Thermoelectric conversion module, electronic component, power generation module, temperature control module, and method for manufacturing a thermoelectric conversion module
The thermoelectric conversion module with an element housing having through-holes addresses durability and thermal conductivity issues, improving mechanical strength and reducing corrosion, thereby enhancing the Seebeck and Peltier effects.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- NITERRA CO LTD
- Filing Date
- 2022-08-31
- Publication Date
- 2026-05-29
Smart Images
Figure 0007867404000001 
Figure 0007867404000002 
Figure 0007867404000003
Abstract
Description
Technical Field
[0001] The present invention relates to a thermoelectric conversion module, an electronic component, a power generation module, a Peltier module, and a method for manufacturing a thermoelectric conversion module.
Background Art
[0002] Conventionally, a thermoelectric conversion module that uses a thermoelectric conversion element (thermoelectric element) utilizing the Seebeck effect or the Peltier effect and is used for power generation or temperature control of electronic devices is known (see, for example, Patent Documents 1 and 2). In the thermoelectric conversion module described in Patent Document 1, the side surface of a columnar thermoelectric element main body formed of a thermoelectric material is covered with a coating layer composed of conductive particles and an insulating material. The coating layer prevents adhesion of moisture from the outside to the thermoelectric element main body.
[0003] In the thermoelectric conversion module described in Patent Document 2, an insulating resin is filled between a plurality of thermoelectric elements, and the thermoelectric elements are fixed with the insulating resin, thereby suppressing breakage of the fragile thermoelectric elements. As the filled insulating resin, an epoxy resin containing fine bubbles is used in order to lower the thermal conductivity.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0005] In thermoelectric conversion modules, it is preferable to suppress corrosion and failure of thermoelectric elements and to reduce the thermal conductivity of the space or material such as resin placed between thermoelectric elements. However, the technology described in Patent Document 1 has problems with durability, such as low impact resistance of the thermoelectric conversion module and failure due to differences in thermal expansion between components, because the space between thermoelectric elements is not mechanically reinforced. On the other hand, the technology described in Patent Document 2 has the problem that the space between thermoelectric elements is filled with epoxy resin, so the thermal conductivity is not sufficiently reduced.
[0006] The present invention has been made to solve at least some of the above-mentioned problems, and aims to provide a thermoelectric conversion module that can obtain the Seebeck effect or Peltier effect more effectively while suppressing the breakdown of thermoelectric elements. [Means for solving the problem]
[0007] The present invention was made to solve at least some of the problems described above, and can be realized in the following forms. A thermoelectric conversion module comprising: a first substrate made of an insulating material having a first main surface on which a first conductor pattern is formed; a second substrate made of an insulating material having a second main surface on which a second conductor pattern is formed, wherein the second main surface is positioned opposite the first main surface; a plurality of thermoelectric elements electrically connecting the first conductor pattern and the second conductor pattern; and an element housing made of an insulating material and positioned between the first substrate and the second substrate, wherein the element housing A thermoelectric conversion module characterized by having a plurality of through holes greater than the number of thermoelectric elements, wherein the plurality of through holes are formed in the element housing, penetrating the surface facing the first substrate and the surface facing the second substrate, some of the plurality of through holes in the element housing are filled with the thermoelectric elements on the inside, the remaining through holes are not filled with the thermoelectric elements, and the cross-sectional area of the remaining through holes is smaller than the cross-sectional area of the through holes filled with the thermoelectric elements. In addition, the present invention can also be realized in the following forms.
[0008] (1) According to one embodiment of the present invention, a thermoelectric conversion module is provided. This thermoelectric conversion module comprises: a first substrate made of an insulating material having a first main surface on which a first conductor pattern is formed; a second substrate made of an insulating material having a second main surface on which a second conductor pattern is formed, wherein the second main surface is positioned opposite to the first main surface; a plurality of thermoelectric elements that electrically connect the first conductor pattern and the second conductor pattern; and an element housing made of an insulating material and positioned between the first substrate and the second substrate, wherein the element housing has a plurality of through holes, more than the number of thermoelectric elements, and the plurality of through holes penetrate the surface of the element housing that faces the first substrate and the surface that faces the second substrate, and some of the plurality of through holes of the element housing are filled with the thermoelectric elements inside, while the remaining through holes are not filled with the thermoelectric elements.
[0009] In this configuration, an element housing having through-holes filled with multiple thermoelectric elements is placed between a first substrate on which a first conductor pattern is formed and a second substrate on which a second conductor pattern is formed. The element housing includes through-holes that form voids without thermoelectric elements, in addition to the through-holes that are filled with thermoelectric elements. Therefore, in this configuration, the heat transfer coefficient of the element housing can be reduced compared to the case where the element housing does not include through-holes that form voids. Furthermore, the portion of the element housing where no through-holes are formed covers the surface of the thermoelectric elements along the alignment direction in which the thermoelectric elements are arranged. Therefore, it is possible to suppress the progression of corrosion and other damage to the thermoelectric elements due to the adhesion of moisture caused by the external environment. In addition, the element housing connects adjacent thermoelectric elements along the alignment direction. Therefore, the mechanical strength in the direction perpendicular to the alignment direction can be improved. In other words, in this configuration, the Seebeck effect or Peltier effect can be obtained more effectively by suppressing the damage to the thermoelectric elements and reducing the heat transfer coefficient of the element housing.
[0010] (2) In the thermoelectric conversion module of the above form, the thermal conductivity of the insulating material forming the element housing may be less than the thermal conductivity of the insulating material forming the first substrate and less than the thermal conductivity of the insulating material forming the second substrate. In this configuration, the thermal conductivity of the element housing is lower than that of the first and second substrates. Therefore, heat transfer between the first and second substrates is further suppressed, and the Seebeck effect or Peltier effect can be obtained more effectively.
[0011] (3) According to another embodiment of the present invention, a method for manufacturing a thermoelectric conversion module is provided. This manufacturing method comprises: a preparation step of preparing a first substrate and a second substrate made of an insulating material, the first substrate having a first conductor pattern formed on it and the second substrate having a second conductor pattern formed on it; a hole forming step of forming a plurality of through holes penetrating in the thickness direction in a green sheet made of an insulating material; a paste filling step of filling a portion of the plurality of through holes formed with a paste of thermoelectric material powder; a thermocompression bonding step of thermocompression bonding the green sheet with the paste filled on it, with the first substrate placed on one side so that the first conductor pattern faces the green sheet and the second substrate placed on the other side so that the second conductor pattern faces the green sheet; and a firing step of firing the laminate formed by the thermocompression bonding step. In this configuration, the hole-forming process creates both through-holes in the green sheet for which thermoelectric elements are placed, and through-holes that function as voids after processing. In the paste-filling process, a paste of thermoelectric material powder, which will form the basis of the thermoelectric elements, is filled into the predetermined through-holes. Therefore, compared to a method in which insulating material is poured between the first and second substrates after the placement of the thermoelectric elements, through-holes as voids can be easily formed. Furthermore, a thermoelectric conversion module can be manufactured in which the thermoelectric elements are covered with insulating material.
[0012] Furthermore, the present invention can be realized in various forms, for example, as a thermoelectric conversion module, a Peltier module, an apparatus equipped with a thermoelectric element, an electronic component, a power generation module, a method for manufacturing a thermoelectric conversion module, and a system equipped with these. [Brief explanation of the drawing]
[0013] [Figure 1] This is a schematic perspective view of a thermoelectric conversion module according to an embodiment of the present invention. [Figure 2] This is an exploded perspective view of a thermoelectric conversion module. [Figure 3] This is an explanatory diagram of a thermoelectric element. [Figure 4]It is a schematic view of the A-A cross section of the thermoelectric conversion module in FIG. 2. [Figure 5] It is a flowchart of a method for manufacturing a thermoelectric conversion module. [Figure 6] It is an explanatory view of the thermoelectric conversion module of Comparative Example 1. [Figure 7] It is an explanatory view of the thermoelectric conversion module of Comparative Example 2. [Figure 8] It is an explanatory view of the element container of Modified Example 1. [Figure 9] It is an explanatory view of the element container of Modified Example 2. [Figure 10] It is a schematic cross-sectional view of an electronic component including the thermoelectric conversion module of Modified Example 3.
Mode for Carrying Out the Invention
[0014] <Embodiment> FIG. 1 is a schematic perspective view of the thermoelectric conversion module 100 according to an embodiment of the present invention. In the thermoelectric conversion module 100 of the present embodiment, an element container 30 disposed between the first substrate 10 and the second substrate 20 covers the thermoelectric element and has through holes penetrating in the stacking direction. In the present embodiment, since the thermoelectric element is covered by the element container 30, the progress of the destruction of the thermoelectric element due to the adhesion of moisture to the thermoelectric element can be suppressed. Further, since the element container 30 has through holes as voids, the heat transfer rate of the element container 30 is reduced, and the Seebeck effect or Peltier effect of the thermoelectric conversion module 100 can be obtained more.
[0015] As shown in FIG. 1, the thermoelectric conversion module 100 includes a flat first substrate 10, a flat second substrate 20 arranged to face the first substrate 10, an element housing 30 arranged between the first substrate 10 and the second substrate 20, a plurality of thermoelectric elements not shown, and lead wires LN1, LN2. The first substrate 10 and the second substrate 20 have a rectangular plane along the plane direction orthogonal to the stacking direction (thickness direction) in which the first substrate 10, the element housing 30, and the second substrate 20 are stacked. In the present embodiment, as shown in FIG. 1, an orthogonal coordinate system CS composed of an X-axis, a Y-axis, and a Z-axis is defined. In the orthogonal coordinate system CS, the Z-axis is defined as an axis parallel to the stacking direction, and an X-axis and a Y-axis parallel to each side of the rectangular first substrate 10 and second substrate 20 are defined. The orthogonal coordinate system CS corresponds to the orthogonal coordinate system CS shown in FIG. 2 and subsequent figures.
[0016] The lead wires LN1, LN2 are electrically connected through a second conductor pattern formed on the second substrate 20 described later. When the thermoelectric conversion module 100 is used as a Peltier module, when a current flows between the lead wires LN1, LN2, a temperature difference occurs between the first substrate 10 and the second substrate 20 due to the Peltier effect of the plurality of thermoelectric elements filled in the element housing 30. Or, when it is used as a power generation module, when a temperature difference occurs between the first substrate 10 and the second substrate 20, the electric power generated can be taken out through the lead wire LN1 and the lead wire LN2.
[0017] FIG. 2 is an exploded perspective view of the thermoelectric conversion module 100. In FIG. 2, the illustration of the lead wires LN1, LN2 is omitted. As shown in FIG. 2, the first substrate 10 includes a flat ceramic substrate 13 and a first conductor pattern 12 formed on the first main surface 11 of the ceramic substrate 13 facing the second substrate 20. In the present embodiment, the ceramic substrate 13 is formed of alumina, an insulating material. The first conductor pattern 12 of the present embodiment is composed of eight spaced metal layers so as to electrically connect a plurality of thermoelectric elements 40 described later in series.
[0018] The second substrate 20 comprises a flat ceramic substrate 23 and a second conductor pattern 22 formed on the second main surface 21 of the ceramic substrate 23 facing the first substrate 10. The ceramic substrate 23 is the same substrate as the ceramic substrate 13 of the first substrate 10. The second conductor pattern 22 in this embodiment is composed of nine spaced metal layers that electrically connect multiple thermoelectric elements 40 electrically connected in series by the first conductor pattern 12. Of the nine metal layers, metal layers 221 and 222 extend to the end face 23F of the ceramic substrate 23 parallel to the YZ plane on the positive X-axis side. Metal layer 221 is connected to lead wire LN1. Metal layer 222 is connected to lead wire LN2.
[0019] As shown in Figure 2, the element housing 30 has a substantially rectangular parallelepiped shape with a predetermined thickness in the Z-axis direction. The element housing 30 is made of an insulating material such as alumina oxide. In this embodiment, the thermal conductivity of the insulating material forming the element housing 30 is smaller than that of the insulating material forming the first substrate 10, and also smaller than that of the insulating material forming the second substrate 20. The element housing 30 has 25 through holes 33 that penetrate the first surface 31 facing the first substrate 10 and the second surface 32 facing the second substrate 20. The through holes 33 have a circular cross-section and penetrate the element housing 30 along the thickness direction.
[0020] Figure 3 is an explanatory diagram of the thermoelectric element 40. Figure 3 shows a schematic top view of the element housing 30 and the thermoelectric element 40. As shown in Figures 2 and 3, the thermoelectric element 40 is filled inside 16 of the 25 through holes 33 formed in the element housing 30. On the other hand, the remaining 9 through holes 33 that do not house the thermoelectric element 40 form an empty space. In other words, the element housing 30 has 25 through holes, which is more than the total number of thermoelectric elements 40 (16).
[0021] The thermoelectric element 40 is composed of eight N-type thermoelectric elements (N-type elements) 41 and eight P-type thermoelectric elements (P-type elements) 42. In Figure 2, the N-type elements 41 are represented by one type of diagonal hatching. The P-type elements 42 are represented by two types of diagonal cross-hatching. The N-type elements 41 and P-type elements 42 in this embodiment are made of a bismuth telluride-based material.
[0022] As shown in Figure 2, the N-type elements 41 and P-type elements 42 are arranged alternately. The sides of the N-type elements 41 and P-type elements 42 perpendicular to the thickness direction are covered by the element housing 30. In other words, the element housing 30 covering the sides of each N-type element 41 and the element housing 30 covering the sides of each P-type element 42 are connected without being separated, along the plane direction perpendicular to the thickness direction (the arrangement direction of the thermoelectric elements 40).
[0023] Figure 4 is a schematic diagram of the AA cross-section of the thermoelectric conversion module 100 in Figure 2. As shown in Figure 4, the first conductor pattern 12 formed on the first substrate 10 and the second conductor pattern 22 formed on the second substrate 20 electrically connect the alternately arranged N-type elements 41 and P-type elements 42 in series. As a result, current flows between the lead wires LN1 and LN2, causing the thermoelectric conversion module 100 to function as a Peltier mechanism.
[0024] Figure 5 is a flowchart of the manufacturing method for the thermoelectric conversion module 100. As shown in the manufacturing flow in Figure 5, first, a preparation step is performed to prepare a first substrate 10 on which a first conductor pattern 12 is formed and a second substrate 20 on which a second conductor pattern 22 is formed (step S1). Next, a hole formation step is performed in which a green sheet made of an insulating material such as alumina oxide is formed by punching to create a plurality of through holes 33 that penetrate in the thickness direction (step S2).
[0025] Step S3 is a paste filling step in which a paste of powder material, which is the material for the thermoelectric element 40, is filled into some of the multiple through holes 33 formed in the green sheet. Step S4 is a thermocompression bonding step in which the first substrate 10 and the second substrate 20 are stacked and heat-pressed together on both sides of the paste-filled green sheet. In the thermocompression bonding step, the first substrate 10 is placed on one side of the green sheet so that the first conductor pattern 12 faces it, and the second substrate 20 is placed on the other side of the green sheet so that the second conductor pattern 22 faces it. Step S5 is a firing step in which the laminate formed by the thermocompression bonding step, consisting of the first substrate 10, the green sheet, and the second substrate 20, is fired. Finally, lead wires LN1 and LN2 are attached to the metal layers 221 and 222 of the second conductor pattern 22 after firing by welding, and the manufacturing flow is completed.
[0026] Figure 6 is an explanatory diagram of the thermoelectric conversion module 100x of Comparative Example 1. Figure 6 shows a schematic top view of the element housing 30x and thermoelectric element 40 in the thermoelectric conversion module 100x of Comparative Example 1, corresponding to Figure 3 of the embodiment. Compared with the thermoelectric conversion module 100 of the embodiment shown above, the thermoelectric conversion module 100x of Comparative Example 1 shown in Figure 6 does not have through holes 33 that function as air gaps formed in the element housing 30x. In other words, in Comparative Example 1, the element housing 30x is present in all areas between the first substrate 10 and the second substrate 20 where the thermoelectric element 40 is not present.
[0027] Figure 7 is an explanatory diagram of the thermoelectric conversion module 100y of Comparative Example 2. Figure 7 shows a schematic top view of the coating layer 30y and thermoelectric elements 40 in the thermoelectric conversion module 100y of Comparative Example 2, corresponding to Figure 3 of the embodiment. Compared to the thermoelectric conversion module 100 of the embodiment described above, the thermoelectric conversion module 100y of Comparative Example 2 shown in Figure 7 has a coating layer 30y that covers the sides of each thermoelectric element 40 instead of an element housing 30. In Comparative Example 2, each of the coating layers 30y of the thermoelectric element 40 is spaced apart and not connected to the coating layers 30y of the other thermoelectric elements 40. For comparison, the rectangular outer frame OB of the element housing 30 in the embodiment described above is shown by a dashed line in Figure 7.
[0028] As described above, the element housing 30 of the thermoelectric conversion module 100 of this embodiment is positioned between the first substrate 10 and the second substrate 20. The element housing 30 has 25 through holes, which is more than the total number of thermoelectric elements 40 (16). Of the 25 through holes 33 formed in the element housing 30, thermoelectric elements 40 are filled inside 9 of the through holes 33. Of the 25 through holes 33, the remaining 9 through holes 33 that do not house thermoelectric elements 40 form voids. Therefore, in this embodiment, the heat transfer coefficient of the element housing 30 can be reduced compared to the thermoelectric conversion module 100x of Comparative Example 1 (Figure 6), which does not include through holes 33 that form voids. Furthermore, in this embodiment, the void ratio of the element housing 30 can be adjusted by the size and number of through holes 33, compared to an element housing formed from a resin containing air bubbles. Furthermore, in this embodiment, the element housing 30 has portions where the through holes 33 are not formed that cover the sides of the thermoelectric elements 40 along the plane direction in which the thermoelectric elements 40 are arranged. Therefore, it is possible to suppress the progression of corrosion and other damage to the thermoelectric elements 40 due to moisture adhering to them due to the external environment. Moreover, unlike the thermoelectric conversion module 100y of Comparative Example 2 (Figure 7), the element housing 30 connects adjacent thermoelectric elements 40 along the plane direction. Therefore, it is possible to improve the mechanical strength in the stacking direction (thickness direction) perpendicular to the plane direction. As a result, even if thermoelectric elements 40 with low strength are used, the damage to the thermoelectric conversion module 100 can be suppressed by the element housing 30 with improved mechanical strength. In other words, in this embodiment, the Seebeck effect or Peltier effect can be obtained more effectively by suppressing the damage to the thermoelectric elements 40 and reducing the heat transfer coefficient of the element housing 30.
[0029] Furthermore, in this embodiment, the thermal conductivity of the insulating material forming the element housing 30 is lower than that of the insulating material forming the first substrate 10, and also lower than that of the insulating material forming the second substrate 20. Therefore, heat transfer between the first substrate 10 and the second substrate 20 is rapid, and heat transfer between the first substrate 10 and the second substrate 20 is suppressed, making it possible to obtain the Seebeck effect or Peltier effect more effectively.
[0030] Furthermore, in the manufacturing method of the thermoelectric conversion module 100 of this embodiment, as shown in the manufacturing flow of Figure 5, a hole formation step is performed in which a plurality of through holes that penetrate in the thickness direction are formed by punching into a green sheet made of an insulating material such as alumina oxide (step S2). A paste filling step is performed in which a paste of powder, which is the material for the thermoelectric element 40, is filled into some of the plurality of through holes 33 formed in the green sheet (step S3). A thermocompression bonding step is performed in which the first substrate 10 and the second substrate 20 are placed on both sides of the paste-filled green sheet and thermocompression bonded (step S4). In other words, in this embodiment, the hole formation step forms both through holes 33 in the green sheet in which the thermoelectric element 40 is placed, and through holes 33 that function as voids after processing. In the paste filling step, a powder paste of the thermoelectric material that will become the thermoelectric element 40 is filled into some of the plurality of through holes 33. Therefore, compared to a method in which insulating material is poured between the first substrate 10 and the second substrate 20 after the thermoelectric element 40 has been placed, through-holes 33 as voids can be easily formed. Furthermore, a thermoelectric conversion module 100 can be manufactured in which the thermoelectric element 40 is covered with insulating material.
[0031] <Modified form of this embodiment> The present invention is not limited to the embodiments described above, and can be implemented in various forms without departing from its spirit, for example, the following modifications are also possible.
[0032] <Example 1> The thermoelectric conversion module 100 in the above embodiment is an example, and the configuration and shape of the thermoelectric conversion module can be modified. The thermoelectric conversion module can be modified to include a first substrate 10, a second substrate 20, a plurality of thermoelectric elements 40 that electrically connect the first conductor pattern 12 and the second conductor pattern 22, and through holes 33 in which the thermoelectric elements 40 are not housed. For example, the thermoelectric conversion module 100 does not have to include lead wires LN1 and LN2. The first substrate 10 and the second substrate 20 have different shapes and do not have to have a rectangular shape along the plane direction. The voids in the through holes 33 in which the thermoelectric elements 40 are not housed may be filled with air or other gases, or they may be a vacuum.
[0033] The shape of the element housing 30 in which the through-holes 33 are formed can also be modified. Figure 8 is an explanatory diagram of the element housing 30a of Modified Example 1. Figure 8 shows a schematic top view of the element housing 30a and thermoelectric element 40 of Modified Example 1, which corresponds to Figure 3 of the above embodiment. In the thermoelectric conversion module of Modified Example 1, the through-holes 33a formed in the element housing 30a are different from those in the thermoelectric conversion module 100 of the above embodiment. As shown in Figure 8, the through-holes 33a of Modified Example 1 consist of eight element-filling through-holes 33A in which the thermoelectric element 40 is filled, and 33 void through-holes 33B which are voids. The void through-holes 33B have a smaller cross-sectional area than the element-filling through-holes 33A and are holes that penetrate the element housing 30a in the thickness direction.
[0034] <Modification 2> Figure 9 is an explanatory diagram of the element housing 30b of Modified Example 2. Figure 9 shows a schematic top view of the element housing 30b and thermoelectric element 40 of Modified Example 2, corresponding to Figure 3 of the above embodiment. In the thermoelectric conversion module of Modified Example 2, the shape of the element housing 30b is different from that of the thermoelectric conversion module 100 of the above embodiment. As shown in Figure 9, the element housing 30b of Modified Example 2 includes a coating layer 34 that covers each side of the thermoelectric element 40 and a connecting portion 35 that connects each coating layer 34. In other words, the area surrounded by the coating layer 34 and the connecting portion 35 is the through hole 33b in Modified Example 2. The coating layer 34 and the connecting portion 35 extend along the thickness direction between the first substrate 10 and the second substrate 20. As shown in Modified Example 2 in Figure 9, the cross-sectional shape of the through hole 33b may be a polygon or other shape other than a circle.
[0035] The element housing 30 may be made of an insulating material other than an oxide such as alumina. For example, the element housing 30 may be made of glass, a ceramic containing glass, or a resin. The thermal conductivity of the element housing 30 is preferably lower than that of the ceramic substrate 13 of the first substrate 10 and the ceramic substrate 23 of the second substrate 20. On the other hand, the thermal conductivity of the element housing 30 may be higher than or equal to that of the ceramic substrate 13, or higher than or equal to that of the ceramic substrate 23.
[0036] The shape of the thermoelectric element 40 can also be modified; for example, the shape of the P-type element 42 may differ from the shape of the N-type element 41. For example, the thermoelectric element 40 may have a rectangular parallelepiped shape instead of a cylindrical shape. As the material of the thermoelectric element 40, materials other than bismuth telluride may be used, such as skutterudite, magnesium silicide, and oxide. As the material of the ceramic substrate 13 of the first substrate 10 and the ceramic substrate 23 of the second substrate 20, materials other than alumina may be used, such as alumina oxides, glass, aluminum nitride, glass ceramic, and silicon nitride.
[0037] <Variation 3> Figure 10 is a schematic cross-sectional view of an electronic component (ceramic package) 200 equipped with a thermoelectric conversion module 100c according to Modification 3. The electronic component 200 shown in Figure 10 comprises a thermoelectric conversion module 100c and an element housing package 150 as an optical module. The thermoelectric conversion module 100c comprises a base substrate 153 instead of the first substrate 10 of the thermoelectric conversion module 100 in the above embodiment. In the electronic component 200 shown in Figure 10, the base substrate 153 is part of the configuration of both the thermoelectric conversion module 100c and the element housing package 150. As a result, the thermoelectric conversion module 100c and the element housing package 150 are manufactured as an integrated unit, which enables miniaturization of the electronic component 200 and reduction of its manufacturing cost. The thermoelectric conversion module 100c functions as a cooling mechanism for the element housing package 150 for the optical module.
[0038] As shown in Figure 10, the element housing package 150 comprises a base substrate 153 and a frame 155 and a lid 154 that form a housing space SP in which the light-emitting element 60 is housed. The frame 155 and the lid 154 are made of the same insulating material as the base substrate 153. The lower surface of the frame 155 (the surface on the negative Z-axis side) is joined to the upper surface of the base substrate 153 (the surface on the positive Z-axis side). Although not shown in Figure 10, the frame 155 has a shape in which the inside of a rectangular parallelepiped that forms the housing space SP is hollowed out along the outer frame of the rectangular base substrate 153. Of the lower surfaces of the lid 154, the surface facing the upper surface of the frame 155 is joined to the upper surface of the frame 155. Note that in Figure 10, the bonding layers between the base substrate 153 and the frame 155, and the bonding layers between the frame 155 and the lid 154 are not shown.
[0039] The thermoelectric conversion module 100c comprises a first substrate 10, an element housing 30, a base substrate 153 that functions as a second substrate, a metal bonding member 50 bonded to the first substrate 10, and a light-emitting element 60 arranged on the first substrate 10 via the bonding member 50. The bonding member 50 bonds the first substrate 10 and the light-emitting element 60, and by forming a wiring pattern on the first substrate 10 and attaching the light-emitting element 60 with solder or the like, both component fixing and electrical connection can be achieved. The bonding member 50 transfers the heat generated by the light-emitting element 60 to the first substrate 10. The bonding member 50 may be made of a metal or a material other than metal. In the electronic component 200, the heat generated by the light-emitting element 60 is controlled by the thermoelectric conversion module 100c via the first substrate 10, the bonding member 50, and the base substrate 153. Furthermore, the components placed on the first substrate 10 via the bonding member 50 are not limited to the light-emitting element 60; electronic components that are preferably temperature-controlled may also be used.
[0040] Furthermore, the electronic component 200 shown in Figure 10 can also function as a power generation module by replacing the light-emitting element 60 of the element housing package 150 with a heating device, and using the heat generated by the heating device to generate electricity via a thermoelectric conversion module 100c.
[0041] The manufacturing flow shown in Figure 5 is an example, and the thermoelectric conversion module 100 may be manufactured by other manufacturing methods. For example, when applying the thermoelectric conversion module to a relatively large power generation module that utilizes thermoelectric conversion, a green sheet of insulating material with multiple through-holes formed by punching is first fired. After firing, a paste of powder, which is the material for the thermoelectric element, is filled into the predetermined through-holes of the green sheet, and then fired again to produce the element housing and thermoelectric element. Subsequently, a first conductor pattern and a second conductor pattern may be formed on both sides of the element housing and thermoelectric element by printing or other means, and finally, the first substrate and the second substrate may be joined together.
[0042] In the above embodiment, the thermoelectric conversion module 100 functioned as both a temperature control module utilizing the Seebeck effect and a power generation module utilizing the Peltier effect. However, the thermoelectric conversion module 100 may function as either a temperature control module or a power generation module.
[0043] The embodiments of this specification have been described above based on the embodiments and modifications described above. The embodiments described above are for the purpose of facilitating understanding of this specification and do not limit it. This specification may be modified and improved without departing from its spirit and the scope of the claims, and equivalents thereof are included in this specification. Furthermore, any technical features that are not described as essential in this specification may be deleted as appropriate.
[0044] The present invention can also be realized in the following forms. [Application Example 1] It is a thermoelectric conversion module, A first substrate made of an insulating material has a first main surface on which a first conductor pattern is formed, A second substrate having a second main surface on which a second conductor pattern is formed, and made of an insulating material, wherein the second main surface is positioned opposite to the first main surface, A plurality of thermoelectric elements electrically connecting the first conductor pattern and the second conductor pattern, An element housing formed of an insulating material and disposed between the first substrate and the second substrate, Equipped with, The element housing has a plurality of through holes, more than the number of thermoelectric elements, and the plurality of through holes penetrate the surface of the element housing facing the first substrate and the surface facing the second substrate. Of the plurality of through holes in the element housing, Some of the aforementioned through holes are filled with the thermoelectric elements on the inside. A thermoelectric conversion module characterized in that the remaining through-holes do not house the thermoelectric elements. [Application Example 2] The thermoelectric conversion module described in Application Example 1, A thermoelectric conversion module characterized in that the thermal conductivity of the insulating material forming the element housing is smaller than the thermal conductivity of the insulating material forming the first substrate, and also smaller than the thermal conductivity of the insulating material forming the second substrate. [Application Example 3] It is an electronic component, An electronic component comprising a thermoelectric conversion module as described in Application Example 1 or Application Example 2. [Application Example 4] A power generation module, A power generation module comprising a thermoelectric conversion module as described in any one of Application Examples 1 to 3. [Application Example 5] A temperature control module, A temperature control module comprising a thermoelectric conversion module as described in any one of Application Examples 1 to 4. [Application Example 6] A method for manufacturing a thermoelectric conversion module, A preparation step of preparing a first substrate and a second substrate made of an insulating material, wherein the first substrate has a first conductor pattern formed on it, and the second substrate has a second conductor pattern formed on it. A hole-forming step in which multiple through holes are formed in the thickness direction of a green sheet made of an insulating material, A paste filling step is performed in which a paste of thermoelectric material powder is filled into some of the multiple through holes that have been formed, A heat-pressing step is performed in which the first substrate is placed on one side of the green sheet filled with the paste so that the first conductive pattern faces the green sheet, and the second substrate is placed on the other side so that the second conductive pattern faces the green sheet, and the two substrates are heat-pressed together. A firing step in which the laminated body formed by the aforementioned heat-compression bonding step is fired, A manufacturing method that includes the following features. [Explanation of Symbols]
[0045] 10…First circuit board 11…First main surface 12…First conductor pattern 13,23…Ceramic substrate 20...Second circuit board 21...Second main surface 22…Second conductor pattern 23F... Edge face of ceramic substrate 30, 30a, 30b, 30x… Element housing 30y…Covering layer 31...First surface of the element housing 32...Second surface of the element housing 33,33a,33b...Through hole 33A...Through-hole for element filling 33B...Through hole for void 34…Covering layer 35...Connection part 40… Thermoelectric element 41...N-type element 42...P-type element 50…Joint member 60…Light-emitting diode 100, 100c, 100x, 100y… Thermoelectric conversion module 150... Element storage package 153...Base board (second board) 154... Lid 155…frame body 200... Electronic components 221,222…metal layer CS… Cartesian coordinate system LN1, LN2... Lead wires OB...Outer frame SP...Storage space
Claims
1. It is a thermoelectric conversion module, A first substrate made of an insulating material has a first main surface on which a first conductor pattern is formed, A second substrate made of an insulating material having a second main surface on which a second conductor pattern is formed, wherein the second main surface is positioned opposite to the first main surface, A plurality of thermoelectric elements electrically connecting the first conductor pattern and the second conductor pattern, An element housing formed of an insulating material and disposed between the first substrate and the second substrate, Equipped with, The element housing has a plurality of through holes, more than the number of thermoelectric elements, and the plurality of through holes penetrate the surface of the element housing facing the first substrate and the surface facing the second substrate. Of the plurality of through holes in the element housing, Some of the aforementioned through holes are filled with the thermoelectric elements on the inside. The remaining through-hole does not house the thermoelectric element. A thermoelectric conversion module characterized in that the cross-sectional area of the remaining through-hole is smaller than the cross-sectional area of the through-hole filled with the thermoelectric element.
2. A thermoelectric conversion module according to claim 1, A thermoelectric conversion module characterized in that the thermal conductivity of the insulating material forming the element housing is smaller than the thermal conductivity of the insulating material forming the first substrate, and also smaller than the thermal conductivity of the insulating material forming the second substrate.
3. It is an electronic component, An electronic component comprising a thermoelectric conversion module according to claim 1 or claim 2.
4. A power generation module, A power generation module comprising the thermoelectric conversion module described in claim 1 or claim 2.
5. A temperature control module, A temperature control module comprising the thermoelectric conversion module described in claim 1 or claim 2.
6. A method for manufacturing a thermoelectric conversion module, A preparation step of preparing a first substrate and a second substrate made of an insulating material, wherein the first substrate has a first conductor pattern formed on it, and the second substrate has a second conductor pattern formed on it. A hole-forming step in which multiple through holes with different diameters are formed in a green sheet made of an insulating material, penetrating in the thickness direction, A paste filling step is performed in which a paste of thermoelectric material powder is filled into all of the through holes with the largest diameter among the multiple through holes that have been formed, A heat-pressing step is performed in which the first substrate is placed on one side of the green sheet filled with the paste so that the first conductor pattern faces the green sheet, and the second substrate is placed on the other side so that the second conductor pattern faces the green sheet, and the two substrates are heat-pressed together. A firing step in which the laminated body formed by the aforementioned heat-compression bonding step is fired, A manufacturing method that includes the following features.