Flux and Soldering Methods
A flux composition with rosin ester, glycol solvent, and organic hydrofluoric acid salt addresses the challenge of soldering enameled aluminum wire by melting the enamel and oxide film, achieving effective soldering without enamel stripping.
JP7745931B2Active Publication Date: 2025-09-30ISHIKAWA KINZOKU
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Patent Information
- Application Number
- JP2024502751
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-02-28
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2042-02-28
AI Technical Summary
Technical Problem
Existing fluxes fail to effectively wet solder to enameled aluminum wire without stripping the enamel, unlike enameled copper wire, due to insufficient solderability and inability to dissolve the enamel coating.
Method used
A flux composition comprising rosin ester, a glycol solvent with a phenyl group, and an organic hydrofluoric acid salt is used to melt the enamel and dissolve the oxide film on the aluminum conductor, allowing soldering without enamel stripping.
Benefits of technology
The flux enables successful soldering of enameled aluminum wire by wetting the solder to the enamel-coated aluminum wire without stripping the enamel, ensuring a reliable electrical connection.
✦ Generated by Eureka AI based on patent content.
Abstract
Hitherto, there has been no flux with which an enameled aluminum wire can be soldered to an adherend without removal of the enamel. The present invention provides a flux comprising a rosin ester, a rosin that is not the rosin ester, a solvent which is diethylene glycol monophenyl ether and / or propylene glycol monophenyl ether, and an organic salt of hydrofluoric acid (as an activator). The flux enables an enameled aluminum wire to be wetted with a solder and soldered to an adherend without necessitating removal of the enamel.
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