Gaming machine
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Filing Date
- 2023-08-22
- Publication Date
- 2026-04-28
AI Technical Summary
【0009】 本発明の遊技機においては、セキュリティの低下を抑制することができる。
Smart Images

Figure 0007852882000001 
Figure 0007852882000002 
Figure 0007852882000003
Abstract
Claims
[Claim 1] A gaming machine having multiple circuit boards on which multiple electronic components are mounted, A specific substrate having a solid ground plane, where almost the entire surface of the substrate on which multiple electronic components are mounted is covered with a resist film, The specific substrate has, Multiple test points used to inspect the electronic components to be installed, Signal wiring pattern and A wiring connection through-hole for electrically connecting a signal wiring pattern formed on the front surface of the specified substrate and a signal wiring pattern formed on the back surface of the specified substrate, A wiring connection land portion is formed to be located around the wiring connection through-hole and connected to the signal wiring pattern which has a constant pattern width, A specific test point among the aforementioned multiple test points is a specific land portion for testing, A thermal pattern formed to be located around the specific test land portion and to connect the specific test land portion with the solid ground of the specific substrate, The specified substrate has a specific through-hole that electrically connects the front solid ground formed on the front surface of the specified substrate and the back solid ground formed on the back surface of the specified substrate, Among the plurality of test points, the special test point has a special test land portion connected to the signal wiring pattern which is composed of a certain pattern width, The aforementioned wiring connection land portion and the aforementioned special test land portion have a non-solderable portion, at least a part of which is covered with the resist film and is therefore unsolderable. Furthermore, multiple specific test points are provided on the substrate surface on which the multiple electronic components are mounted. The diameter of each of the specified through-holes at the specified test point is all the same. Near the aforementioned special test land area, a marking section indicating a test point is provided, and the same type of marking section is also provided near the aforementioned specific test land area. A gaming machine characterized by the following features.
Citation Information
Patent Citations
Inspection point setting device and program
JP2015010925A
Game machine
JP2020044017A
Game machine
JP2022082248A