions (711, 715) of the first case and is fixed to the first case. The terminal of the electronic component inserted from the first surface side of the substrate protrudes a predetermined length from the second surface. Through the top surface portion of the first case facing the first surface of the substrate, the electronic component is visible. Through the top surface portion of the second case facing the second surface of the substrate, the terminal of the electronic component and the head of the screw are visible. In a state where the screw is tightened without loosening and the substrate is fixed to the first case, Let the dimension from the second surface of the substrate to the tip of the terminal of the lead component be the first dimension (dimension A), Let the dimension from the second surface of the substrate to the tip of the head of the screw be the second dimension (dimension B), Let the dimension from the second surface of the substrate to the top surface of the second case be the third dimension (dimension C), Let the dimension from the tip of the head of the screw to the top surface of the second case be the fourth dimension (dimension D), If the length that the screw is inserted into the substrate mounting portion is the fifth dimension (dimension E), the third dimension is larger than the second dimension, the second dimension is larger than the first dimension, and the fifth dimension is larger than the fourth dimension.

[0244] In a state where the screw is tightened without loosening and the substrate is fixed to the first case, the third dimension is larger than the second dimension, and the second dimension is larger than the first dimension. Therefore, the tip of the head of the screw and the tip of the terminal of the lead component do not contact the top surface of the second case. Thereby, breakage of the second case, the lead component, etc. can be prevented. Further, since the fifth dimension is larger than the fourth dimension, even if the screw becomes loose during tightening, the screw moves to the top surface side of the second case and the head of the screw contacts the top surface of the second case, resulting in the fourth dimension = 0, the fifth dimension > 0. Therefore, even when the head of the screw contacts the top surface of the second case, the screw is inserted into the substrate mounting portion by a predetermined amount, and the screw does not fall off from the substrate mounting portion. Therefore, the screw does not fall off (due to the absence of the screw), and the terminal of the lead component does not contact the top surface of the second case. Thereby, when the screw becomes loose during tightening, it is possible to prevent the lead component from contacting the top surface of the second case and the lead component from coming off the substrate or being damaged.

[0245] Also, in the gaming machine of this embodiment, Let the dimension from the first surface of the substrate to the top surface of the first case be the sixth dimension (dimension L), Let the height from the first surface of the connector disposed on the first surface of the substrate and covered by the top surface of the first case be the seventh dimension (dimension M), If the dimension from the first surface of the substrate to the tip of the screw inserted into the substrate mounting portion is the eighth dimension (dimension N), the sixth dimension is larger than the seventh dimension, and the eighth dimension is smaller than the seventh dimension.

[0246] Since the sixth dimension is larger than the seventh dimension, the screw is tightened without loosening, and in a state where the substrate is fixed to the first case, the connector does not contact the top surface portion of the first case. Thereby, it is possible to prevent the connector from being damaged. Further, if the eighth dimension is larger than the seventh dimension, there is a high possibility that the connector contacts the top surface portion of the first case because the screw is inserted deeper into the substrate mounting portion. However, in the present embodiment, since the eighth dimension is set smaller than the seventh dimension, such a possibility can be reduced.

[0247] (Fifth Embodiment) Next, a fifth embodiment of the present invention will be described. Hereinafter, for the configurations similar to those of the gaming machine of the above-described fourth embodiment, the description thereof will be omitted or simplified. Further, although the substrate 400 of the payout control substrate unit 700 will be used for the description, the present invention is also applicable to other predetermined substrates provided in the gaming machine.

[0248] FIG. 31(a) shows an electrolytic capacitor 810 (first component), which is one of the lead components arranged on the substrate 400. The electrolytic capacitor 810 includes a columnar main body portion 811 and lead terminal portions 812 extending from the bottom of the main body portion 811. The lead terminal portion 812 is composed of two leads (a pair of leads). The two leads are provided at a predetermined interval α in a predetermined direction (along). (The interval between the leads is α.)

[0249] Although not shown, the substrate 400 is provided with through holes (holes) through which the lead terminal portions 812 of the electrolytic capacitor 810 can be inserted. When the interval (pitch) of the through holes (holes) is β, in the present embodiment, the interval β is larger than the interval α. For this reason, as shown in FIG. 31(b), the lead terminal portions 812 of the electrolytic capacitor 810 are subjected to bending processing (forming) so that the interval on the tip side becomes β.

[0250] The electrolytic capacitor 810 is soldered and fixed to the substrate 400 with the lead terminal portion 812 inserted into the through hole (hole) of the substrate 400. FIG. 31(c) is a view showing the second surface side of the substrate 400. In a state where the electrolytic capacitor 810 is attached to the substrate 400, the tip side of the lead terminal portion 812 is bent. In the present embodiment, the tip of each lead faces outward (diagonally outward).

[0251] As shown in FIG. 32(a), a predetermined distance γ is secured (a predetermined gap γ is formed) between the main body portion 811 (bottom portion thereof) and the surface of the substrate 400 (first surface, mounting surface). In other words, the electrolytic capacitor 810 (main body portion 811) is in a state of floating by a predetermined distance γ from the surface (first surface) of the substrate 400. Since the lead terminal portion 812 is formed in accordance with the pitch (interval β) of the holes, the main body portion 811 does not contact (abut) the substrate 400 and is arranged on the substrate 400 in a state of floating by a predetermined distance γ. Although not shown, in a state where the substrate 400 is housed in the substrate case 701 (see the fourth embodiment), a predetermined gap is secured between the tip of the electrolytic capacitor 810 and the top surface portion of the first case 710 so that the electrolytic capacitor 810 does not contact the top surface portion of the first case 710.

[0252] FIG. 33(a) is a view of the first surface of the substrate 400 as seen from the direction of the substrate surface normal. The substrate 400 is provided with a plurality of holes (through-holes) into which the leads of the electrolytic capacitor 810 are inserted, at predetermined intervals along a predetermined direction. Here, a direction parallel to the substrate surface and along the predetermined direction is defined as the second direction. In FIG. 33(a), the second direction coincides with the vertical direction in the figure. Further, a direction parallel to the substrate surface and perpendicular to the second direction (a direction orthogonal to the second direction) is defined as the first direction. Note that perpendicular includes not only 90° but also substantially perpendicular, and for example, the angle between the first direction and the second direction may be about 75° to about 105°. The electrolytic capacitor 810 is a relatively tall component compared to other electronic components (such as resistors, etc.) arranged on the substrate 400, and is more likely to receive force (external force) during assembly compared to other electronic components.

[0253] Here, as cases where force is applied to the electrolytic capacitor 810 (main body 811), consider the case where force is applied along the first direction and the case where force is applied along the second direction. When force (force directed in the first direction) is applied along the first direction, the electrolytic capacitor 810 (main body 811) is more likely to fall over (the lead terminal portion 812 is more likely to bend) than when force (force directed in the second direction) is applied along the second direction. In other words, the electrolytic capacitor 810 is weak against an external force along the first direction, and the lead terminal portion 812 is likely to bend. On the other hand, the electrolytic capacitor 810 is strong against an external force along the second direction, and the lead terminal portion 812 is less likely to bend compared to the case where an external force along the first direction is received.

[0254] As shown in Fig. 32(a), the distance (height) from the surface (first surface) of the substrate 400 to the tip of the electrolytic capacitor 810 is defined as a distance δ (specific distance). The distance δ can be said to be the distance corresponding to the height of the electrolytic capacitor 810 (from the first surface). Also, as shown in Fig. 33(a), a range inside a circle (virtual circle) centered on the arrangement position of the electrolytic capacitor 810 and having a radius of the distance δ is defined as a specific range ε. In the present embodiment, a ceramic capacitor 820 (second component) is arranged within the specific range ε and at a position in the first direction of the electrolytic capacitor 810 (a position adjacent to the electrolytic capacitor 810 in the first direction).

[0255] As shown in Fig. 32(b), when the electrolytic capacitor 810 is tilted toward the ceramic capacitor 820 (when the lead is bent) by an external force along the first direction, the electrolytic capacitor 810 and the ceramic capacitor 820 come into contact (abut). In other words, the electrolytic capacitor 810 is configured to stop tilting (reach a state where it does not tilt further) due to contact with the ceramic capacitor 820. Further in other words, the ceramic capacitor 820 is arranged at a position (within the range where contact is possible) where it abuts on the electrolytic capacitor 810 whose lead is bent due to an external force being applied in the first direction.

[0256] The ceramic capacitor 820 includes two leads (a pair of leads) extending from the main body portion. When the two leads are inserted into the through holes (holes) of the substrate 400, they are soldered and fixed to the substrate 400. The distance between the main body portion of the ceramic capacitor 820 and the substrate 400 is smaller than the aforementioned predetermined distance γ, and the ceramic capacitor 820 is less likely to fall (the leads are less likely to bend) than the electrolytic capacitor 810. Also, for the ceramic capacitor 820, the direction in which the holes for inserting the leads are provided (the direction in which the hole intervals are formed) is perpendicular to the direction in which the holes for inserting the leads of the electrolytic capacitor 810 are provided (the aforementioned second direction). For this reason, the ceramic capacitor 820 is likely to fall in the aforementioned second direction, but is less likely to fall in the aforementioned first direction. Therefore, even if the electrolytic capacitor 810 falls and receives a force (a force acting in the first direction), the ceramic capacitor 820 can support the electrolytic capacitor 810 without falling together with the electrolytic capacitor 810.

[0257] As shown in FIG. 33(a), identification information (silk characters) "C32" corresponding to the ceramic capacitor 820 is indicated on the substrate 400 in the vicinity of the ceramic capacitor 820. In the present embodiment, the identification information "C32" is within a specific range ε and is indicated at a position in the first direction of the electrolytic capacitor 810. Specifically, in the first direction, the identification information "C32" is indicated at a position substantially opposite to the electrolytic capacitor 810 with the ceramic capacitor 820 interposed therebetween. Note that the identification information "C32" is a character string combining the alphabet "C" representing a capacitor and the number "32" assigned to the capacitor. For example, in the case of a capacitor to which the number "3" is assigned, it becomes "C3", and in the case of a capacitor to which the number "108" is assigned, it becomes "C108".

[0258] As shown in FIG. 33(b), in the present embodiment, even when the electrolytic capacitor 810 has fallen (the lead has been bent) and is in contact with the ceramic capacitor 820, and the ceramic capacitor 820 is covered (hidden) and cannot be visually recognized when viewed from the substrate surface normal direction, the identification information "C32" of the ceramic capacitor 820 (the component to be contacted) can be visually recognized without being hidden (blocked) (that is, the visibility of the identification information "C32" is ensured). Note that "can be visually recognized" does not mean that the whole is completely visible. Even if the visibility of a part (for example, a part of the number) is impaired (hidden), as long as the operator can identify that it is the identification information "C32", it is considered to be visually recognizable.

[0259] The identification information "C32" is marked at a position that will not be covered by the electrolytic capacitor 810 in contact with the ceramic capacitor 820. In the present embodiment, the electrolytic capacitor 810 disposed on the substrate 400 in a floating state by a predetermined distance γ will have its lead bent when a force is applied in the first direction, and the amount of bending is within a range that does not cover and hide the identification information "C32" of the ceramic capacitor 820.

[0260] Note that the identification information "C62" corresponding to the electrolytic capacitor 810 is provided in the second direction (one side) where the main body 811 is difficult to fall. Therefore, the identification information "C62" can be visually recognized even when the electrolytic capacitor 810 has fallen in the first direction and is in contact with the ceramic capacitor 820.

[0261] Also, in FIG. 33(a), it is assumed that the ceramic capacitor 820 is arranged on one side (left side) adjacent to the electrolytic capacitor 810 in the first direction. However, the ceramic capacitors 820 may be arranged on both sides adjacent to the electrolytic capacitor 810 in the first direction. In other words, the electrolytic capacitor 810 may be configured to contact the ceramic capacitor 820 and stop falling regardless of which side it falls on in the first direction. In that case, the identification information of each ceramic capacitor 820 should be visible when viewed from the normal direction of the substrate surface, regardless of which side of the electrolytic capacitor 810 falls and contacts the ceramic capacitor 820 in the first direction.

[0262] In this embodiment, the electrolytic capacitor 810 is described as the first component. However, the first component is not limited to the electrolytic capacitor 810 and may be other lead components. Specifically, it may be a lead component having a main body and leads (lead terminal portions) extending from the main body, where the main body is arranged on the substrate 400 in a state of floating by a predetermined distance, and the leads are bent so that the main body can fall. Also, the number of such leads may be two or more. For example, it may be provided with three leads. In the case of three leads, three holes into which the leads of the first component are inserted are provided on the substrate 400 at a predetermined interval in a predetermined direction (at each predetermined interval).

[0263] Also, in this embodiment, the component arranged within the specific range ε and in the first direction of the electrolytic capacitor 810 is regarded as the ceramic capacitor 820 (second component). However, the second component is not limited to the ceramic capacitor 820 and may be other electronic components. However, it is assumed that the second component has a predetermined height from the substrate surface (first surface) and can contact the first component in a state where the leads are bent.

[0264] In addition to the electrolytic capacitor 810 (first electrolytic capacitor) disposed on the substrate 400, an electrolytic capacitor 840 (second electrolytic capacitor) (fourth component) may be included separately from the above-described electrolytic capacitor 810. FIG. 34 is a diagram showing the electrolytic capacitor 810 and the electrolytic capacitor 840. The electrolytic capacitor 840 includes a columnar main body portion 841 and lead terminal portions 842 extending from the bottom of the main body portion 841. The diameter of the main body portion 841 of the electrolytic capacitor 840 is larger than the diameter of the main body portion 811 of the electrolytic capacitor 810 (has a larger diameter). In other words, the size of the main body portion 841 of the electrolytic capacitor 840 is larger than the size of the main body portion 811 of the electrolytic capacitor 810.

[0265] As described above, the electrolytic capacitor 810 has lead terminal portions 812 formed thereon and is disposed on the substrate 400 with a gap of a predetermined distance γ provided between the main body portion 811 and the substrate 400. On the other hand, in the electrolytic capacitor 840, the distance (gap) between the main body portion 841 and the surface of the substrate 400 is smaller than the predetermined distance γ (the distance between the main body portion 811 and the substrate 400 in the electrolytic capacitor 810). Being smaller than the predetermined distance γ (being in a state smaller than the predetermined distance γ) includes a state where there is no gap (the gap is 0). In the present embodiment, the electrolytic capacitor 840 is disposed on the substrate 400 in a state where no gap is provided between the main body portion 841 and the surface of the substrate 400 (that is, in a state where the main body portion 841 is in contact with the substrate 400). Although not shown, a minute gap (a gap smaller than the predetermined distance γ) may be provided between the main body portion 841 and the surface of the substrate 400. The smaller the gap between the main body portion 811 (main body portion 840) and the surface of the substrate 400, the higher the stability when the electrolytic capacitor is disposed on the substrate 400. In a state where they are disposed on the substrate 400, the electrolytic capacitor 810 is a component that is taller than the electrolytic capacitor 840.

[0266] The pitch of the holes on the substrate 400 into which the lead terminal portion 812 of the electrolytic capacitor 810 is inserted is β. In this embodiment, the interval β is 5.5 mm. Also, the pitch of the holes into which the lead terminal portion 842 of the electrolytic capacitor 840 is inserted is also β (5.5 mm). In other words, the interval of the lead terminal portions 842 is β. Note that the lead terminal portion 842 is not formed. The electrolytic capacitor 810 and the electrolytic capacitor 840 have the same pitch of the mounting holes (the interval between the leads of the electrolytic capacitor 810 and the interval between the leads of the electrolytic capacitor 840 are the same). By aligning the pitch of the holes (by aligning the intervals of the leads), the effect that the pattern design becomes easy can be enjoyed.

[0267] The electrolytic capacitor 810 arranged on the substrate 400 with a gap of a predetermined distance γ provided is more likely to have its leads bent compared to the electrolytic capacitor 840 arranged on the substrate 400 with a gap (including 0) smaller than the predetermined distance γ. In this embodiment, for the electrolytic capacitor 810 (the first electrolytic capacitor) whose leads are likely to bend, even when the leads are bent and come into contact with a predetermined component (adjacent component), the identification information of the predetermined component can be made visible.

[0268] As shown in FIG. 33(a), the ceramic capacitor 820 (the second component) is arranged within a specific range ε and in a position in the first direction of the electrolytic capacitor 810. This ceramic capacitor 820 is a component that is more resistant to heat (has higher heat resistance) compared to the IC 830. Also, the ceramic capacitor 820 is a component that generates less heat (is smaller) compared to the IC 830.

[0269] IC830 (the third component) includes a rectangular plate-shaped main body 831 and lead terminal portions 832 extending from the main body 831. The leads constituting the lead terminal portions 832 are provided in plural at predetermined intervals along each side in the longitudinal direction of the main body 831 (each of a pair of long sides). IC830 is soldered and fixed to the substrate 400 in a state where the lead terminal portions 832 are inserted into through holes (holes) of the substrate 400. At least a part of IC830 is disposed within the range of a specific range ε and at a position in the second direction of the electrolytic capacitor 810. IC830 is a component that is more vulnerable to heat (has lower heat resistance) compared to the ceramic capacitor 820. Also, IC830 is a component that generates more heat (has a larger amount of heat generation) compared to the ceramic capacitor 820. Note that in the present embodiment, IC830 is an IC in a plastic package. IC830 is a motor driver, and depending on the usage frequency and situation, when the game on the gaming machine is performed as normal and the operation continues for a predetermined time, it is a component whose amount of heat generation becomes larger (surface temperature becomes higher) than that of the ceramic capacitor 820.

[0270] When the electrolytic capacitor 810 is used in an environment with a high temperature, the deterioration is promoted (the speed of deterioration becomes faster) compared to when it is used in an environment with a low temperature. In other words, the electrolytic capacitor 810 is such that the deterioration is promoted more in a high-temperature environment.

[0271] In the present embodiment, although the IC830 with low heat resistance is disposed in the second direction of the electrolytic capacitor 810, the leads of the electrolytic capacitor 810 are difficult to bend in the second direction. In other words, the component vulnerable to heat (IC830) is disposed at a position where it is difficult for the electrolytic capacitor 810 to come into contact. Further in other words, it is difficult for the electrolytic capacitor 810 to come into contact with IC830 (the component vulnerable to heat). Thereby, it is possible to suppress the electrolytic capacitor 810 from coming into contact with IC830 and damaging IC830 due to heat. Note that the component (ceramic capacitor 820) that is disposed at a position where the lead is easily bent and the electrolytic capacitor 810 is likely to come into contact is resistant to heat, and thus is less likely to be damaged even when the electrolytic capacitor 810 comes into contact with it.

[0272] Also, an IC 830 that generates a large amount of heat in the second direction of the electrolytic capacitor 810 is disposed, but the lead of the electrolytic capacitor 810 is less likely to be bent in the second direction. In other words, the component (IC 830) that generates a large amount of heat is disposed at a position where it is difficult for the electrolytic capacitor 810 to come into contact. Further in other words, it is difficult for the electrolytic capacitor 810 to come into contact with the IC 830. Thereby, it is possible to suppress the electrolytic capacitor 810 from coming into contact with the IC 830, the electrolytic capacitor 810 from becoming high temperature, and the deterioration of the electrolytic capacitor 810 from being promoted. Note that the component (ceramic capacitor 820) that is disposed at a position where the lead is easily bent and the electrolytic capacitor 810 is likely to come into contact generates a small amount of heat, and thus it is difficult for the deterioration of the electrolytic capacitor 810 to be promoted even when the electrolytic capacitor 810 comes into contact with the ceramic capacitor 820.

[0273] The gaming machine of the present embodiment includes a substrate 400 and components disposed on the substrate, and the components include a first component (electrolytic capacitor 810) and a second component (ceramic capacitor 820). The first component includes a main body portion 811 and a lead terminal portion 812 having a plurality of leads extending from the main body portion. The substrate includes a plurality of holes provided at a predetermined interval in a predetermined direction. The first component is disposed on the substrate in a state where the plurality of leads are inserted into the plurality of holes and a predetermined gap is formed between the main body portion and the substrate. A direction parallel to the substrate surface and along the predetermined direction is defined as the second direction. A direction parallel to the substrate surface and perpendicular to the second direction is defined as the first direction. When the distance from the substrate to the tip of the main body is defined as a specific distance, on the substrate, within the range of a circle centered on the position of the first component and having the specific distance as the radius, the second component is arranged and the identification information corresponding to the second component is indicated, the second component and the identification information are provided in the first direction of the first component, when a force acting in the first direction is applied to the main body, the lead terminal portion is bent, and the main body is in contact with the second component, the identification information is visible when viewed from the substrate surface normal direction.

[0274] When a force acting in the first direction is applied to the main body, the lead terminal portion is bent, and the main body is in contact with the second component, the identification information is visible when viewed from the substrate surface normal direction. Therefore, even if at least a part of the second component is covered by the contact of the main body and it becomes difficult to view the second component, the second component can be specified (identified) through the identification information corresponding to the second component. As a result, when the lead terminal portion of the first component is bent, it is possible to suppress a decrease in the efficiency of work (such as inspection work) due to difficulty in specifying the component (the second component) covered by the first component.

[0275] Also, in the gaming machine of the present embodiment, when a force acting in the second direction is applied to the main body of the first component, the lead terminal portion is less likely to bend than when a force acting in the first direction is applied to the main body, the identification information corresponding to the first component is provided in the second direction of the first component.

[0276] The identification information corresponding to the first component is provided in the second direction in which the lead terminal portion is less likely to bend. Therefore, it is possible to suppress impairment of the visibility of the identification information corresponding to the first component when the lead terminal portion is bent.

[0277] Also, in the gaming machine of the present embodiment, the component includes a third component (IC830) at least partially included within the range of the circle and arranged on the substrate so as to be positioned in the second direction of the first component. The third component generates more heat than the second component arranged in the first direction of the first component. The first component is more likely to deteriorate in a high-temperature environment. When a force acting in the second direction is applied to the main body portion, the lead terminal portion of the first component is less likely to bend than when a force acting in the first direction is applied to the main body portion.

[0278] The first component is a component whose deterioration is promoted more in a high-temperature environment, and the third component with a large amount of heat generation is arranged in the second direction of the first component. However, the lead terminal portion of the first component is less likely to bend in the second direction. In this way, by arranging the third component with a large amount of heat generation on the side where the lead terminal portion is less likely to bend, the first component abuts against the third component, and it is possible to suppress the first component from becoming high temperature and promoting the deterioration of the first component. Also, the second component arranged on the side where the lead terminal portion is likely to bend (the side where the first component is likely to abut) is a component that generates less heat than the third component. Therefore, even when the first component abuts against the second component, it is possible to suppress the first component from becoming high temperature due to the influence of the ambient temperature and promoting the deterioration of the first component.

[0279] Also, in the gaming machine of the present embodiment, the component includes a third component (IC830) at least partially included within the range of the circle and arranged on the substrate so as to be positioned in the second direction of the first component. The third component has lower heat resistance than the second component arranged in the first direction of the first component. When a force acting in the second direction is applied to the main body, the lead terminal portion is less likely to bend than when a force acting in the first direction is applied to the main body.

[0280] The third component with low heat resistance in the second direction of the first component is arranged. However, the lead terminal portion of the first component is difficult to bend in the second direction. In this way, by arranging the third component on the side where the lead terminal portion is difficult to bend (the side where the first component is difficult to contact), it is possible to prevent the first component from contacting the third component and suppress the failure (deterioration) of the third component with low heat resistance. In addition, by arranging the second component with higher heat resistance than the third component on the side where the lead terminal portion is likely to bend (the side where the first component is likely to contact), it is possible to suppress the failure of the second component when the first component contacts.

[0281] Also, in the gaming machine of this embodiment, The component includes a fourth component (electrolytic capacitor 840) that is the same type as the first component and has a larger main body size than the first component. The first component and the fourth component have the same interval between the holes into which the lead terminal portion is inserted. The fourth component is arranged on the substrate in a state where the gap between the main body and the substrate is smaller than the predetermined gap in the first component.

[0282] The first component has its lead terminal portion bent according to the interval between the holes in the substrate into which the lead terminal portion is inserted (the same as the interval between the holes into which the lead terminal portion of the fourth component, which is larger than the first component, is inserted). The first component is arranged on the substrate with a predetermined gap formed between the main body portion (the main body portion of the first component) and the substrate. On the other hand, the fourth component is arranged on the substrate with the gap between the main body portion (the main body portion of the fourth component) and the substrate being smaller than the predetermined gap. The lead terminal portion of the first component is more likely to bend compared to the fourth component. In this embodiment, for the first component different from the fourth component, even when a force acting in the first direction is applied to the main body portion (the main body portion of the first component) and the lead terminal portion (the lead terminal portion of the first component) bends and the main body portion (the main body portion of the first component) comes into contact with the second component, when viewed from the normal direction of the substrate surface, the identification information (the identification information of the second component) is visible. Thereby, when the lead terminal portion of the first component bends, it is possible to suppress the difficulty of identifying the component (the second component) covered by the first component and the reduction in the efficiency of the work (inspection work).

[0283] In FIG. 31(c), in the case of the electrolytic capacitor 810, it is assumed that the tips of the terminals of the pair of leads face outward (diagonally outward) respectively. On the other hand, in FIG. 30 according to the fourth embodiment, in the case of the lead component β, it is assumed that the tips of the terminals of the pair of leads face inward respectively. Here, the lead component β is a resistor. By making the bending direction of the lead tips different according to the type of the component (by setting a rule for the bending direction of the lead) for the lead component in this way, it is possible to identify (narrow down) which type of component it is by only looking at the second surface side of the substrate 400. Thereby, the efficiency of work such as inspection can be improved.

[0284] (Sixth Embodiment) Next, a sixth embodiment of the present invention will be described. Hereinafter, for the components similar to those of the gaming machine according to the fourth embodiment described above, the description thereof will be omitted or simplified. Further, although the substrate 400 of the payout control substrate unit 700 will be used for the description, the present invention is also applicable to other predetermined substrates provided in the gaming machine.

[0285] In FIG. 30, the case where the substrate 400 is fixed to the first case 710 (boss 715) using the screw α is shown. The screw α is a pan head screw. In the present embodiment, as shown in FIG. 35, a countersunk head screw S is used as the screw (fixing member) for fixing the substrate 400 to the first case 710 (first member). The metal countersunk head screw S has a flat upper surface of the head (plane) and a conical seating surface. The countersunk head screw S is a screw used, for example, when it is not desired to project the head by providing a countersink in the tightening mating member. In the present embodiment, however, the countersunk head screw S is used without providing a countersink in the substrate 400, which is the tightening mating member. Here, the dimension of the substrate case 701 (case) in the same direction as the thickness direction of the substrate 400 is defined as the "thickness of the substrate case 701". The substrate case 701 is required to have a reduced (thinner) thickness from the viewpoint of securing a mounting space for other components.

[0286] Since the upper surface of the head of the countersunk head screw S is flat, the height of the head is lower (the axial dimension B is smaller) than that of the pan head screw. A predetermined gap (dimension D) is secured between the head of the screw and the substrate case 701 (second case 720). However, since the dimension B of the countersunk head screw S is smaller than that of the pan head screw, when the countersunk head screw S is used, the second case 720 (second member) can be arranged closer to the substrate 400 side (the space inside the substrate case 701 can be reduced). That is, when the countersunk head screw S is used, the substrate case 701 can be formed thinner than when the pan head screw is used, realizing miniaturization and space saving.

[0287] Incidentally, when the thickness of the substrate case 701 (the space inside the substrate case 701) is constant, when using the countersunk head screw S, a larger distance (gap) (dimension D) can be ensured between the head of the screw and the second case 720 than when using the pan head screw. Therefore, the possibility that the head of the screw contacts the second case 720 and the second case 720 is damaged can be reduced. Further, when comparing the contact area with the substrate 400 (flat substrate surface) (second surface) between the head of the countersunk head screw S and the head of the pan head screw, the contact area of the head of the countersunk head screw S with the substrate 400 is smaller than that of the head of the pan head screw. Therefore, when the screw is tightened, the range where force is applied to the substrate can be reduced, and damage to the substrate can be suppressed.

[0288] As shown in FIG. 29 and the like, a substantially circular pattern non-formation region N (a region where no copper foil is provided) is provided around the through hole 450 (screw insertion hole) (screw hole) of the substrate 400. The substantially circular shape includes a circular shape (isolated circle), and also includes a case where a part of the circle is connected to another pattern non-formation region N and does not form a complete circle. The outside (radial outside) of the substantially circular pattern non-formation region N is a region where a pattern is formed (a region where copper foil is provided).

[0289] Although not shown, the diameter of the pattern non-formation region N around the through hole 450 is larger than the diameter of the head of the countersunk head screw S. For example, the diameter of the pattern non-formation region N is about 1 to 3 mm larger than the diameter of the head of the countersunk head screw S. The pattern non-formation region N has a size such that when viewed from the normal direction of the substrate surface (second surface), the head of the countersunk head screw S does not protrude outside the pattern non-formation region N (the head of the countersunk head screw S fits inside the pattern non-formation region N). Therefore, it is possible to suppress the contact between the screw and the copper foil and the resulting electrical conduction, and to prevent damage to the components. Also, it is possible to prevent damage to the copper foil due to contact with the screw. Further, even if a screw with a large head diameter (different from the designed one) is used, the possibility that the head of the screw contacts the copper foil can be reduced.

[0290] Here, the radially outer end portion at the head of the countersunk screw S is defined as the outer end portion of the head of the countersunk screw S. As shown in FIG. 35, in the state where the countersunk screw S is tightened to the first case 710 (the state where the substrate 400 is fixed by the countersunk screw S), the gap (the gap in the axial direction of the screw) between the second surface of the substrate 400 and the outer end portion of the head of the countersunk screw S is defined as the first gap.

[0291] Electronic components are mounted on the first surface of the substrate 400. Further, the head of the countersunk screw S is located on the second surface of the substrate 400. Here, among the spaces formed inside the substrate case 701, the space on the first surface side is defined as the first space, and the space on the second surface side is defined as the second space. In the present embodiment, in the state where the substrate 400 is enclosed (stored) inside the substrate case 701, a second gap that communicates (connects) the first space and the second space is provided. The air inside the substrate case 701 can move between the first space and the second space through the second gap. The second gap is formed, for example, between a predetermined outer edge (outer end) of the substrate 400 and the inner surface (inner side surface) of the substrate case 701.

[0292] The second gap is smaller than the size of the electronic component (component) arranged on the first surface of the substrate 400. In other words, the electronic component arranged on the first surface of the substrate 400 is larger than the second gap. The second gap is sized such that the electronic component arranged on the first surface of the substrate 400 cannot pass (move) from the first space to the second space. When it is said that "the second gap is smaller than the size of the electronic component arranged on the first surface of the substrate 400", it means that the second gap is smaller than the smallest width (dimension) among the widths (dimensions) in each direction (vertical direction, horizontal direction, radial direction, etc.) of the electronic component. For example, in the case of a long plate-shaped electronic component where the thickness dimension is smaller than the short-side dimension, the thickness dimension is the "smallest width". Even if the electronic component arranged on the first surface of the substrate 400 comes off and moves, the electronic component cannot move from the first space to the second space through the second gap. Therefore, by looking only at the first space side, it is possible to check for the presence or absence of the removed component (detached component).

[0293] The electronic components arranged on the first surface of the substrate 400 may be chipped in part due to deterioration or the like. And it may happen that the chipped component (fragment) is smaller than the second gap. That is, it may happen that the chipped component (fragment) moves from the first space to the second space through the second gap. When the chipped component moves to the second space, the presence or absence of the chipped component can be confirmed by checking the second space side. However, if the chipped component is caught and stays in the first gap, it becomes difficult to notice the presence of the chipped component.

[0294] In the present embodiment, the first gap is smaller than the second gap. For this reason, even when the chipped component (fragment) moves from the first space to the second space through the second gap, it is difficult for the component to be caught (get into) the first gap. That is, the possibility that the chipped component is caught (gets into) the first gap is low. Thereby, even when the component is damaged and chipped, the possibility of finding the chipped component can be increased.

[0295] In the present embodiment, in the payout control board unit 700, when fixing the board 400 to the board case 701, by using a countersunk head screw, the size is reduced and space saving is realized. However, in a predetermined board unit arranged in a place where the space constraint is not relatively strict, a pan head screw or a countersunk head screw may be used when fixing the board to the board case. Also, in a design part or the like other than the board unit, a pan head screw or a countersunk head screw may be used when fixing a predetermined member. In other words, a countersunk head screw is used in a board unit that requires space saving, and a countersunk head screw can be used appropriately in other places.

[0296] The gaming machine of the present embodiment includes a board (400), a case (701) for housing the board, and a fixing member for fixing the board to the case. The board is provided with screw holes. The fixing member is a countersunk head screw (S). The dish screw is inserted into the screw hole from one surface side of the substrate and tightened to the case. A first gap is formed between an end portion on the radially outer side of the head of the dish screw and one surface of the substrate.

[0297] The upper surface of the head of the dish screw is flat, and the height of the head is lower than that of the pan head screw. For this reason, the case can be arranged closer to the substrate side than when a pan head screw is used. For this reason, the thickness of the case can be reduced. For this reason, miniaturization can be achieved and space can be saved. Further, the dish screw has a smaller contact area with the substrate than when a pan head screw is used. For this reason, the range in which force is applied to the substrate can be reduced, and damage to the substrate can be suppressed.

[0298] Also, in the gaming machine of the present embodiment, the case includes a first member (first case 710) that covers the first surface of the substrate and a second member (second case 720) that covers the second surface of the substrate. The dish screw is inserted into the screw hole from the second surface side of the substrate and tightened to the first member. Components are arranged on the first surface side of the substrate. The head of the dish screw is arranged on the second surface side of the substrate. A second gap that communicates the space on the first surface side and the space on the second surface side is provided in the case. The second gap is smaller than the size of the components arranged on the first surface side of the substrate. The first gap is smaller than the second gap.

[0299] Since the second gap is smaller than the size of the component arranged on the first surface side of the substrate, it is possible to prevent the component from moving from the space on the first surface side to the space on the second surface side through the second gap. Further, since the first gap is smaller than the second gap, even if a part of the component arranged on the first surface side of the substrate is chipped and the chipped component (fragment) moves from the space on the first surface side to the space on the second surface side through the second gap, it is possible to suppress the component from being pinched (getting caught) in the first gap. Thereby, the possibility of detecting the chipped component can be increased.

[0300] Also, in the gaming machine of the present embodiment, The periphery of the screw hole on the second surface is a substantially circular region where no copper foil is formed. The diameter of the region is larger than the diameter of the head of the countersunk screw.

[0301] Since the diameter of the region is larger than the diameter of the head of the countersunk screw, it is possible to suppress the head of the countersunk screw from coming into contact with the copper foil and being electrically conductive, and to prevent damage to the component. Also, it is possible to prevent damage to the copper foil due to the contact. Further, even if a screw with a large head diameter is used, it is possible to reduce the possibility of the head of the screw coming into contact with the copper foil.

[0302] (Seventh Embodiment) Next, a seventh embodiment of the present invention will be described. Hereinafter, for the same configurations as those of the gaming machine of the first embodiment described above, the description thereof will be omitted or simplified.

[0303] As shown in FIG. 7, the front case 402a serves as a cover member disposed on the rear side of the gaming machine and is formed of a transparent resin. In the present embodiment, an ABS resin (acrylonitrile, butadiene, styrene copolymer resin) is used as the resin. On the other hand, the back case 402b serves as a base member disposed on the front side of the gaming machine and is formed of a transparent resin. In the present embodiment, a PC (polycarbonate) resin is used as the resin. Although both the front case 402a and the back case 402b are formed of transparent resins, their materials are different. As shown in FIG. 7, a seal (seal 410) is attached to the front case 402a. On the other hand, no seal is attached to the back case 402b.

[0304] Around the payout control board 400 (board case 402) (payout control board unit 401), there are components that generate heat (heat-generating components). Inside the board case 402, the payout control board 400 is disposed, and various electronic components are disposed on the payout control board 400, including components that generate heat. Also, around (in the vicinity of) the board case 402, there are components that generate heat (heat-generating components). Such components are provided, for example, on the front side of the board case 402 (back case 402b: base member) that houses the payout control board 400 (the back side of the board case 402 when viewed from the rear of the gaming machine). Note that such components may be provided on any of the left side, right side, upper side, or lower side of the board case 402 (payout control board 400) when viewed from the rear of the gaming machine. Examples of such components include a power supply board (power supply board unit). A plurality of components are disposed on the power supply board, and among the plurality of components, in particular, the coil and the power supply IC are components with a relatively large heat generation amount. Also, as such components, for example, there is a board on which components such as a motor, a motor driver (IC), and an LED driver (IC) are mounted. The heat-generating components disposed around the board case 402 are not limited to one, and a plurality of them may be provided. In order to achieve space saving in the housing, such components may be disposed relatively close to the payout control board 400 (payout control board unit 401).

[0305] In an environment where temperature changes occur (for example, during high temperatures), gas may be generated from the surface of a case (member) made of PC resin. Therefore, when a seal is attached to the surface of the case, the generated gas is trapped inside the seal, bubbles are formed inside the seal (bubbles accumulate), and unevenness may be formed on the surface of the seal (the surface becomes bumpy). As shown in FIG. 9, the seal 410 is provided with a field for the opener to fill in, a field for the opening date to be filled in, etc., and there may be characters filled in. Therefore, when such unevenness is formed, the visibility of the filled characters decreases (it becomes difficult to visually recognize the characters). Also, when such unevenness is formed, it becomes difficult to write characters on the seal 410. The seal 410 is formed of a vinyl chloride film having excellent heat resistance and weather resistance. Therefore, unlike a paper seal, it has low air permeability and it is difficult for the internal bubbles to pass through (difficult to escape to the outside). As a result, when gas is generated and unevenness is formed, it is difficult to eliminate the unevenness.

[0306] In an environment where temperature changes occur (for example, during high temperatures), the amount of gas generated from a case made of ABS resin is less than that from a case made of PC resin. Therefore, in this embodiment, the front case 402a to which the seal 410 is attached is formed of ABS resin, and the back case 402b to which the seal is not attached is formed of PC resin. By attaching the seal 410 to the surface of the ABS front case 402a, it is possible to suppress the formation of unevenness on the surface of the seal 410. As a result, it is possible to suppress the difficulty of visually recognizing the characters described on the seal 410 and the difficulty of writing characters on the seal 410.

[0307] In addition, in the present embodiment, the back case 402b (base member) has a larger volume than the front case 402a (cover member). That is, the back case 402b with a larger volume than the front case 402a is formed of PC resin, and the front case 402a with a smaller volume than the back case 402b is formed of ABS resin. PC resin has higher strength than ABS resin. Also, the back case 402b is a component arranged closer to the player side than the front case 402a in the gaming machine. By forming the back case 402b, which has a larger volume and is arranged on the player side, with a stronger material (PC resin) than the front case 402a, it is possible to improve the anti-tampering performance.

[0308] Further, the front case 402a and the back case 402b are caulked and joined. For this reason, the substrate case 402 cannot be opened unless the caulked portion is destroyed. In the present embodiment, this caulked portion is formed of PC (a part of the back case 402b). In other words, a part of the PC-made back case 402b is caulked. By forming the caulked portion with PC resin, which has higher strength than ABS resin, it is possible to make it more difficult to break the caulked portion. Thereby, the anti-tampering performance can be improved.

[0309] The front case 402a is provided with bosses having screw holes, etc., and the payout control board 400 is screwed and fixed to the front case 402a. If the front case 402a were made of PC, since its strength is high, the force required for screwing would be large, resulting in a decrease in workability. In the present embodiment, since the front case 402a is formed of ABS resin instead of PC resin, it is possible to avoid such a decrease in workability.

[0310] The gaming machine of the present embodiment includes a substrate (400) and a case (402) for housing the substrate. The case includes a first member (front case 402a) that covers one surface of the substrate and a second member (back case 402b) that covers the other surface of the substrate. A seal (410) capable of writing predetermined information is attached to the first member. The first member is formed of an ABS resin. The second member is formed of a polycarbonate resin.

[0311] If the first member is formed of a polycarbonate resin and the seal is attached to the first member, bubbles may be formed in the seal due to gas generation, and irregularities may be formed on the surface of the seal. In this case, it becomes difficult to write predetermined information on the seal, and if predetermined information is written on the seal, it becomes difficult to visually recognize the predetermined information. In the present embodiment, since the first member to which the seal is attached is formed of an ABS resin that generates less gas than a polycarbonate resin, it is possible to suppress the formation of irregularities on the surface of the seal. Thereby, it is possible to suppress the difficulty of writing predetermined information on the seal and the difficulty of visually recognizing the predetermined information described on the seal. Further, by forming the second member of a polycarbonate resin having higher strength than the ABS resin instead of the ABS resin, the anti-tampering performance can be improved.

[0312] Further, in the gaming machine of the present embodiment, Components that generate heat are provided around the case. No seal is attached to the second member. The volume of the second member is larger than the volume of the first member.

[0313] Components that generate heat are provided around the case, but the seal is attached to the first member made of ABS, and the seal is not attached to the second member made of PC. For this reason, it is possible to prevent the formation of irregularities on the surface of the seal. Further, the second member having a larger volume than the first member is formed of a PC resin having higher strength than the ABS resin. By forming a member (the second member) having a larger volume of a material having high strength, the anti-tampering performance can be improved.

[0314] (Eighth Embodiment) Next, the eighth embodiment of the present invention will be described. Hereinafter, for the components similar to those of the gaming machine of the fourth embodiment described above, the description thereof will be omitted or simplified.

[0315] FIG. 36 is a view of a part of the mounting surface (front surface) (first surface) of the substrate 400 (payout control substrate 400) of the present embodiment as viewed from a direction orthogonal to the mounting surface (first surface normal direction). In the present embodiment, an insertion-mounted main IC 900 (specific IC) (CPU) (specific integrated circuit) is mounted on the substrate 400. The main IC 900 controls various processes by the substrate 400. In the present embodiment, a plurality of types of ICs are arranged on the substrate 400, and the main IC 900 is one of them, and the number of main ICs 900 arranged is one. The main IC 900 includes a main body portion (package) 910 that incorporates a CPU, a memory, etc. and is formed in a substantially rectangular plate shape, and a plurality of IC terminals (lead pins) T that are electrically connected to the circuit incorporated in the main body portion 910.

[0316] In the present embodiment, a ZIP (Zigzag In-Line Package) type is used as the main IC 900, and the IC terminals T extend alternately in a zigzag shape from one side surface (one side) of the main body portion 910 toward the mounting surface side. Note that the main IC 900 may be of the SIP (Single In-Line Package) type. In that case, the IC terminals T extend side by side in a single row from one side surface (one side) of the main body portion 910 toward the mounting surface side.

[0317] FIG. 37 is a schematic view of the location on the substrate 400 where the main IC 900 is disposed, as seen from a direction (side) facing the plate surface of the main body portion 910 of the main IC 900. Here, with respect to the substantially rectangular plate-shaped main body portion 910, the direction along the long side is defined as the "longitudinal direction", and the direction along the short side is defined as the "lateral direction". Also, the plate thickness direction of the main body portion 910 is defined as the "thickness direction". The main IC 900 is arranged such that one side in the longitudinal direction of the main body portion 910 is located on the mounting surface side, and each side in the lateral direction of the main body portion 910 is substantially perpendicular (including perpendicular) to the mounting surface of the substrate 400. Here, the surface of the main body portion 910 that faces the mounting surface of the substrate 400 is defined as the bottom surface of the main body portion 910. The bottom surface can be said to be one of the pair of side surfaces that face each other in the lateral direction of the main body portion 910.

[0318] A plurality of IC terminals T extend from the bottom surface of the main body portion 910 toward the mounting surface side, and are provided at predetermined intervals along the longitudinal direction of the main body portion 910. In the present embodiment, the plurality of IC terminals T are provided in an alternating zigzag pattern. In other words, the plurality of IC terminals T are provided in two staggered rows. In the present embodiment, 64 IC terminals T, namely IC terminal T1 to IC terminal T64, are provided as the plurality of IC terminals T. Each IC terminal T is formed of a conductive metal.

[0319] The substrate 400 is provided with 64 through holes corresponding to IC terminals T1 to IC terminals T64. The through holes can be referred to as through holes for mounting the main IC 900 (for the main IC 900). The main IC 900 is joined to the substrate 400 by inserting the IC terminals T1 to T64 into the respective through holes and soldering them. In other words, the main IC 900 is disposed on the substrate 400 in a state where each IC terminal T and each through hole (the wiring pattern connected to the through hole) are electrically connected.

[0320] In addition to the main IC 900, a plurality of components (electronic components) are mounted on the substrate 400. Note that the plurality of components may include surface-mounted components in addition to lead components. The substrate 400 is provided with a wiring pattern (signal line) that connects (connects) the main IC 900 and a predetermined component. In other words, the substrate 400 is provided with a wiring pattern (signal line) that connects the through hole corresponding to the IC terminal T of the main IC 900 and the through hole corresponding to the terminal of the predetermined component.

[0321] FIG. 38 is a view of a part of the back surface (second surface) of the substrate 400 (the back side of the mounting position of the main IC 900) as viewed from a direction orthogonal to the back surface (second surface normal direction). In the present embodiment, in all the wiring patterns 920 that connect the main IC 900 and the components arranged on the substrate 400, at least the portion on the main IC 900 side is connected to the IC terminal T of the main IC 900 on the second surface of the substrate 400.

[0322] The wiring pattern 920 includes a wiring pattern 921 in which all paths are provided on the back surface (second surface) of the substrate 400, and a wiring pattern 922 in which a part (the part on the main IC 900 side) is provided on the back surface (second surface) of the substrate 400 and a part (the part on the counterpart component side) is provided on the front surface (first surface) of the substrate 400. Note that the blackened portions in the figure indicate that solder is attached.

[0323] The wiring pattern 922 has a predetermined length of wiring pattern (IC-side wiring pattern 922a) including a connection portion with a predetermined IC terminal T of the main IC 900 formed on the back surface of the substrate 400. As shown in FIG. 36, a predetermined length of wiring pattern (counterpart-side wiring pattern 922b) including a connection portion with a predetermined terminal of the counterpart component is formed on the front surface of the substrate 400, and the two are connected via a via 923 (via hole) (through hole). In the present embodiment, among the wiring patterns that connect a predetermined terminal T of the main IC 900 and a predetermined terminal of another component, at least a predetermined length of wiring pattern including the connection portion with the terminal T is provided on the back surface of the substrate 400.

[0324] As shown in FIG. 36, on the surface (mounting surface) of the substrate 400, around all the through holes (the through holes into which the IC terminals T are inserted) for the main IC 900, a ground pattern Y (ground pattern region Y) (solid ground portion Y) surrounding all the through holes is provided. In other words, on the surface of the substrate 400, around all the through holes (all the IC terminals T) for the main IC 900, there is no wiring pattern (wiring pattern 920) connecting the main IC 900 and other components, and a ground pattern region Y that is not separated by the wiring pattern is provided.

[0325] Also, on the back surface of the substrate 400, a ground pattern region Z is provided in a portion including the peripheral portion of the through hole for the main IC 900. The ground pattern region Y (first ground pattern) and the ground pattern region Z (second ground pattern) are electrically connected via a ground through hole (such as the ground through hole 960).

[0326] By configuring in this way, the noise resistance of the main IC 900 can be improved. Also, the heat dissipation performance can be improved. Further, on the surface of the substrate 400, by not providing a wiring pattern connected to the IC terminal T around the IC terminal T and adopting a simple configuration (solid ground portion), it can be easily detected when fraud is committed. That is, the anti-fraud performance can be improved.

[0327] Also, in the ground pattern region Y, a frame-shaped silk display 930 indicating the mounting position (mounting region) of the main IC 900 is provided. The silk display 930 (frame line) is formed by, for example, white silk printing. The main IC 900 is arranged inside the silk display 930. Note that the size and shape of the silk display 930 will be described later.

[0328] In this embodiment, all the wiring patterns 920 connecting the main IC 900 and the components arranged on the substrate 400 are such that at least the portion on the main IC 900 side is connected to the IC terminal T of the main IC 900 on the second surface of the substrate 400. Here, the "at least the portion on the main IC 900 side", that is, the IC-side wiring pattern 922a will be described. The counterparty-side wiring pattern 922b (Fig. 36) is connected to the IC-side wiring pattern 922a (Fig. 38) provided on the back surface of the substrate 400 via a predetermined via 923 provided outside the silk display 930. The counterparty-side wiring pattern 922b is configured not to cross the silk display 930. In other words, the counterparty-side wiring pattern 922b is formed so as not to enter the inside of the silk display 930. On the back surface of the substrate 400, the IC-side wiring pattern 922a is formed with a predetermined length connecting a predetermined position (via 923) outside the silk display 930 on the surface and a predetermined terminal T of the main IC 900. The IC-side wiring pattern 922a includes the connection portion with the terminal T and has a predetermined length reaching at least outside the silk display 930 on the surface.

[0329] As shown in Fig. 36, for the predetermined IC terminals (pins) of the main IC 900, the IC terminals may be connected to each other by a wiring pattern J (excluding the ground pattern) on the surface (mounting surface) of the substrate 400. In other words, a wiring pattern (signal line) connecting a predetermined IC terminal and a predetermined IC terminal may be provided on the surface of the substrate 400. By allowing the formation of the wiring pattern on the surface, the efficiency of pattern design can be improved.

[0330] Note that the main IC 900 may be of the DIP (Dual In-Line Package) type in which terminals extend from both sides (a pair of opposite sides) of the main body portion toward the mounting surface side instead of one side of the main body portion. In FIG. 17, for the main IC 500 in which IC terminals extend from both sides of the main body portion, a first ground pattern 560 and a second ground pattern 561 are provided between the IC terminals P1 to P35 and the IC terminals P36 to P71, and a plurality of main IC back through holes 562 are provided as through holes for electrically connecting the first ground pattern 560 and the second ground pattern 561. Even for a DIP-type main IC, all the wiring patterns 920 (at least the IC-side wiring pattern 922a) may be provided on one surface, and the ground pattern region Y may be provided on the other surface as in the present embodiment.

[0331] When the main IC 900 is of the ZIP type, since the IC terminal T extends from one side (bottom surface) of the main body portion 910, the facing area between the main body portion 910 and the mounting surface of the substrate 400 is smaller than that of the main IC 500, and the interval (interval between columns) of the IC terminals T arranged in two columns along the longitudinal direction of the main body portion 910 is also smaller. For this reason, it is difficult to provide a ground pattern or a ground through hole at a location on the surface of the substrate 400 that faces the bottom surface of the main body portion 910 (the region behind the main IC). Even if it is provided, it will be a ground pattern (solid ground portion) with a narrow width and a small area.

[0332] Therefore, in the present embodiment, all the wiring patterns 920 (at least the IC-side wiring pattern 922a) are provided on the back surface of the substrate 400, and on the front surface of the substrate 400, at least the IC-side wiring pattern 922a is not provided, and a ground pattern region Y surrounding the through hole for the main IC 900 is formed. Thereby, even when the ZIP-type main IC 900 is used, the noise resistance can be improved. Also, the heat dissipation can be improved.

[0333] In this embodiment, all wiring patterns 920 (at least the IC-side wiring pattern 922a) may be provided on the front surface (first surface) of the substrate 400, and the ground pattern region Y may be provided on the back surface (second surface) of the substrate 400. However, when the surface on which the main IC 900 is disposed and the surface on which the ground pattern region Y is formed are the same surface (Fig. 36), the periphery of the main IC 900 has a simple configuration and can be easily detected if any fraud is committed.

[0334] In this embodiment, the substrate 400 is a two-layer substrate, but it is not limited thereto and may be a multilayer substrate. In the case of a multilayer substrate, the ground can be further strengthened by using a predetermined layer as a ground dedicated layer. Note that in this embodiment, even in the case of a two-layer substrate, all wiring patterns 920 (at least the IC-side wiring pattern 922a) are provided on one surface of the substrate 400 and the ground pattern region Y is provided on the other surface, thereby realizing noise resistance of the main IC 900.

[0335] Regarding components other than the main IC 900, the wiring patterns connecting other components (connecting terminals of other components to each other) may be provided on the front surface of the substrate 400, may be provided on the back surface of the substrate 400, or may be provided on both the front and back surfaces of the substrate 400.

[0336] (Silk display) A plurality of components including the main IC 900 are disposed on the mounting surface (front surface) (first surface) of the substrate 400. In addition, a silk display (display) indicating the mounting area (mounting position) of each component is provided on the mounting surface of the substrate 400. The silk display is formed, for example, by white silk printing. The silk display 930 (first display) shown in Fig. 36 is a silk display indicating the mounting area of the main IC 900. Note that the silk display may be marked so as to indicate the outer shape of each component when viewed from a direction perpendicular to the mounting surface (in accordance with the outer shape of each component), or may be marked with a shape different from the outer shape (for example, a square frame).

[0337] In this embodiment, when viewed from a direction orthogonal to the mounting surface, the outer shape of the main IC 900 and the outer shape of the silk display 930 are different. Note that the silk display 930 may be formed to correspond to the outer shape of the main body 910 when viewed from a direction (side) in which the main IC 900 faces the plate surface of the main body 910 (FIG. 37).

[0338] Here, components other than the main IC 900 that are arranged on the mounting surface of the substrate 400 are referred to as "predetermined components 940". In other words, the components arranged on the mounting surface of the substrate 400 are divided into the main IC 900 and the predetermined components 940. At least one or more predetermined components 940 are provided. Examples of the predetermined components 940 include an IC (an IC different from the main IC 900), a resistor array (ladder resistor), a connector, an electrolytic capacitor, and the like.

[0339] On the mounting surface of the substrate 400, a silk display 950 (second display) indicating the mounting area of the predetermined component 940 is provided. Here, the IC 941, which is one of the predetermined components 940, will be described. The IC 941 is a type of IC different from the main IC 900. As shown in FIG. 36, in this embodiment, a plurality of ICs 941 are arranged on the mounting surface of the substrate 400. Also, as shown in FIG. 39(a), on the mounting surface of the substrate 400, a silk display 951 as a silk display 950 corresponding to the IC 941 is provided. The silk display 951 is formed to correspond to the outer shape of the IC 941 (main body portion) and has a notch (recess) on a semi-circular arc.

[0340] As shown in FIG. 36, one of the predetermined components 940 includes a resistor array 942. Also, on the mounting surface of the substrate 400, a silk display 952 as a silk display 950 corresponding to the resistor array 942 is provided. Although not shown, there is a connector among the predetermined components 940, and on the mounting surface of the substrate 400, a silk display 950 corresponding to the outer shape of the connector is provided. Although not shown, there is an electrolytic capacitor among the predetermined components 940, and on the mounting surface of the substrate 400, a silk display 950 corresponding to the outer shape of the electrolytic capacitor is provided.

[0341] In this embodiment, when viewed from a direction orthogonal to the mounting surface, the size of the silk display 930 with respect to the size of the main IC 900 is larger than the size of the silk display 950 with respect to the size of the predetermined component 940. Whether the predetermined component 940 is any component such as the IC 941, the connector, the electrolytic capacitor, etc. (any component whose silk display is formed along the outer shape), the size of the silk display 930 with respect to the size of the main IC 900 is larger than the size of the silk display 950 with respect to the size of the predetermined component 940. Here, the "size" refers to the area when viewed from a direction orthogonal to the mounting surface, but it may also be the length of the outer periphery when viewed from a direction orthogonal to the mounting surface.

[0342] Note that the size of the silk display 950 with respect to the size of the predetermined component 940 may be 1 or less. In other words, the predetermined component 940 and the silk display 950 may be the same size, or the size of the silk display 950 may be smaller than the size of the predetermined component 940 (for example, the IC 941).

[0343] When the predetermined component 940 is set to all ICs (other ICs) other than the main IC 900 arranged on the substrate 400, in this embodiment, the size of the silk display 930 with respect to the size of the main IC 900 is larger than the size of the silk display 950 with respect to the size of any other IC. In other words, the ratio of the size of the silk display 930 with respect to the main IC 900 is larger than the ratio of the size of the silk display 950 with respect to any other IC (any other predetermined IC).

[0344] The main IC 900 is a core component that controls various processes by the substrate 400. In the present embodiment, when viewed from a direction orthogonal to the mounting surface, the area of the portion (the first margin) that is outside (surrounding) the main IC 900 and inside the silk display 930 is larger than the area of the portion (the second margin) that is outside (surrounding) the predetermined component 940 and inside the silk display 950. Since a relatively large first margin is ensured for the main IC 900, it can be easily identified. Thereby, when inspecting the presence or absence of fraud with respect to the substrate 400, the main IC 900 can be quickly identified and confirmed. For this reason, the efficiency of the inspection work can be improved.

[0345] The main IC 900 is a ZIP in which IC terminals T are provided on one side (bottom surface) of the main body 910, the facing area between the main body 910 and the mounting surface of the substrate 400 is small, and the interval (interval between rows) of the IC terminals T arranged in two rows along the longitudinal direction of the main body 910 is also small. For this reason, it is difficult to provide a ground through hole in the portion (the area behind the main IC) facing the bottom surface of the main body 910 on the surface of the substrate 400, that is, between the two rows of IC terminals T (inside).

[0346] In the present embodiment, at least one ground through hole 960 (specific ground through hole) is provided at a predetermined position outside the IC terminal T in the vicinity of the arrangement position of the main IC 900, connecting the ground pattern region Y (the first ground pattern) on the mounting surface of the substrate 400 and the ground pattern region Z (the second ground pattern) on the back surface of the substrate 400 to strengthen the ground. The fact that the ground through hole 960 is provided in the vicinity of the arrangement position of the main IC 900 means that, for example, when the distance between the main IC 900 and the component arranged near the main IC 900 is defined as the first distance, the ground through hole 960 is provided at a position closer to the main IC 900 than the midpoint of the first distance (the midpoint of the first distance).

[0347] In this embodiment, as shown in FIG. 36, four ground through holes 960 are provided. The silk display 930 is formed to include each ground through hole 960 inside. In other words, the silk display 930 is formed to surround both the main IC 900 and the ground through holes 960 (four). When using the ZIP type main IC 900, since it is difficult to provide a ground through hole on the back of the main IC, the necessity (importance) of providing the ground through hole 960 near (around) the main IC 900 has increased. That is, the ground through hole 960 is a component with high importance from the perspective of ground strengthening.

[0348] By providing the silk display 930 so that the ground through hole 960 is included inside, it becomes clear that the ground through hole 960 is an important component related to the main IC 900. For example, in the design stage, etc., it is possible to suppress accidentally removing the ground through hole 960 or moving the position of the ground through hole 960 to a position far from the main IC 900.

[0349] The ZIP type main IC 900 is a component with a relatively large height from the mounting surface. Therefore, when an impact or the like is applied to the main body portion 910, the main body portion 910 is relatively likely to fall in the thickness direction (the left - right direction in FIG. 36). Here, the posture in which the short - side edge of the main body portion 910 is perpendicular to the mounting surface of the substrate 400 is taken as the reference position (tilt is 0 degrees). In this embodiment, even when the main IC 900 (main body portion 910) is tilted by about 10 to 15 degrees with respect to the reference position, when viewed from the direction orthogonal to the mounting surface, the main body portion 910 does not protrude outside the silk display 930. If, when viewed from the direction orthogonal to the mounting surface, the main body portion 910 protrudes outside the silk display 930, there is a possibility that it will be determined that the main IC 900 is not arranged in the normal position. In this embodiment, since the range (size) of the silk display 930 is set in consideration of the tilt of the main body portion 910, the possibility of such a determination can be reduced.

[0350] The DIP-type IC941 (Fig. 36) has a plurality of terminals extending along both sides (a pair of long sides) of the main body. The IC941 is soldered and joined to the substrate 400 with the plurality of terminals inserted into a plurality of through holes of the substrate 400. In other words, it is arranged on the substrate 400 in a state where each terminal and each through hole (wiring pattern connected to the through hole) are electrically connected.

[0351] Fig. 39(b) is a view of the location where a predetermined IC941 is mounted as seen from the back side (second surface side). For the IC941, the size (area) of the lands (pads) corresponding to the terminals at the four corners (through holes at the four corners) is larger than the size (area) of the lands corresponding to the terminals other than the four corners (through holes other than the four corners). In other words, the amount of solder (solder adhesion amount) at the locations where the terminals at the four corners are fixed is more than the amount of solder (solder adhesion amount) at the locations where the terminals other than the four corners are fixed. For example, the lands corresponding to the terminals at the four corners are substantially elliptical in shape, and the lands corresponding to the terminals other than the four corners are substantially circular in shape. Thereby, the bonding strength between the IC941 and the substrate 400 can be improved. In other words, the fixing of the IC941 to the substrate 400 can be made stronger. When the IC941 is, for example, a surface-mounted component, the lands may be read as pads.

[0352] A plurality of components are arranged on the substrate 400. In this embodiment, there is no component other than the IC941 in which the lands corresponding to the terminals at the four corners are formed relatively large. Therefore, by only looking at the back side (second surface side) of the substrate 400, the mounting position and the number of mounted IC941s can be specified. Also, when an IC of a type different from the IC941 (for example, the main IC900, etc.) is arranged on the substrate 400, the IC941 (a specific type of IC) can be specified by only looking at the second surface side of the substrate 400. Thereby, the efficiency of the inspection work can be improved.

[0353] On the mounting surface of the substrate 400, the distance (shortest distance) between the main IC 900 and a predetermined component 940 arranged closest to the main IC 900 is defined as the first distance. Also, for all predetermined components 940 other than the main IC 900, the distance (shortest distance) between a predetermined component 940 and a predetermined component 940 arranged closest to the said predetermined component 940 is defined as the second distance. In the present embodiment, the first distance is set to be larger (longer) than the second distance. Since the distance between the main IC 900 and the predetermined components 940 is relatively large (since it is arranged in an isolated state), it can be more easily identified.

[0354] Also, on the mounting surface of the substrate 400, the distance (shortest distance) between the main IC 900 and an IC (different from the main IC 900) arranged closest to the main IC 900 is defined as the first distance, and for ICs other than the main IC 900, the distance between the closest ICs is defined as the second distance. In this case, the first distance is set to be larger (longer) than the second distance.

[0355] The gaming machine of the present embodiment comprises a substrate (400) and a specific integrated circuit (900) arranged on the said substrate. The specific integrated circuit comprises a rectangular plate-shaped main body portion (910) and a plurality of terminals (T) extending from the main body portion. The substrate comprises a plurality of through-holes formed so as to be able to insert each of the plurality of terminals. The specific integrated circuit is arranged on the substrate with the plurality of terminals inserted into the plurality of through-holes. A ground pattern area (Y) surrounding the plurality of through-holes is formed on one surface of the substrate. All wiring patterns (920) connecting the specific integrated circuit and components arranged on the substrate are connected to the terminals on the other surface of the substrate at least at the portion (922a) on the specific integrated circuit side.

[0356] All the wiring patterns connecting the specific integrated circuit and the components arranged on the substrate are such that at least the part on the specific integrated circuit side is connected to the terminal on the other surface of the substrate, and on one surface of the substrate, a ground pattern region surrounding the plurality of through holes is formed. Therefore, the ground pattern region is a region formed without being separated by the wiring patterns. By providing such a ground pattern region, the noise resistance and heat dissipation of the specific integrated circuit can be improved.

[0357] Also, the gaming machine of the present embodiment When one of a pair of opposing side surfaces in the lateral direction of the main body part is taken as the bottom surface, the plurality of terminals extend from the bottom surface and are provided along the longitudinal direction of the main body part.

[0358] The specific integrated circuit is of a type in which the plurality of terminals extend from the bottom surface of the main body part and the plurality of terminals are provided along the longitudinal direction of the main body part. In this case, it is difficult to form a ground pattern region at a position (the back of the specific integrated circuit) on the substrate facing the bottom surface of the specific integrated circuit. In the present embodiment, the ground pattern region is a region formed without being separated by the wiring patterns. By providing such a ground pattern region, even if it is difficult to provide a ground pattern region on the back of the specific integrated circuit, the noise resistance and heat dissipation of the specific integrated circuit can be improved.

[0359] Also, the gaming machine of the present embodiment includes a substrate (400) and a plurality of components (900, 940) arranged on the first surface of the substrate, on the first surface of the substrate, indications (930, 950) indicating the mounting regions of the respective components are provided, among the plurality of components, there are a specific integrated circuit (900) and predetermined components (940) other than the specific integrated circuit, When the display corresponding to the specific integrated circuit is the first display (930) and the display corresponding to the predetermined component is the second display (950), When viewed from a direction orthogonal to the first surface of the substrate, the size of the first display with respect to the size of the specific integrated circuit is larger than the size of the second display with respect to the size of the predetermined component.

[0360] The size of the first display with respect to the size of the specific integrated circuit is larger than the size of the second display with respect to the size of the predetermined component. Therefore, the specific integrated circuit can be easily identified from among the plurality of components. Thereby, when inspecting the presence or absence of fraud with respect to the substrate, the specific integrated circuit can be quickly identified and confirmed. For this reason, the efficiency of the inspection work can be improved.

[0361] In addition, the gaming machine of the present embodiment The specific integrated circuit includes a rectangular plate-shaped main body portion (910) and a plurality of terminals (T) extending from the main body portion. When one of a pair of side surfaces facing each other in the short side direction of the main body portion is taken as the bottom surface, The plurality of terminals extend from the bottom surface and are provided along the longitudinal direction of the main body portion. The substrate includes a plurality of through holes formed so as to be able to insert each of the plurality of terminals. In the specific integrated circuit, the plurality of terminals are inserted into the plurality of through holes and are arranged on the substrate. The substrate includes a specific ground through hole (960) formed in the vicinity of the specific integrated circuit. The first display is formed so as to include the specific ground through hole inside.

[0362] The specific integrated circuit is of a type in which the plurality of terminals extend from the bottom surface of the main body portion, and the plurality of terminals are provided along the longitudinal direction of the main body portion. In this case, it is difficult to form a ground through hole at a position (the back of the specific integrated circuit) facing the bottom surface of the specific integrated circuit on the substrate. Therefore, in the present embodiment, the specific ground through hole is provided in the vicinity of the specific integrated circuit to strengthen the ground and improve the noise resistance of the specific integrated circuit. That is, the specif...

Claims

【Claim 1】 A region between an outer rail and an inner rail, comprising a guiding region for guiding a launched game ball to a game area, a ball return prevention mechanism for preventing the game ball from returning from the game area to the guiding region, a substrate, and a plurality of components arranged on a first surface of the substrate, wherein the ball return prevention mechanism has a displacement member displaceable between a first state, a second state, and a third state, the displacement member has a side surface portion facing the outer rail and a tip portion at the tip side of the side surface portion, a shortest distance from the tip portion to the outer rail is defined as a specific distance, a game ball guided from the guiding region to the game area is defined as one game ball, and a game ball attempting to return from the game area to the guiding region is defined as another game ball, the first state is a state where the specific distance is shorter than the second state, the second state is a state where the specific distance is longer than the first state, the third state is a state where the one game ball contacts the side surface portion, the outer rail, and the other game ball, and the other game ball contacts the tip portion, the outer rail, and the one game ball, such that the specific distance is longer than the first state and shorter than the second state, and shorter than a shortest distance from the lowest point of the other game ball to the outer rail, a display indicating a mounting region of each of the components is provided on the first surface of the substrate, the plurality of components include a specific integrated circuit and predetermined components other than the specific integrated circuit, when the display corresponding to the specific integrated circuit is defined as a first display and the display corresponding to the predetermined components is defined as a second display, when viewed from a direction orthogonal to the first surface of the substrate, a size of the first display with respect to a size of the specific integrated circuit is larger than a size of the second display with respect to a size of the predetermined components, the specific integrated circuit includes a substantially rectangular plate-shaped main body portion and a plurality of terminals extending from the main body portion, the plurality of terminals are provided along a longitudinal direction of the main body portion on one side surface of the main body portion, the substrate includes a plurality of through holes formed to allow insertion of each of the plurality of terminals, the specific integrated circuit is arranged on the substrate with the plurality of terminals inserted into the plurality of through holes, the substrate includes a specific ground through hole formed in the vicinity of the specific integrated circuit, and the first display is formed to include the specific ground through hole inside, a gaming machine.

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