structural members
By controlling the planar surface shape of substrates with a slope of 0.0050 or less through Fourier transform, the protective films on structural members achieve enhanced particle resistance, addressing the issue of film deterioration and particle generation in semiconductor manufacturing.
Patent Information
- Application Number
- JP2025013266
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-03-28
- Filing Date
- 2025-01-29
- Publication Date
- 2025-10-01
- Estimated Expiration
- 2045-01-29
AI Technical Summary
Existing protective films on structural members in semiconductor manufacturing equipment deteriorate and generate large particles when exposed to plasma, leading to process disruptions, despite efforts to form dense, particle-resistant films that are thin and influenced by substrate surface shape.
Control the surface shape of the substrate using a new index in the planar direction, represented by the average slope of a Fourier transform of the surface shape, to ensure a slope of 0.0050 or less, even if the arithmetic mean roughness exceeds 0.15 μm, thereby enhancing particle resistance.
This approach results in a structural member with a protective film that exhibits excellent particle resistance, simplifying surface treatment and improving productivity while maintaining film integrity.