Heat medium supply device

Abstract

To provide a heat medium supply device capable of supplying a heat medium at a stable temperature while preventing a high load on a cooling device when the temperature of the heat medium returning from a semiconductor manufacturing device changes suddenly.SOLUTION: A heat medium supply device 1 includes: a cooling-side outlet pipe 17 that transfers a heat medium from a cooling-side tank 16 to a cooling device 8; a cooling-side bypass pipe 44 that extends from a cooling-side return pipe 26 to the cooling-side outlet pipe 17, bypassing the cooling-side tank 16; a cooling-side bypass valve 45 provided in the cooling-side bypass 44; and an operation control unit 35 that controls the operation of the cooling-side bypass valve 45. The operation control unit 35 is configured to open the cooling-side bypass valve 45 when a temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is within a preset allowable low temperature range, and to close the cooling-side bypass valve 45 when the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is outside the allowable low temperature range.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a heat medium supply device that supplies a heat medium for adjusting the temperature of a semiconductor manufacturing device such as an etching device, a CVD device, or a PVD device to the semiconductor manufacturing device.

Background Art

[0002] A semiconductor manufacturing device (for example, an etching device, a CVD device, or a PVD device) for manufacturing a semiconductor device is configured to execute a manufacturing process while controlling the processing temperature. For example, in an etching device, the processing temperature of a wafer is adjusted by flowing a liquid as a temperature-controlled heat medium through a flow path formed in a susceptor that supports the wafer.

[0003] FIG. 5 is a schematic diagram showing a conventional example of a heat medium supply device that supplies a heat medium to a semiconductor manufacturing device. The heat medium supply device 500 includes a heating device 501 that heats the heat medium and a cooling device 502 that cools the heat medium. The heat medium is stored in a heating-side tank 504 and a cooling-side tank 505. The heat medium heated by the heating device 501 is transferred to the heating-side tank 504 and further transferred from the heating-side tank 504 into the heat medium mixing device 507. On the other hand, the heat medium stored in the cooling-side tank 505 is transferred to the cooling device 502 and cooled by the cooling device 502. The cooled heat medium is transferred to the heat medium mixing device 507.

[0004] The heated heat medium and the cooled heat medium are mixed in the heat medium mixing device 507 and adjusted to the temperature required for the semiconductor manufacturing device 510. The heat medium with the adjusted temperature is sent to the semiconductor manufacturing device 510, whereby the semiconductor manufacturing device 510 is maintained at the target temperature. The heat medium that has passed through the semiconductor manufacturing device 510 is returned to the heat medium mixing device 507, branched by the heat medium mixing device 507, and transferred to the heating-side tank 504 and the cooling-side tank 505. In this way, the heat medium circulates between the heat medium supply device 500 and the semiconductor manufacturing device 510.

Prior Art Documents

[0005] [Patent Document 1] Japanese Patent Publication No. 2023-98068 [Overview of the project] [Problems that the invention aims to solve]

[0006] The target temperature for wafer processing in the semiconductor manufacturing apparatus 510 can fluctuate significantly during wafer processing. Such fluctuations in the target temperature can cause abrupt changes in the temperature of the heat transfer medium returning from the semiconductor manufacturing apparatus 510 to the heating tank 504 and cooling tank 505 via the heat transfer medium mixer 507. As a result, a high load is temporarily placed on the heating device 501 and cooling device 502, and it can take time for the temperature of the heat transfer medium supplied to the heat transfer medium mixer 507 to stabilize.

[0007] Therefore, the present invention provides a heat medium supply device that can prevent high load on the cooling device and supply a heat medium at a stable temperature when the temperature of the heat medium returning from semiconductor manufacturing equipment changes suddenly. Furthermore, the present invention provides a heat medium supply device that can prevent high load on the heating device and supply a heat medium at a stable temperature when the temperature of the heat medium returning from semiconductor manufacturing equipment changes suddenly. [Means for solving the problem]

[0008] In one embodiment, a heat transfer medium supply device for supplying a heat transfer medium to regulate the temperature of a semiconductor manufacturing apparatus comprises a heating device for heating the heat transfer medium, a cooling device for cooling the heat transfer medium, a heating medium transfer pipe for sending the heated heat transfer medium to the semiconductor manufacturing apparatus, a cooling medium transfer pipe for sending the cooled heat transfer medium to the semiconductor manufacturing apparatus, a heating side tank and a cooling side tank for holding the heat transfer medium, a heating side return pipe for returning the heat transfer medium that has passed through the semiconductor manufacturing apparatus to the heating side tank, a cooling side temperature measuring device provided in the cooling side return pipe for measuring the temperature of the heat transfer medium in the cooling side return pipe, and a cooling side temperature measuring device provided in the cooling side tank for measuring the temperature of the heat transfer medium in the cooling side return pipe. A heat transfer medium supply device is provided, comprising: a cooling-side outlet pipe for transferring the heat transfer medium to the cooling device; a cooling-side bypass pipe extending from the cooling-side return pipe, bypassing the cooling-side tank, to the cooling-side outlet pipe; a cooling-side bypass valve provided in the cooling-side bypass pipe; and an operation control unit for controlling the operation of the cooling-side bypass valve, wherein the operation control unit is configured to open the cooling-side bypass valve when the temperature of the heat transfer medium in the cooling-side return pipe, as measured by the cooling-side temperature measuring instrument, is within a preset allowable low temperature range, and to close the cooling-side bypass valve when the temperature of the heat transfer medium in the cooling-side return pipe, as measured by the cooling-side temperature measuring instrument, is outside the allowable low temperature range.

[0009] When the temperature of the heat transfer medium in the cooling-side return pipe is outside the permissible low-temperature range, the cooling-side bypass valve is closed, and the heat transfer medium in the cooling-side return pipe is transferred to the cooling-side tank. More specifically, when the temperature of the heat transfer medium in the cooling-side return pipe is lower than the lower limit of the permissible low-temperature range, the low-temperature heat transfer medium flows into the cooling-side tank and is stored there. During the operation of the semiconductor manufacturing equipment, relatively high-temperature heat transfer medium may temporarily return through the cooling-side return pipe. When the temperature of the heat transfer medium in the cooling-side return pipe is higher than the upper limit of the permissible low-temperature range, the high-temperature heat transfer medium flows into the cooling-side tank. Since low-temperature heat transfer medium is already present in the cooling-side tank, the high-temperature heat transfer medium mixes with the low-temperature heat transfer medium, and the heat transfer medium that is hotter than the upper limit of the permissible low-temperature range that has flowed into the cooling-side tank is cooled. As a result, the temperature of the heat transfer medium flowing from the cooling-side tank through the cooling-side outlet pipe to the cooling device becomes lower than the temperature of the heat transfer medium in the cooling-side return pipe, and the load on the cooling device can be reduced compared to when the high-temperature heat transfer medium is supplied directly to the cooling device. When the temperature of the heat transfer medium in the cooling return pipe is within the permissible low-temperature range, the load on the cooling system is not significant. In this way, the cooling bypass valve operates based on whether or not the temperature of the heat transfer medium in the cooling return pipe is within the permissible low-temperature range, thereby stabilizing the load on the cooling system.

[0010] In one embodiment, the heat transfer medium supply device further comprises a heating-side temperature measuring instrument provided in the heating-side return pipe for measuring the temperature of the heat transfer medium in the heating-side return pipe, a heating-side outlet pipe for transferring the heat transfer medium from the heating-side tank to the heating device, a heating-side bypass pipe extending from the heating-side return pipe, bypassing the heating-side tank, to the heating-side outlet pipe, and a heating-side bypass valve provided in the heating-side bypass pipe, wherein the operation control unit is configured to open the heating-side bypass valve when the temperature of the heat transfer medium in the heating-side return pipe, as measured by the heating-side temperature measuring instrument, is within a preset allowable high-temperature range, and to close the heating-side bypass valve when the temperature of the heat transfer medium in the heating-side return pipe, as measured by the heating-side temperature measuring instrument, is outside the allowable high-temperature range.

[0011] When the temperature of the heat transfer medium in the heating-side return pipe is outside the allowable high-temperature range, the heating-side bypass valve is closed, and the heat transfer medium in the heating-side return pipe is transferred to the heating-side tank. More specifically, when the temperature of the heat transfer medium in the heating-side return pipe is higher than the upper limit of the allowable high-temperature range, the high-temperature heat transfer medium flows into the heating-side tank and is stored there. When the temperature of the heat transfer medium in the heating-side return pipe is lower than the lower limit of the allowable high-temperature range, the low-temperature heat transfer medium also flows into the heating-side tank. The low-temperature heat transfer medium is mixed with the heat transfer medium in the heating-side tank, and the heat transfer medium that is lower than the lower limit of the allowable high-temperature range that has flowed into the heating-side tank is heated. As a result, the temperature of the heat transfer medium flowing from the heating-side tank through the heating-side outlet pipe to the heating device becomes higher than the temperature of the heat transfer medium in the heating-side return pipe, and the load on the heating device can be reduced compared to when the low-temperature heat transfer medium is supplied directly to the heating device. When the temperature of the heat transfer medium in the heating-side return pipe is within the allowable high-temperature range, the load on the heating device is not significant. In this way, the heating-side bypass valve operates based on whether or not the temperature of the heat transfer medium in the heating-side return pipe is within the allowable high-temperature range, thereby stabilizing the load on the heating device.

[0012] In one embodiment, the semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing apparatuses.

[0013] In one embodiment, a heat transfer medium supply device for supplying a heat transfer medium to regulate the temperature of a semiconductor manufacturing apparatus comprises: a heating device for heating the heat transfer medium; a cooling device for cooling the heat transfer medium; a heating medium transfer pipe for sending the heated heat transfer medium to the semiconductor manufacturing apparatus; a cooling medium transfer pipe for sending the cooled heat transfer medium to the semiconductor manufacturing apparatus; a heating side tank and a cooling side tank for holding the heat transfer medium; a heating side return pipe for returning the heat transfer medium that has passed through the semiconductor manufacturing apparatus to the heating side tank; a heating side temperature measuring device provided in the heating side return pipe for measuring the temperature of the heat transfer medium in the heating side return pipe; and a heating side temperature measuring device provided in the heating side return pipe for measuring the temperature of the heat transfer medium in the heating side return pipe. A heat transfer medium supply device is provided, comprising: a heating-side outlet pipe for transferring the heat transfer medium to the heating device; a heating-side bypass pipe extending from the heating-side return pipe, bypassing the heating-side tank, to the heating-side outlet pipe; a heating-side bypass valve provided in the heating-side bypass pipe; and an operation control unit for controlling the operation of the cooling-side bypass valve, wherein the operation control unit is configured to open the heating-side bypass valve when the temperature of the heat transfer medium in the heating-side return pipe, as measured by the heating-side temperature measuring instrument, is within a preset allowable high-temperature range, and to close the heating-side bypass valve when the temperature of the heat transfer medium in the heating-side return pipe, as measured by the heating-side temperature measuring instrument, is outside the allowable high-temperature range.

[0014] When the temperature of the heat transfer medium in the heating-side return pipe is outside the allowable high-temperature range, the heating-side bypass valve is closed, and the heat transfer medium in the heating-side return pipe is transferred to the heating-side tank. More specifically, when the temperature of the heat transfer medium in the heating-side return pipe is higher than the upper limit of the allowable high-temperature range, the high-temperature heat transfer medium flows into the heating-side tank and is stored there. When the temperature of the heat transfer medium in the heating-side return pipe is lower than the lower limit of the allowable high-temperature range, the low-temperature heat transfer medium also flows into the heating-side tank. The low-temperature heat transfer medium is mixed with the heat transfer medium in the heating-side tank, and the heat transfer medium that is lower than the lower limit of the allowable high-temperature range that has flowed into the heating-side tank is heated. As a result, the temperature of the heat transfer medium flowing from the heating-side tank through the heating-side outlet pipe to the heating device becomes higher than the temperature of the heat transfer medium in the heating-side return pipe, and the load on the heating device can be reduced compared to when the low-temperature heat transfer medium is supplied directly to the heating device. When the temperature of the heat transfer medium in the heating-side return pipe is within the allowable high-temperature range, the load on the heating device is not significant. In this way, the heating-side bypass valve operates based on whether or not the temperature of the heat transfer medium in the heating-side return pipe is within the allowable high-temperature range, thereby stabilizing the load on the heating device.

[0015] In one embodiment, the heat transfer medium supply device further comprises a cooling-side temperature measuring instrument provided in the cooling-side return pipe for measuring the temperature of the heat transfer medium in the cooling-side return pipe, a cooling-side outlet pipe for transferring the heat transfer medium from the cooling-side tank to the cooling device, a cooling-side bypass pipe extending from the cooling-side return pipe, bypassing the cooling-side tank, to the cooling-side outlet pipe, and a cooling-side bypass valve provided in the cooling-side bypass pipe, wherein the operation control unit is configured to open the cooling-side bypass valve when the temperature of the heat transfer medium in the cooling-side return pipe, as measured by the cooling-side temperature measuring instrument, is within a preset allowable low-temperature range, and to close the cooling-side bypass valve when the temperature of the heat transfer medium in the cooling-side return pipe, as measured by the cooling-side temperature measuring instrument, is outside the allowable low-temperature range.

[0016] When the temperature of the heat transfer medium in the cooling-side return pipe is outside the permissible low-temperature range, the cooling-side bypass valve is closed, and the heat transfer medium in the cooling-side return pipe is transferred to the cooling-side tank. More specifically, when the temperature of the heat transfer medium in the cooling-side return pipe is lower than the lower limit of the permissible low-temperature range, the low-temperature heat transfer medium flows into the cooling-side tank and is stored there. During the operation of the semiconductor manufacturing equipment, relatively high-temperature heat transfer medium may temporarily return through the cooling-side return pipe. When the temperature of the heat transfer medium in the cooling-side return pipe is higher than the upper limit of the permissible low-temperature range, the high-temperature heat transfer medium flows into the cooling-side tank. Since low-temperature heat transfer medium is already present in the cooling-side tank, the high-temperature heat transfer medium mixes with the low-temperature heat transfer medium, and the heat transfer medium that is hotter than the upper limit of the permissible low-temperature range that has flowed into the cooling-side tank is cooled. As a result, the temperature of the heat transfer medium flowing from the cooling-side tank through the cooling-side outlet pipe to the cooling device becomes lower than the temperature of the heat transfer medium in the cooling-side return pipe, and the load on the cooling device can be reduced compared to when the high-temperature heat transfer medium is supplied directly to the cooling device. When the temperature of the heat transfer medium in the cooling return pipe is within the permissible low-temperature range, the load on the cooling system is not significant. In this way, the cooling bypass valve operates based on whether or not the temperature of the heat transfer medium in the cooling return pipe is within the permissible low-temperature range, thereby stabilizing the load on the cooling system.

[0017] In one embodiment, the semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing apparatuses. [Effects of the Invention]

[0018] According to one embodiment of the present invention, the cooling-side bypass valve operates based on whether or not the temperature of the heat transfer medium in the cooling-side return pipe is within an acceptable low-temperature range, thereby stabilizing the load on the cooling device. According to one embodiment of the present invention, the heating side bypass valve operates based on whether or not the temperature of the heat transfer medium in the heating side return pipe is within an allowable high-temperature range, thereby stabilizing the load on the heating device. [Brief explanation of the drawing]

[0019] [Figure 1] This is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supply device and a semiconductor manufacturing device. [Figure 2] This is a schematic diagram showing another embodiment of the heat medium supply device. [Figure 3] This is a schematic diagram showing still another embodiment of the heat medium supply device. [Figure 4] This is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supply device and a plurality of semiconductor manufacturing devices. [Figure 5] This is a schematic diagram showing a conventional example of the heat medium supply device.

Embodiments for Carrying Out the Invention

[0020] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supply device 1 and a semiconductor manufacturing device 2. The heat medium supply device 1 is configured to supply a heat medium for adjusting the temperature of the semiconductor manufacturing device 2 (for example, an etching device, a CVD device, a PVD device, etc.) to the semiconductor manufacturing device 2.

[0021] As shown in FIG. 1, the semiconductor manufacturing system includes a heat medium supply device 1, a heat medium mixing device 5 connected to the heat medium supply device 1, and a semiconductor manufacturing device 2 connected to the heat medium mixing device 5. The heat medium supply device 1 is connected to the semiconductor manufacturing device 2 via the heat medium mixing device 5. In the embodiment shown in FIG. 1, an etching device that performs a dry etching process on a wafer is used as the semiconductor manufacturing device 2, but the semiconductor manufacturing device 2 is not limited to this embodiment.

[0022] The heat transfer medium supply device 1 comprises a heating device 7 for heating the heat transfer medium, a cooling device 8 for cooling the heat transfer medium, a heating medium transfer pipe 11 for sending the heated heat transfer medium to the semiconductor manufacturing apparatus 2, a cooling medium transfer pipe 12 for sending the cooled heat transfer medium to the semiconductor manufacturing apparatus 2, and a heating-side tank 15 and a cooling-side tank 16 for holding the heat transfer medium. The heat transfer medium supply device 1 has an insulating material 18 that covers the entire outer surface of the heating-side tank 15 and an insulating material 19 that covers the entire outer surface of the cooling-side tank 16. The insulating materials 18 and 19 are configured to maintain the temperature of the heat transfer medium held in the heating-side tank 15 and the cooling-side tank 16.

[0023] The heating medium transfer pipe 11 extends from the heating side tank 15 to the heat medium mixing device 5, and the cooling medium transfer pipe 12 extends from the cooling device 8 to the heat medium mixing device 5. The heat medium supply device 1 further includes a cooling side outlet pipe 17 that transfers the heat medium from the cooling side tank 16 to the cooling device 8. The cooling side outlet pipe 17 extends from the cooling side tank 16 to the cooling device 8. The cooling side outlet pipe 17 is located upstream of the cooling medium transfer pipe 12.

[0024] The heating medium transfer pipe 11 and the cooling medium transfer pipe 12 are connected to the heat medium mixing device 5, and communicate with the semiconductor manufacturing apparatus 2 via the heat medium mixing device 5. The heat medium mixing device 5 is equipped with a plurality of flow control valves (not shown) that communicate with the heating medium transfer pipe 11 and the cooling medium transfer pipe 12, respectively. The heat medium mixing device 5 is configured to adjust the temperature to the temperature required by the semiconductor manufacturing apparatus 2 by mixing the heated heat medium and the cooled heat medium while adjusting the flow rate of the heated heat medium and the flow rate of the cooled heat medium.

[0025] In one embodiment, a fluorine-based inert liquid is used as the heat transfer medium. An example of the heating device 7 is an electric heater. An example of the cooling device 8 is a vapor compression refrigerator, an absorption refrigerator, etc. Vapor compression refrigerators include turbo refrigerators, screw refrigerators, rotary refrigerators, scroll refrigerators, etc., and these can be used. The configuration of the heating device 7 and the cooling device 8 is not particularly limited as long as they can heat and cool the heat transfer medium.

[0026] The heat transfer medium supply device 1 further includes a tank communication pipe 20 connecting the heating side tank 15 and the cooling side tank 16, a communication valve 21 provided in the tank communication pipe 20, a heating side return pipe 25 that returns the heat transfer medium that has passed through the semiconductor manufacturing apparatus 2 to the heating side tank 15, and a cooling side return pipe 26 that returns the heat transfer medium that has passed through the semiconductor manufacturing apparatus 2 to the cooling side tank 16. The heating side return pipe 25 extends from the heat transfer medium mixing device 5 to the heating side tank 15. The cooling side return pipe 26 extends from the heat transfer medium mixing device 5 to the cooling side tank 16.

[0027] The heating device 7 is installed in the heating-side return pipe 25 and is configured to heat the heat transfer medium flowing through the heating-side return pipe 25. The heating device 7 is located upstream of the heating-side tank 15. The heat transfer medium heated by the heating device 7 is transferred to the heating-side tank 15 through the heating-side return pipe 25 and stored in the heating-side tank 15. The heat transfer medium supply device 1 includes a heating-side liquid level detection device 31 that detects the liquid level of the heat transfer medium in the heating-side tank 15 and a cooling-side liquid level detection device 32 that detects the liquid level of the heat transfer medium in the cooling-side tank 16.

[0028] The heat transfer medium supply device 1 is equipped with a heating-side pump 33 connected to a heating medium transfer pipe 11. When the heating-side pump 33 is operated, the heat transfer medium (heated heat transfer medium) in the heating-side tank 15 is sent to the heat transfer medium mixer 5 through the heating medium transfer pipe 11, and then sent from the heat transfer medium mixer 5 to the semiconductor manufacturing apparatus 2.

[0029] The cooling device 8 is located downstream of the cooling tank 16. More specifically, the cooling device 8 is connected to the cooling medium transfer pipe 12 and the cooling outlet pipe 17. The heat transfer medium supply device 1 includes a cooling pump 34 connected to the cooling outlet pipe 17. When the cooling pump 34 is operated, the heat transfer medium is sent from the cooling tank 16 to the cooling device 8 through the cooling outlet pipe 17 and cooled by the cooling device 8. The cooled heat transfer medium is sent to the heat transfer medium mixer 5 through the cooling medium transfer pipe 12, and then from the heat transfer medium mixer 5 to the semiconductor manufacturing apparatus 2.

[0030] The heated heat transfer medium and the cooled heat transfer medium are mixed by the heat transfer medium mixing device 5 to produce a heat transfer medium with a preset temperature. The heat transfer medium at the preset temperature is transferred from the heat transfer medium mixing device 5 to the semiconductor manufacturing apparatus 2, and as it passes through the semiconductor manufacturing apparatus 2, it heats or cools the wafers (not shown) inside the semiconductor manufacturing apparatus 2. The heat transfer medium that has passed through the semiconductor manufacturing apparatus 2 is returned to the heat transfer medium mixing device 5 and splits into two flows. One of the two flows into the heating-side return pipe 25, and the other flows into the cooling-side return pipe 26. The heat transfer medium that flows into the heating-side return pipe 25 is heated by the heating device 7 and then flows into the heating-side tank 15. The heat transfer medium that flows into the cooling-side return pipe 26 flows through the cooling-side return pipe 26 and into the cooling-side tank 16 or the cooling-side outlet pipe 17.

[0031] As the heat transfer medium circulates between the heat transfer medium supply device 1 and the semiconductor manufacturing apparatus 2, a difference arises between the liquid level of the heat transfer medium in the heating tank 15 and the liquid level of the heat transfer medium in the cooling tank 16. The heat transfer medium supply device 1 in this embodiment is configured to open a communication valve 21 provided in the tank communication pipe 20 when the difference between the liquid level of the heat transfer medium in the heating tank 15 and the liquid level of the heat transfer medium in the cooling tank 16 exceeds a threshold.

[0032] The heat transfer medium supply device 1 includes an operation control unit 35 that controls the operation of the communication valve 21. The operation control unit 35 includes at least one computer. The operation control unit 35 includes a storage device 35a that stores programs and the like, and an arithmetic unit 35b that performs calculations according to the instructions contained in the program. The storage device 35a includes a main memory such as random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or solid state drive (SSD). Examples of arithmetic unit 35b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 35 is not limited to these examples.

[0033] The heat transfer medium supply device 1 includes a cooling-side temperature measuring instrument 41 installed in the cooling-side return pipe 26, a cooling-side bypass pipe 44 extending from the cooling-side return pipe 26 to the cooling-side outlet pipe 17, bypassing the cooling-side tank 16, and a cooling-side bypass valve 45 installed in the cooling-side bypass pipe 44. One end of the cooling-side bypass pipe 44 is connected to the cooling-side return pipe 26, and the other end of the cooling-side bypass pipe 44 is connected to the cooling-side outlet pipe 17. The connection point B1 between the cooling-side bypass pipe 44 and the cooling-side outlet pipe 17 is located upstream of the cooling-side pump 34. When the cooling-side bypass valve 45 is closed, the heat transfer medium flows into the cooling-side tank 16 through the cooling-side return pipe 26. When the cooling-side bypass valve 45 is opened, most of the heat transfer medium flowing through the cooling-side return pipe 26 flows into the cooling-side bypass pipe 44. The cooling-side bypass valve 45 is an actuator-driven valve, such as an electric valve.

[0034] The cooling-side temperature sensor 41 is configured to measure the temperature of the heat transfer medium in the cooling-side return pipe 26. The cooling-side temperature sensor 41 is electrically connected to the operation control unit 35, and the measured temperature of the heat transfer medium in the cooling-side return pipe 26 is sent to the operation control unit 35. The cooling-side bypass valve 45 is electrically connected to the operation control unit 35, and the operation of the cooling-side bypass valve 45 is controlled by the operation control unit 35.

[0035] The operation control unit 35 is configured to open the cooling-side bypass valve 45 when the temperature of the heat transfer medium in the cooling-side return pipe 26, as measured by the cooling-side temperature measuring device 41, is within a preset allowable low-temperature range, and to close the cooling-side bypass valve 45 when the temperature of the heat transfer medium in the cooling-side return pipe 26, as measured by the cooling-side temperature measuring device 41, is outside the allowable low-temperature range.

[0036] In one embodiment, the lower limit of the allowable low temperature range is less than or equal to the minimum operating refrigeration capacity of the cooling device 8, and the upper limit of the allowable low temperature range is greater than or equal to the rated refrigeration capacity of the cooling device 8. The minimum operating refrigeration capacity of the cooling device 8 is 10% to 20% of the rated refrigeration capacity of the cooling device 8. When the load is below this minimum operating refrigeration capacity (light load), the cooling device 8 cannot maintain the target temperature (i.e., the load temperature will be lower than the target temperature). Also, for loads exceeding the rated refrigeration capacity of the cooling device 8, the cooling device 8 cannot cool sufficiently and cannot maintain the target temperature (i.e., the load temperature will be higher than the target temperature). From this perspective, in one embodiment, the lower limit of the allowable low temperature range is less than or equal to the minimum operating refrigeration capacity of the cooling device 8, and the upper limit of the allowable low temperature range is greater than or equal to the rated refrigeration capacity of the cooling device 8.

[0037] When the temperature of the heat transfer medium in the cooling-side return pipe 26 is outside the allowable low temperature range, the cooling-side bypass valve 45 is closed, and the heat transfer medium in the cooling-side return pipe 26 is transferred to the cooling-side tank 16. More specifically, when the temperature of the heat transfer medium in the cooling-side return pipe 26 is lower than the lower limit of the allowable low temperature range, the low-temperature heat transfer medium flows into the cooling-side tank 16 and is stored in the cooling-side tank 16.

[0038] During the operation of the semiconductor manufacturing apparatus 2, a relatively high-temperature heat transfer medium may temporarily return through the cooling-side return pipe 26. When the temperature of the heat transfer medium in the cooling-side return pipe 26 is higher than the upper limit of the allowable low-temperature range, the high-temperature heat transfer medium flows into the cooling-side tank 16. Since a low-temperature heat transfer medium is already present in the cooling-side tank 16, the high-temperature heat transfer medium mixes with the low-temperature heat transfer medium, and the heat transfer medium that is hotter than the upper limit of the allowable low-temperature range that has flowed into the cooling-side tank 16 is cooled. As a result, the temperature of the heat transfer medium flowing from the cooling-side tank 16 through the cooling-side outlet pipe 17 to the cooling device 8 becomes lower than the temperature of the heat transfer medium in the cooling-side return pipe 26, and the load on the cooling device 8 can be reduced compared to when the high-temperature heat transfer medium is supplied directly to the cooling device 8.

[0039] When the temperature of the heat transfer medium in the cooling-side return pipe 26 is within the allowable low-temperature range, the load on the cooling device 8 is not large. Therefore, the cooling-side bypass valve 45 is opened, and most of the heat transfer medium flowing through the cooling-side return pipe 26 flows to the cooling-side outlet pipe 17, with almost no flow into the cooling-side tank 16. While the cooling-side bypass valve 45 is open, the cooling-side tank 16 is thermally isolated. Normally, the temperature inside the cooling-side tank 16 is significantly different from the ambient temperature around the cooling-side tank 16. Since the entire outer surface of the cooling-side tank 16 is covered with insulation material 19, the temperature inside the cooling-side tank 16 can be maintained even when the cooling-side tank 16 is thermally isolated.

[0040] As described above, the cooling-side bypass valve 45 operates based on whether or not the temperature of the heat transfer medium in the cooling-side return pipe 26 is within the permissible low-temperature range, thereby stabilizing the load on the cooling device 8.

[0041] In one embodiment, a first lower limit and a second lower limit lower than the first lower limit may be set as the lower limits of the allowable low temperature range. The operation control unit 35 may gradually (for example, stepwise or steplessly) close the cooling-side bypass valve 45 as the temperature of the heat transfer medium in the cooling-side return pipe 26 decreases from the first lower limit to the second lower limit. That is, when the temperature of the heat transfer medium in the cooling-side return pipe 26 decreases to the first lower limit, the operation control unit 35 begins to close the cooling-side bypass valve 45, sending a portion of the heat transfer medium flowing through the cooling-side return pipe 26 to the cooling-side tank 16. Then, when the temperature of the heat transfer medium in the cooling-side return pipe 26 decreases further to the second lower limit, the operation control unit 35 completely closes the cooling-side bypass valve 45. As a result, all of the heat transfer medium flowing through the cooling-side return pipe 26 flows into the cooling-side tank 16.

[0042] Figure 2 is a schematic diagram showing another embodiment of the heat transfer medium supply device 1. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to Figure 1, so redundant explanations are omitted. The heat transfer medium supply device 1 of the embodiment shown in Figure 2 is equipped with a heating-side bypass pipe 54 and a heating-side bypass valve 55 instead of a cooling-side bypass pipe 44 and a cooling-side bypass valve 45.

[0043] The cooling medium transfer pipe 12 extends from the cooling side tank 16 to the heat medium mixing device 5. The cooling device 8 is attached to the cooling medium transfer pipe 12 and is configured to cool the heat medium flowing through the cooling medium transfer pipe 12. The heating medium transfer pipe 11 extends from the heating device 7 to the heat medium mixing device 5. The heat medium supply device 1 further includes a heating side outlet pipe 57 that transfers the heat medium from the heating side tank 15 to the heating device 7. The heating side outlet pipe 57 extends from the heating side tank 15 to the heating device 7. The heating side outlet pipe 57 is located upstream of the heating medium transfer pipe 11.

[0044] The heating device 7 is located downstream of the heating tank 15. More specifically, the heating device 7 is connected to the heating medium transfer pipe 11 and the heating outlet pipe 57. The heat medium supply device 1 includes a heating pump 33 connected to the heating outlet pipe 57. When the heating pump 33 is operated, the heat medium is sent from the heating tank 15 through the heating outlet pipe 57 to the heating device 7 and heated by the heating device 7. The heated heat medium is sent to the heat medium mixer 5 through the heating medium transfer pipe 11, and then from the heat medium mixer 5 to the semiconductor manufacturing apparatus 2.

[0045] The heated heat transfer medium and the cooled heat transfer medium are mixed by the heat transfer medium mixer 5 to produce a heat transfer medium with a preset temperature. The heat transfer medium at the preset temperature is transferred from the heat transfer medium mixer 5 to the semiconductor manufacturing apparatus 2, and as it passes through the semiconductor manufacturing apparatus 2, it heats or cools the wafers (not shown) inside the semiconductor manufacturing apparatus 2. The heat transfer medium that has passed through the semiconductor manufacturing apparatus 2 is returned to the heat transfer medium mixer 5 and splits into two flows. One of the two flows into the cooling-side return pipe 26, and the other flows into the heating-side return pipe 25. The heat transfer medium that flows into the cooling-side return pipe 26 flows into the cooling-side tank 16. The heat transfer medium that flows into the heating-side return pipe 25 flows through the heating-side return pipe 25 and flows into the heating-side tank 15 or the heating-side outlet pipe 57.

[0046] The heat transfer medium supply device 1 includes a heating-side temperature measuring instrument 51 installed in the heating-side return pipe 25, a heating-side bypass pipe 54 extending from the heating-side return pipe 25 to the heating-side outlet pipe 57, bypassing the heating-side tank 15, and a heating-side bypass valve 55 installed in the heating-side bypass pipe 54. One end of the heating-side bypass pipe 54 is connected to the heating-side return pipe 25, and the other end of the heating-side bypass pipe 54 is connected to the heating-side outlet pipe 57. The connection point B2 between the heating-side bypass pipe 54 and the heating-side outlet pipe 57 is located upstream of the heating-side pump 33. When the heating-side bypass valve 55 is closed, the heat transfer medium flows into the heating-side tank 15 through the heating-side return pipe 25. When the heating-side bypass valve 55 is opened, most of the heat transfer medium flowing through the heating-side return pipe 25 flows into the heating-side bypass pipe 54. The heating-side bypass valve 55 is an actuator-driven valve, such as an electric valve.

[0047] The heating-side temperature measuring device 51 is configured to measure the temperature of the heat transfer medium in the heating-side return pipe 25. The heating-side temperature measuring device 51 is electrically connected to the operation control unit 35, and the measured temperature of the heat transfer medium in the heating-side return pipe 25 is sent to the operation control unit 35. The heating-side bypass valve 55 is electrically connected to the operation control unit 35, and the operation of the heating-side bypass valve 55 is controlled by the operation control unit 35.

[0048] The operation control unit 35 is configured to open the heating-side bypass valve 55 when the temperature of the heat transfer medium in the heating-side return pipe, as measured by the heating-side temperature measuring device 51, is within a preset allowable high-temperature range, and to close the heating-side bypass valve 55 when the temperature of the heat transfer medium in the heating-side return pipe 25, as measured by the heating-side temperature measuring device 51, is outside the allowable high-temperature range.

[0049] In one embodiment, the upper limit of the allowable high temperature range is less than or equal to the minimum operating heating capacity of the heating device 7, and the lower limit of the allowable high temperature range is greater than or equal to the rated heating capacity of the heating device 7. The minimum operating heating capacity of the heating device 7 is 10% to 20% of the rated heating capacity of the heating device 7. When the load is below this minimum operating heating capacity (light load), the heating device 7 cannot secure the target temperature (i.e., the load temperature is higher than the target temperature). Also, for loads exceeding the rated heating capacity of the heating device 7, the heating device 7 cannot heat sufficiently and cannot secure the target temperature (i.e., the load temperature is lower than the target temperature). From this perspective, in one embodiment, the upper limit of the allowable high temperature range is less than or equal to the minimum operating heating capacity of the heating device 7, and the lower limit of the allowable high temperature range is greater than or equal to the rated heating capacity of the heating device 7.

[0050] When the temperature of the heat transfer medium in the heating-side return pipe 25 is outside the allowable high-temperature range, the heating-side bypass valve 55 is closed, and the heat transfer medium in the heating-side return pipe 25 is transferred to the heating-side tank 15. More specifically, when the temperature of the heat transfer medium in the heating-side return pipe 25 is higher than the upper limit of the allowable high-temperature range, the high-temperature heat transfer medium flows into the heating-side tank 15 and is stored in the heating-side tank 15.

[0051] Even when the temperature of the heat transfer medium in the heating-side return pipe 25 is lower than the lower limit of the allowable high-temperature range, the low-temperature heat transfer medium flows into the heating-side tank 15. Since high-temperature heat transfer medium is already present in the heating-side tank 15, the low-temperature heat transfer medium mixes with the heat transfer medium in the heating-side tank 15, and the heat transfer medium that flows into the heating-side tank 15 and is lower than the lower limit of the allowable high-temperature range is heated. As a result, the temperature of the heat transfer medium flowing from the heating-side tank 15 through the heating-side outlet pipe 57 to the heating device 7 becomes higher than the temperature of the heat transfer medium in the heating-side return pipe 25, and the load on the heating device 7 can be reduced compared to when the low-temperature heat transfer medium is supplied directly to the heating device 7.

[0052] When the temperature of the heat transfer medium in the heating-side return pipe 25 is within the allowable high-temperature range, the load on the heating device 7 is not large. Therefore, the heating-side bypass valve 55 is opened, and most of the heat transfer medium flowing through the heating-side return pipe 25 flows to the heating-side outlet pipe 57, with almost no flow into the heating-side tank 15. While the heating-side bypass valve 55 is open, the heating-side tank 15 is thermally isolated. Normally, the temperature inside the heating-side tank 15 is significantly different from the ambient temperature around the heating-side tank 15. Since the entire outer surface of the heating-side tank 15 is covered with insulation material 18, the temperature inside the heating-side tank 15 can be maintained even when the heating-side tank 15 is thermally isolated.

[0053] As described above, the heating-side bypass valve 55 operates based on whether or not the temperature of the heat transfer medium in the heating-side return pipe 25 is within the allowable high-temperature range, thereby stabilizing the load on the heating device 7.

[0054] In one embodiment, a first upper limit and a second upper limit higher than the first upper limit may be set as upper limits for the allowable high temperature range. The operation control unit 35 may gradually (for example, stepwise or steplessly) close the heating side bypass valve 55 as the temperature of the heat transfer medium in the heating side return pipe 25 rises from the first upper limit to the second upper limit. That is, when the temperature of the heat transfer medium in the heating side return pipe 25 rises to the first upper limit, the operation control unit 35 begins to close the heating side bypass valve 55, sending a portion of the heat transfer medium flowing through the heating side return pipe 25 to the heating side tank 15. Then, when the temperature of the heat transfer medium in the heating side return pipe 25 rises further to the second upper limit, the operation control unit 35 completely closes the heating side bypass valve 55. As a result, all of the heat transfer medium flowing through the heating side return pipe 25 flows into the heating side tank 15.

[0055] Figure 3 is a schematic diagram showing yet another embodiment of the heat transfer medium supply device 1. The embodiment shown in Figure 3 is a combination of the embodiment described with reference to Figure 1 and the embodiment described with reference to Figure 2. That is, the heat transfer medium supply device 1 of the embodiment shown in Figure 3 includes a cooling-side bypass pipe 44, a cooling-side bypass valve 45, a heating-side bypass pipe 54, and a heating-side bypass valve 55. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiments described with reference to Figures 1 and 2, so redundant explanations are omitted.

[0056] The cooling medium transfer pipe 12 extends from the cooling device 8 to the heat medium mixing device 5, and the cooling-side outlet pipe 17 extends from the cooling-side tank 16 to the cooling device 8. The heating medium transfer pipe 11 extends from the heating device 7 to the heat medium mixing device 5, and the heating-side outlet pipe 57 extends from the heating-side tank 15 to the heating device 7. The heating device 7 is located downstream of the heating-side tank 15 and is connected to the heating medium transfer pipe 11 and the heating-side outlet pipe 57. The cooling device 8 is located downstream of the cooling-side tank 16 and is connected to the cooling medium transfer pipe 12 and the cooling-side outlet pipe 17.

[0057] The heat transfer medium supply device 1 includes a cooling-side temperature measuring instrument 41 provided on the cooling-side return pipe 26, a cooling-side bypass pipe 44 extending from the cooling-side return pipe 26 to the cooling-side outlet pipe 17, a cooling-side bypass valve 45 provided on the cooling-side bypass pipe 44, a heating-side temperature measuring instrument 51 provided on the heating-side return pipe 25, a heating-side bypass pipe 54 extending from the heating-side return pipe 25 to the heating-side outlet pipe 57, and a heating-side bypass valve 55 provided on the heating-side bypass pipe 54.

[0058] The operation control unit 35 is configured to open the cooling-side bypass valve 45 when the temperature of the heat transfer medium in the cooling-side return pipe 26, as measured by the cooling-side temperature measuring device 41, is within a preset allowable low temperature range, and to close the cooling-side bypass valve 45 when the temperature of the heat transfer medium in the cooling-side return pipe 26, as measured by the cooling-side temperature measuring device 41, is outside the allowable low temperature range.

[0059] Furthermore, the operation control unit 35 is configured to open the heating-side bypass valve 55 when the temperature of the heat transfer medium in the heating-side return pipe 25, as measured by the heating-side temperature measuring device 51, is within a preset allowable high-temperature range, and to close the heating-side bypass valve 55 when the temperature of the heat transfer medium in the heating-side return pipe 25, as measured by the heating-side temperature measuring device 51, is outside the allowable high-temperature range.

[0060] According to this embodiment, the cooling-side bypass valve 45 operates based on whether the temperature of the heat transfer medium in the cooling-side return pipe 26 is within the allowable low-temperature range, and the heating-side bypass valve 55 operates based on whether the temperature of the heat transfer medium in the heating-side return pipe 25 is within the allowable high-temperature range. As a result, the load on the cooling device 8 and the heating device 7 can be stabilized.

[0061] Figure 4 is a schematic diagram showing another embodiment of a semiconductor manufacturing system including a heat transfer medium supply device 1 and a plurality of semiconductor manufacturing apparatuses 2. The heat transfer medium supply device 1 is the heat transfer medium supply device 1 of any embodiment described with reference to Figures 1 to 3. As shown in Figure 4, the heat transfer medium supply device 1 is connected to a plurality of semiconductor manufacturing apparatuses 2 via a plurality of heat transfer medium mixing devices 5. More specifically, each of the heating medium transfer pipe 11, cooling medium transfer pipe 12, heating side return pipe 25, and cooling side return pipe 26 of the heat transfer medium supply device 1 is connected to a plurality of semiconductor manufacturing apparatuses 2 via a plurality of heat transfer medium mixing devices 5. The heat transfer medium supply device 1 of this embodiment can adjust the processing temperature of the plurality of semiconductor manufacturing apparatuses 2.

[0062] The embodiments described above are intended to enable persons with ordinary skill in the art to implement the present invention. Various modifications of the above embodiments can be made naturally by those skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments as well. Therefore, the present invention is not limited to the embodiments described, but is to be interpreted in the broadest sense according to the technical idea defined by the claims. [Explanation of symbols]

[0063] 1 Heat medium supply device 2. Semiconductor manufacturing equipment 5 Heat medium mixing device 7 Heating device 8 Cooling device 11 Heating medium transfer pipe 12 Coolant transfer pipe 15 Heating side tank 16 Cooling side tank 17 Cooling side outlet pipe 18,19 Insulation 20 Tank connecting pipes 21 Communicating valve 25 Heating side return tube 26 Cooling return pipe 31. Heating side liquid level detection device 32 Cooling side liquid level detection device 33. Heating pump 34 Cooling pump 35. Operation Control Unit 41 Cooling side temperature measuring device 44 Cooling-side bypass pipe 45 Cooling-side bypass valve 51 Heating side temperature measuring device 54 Heating side bypass tube 55 Heating side bypass valve 57 Heating side outlet pipe

Claims

1. A heat transfer medium supply device that supplies a heat transfer medium for adjusting the temperature of semiconductor manufacturing equipment, A heating device for heating a heat transfer medium, A cooling device for cooling the heat transfer medium, A heating medium transfer pipe that sends the heated heating medium to the semiconductor manufacturing apparatus, A cooling medium transfer pipe that sends the cooled heat medium to the semiconductor manufacturing apparatus, A heating tank and a cooling tank for holding the heat transfer medium, A heating-side return pipe that returns the heat transfer medium that has passed through the semiconductor manufacturing apparatus to the heating-side tank, A cooling-side return pipe that returns the heat transfer medium that has passed through the semiconductor manufacturing apparatus to the cooling-side tank, A cooling-side temperature measuring device is provided in the cooling-side return pipe and measures the temperature of the heat transfer medium inside the cooling-side return pipe. A cooling outlet pipe for transferring the heat transfer medium from the cooling tank to the cooling device, A cooling side pump connected to the aforementioned cooling side outlet pipe, A cooling-side bypass pipe extends from the cooling-side return pipe, bypassing the cooling-side tank, to the cooling-side outlet pipe, A cooling-side bypass valve is provided in the cooling-side bypass pipe, The system includes an operation control unit that controls the operation of the cooling-side bypass valve, The connection point between the cooling-side bypass pipe and the cooling-side outlet pipe is located upstream of the cooling-side pump. The aforementioned operation control unit, When the temperature of the heat transfer medium in the cooling side return pipe, as measured by the cooling side temperature measuring instrument, is within a preset allowable low temperature range, the cooling side bypass valve is opened, allowing the heat transfer medium flowing through the cooling side return pipe to flow into the cooling side bypass pipe, thereby thermally isolating the cooling side tank. The system is configured to close the cooling-side bypass valve and allow the heat transfer medium flowing through the cooling-side return pipe to flow into the cooling-side tank when the temperature of the heat transfer medium in the cooling-side return pipe, as measured by the cooling-side temperature measuring instrument, is outside the allowable low-temperature range. A heat transfer medium supply device wherein the upper limit of the allowable low temperature range is set based on the rated refrigeration capacity of the cooling device, and the lower limit of the allowable low temperature range is set based on the minimum operable refrigeration capacity of the cooling device.

2. A heating-side temperature measuring device is provided in the heating-side return pipe for measuring the temperature of the heat transfer medium inside the heating-side return pipe, A heating outlet pipe for transferring the heat transfer medium from the heating tank to the heating device, A heating side pump connected to the aforementioned heating side outlet pipe, A heating-side bypass pipe extends from the heating-side return pipe, bypassing the heating-side tank, to the heating-side outlet pipe, The heating-side bypass pipe is further provided with a heating-side bypass valve, The connection point between the heating-side bypass pipe and the heating-side outlet pipe is located upstream of the heating-side pump. The aforementioned operation control unit, When the temperature of the heat transfer medium in the heating side return pipe, as measured by the heating side temperature measuring instrument, is within a preset allowable high temperature range, the heating side bypass valve is opened, and the heat transfer medium flowing through the heating side return pipe is allowed to flow into the heating side bypass pipe, thereby thermally isolating the heating side tank. When the temperature of the heat transfer medium in the heating side return pipe, as measured by the heating side temperature measuring instrument, is outside the allowable high temperature range, the heating side bypass valve is closed, causing the heat transfer medium flowing through the heating side return pipe to flow into the heating side tank. The heat transfer medium supply device according to claim 1, wherein the lower limit of the allowable high temperature range is set based on the rated heating capacity of the heating device, and the upper limit of the allowable high temperature range is set based on the minimum operating heating capacity of the heating device.

3. The aforementioned semiconductor manufacturing apparatus, a plurality of semiconductor manufacturing apparatuses, The heat medium supply apparatus according to claim 1, wherein each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing apparatuses.

4. A heat transfer medium supply device that supplies a heat transfer medium for adjusting the temperature of semiconductor manufacturing equipment, A heating device for heating a heat transfer medium, A cooling device for cooling the heat transfer medium, A heating medium transfer pipe that sends the heated heating medium to the semiconductor manufacturing apparatus, A cooling medium transfer pipe that sends the cooled heat medium to the semiconductor manufacturing apparatus, A heating tank and a cooling tank for holding the heat transfer medium, A heating-side return pipe that returns the heat transfer medium that has passed through the semiconductor manufacturing apparatus to the heating-side tank, A cooling-side return pipe that returns the heat transfer medium that has passed through the semiconductor manufacturing apparatus to the cooling-side tank, A heating-side temperature measuring device is provided in the heating-side return pipe for measuring the temperature of the heat transfer medium inside the heating-side return pipe, A heating outlet pipe for transferring the heat transfer medium from the heating tank to the heating device, A heating side pump connected to the aforementioned heating side outlet pipe, A heating-side bypass pipe extends from the heating-side return pipe, bypassing the heating-side tank, to the heating-side outlet pipe, A heating-side bypass valve is provided in the heating-side bypass pipe, The system includes an operation control unit that controls the operation of the heating side bypass valve, The connection point between the heating-side bypass pipe and the heating-side outlet pipe is located upstream of the heating-side pump. The aforementioned operation control unit, When the temperature of the heat transfer medium in the heating side return pipe, as measured by the heating side temperature measuring instrument, is within a preset allowable high temperature range, the heating side bypass valve is opened, and the heat transfer medium flowing through the heating side return pipe is allowed to flow into the heating side bypass pipe, thereby thermally isolating the heating side tank. When the temperature of the heat transfer medium in the heating side return pipe, as measured by the heating side temperature measuring instrument, is outside the allowable high temperature range, the heating side bypass valve is closed, causing the heat transfer medium flowing through the heating side return pipe to flow into the heating side tank. A heat transfer medium supply device in which the lower limit of the allowable high temperature range is set based on the rated heating capacity of the heating device, and the upper limit of the allowable high temperature range is set based on the minimum operating heating capacity of the heating device.

5. A cooling-side temperature measuring device is provided in the cooling-side return pipe and measures the temperature of the heat transfer medium inside the cooling-side return pipe. A cooling outlet pipe for transferring the heat transfer medium from the cooling tank to the cooling device, A cooling side pump connected to the aforementioned cooling side outlet pipe, A cooling-side bypass pipe extends from the cooling-side return pipe, bypassing the cooling-side tank, to the cooling-side outlet pipe, The cooling-side bypass pipe is further provided with a cooling-side bypass valve, The connection point between the cooling-side bypass pipe and the cooling-side outlet pipe is located upstream of the cooling-side pump. The aforementioned operation control unit, When the temperature of the heat transfer medium in the cooling side return pipe, as measured by the cooling side temperature measuring instrument, is within a preset allowable low temperature range, the cooling side bypass valve is opened, allowing the heat transfer medium flowing through the cooling side return pipe to flow into the cooling side bypass pipe, thereby thermally isolating the cooling side tank. The system is configured to close the cooling-side bypass valve and allow the heat transfer medium flowing through the cooling-side return pipe to flow into the cooling-side tank when the temperature of the heat transfer medium in the cooling-side return pipe, as measured by the cooling-side temperature measuring instrument, is outside the allowable low-temperature range. The heat transfer medium supply device according to claim 4, wherein the upper limit of the allowable low temperature range is set based on the rated refrigeration capacity of the cooling device, and the lower limit of the allowable low temperature range is set based on the minimum operable refrigeration capacity of the cooling device.

6. The aforementioned semiconductor manufacturing apparatus, a plurality of semiconductor manufacturing apparatuses, The heat medium supply apparatus according to claim 4, wherein each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing apparatuses.

7. A first lower limit and a second lower limit that is lower than the first lower limit are set as the lower limits of the allowable low temperature range. The heat transfer medium supply device according to claim 1 or 5, wherein the operation control unit is configured to gradually close the cooling-side bypass valve as the temperature of the heat transfer medium in the cooling-side return pipe decreases from the first lower limit to the second lower limit.

8. A first upper limit and a second upper limit that is higher than the first upper limit are set as upper limits for the allowable high temperature range. The heat transfer medium supply device according to claim 2 or 4, wherein the operation control unit is configured to gradually close the heating side bypass valve as the temperature of the heat transfer medium in the heating side return pipe rises from the first upper limit to the second upper limit.

9. The cooling tank further comprises an insulating material that covers the entire outer surface of the tank, The heat transfer medium supply device according to claim 1, wherein the temperature of the heat transfer medium in the cooling side tank is maintained by the insulating material while the cooling side bypass valve is open and the cooling side tank is thermally isolated.

10. The heating side tank further comprises an insulating material that covers the entire outer surface, The heat transfer medium supply device according to claim 2 or 4, wherein the temperature of the heat transfer medium in the heating side tank is maintained by the insulating material while the heating side bypass valve is open and the heating side tank is thermally isolated.

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