Optical communication methods and related equipment

Abstract

An embodiment of the present application discloses an optical communication method and related equipment. The method is applied to an optical communication system. The optical communication system includes a first component, a second component, and an optical connection assembly connecting the first component and the second component. The method includes the steps of: controlling the first component to transmit a first optical signal to the second component via the optical connection assembly; transmitting an alarm indication when it is determined that the optical connection assembly is abnormal based on an optical power fluctuation state of the first optical signal in a transmission process; and controlling the first component to transmit a second optical signal to the second component when it is determined that the optical connection assembly is normal based on the optical power fluctuation state of the first optical signal in the transmission process, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal. According to the present application, it is possible to reduce the cost of detecting an abnormality in an optical path of an optical connector, and to discover the abnormality in a timely manner.

Description

[Technical Field]

[0001] [Technical field] This invention relates to the field of optical communication technology, and more particularly to optical communication methods and related equipment. [Background technology]

[0002] In optical communication systems, Ko A connector is needed. An optical connector is a component for removably connecting optical fibers. Because optical connectors can precisely connect both ends of an optical fiber, the optical energy output from the transmitting optical fiber can be coupled to the receiving optical fiber to the maximum extent possible. of Light Link to access to Minimizing the impact on the system is a fundamental requirement for optical connectors. Optical connectors do, to some extent, affect the reliability and performance of optical transmission systems.

[0003] If dust or other contaminants are present in the optical path of an optical connector, it cannot withstand high optical energy density, making it prone to problems such as burnout in high-power optical transmission processes. As a result, it significantly affects optical signal transmission. Existing solutions use instruments to detect whether the optical path of the optical connector is abnormal. However, these detection instruments are expensive, require manual detection, and fail to detect abnormalities in a timely manner. discovery It is not possible to do so. Therefore, it is necessary to reduce detection costs and detect anomalies in a timely manner. discovery The method for doing so is a technical problem that those skilled in the art need to solve urgently. [Overview of the Initiative]

[0004] Embodiments of the present invention reduce the cost of detecting optical path anomalies in optical connectors and enable timely detection of anomalies. discovery It is possible like, Optical communication methods and related equipment are disclosed.

[0005] According to a first aspect, an embodiment of the present application provides an optical communication method applicable to an optical communication system. The optical communication system includes a first component, an optical connection assembly, and a second component, the first and second components being connected by the optical connection assembly. The method is The steps include controlling the first component to transmit a first optical signal to the second component via the optical connection assembly, The steps include sending an alarm instruction when it is determined that the optical connection assembly is abnormal based on the optical power fluctuation state of the first optical signal in the transmission process, The steps include: controlling the first component to transmit a second optical signal to the second component if, based on the optical power fluctuation state of the first optical signal in the transmission process, it is determined that the optical connection assembly is normal, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal.

[0006] Optionally, the first optical signal does not damage the optical communication system. Optionally, the optical power of the first optical signal is less than 10 dBm.

[0007] This solution uses a low-power optical signal (i.e., the first optical signal) to detect the optical connection assembly. An alarm is triggered when an anomaly is detected in the optical connection assembly. Once the optical connection assembly is detected as normal, transmission of a high-power optical signal (i.e., the second optical signal) begins. This avoids the problem of the optical connection assembly burning out due to direct transmission of the high-power optical signal before an anomaly is recognized. Furthermore, this solution measures the insertion loss variation of the optical connection assembly based on the optical power fluctuations of the optical signal during the transmission process, and determines whether the optical connection assembly is abnormal based on this variation. Compared to existing solutions that use instruments to detect anomalies in the optical path of the optical connection assembly, this solution eliminates the need for manual detection and expensive detection instruments, making it labor-saving, low-cost, and highly accurate, allowing for timely detection of anomalies. discovery It is possible.

[0008] In possible implementations, the optical power fluctuation state of the first optical signal in the transmission process is determined by the following method: A step of acquiring a first optical power and a second optical power, wherein the first optical power is the optical power of the first optical signal transmitted at a first interface connecting the first component and the optical connection assembly, and the second optical power is the optical power of the first optical signal transmitted at a second interface connecting the second component and the optical connection assembly, A step of calculating the fluctuation state based on the first optical power and the second optical power, It is obtained using [this method].

[0009] Optionally, the step of calculating the fluctuation state based on the first and second optical powers is: A step of calculating a first insertion loss value of the optical connection assembly based on the first optical power and the second optical power, A step of calculating an insertion loss variation value of the optical connection assembly based on the first insertion loss value and the preset insertion loss value of the optical connection assembly, wherein the preset insertion loss value is read from the register of the optical communication system, and the insertion loss variation value indicates the variation state, Includes.

[0010] This solution first calculates the optical power of the first optical signal transmitted through the input and output interfaces of the optical connection assembly to calculate the current insertion loss value of the optical connection assembly, and then calculates the current insertion loss variation value of the optical connection assembly.

[0011] The first component includes a first monitor detector, The first step to obtaining light power is, The step includes calculating the first optical power based on the third optical power and the first fixed value, The third optical power is the optical power of the third optical signal obtained by detection by the first monitor detector, the third optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power, and the first fixed value is pre-stored in a register of the optical communication system.

[0012] The first fixed value is the value of the intrinsic relationship between the first target optical power and the second target optical power in the first component, the first target optical power is the optical power of the first target optical signal obtained by detection by the first monitor detector, the second target optical power is the optical power of the second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power.

[0013] In this solution, the third optical power is easier to obtain than the optical power of the inbound interface of the optical connection assembly. Therefore, since the first optical power is calculated based on the third optical power, the measurement cost can be reduced. Also, in existing implementations, since the third optical signal is an optical signal obtained by splitting the optical signal of the first component based on power, the optical power of the third optical signal obtained by detection by the first monitor detector is used to analyze whether the optical power of the optical signal of the first component is within the normal range. However, in this solution, the first optical power can be calculated based on the optical power obtained by detection by the first monitor detector, and then the insertion loss variation value of the optical connection assembly can be calculated. That is, in this solution, there is no need to add an optical power detection device, and the insertion loss variation value of the optical connection assembly can be calculated based on the existing available data in the optical communication system. In this way, the hardware cost can be reduced, and the existing available data can be reused.

[0014] In a possible implementation, the first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip in the light source, and the optical power at the first interface of the optical signal generated and transmitted by the light source chip is related to the temperature of the light source chip. The step of obtaining the first optical power includes the step of obtaining the current temperature of the light source chip, and the step of determining the first optical power based on the detected temperature.

[0015] In this solution, since it is difficult to measure the optical power at the inbound interface of the optical connection assembly, in this solution, the optical power of the first optical signal transmitted at the inbound interface of the optical connection assembly is determined based on the inherent relationship between the temperature of the light source chip and the optical power at the first interface of the optical signal generated and transmitted by the light source chip. In this way, the measurement cost is reduced.

[0016] In possible implementations, the optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to the drive current and drive voltage of the light source chip. The step of obtaining the first optical power is: The process further includes the step of obtaining the current drive current and current drive voltage of the light source chip, The step of determining the first optical power based on the detected temperature is: The process includes determining the first optical power based on the detected temperature, drive current, and drive voltage.

[0017] Similarly, in this solution, since measuring the optical power at the inbound interface of the optical connection assembly is difficult, the optical power of the first optical signal transmitted at the inbound interface of the optical connection assembly is determined based on the intrinsic relationship between the temperature, drive current, and drive voltage of the light source chip and the optical power at the first interface of the optical signal generated and transmitted by the light source chip. In this way, measurement costs are reduced.

[0018] In possible implementations, the second component includes a second monitor detector, The steps to acquire the second light power are: The step includes calculating the second optical power based on the fourth optical power and a second fixed value, The fourth optical power is the optical power of the fourth optical signal obtained by detection by the second monitor detector, the first optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power, and the second fixed value is pre-stored in the register of the optical communication system.

[0019] Optionally, the second fixed value is the value of the intrinsic relationship between the third target optical power and the fourth target optical power in the second component, the third target optical power is the optical power of the third target optical signal at the second interface in the second component, the fourth target optical power is the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal is an optical signal obtained by dividing the third target optical signal based on power.

[0020] In this solution, the fourth optical power is easier to obtain than the optical power of the outbound interface of the optical connection assembly. Therefore, since the second optical power is calculated based on the fourth optical power, measurement costs can be reduced. In existing implementations, the fourth optical signal is obtained by dividing the first optical signal received from the second component based on its power, and the optical power of the fourth optical signal obtained by detection by the second monitor detector is used to analyze whether the optical power of the received first optical signal is within the normal range. However, in this solution, the second optical power can be calculated based on the optical power obtained by detection by the second monitor detector, and then the insertion loss variation of the optical connection assembly can be calculated. In other words, this solution does not require additional optical power detection equipment and can calculate the insertion loss variation of the optical connection assembly based on existing obtainable data in the optical communication system. In this way, hardware costs are reduced and existing obtainable data can be reused.

[0021] In possible implementations, the optical power fluctuation state of the first optical signal in the transmission process is determined by the following method: A step of calculating the insertion loss variation value of the optical connection assembly based on the fifth optical power, the sixth optical power, the first preset optical power, and the second preset optical power, wherein the insertion loss variation value is obtained using a step that indicates a variation state. The fifth optical power is the optical power of the fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power. The sixth optical power is the optical power of the sixth optical signal, and the sixth optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power. The first preset optical power and the second preset optical power are read from the registers of the optical communication system.

[0022] Optionally, the first component includes a first monitor detector. The fifth optical power is the optical power obtained by performing detection on the fifth optical signal with the first monitor detector. The first preset optical power is the optical power obtained in advance by detection by the first monitor detector based on the test optical signal in the first component.

[0023] Optionally, the second component includes a second monitor detector. The sixth optical power is the optical power obtained by performing detection on the sixth optical signal with the second monitor detector, The second preset optical power is an optical power that is obtained in advance by detection by the second monitor detector based on the test optical signal transmitted to the second component.

[0024] In this solution, the fifth optical power, sixth optical power, first preset optical power, and second preset optical power are all optical powers obtained through measurements performed directly by the monitor detector. The insertion loss variation of the optical connection assembly may be calculated based on the optical power obtained by direct measurement. It is not necessary to calculate the optical power of the first optical signal at the input and output interfaces of the optical connection assembly. This implementation is easy and can improve the efficiency of optical path anomaly detection in the optical connection assembly.

[0025] In a possible implementation, the optical communication system includes an optical module, the first component being an external laser light source (ELS) of the optical module, and the second component being a silicon photonic chip within the optical module.

[0026] In a possible implementation, the optical communication system includes a service board, the first component being an external laser light source (ELS) for the service board, and the second component being The aforementioned This is a silicon photonic chip within a service board, which is configured to process service signals.

[0027] In a possible implementation, the optical communication system includes a backplane component, the first component being a first service board within the backplane component, the second component being a second service board within the backplane component, the optical connection assembly including an optical backplane within the backplane component, the first service board and the second service board being configured to process service signals, and the optical backplane being configured to enable optical communication between the first service board and the second service board.

[0028] In possible implementations, the optical connection assembly includes one or more of the following: optical fiber, optical connector, optical fiber board, optical-electric integrated connector, optical waveguide, etc.

[0029] The optical communication method provided in this solution can be applied to the various different optical communication systems mentioned above, and thus has a wide range of applications.

[0030] According to a second aspect, an embodiment of the present application further provides an optical communication system, the optical communication system is A control unit configured to control a first component and transmit a first optical signal to a second component via an optical connection assembly, wherein the first component and the second component are connected by the optical connection assembly, and the first component, the second component, and the optical connection assembly are components in the optical communication system, An alarm unit configured to send an alarm instruction when it is determined that the optical connection assembly is abnormal based on the optical power fluctuation state of the first optical signal in the transmission process, Includes, The control unit is further configured to control the first component to transmit a second optical signal to the second component if it is determined that the optical connection assembly is normal based on the optical power fluctuation state of the first optical signal in the transmission process, wherein the optical power of the second optical signal is greater than that of the first optical signal.

[0031] In a possible implementation, the optical communication system further includes a first acquisition unit configured to acquire the optical power fluctuation state of the first optical signal in the transmission process, the first acquisition unit specifically, The system acquires a first optical power and a second optical power, wherein the first optical power is the optical power of the first optical signal transmitted at a first interface connecting the first component and the optical connection assembly, and the second optical power is the optical power of the first optical signal transmitted at a second interface connecting the second component and the optical connection assembly. The fluctuation state is calculated based on the first optical power and the second optical power. It is configured in this way.

[0032] In a possible implementation, the first component includes a first monitor detector, The aforementioned first acquisition unit is, specifically, The system is configured to calculate the first optical power based on the third optical power and the first fixed value. The third optical power is the optical power of the third optical signal obtained by detection by the first monitor detector, the third optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power, and the first fixed value is pre-stored in a register of the optical communication system.

[0033] In a possible implementation, the first fixed value is the value of the intrinsic relationship between the first target optical power and the second target optical power in the first component, the first target optical power is the optical power of the first target optical signal obtained by detection by the first monitor detector, the second target optical power is the optical power of the second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power.

[0034] In possible implementations, the first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip within the light source, and the optical power at the first interface of the optical signal generated and transmitted by the light source chip is related to the temperature of the light source chip. The aforementioned first acquisition unit is, specifically, The current temperature of the light source chip is obtained, The system is configured to determine the first optical power based on the current temperature.

[0035] In possible implementations, the optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to the drive current and drive voltage of the light source chip. The aforementioned first acquisition unit is, specifically, The system is configured to acquire the current drive current and current drive voltage of the aforementioned light source chip. Determining the first optical power based on the detected temperature is: The method includes determining the first optical power based on the detected temperature, drive current, and drive voltage.

[0036] In possible implementations, the second component includes a second monitor detector, The aforementioned first acquisition unit is, specifically, The system is configured to calculate the second optical power based on the fourth optical power and a second fixed value. The fourth optical power is the optical power of the fourth optical signal obtained by detection by the second monitor detector, the first optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power, and the second fixed value is pre-stored in the register of the optical communication system.

[0037] In a possible implementation, the second fixed value is the value of the intrinsic relationship between the third target optical power and the fourth target optical power in the second component, the third target optical power is the optical power of the third target optical signal at the second interface in the second component, the fourth target optical power is the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal is an optical signal obtained by dividing the third target optical signal based on power.

[0038] In possible implementations, the first acquisition unit specifically, Based on the first optical power and the second optical power, the first insertion loss value of the optical connection assembly is calculated. Based on the first insertion loss value and the preset insertion loss value of the optical connection assembly, the insertion loss variation value of the optical connection assembly is calculated, the preset insertion loss value is read from the register of the optical communication system, and the insertion loss variation value indicates the variation state. It is configured in this way.

[0039] In a possible implementation, the optical communication system further includes a second acquisition unit configured to acquire the optical power fluctuation state of the first optical signal in the transmission process, the second acquisition unit specifically, Based on the fifth optical power, sixth optical power, first preset optical power, and second preset optical power, the insertion loss variation value of the optical connection assembly is calculated, and the system is configured such that the insertion loss variation value indicates a state of variation. The fifth optical power is the optical power of the fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power. The sixth optical power is the optical power of the sixth optical signal, and the sixth optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power. The first preset optical power and the second preset optical power are read from the registers of the optical communication system.

[0040] In a possible implementation, the first component includes a first monitor detector, The fifth optical power is the optical power obtained by performing detection on the fifth optical signal with the first monitor detector. The first preset optical power is the optical power obtained in advance by detection by the first monitor detector based on the test optical signal in the first component.

[0041] In possible implementations, the second component includes a second monitor detector, The sixth optical power is the optical power obtained by performing detection on the sixth optical signal with the second monitor detector, The second preset optical power is an optical power that is obtained in advance by detection by the second monitor detector based on the test optical signal transmitted to the second component.

[0042] In possible implementations, the optical connection assembly includes one or more of the following: optical fiber, optical connector, optical fiber board, optical-electric integrated connector, optical waveguide, etc.

[0043] According to a third aspect, the present application provides an optical interconnect processing device including a processor and memory configured to implement the method and possible implementation of the first aspect. The memory is coupled to the processor. When the processor executes a computer program stored in the memory, Optical interconnection processing The device is made capable of performing either the first embodiment or any one of the possible implementations of the first embodiment.

[0044] The device may further include a communication interface. The communication interface is configured for communication between the device and another device. For example, the communication interface may be a transceiver, a circuit, a bus, a module, a pin, or another type of communication interface. The communication interface includes a receiving interface and a transmitting interface. The receiving interface is configured to receive messages, and the transmitting interface is configured to transmit messages.

[0045] In a possible implementation, the device is a component within an optical communication system, the optical communication system includes a first component, an optical connection assembly, and a second component, the first and second components being connected by the optical connection assembly. The device is, Memory configured to store computer programs, Processor and The processor may include the first component, The first optical signal is transmitted to the second component using the optical connection assembly. Based on the optical power fluctuation state of the first optical signal in the transmission process, the insertion loss fluctuation value of the optical connection assembly is obtained, and the insertion loss fluctuation value indicates the variation in the insertion loss of the optical connection assembly compared with a preset insertion loss value. If it is determined that the optical connection assembly is abnormal based on the insertion loss variation value, an alarm instruction is sent. If, based on the insertion loss variation value, the optical connection assembly is determined to be normal, the first component is controlled to transmit a second optical signal to the second component, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal. It is configured in this way.

[0046] The computer program in memory in this application may be stored in advance or downloaded from the Internet and stored when the device is in use. The source of the computer program in memory is not particularly limited in this application. The coupling in this embodiment of this application is an indirect coupling or connection of an electrical, mechanical, or other form between devices, units, or modules, and is used for information exchange between devices, units, or modules.

[0047] According to the fourth aspect, the present application provides a communication device. The communication device includes an optical communication system, and the optical communication system is according to the second aspect. or second aspect It is an optical communication system described in one of the implementations.

[0048] According to a fifth aspect, the present invention provides a communication device comprising a first service board, a second service board, and an optical backplane, wherein the first service board and the second service board are connected by the optical backplane. Based on the first aspect, the communication device comprises the first service board, the second service board, and the optical backplane. or the first aspect An optical communication method is implemented using one of the following implementations.

[0049] The first service board is, in the first aspect or the first aspectA first component in an optical communication method implemented by any of the following, wherein the second service board is a first embodiment or the first aspect A second component in an optical communication method implemented by any of the following, wherein the optical backplane is a first embodiment or the first aspect This is an optical connection assembly in an optical communication method implemented by one of the following.

[0050] According to the sixth aspect, the present application provides a computer-readable storage medium which stores a computer program, and when the computer program is executed by a processor, the first aspect or the first aspect either A method is implemented using possible implementations.

[0051] According to the seventh aspect, the present application provides a computer program product including a computer program. When the computer program is executed by a processor, the computer, according to the first aspect or the first aspect This makes it possible to implement one of the methods described.

[0052] It is understood that all entities provided in the second through seventh embodiments are configured to implement the methods provided in any implementation of the first embodiment. Therefore, for the advantageous effects that can be achieved by the entities, refer to the advantageous effects in the corresponding methods. Further details are not provided here. [Brief explanation of the drawing]

[0053] [Figure 1] This is a diagram of an optical communication system according to an embodiment of the present invention. [Figure 2] This is a diagram of an optical communication system according to an embodiment of the present invention. [Figure 3] This is a diagram of an optical communication system according to an embodiment of the present invention. [Figure 4] This is a diagram of an optical communication system according to an embodiment of the present invention. [Figure 5] This is a diagram of an optical communication system according to an embodiment of the present invention.

[0054] [Figure 6A] This is a diagram of a backplane component according to an embodiment of the present invention. [Figure 6B] This is a diagram of a backplane component according to an embodiment of the present invention. [Figure 6C] This is a diagram of a backplane component according to an embodiment of the present invention. [Figure 6D] This is a diagram of a backplane component according to an embodiment of the present invention.

[0055] [Figure 7] This is a diagram of an optical communication system according to an embodiment of the present invention.

[0056] [Figure 8] This is a schematic flowchart of the optical communication method according to the embodiment of the present invention.

[0057] [Figure 9] This is a diagram of an optical communication system according to an embodiment of the present invention.

[0058] [Figure 10] This is a diagram of the relationship curve according to the embodiment of the present application;

[0059] [Figure 11] This is a diagram showing the logic structure of the device according to the embodiment of the present invention;

[0060] [Figure 12] This is a diagram showing the hardware structure of the device according to an embodiment of the present invention.

[0061] [Figure 13] This is a diagram showing the structure of a communication device according to an embodiment of the present invention. [Modes for carrying out the invention]

[0062] The embodiments of this application will be described below with reference to the attached drawings.

[0063] First, an optical communication system provided in an embodiment of the present application will be described. For example, as shown in Figure 1, with reference to Figure 1, the optical communication system 100 provided in this embodiment of the present application includes a first component 101, an optical connection assembly 102, and a second component 103. The first component 101 and the second component 103 are connected by the optical connection assembly 102. That is, the optical signal of the first component 101 is transmitted to the second component 103 via the optical connection assembly 102.

[0064] The optical connection assembly 102 may include one or more of the following: optical fiber, optical connector, optical fiber board, optical waveguide, optical-electrical integrated connector, optical backplane, etc.

[0065] Refer to Figure 2. In a possible implementation, for example, the optical communication system 100 includes a light source 101, an optical connection assembly 102, and a silicon photonic chip 103. The light source 101 corresponds to a first component 101, and the silicon photonic chip 103 corresponds to a second component 103.

[0066] The light source 101 is configured to generate an optical signal. The generated optical signal passes through the optical connection assembly 102 and is then input to the silicon photonic chip 103. The silicon photonic chip 103 is configured to process the received optical signal. For example, the silicon photonic chip 103 can perform processing such as electro-optical modulation on the received optical signal. For example, the silicon photonic chip 103 includes a silicon photonic modulator, which can perform electro-optical modulation of the optical signal.

[0067] For example, the light source 101 may be an external laser source (ELS), and the external laser source may be connected to the optical connection assembly 102 in a pluggable manner.

[0068] In a possible implementation, the optical communication system 100 shown in Figure 2 includes an optical module. The optical connection assembly 102 and the silicon photonic chip 103 are included in the optical module. The light source 101 may be an external laser source of the optical module and is connected to the optical connection assembly 102 within the optical module in a pluggable manner.

[0069] The optical module is configured to perform conversions between optical signals and electrical signals. Specifically, the optical module can modulate an electrical signal into an optical signal for transmission. In a particular implementation, the optical signal generated by the light source 101 passes through the optical connection assembly 102 of the optical module and is then input to the silicon photonic chip 103 of the optical module. The silicon photonic chip 103 of the optical module modulates the electrical signal into a received optical signal using a silicon photonic modulator for transmission. Furthermore, the optical module can further convert the received optical signal into an electrical signal and demodulate the electrical signal. This is not specifically limited in this application.

[0070] Refer to Figure 3. In another possible implementation, for example, the optical communication system 100 includes a light source 101 and a service board 110, the service board 110 including an optical connection assembly 102 and a silicon photonic chip 103. Similarly, the light source 101 corresponds to the first component 101 described above, and the silicon photonic chip 103 corresponds to the second component 103 described above.

[0071] In a particular implementation, the light source 101 is an external laser source for the service board 110. That is, the light source 101 is connected to the optical connection assembly 102 in a pluggable manner to perform connection to the service board 110. The service board 110 is configured to process service signals, for example, by performing modulation and demodulation of optical signals. This is not limited to the present invention.

[0072] In possible implementations, the silicon photonic chip 103 within the service board 110 may be an on-board optics (OBO) module, a near-package optics (NPO) module, a co-package optics (CPO) assembly, an optics electronic integrated circuit (OEIC), etc. Alternatively, the silicon photonic chip 103 may include a silicon photonic modulation chip within the OBO module, NPO module, CPO assembly, or OEIC, and the silicon photonic modulation chip may include a silicon photonic modulator.

[0073] Furthermore, the OBO module, NPO module, CPO assembly, or OEIC may be configured to perform conversion between optical signals and electrical signals. Specifically, the OBO module, NPO module, CPO assembly, or OEIC may use a silicon photonic modulation chip to modulate an electrical signal into an optical signal for transmission, or it may use a silicon photonic demodulation chip to convert a received optical signal into an electrical signal and perform demodulation. The entire silicon photonic modulation chip and silicon photonic demodulation chip within the OBO module, NPO module, CPO assembly, or OEIC may be referred to as an optical / electrical conversion unit, and the optical / electrical conversion unit may be referred to as an optical engine (OE).

[0074] Figure 4 is a diagram of the service board 110, showing an example where the silicon photonic chip 103 includes an OBO module. As shown in Figure 4, the service board 110 further includes a processing chip 104 and an optical I / O interface 105, in addition to the OBO module 103 and the optical connection assembly 102.

[0075] The processing chip 104 may be a Central Processing Unit (CPU), a Digital Signal Processor (DSP), an Application-Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or another programmable logic element, transistor logic element, hardware component, or any combination thereof. Alternatively, the processor may be a combination that implements computing functions, for example, a combination including one or more microprocessors, a microcontroller unit (MCU), and a digital signal processor, or any combination thereof. Alternatively, the processing chip 104 may be a general-purpose processor or the like.

[0076] The optical input / output (I / O) interface 105 is configured to output optical signals processed by the OBO module 103, and may output optical signals modulated from electrical signals, for example.

[0077] Furthermore, as can be seen from Figure 4, the service board 110 may include a plurality of OBO modules 103, a plurality of optical connection assemblies 102, and a plurality of optical I / O interfaces 105. The quantity of OBO modules 103, optical connection assemblies 102, and optical I / O interfaces 105 included in the service board 110 is not limited to this embodiment of the present application.

[0078] In a specific implementation, the optical connection assembly 102 in the service board 110, as shown in Figure 4, is connected to the light source 101. The optical signal generated by the light source 101 passes through the optical connection assembly 102 of the service board 110 and is then input to the OBO module 103 of the service board 110. The processing chip 104 also transmits an electrical signal to the OBO module 103. The OBO module 103 then uses a silicon optical modulator to modulate the electrical signal from the processing chip 104 into an optical signal from the light source 101, and transmits the modulated optical signal via the optical I / O interface 105.

[0079] The OBO module in Figure 4 may be replaced with the NPO module described above. For details on the functions of the NPO module, please refer to the OBO module. Further details are not provided here.

[0080] Figure 5 is a diagram of the service board 110, showing an example where the silicon photonic chip 103 includes a CPO assembly. As shown in Figure 5, the service board 110 includes a CPO assembly 103, an optical connection assembly 102, and an optical I / O interface 104.

[0081] The CPO assembly 103 includes a processing module 1031 and a plurality of optical engines 1032. The processing module 1031 may be a Central Processing Unit (CPU), a Digital Signal Processor (DSP), an Application-Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or another programmable logic element, transistor logic element, hardware component, or any combination thereof. Alternatively, the processing module 1031 may be a combination that implements computing functions, for example, a combination including one or more microprocessors, a microcontroller unit (MCU), and a digital signal processor, or any combination thereof. Alternatively, the processing module 1031 may be a general-purpose processor, etc. See the description herein for the processing modules described below. Details are not described again here.

[0082] The optical I / O interface 104 is configured to output optical signals processed by the optical engine 1032, and may output optical signals modulated from electrical signals, for example.

[0083] Furthermore, as can be seen from Figure 5, the service board 110 may include a plurality of optical connection assemblies 102 and a plurality of optical I / O interfaces 104. The number of optical connection assemblies 102 and optical I / O interfaces 104 included in the service board 110 is not limited to this embodiment of the present application.

[0084] In a specific implementation, the optical connection assembly 102 in the service board 110, as shown in Figure 5, is connected to the light source 101. The optical signal generated by the light source 101 passes through the optical connection assembly 102 in the service board 110 and is then input to the optical engine 1032 in the CPO assembly 103. Furthermore, the processing module 1031 in the CPO assembly 103 transmits an electrical signal to the optical engine 1032. The optical engine 1032 then uses a silicon optical modulator to modulate the electrical signal from the processing module 1031 into an optical signal from the light source 101, and transmits the modulated optical signal via the optical I / O interface 104.

[0085] In another possible implementation, the optical communication system 100 includes a backplane component. The backplane component includes a backplane, service board 1, and service board 2, the two service boards may be connected to the backplane in a pluggable manner. Communication between the two service boards can be carried out by exchanging transmission signals between the service boards via the backplane. Specifically, the backplane includes an optical backplane and an electrical backplane. The optical backplane includes optical connectors, and the electrical backplane includes electrical connectors. The optical connectors in the optical backplane are configured to connect to optical interfaces in the service boards for transmitting optical signals. The electrical connectors in the electrical backplane are configured to connect to electrical interfaces in the service boards for transmitting electrical signals.

[0086] To facilitate understanding of the backplane in the aforementioned backplane component, Figures 6A and 6B are referenced as examples. Figure 6A is an exemplary plan view of the backplane. Figure 6B is an exemplary side view of the backplane. It can be seen that the optical backplane 610 is located on the electrical backplane 620. The optical backplane 610 includes a plurality of optical connectors 611. The electrical backplane 620 includes a plurality of electrical connectors 621.

[0087] In other possible implementations, the optical backplane 610 and the electrical backplane 620 may be arranged in parallel or optoelectronically integrated. See, for example, Figures 6C and 6D. Figure 6C is a diagram of an example configuration in which the optical backplane 610 and the electrical backplane 620 are arranged in parallel within the backplane. Figure 6D is a diagram of an example configuration in which the optical backplane 610 and the electrical backplane 620 are optoelectronically integrated within the backplane.

[0088] Figure 7 shows a connection diagram between two service boards and a backplane, using service boards 1 and 2 of the backplane components as examples, to facilitate understanding of the connection relationship between the service boards and the backplane. For example, the backplane is shown in a stacked configuration of the optical backplane 610 and the electrical backplane 620 shown in Figure 6B. It can be seen that both service boards 1 and 2 include electrical and optical interfaces. The electrical interface is configured to connect to the electrical connector 621 of the electrical backplane 620, and the optical interface is configured to connect to the optical connector 611 of the optical backplane 610. After being connected to the backplane, service boards 1 and 2 can communicate with each other via the backplane.

[0089] In possible implementations, the structural system shown in Figure 7 may be an optical communication system 100. Specifically, in Figure 7, service board 1 may correspond to the first component 101 in the optical communication system 100, and service board 2 may correspond to the second component 103 in the optical communication system 100. In addition, the backplane and the optical connections within the backplane that connect service boards 1 and 2 may be included. Ko The connector, optical fiber (optical waveguide), etc., correspond to the optical connection assembly 102 in the optical communication system 100.

[0090] In possible implementations, service board 1 or service board 2 may be connected to other components in addition to being connected to the backplane, such as an external laser source. This is not limited to the embodiments of the present application.

[0091] In possible implementations, the backplane component may further include other service boards, which may be connected to the backplane in the same way as service board 1 and service board 2. The number of service boards included in the backplane is not limited herein.

[0092] It should be noted that the optical communication systems applicable to this application are not limited to the optical communication system 100 described above. The optical communication system 100 described above is merely an example and does not constitute a limitation on the embodiments of this application.

[0093] From the above description, it can be seen that the first component and the second component are connected by an optical connection assembly. The optical connection assembly can realize an optical fiber connection between the first component and the second component. However, contaminants such as dust can easily accumulate in the optical path used to realize the optical fiber connection in the optical connection assembly, affecting optical signal transmission. In high-power optical transmission scenarios, the contaminants cannot withstand the high optical energy density, which can cause the optical path to burn out. Therefore, a method for detecting abnormalities in the optical path in the optical connection assembly in a timely and low-cost manner is an urgent technical challenge that needs to be addressed. To solve this problem, embodiments of the present invention provide an optical communication method and related equipment. This method can be applied, for example, to the optical communication system described above.

[0094] In some embodiments, the implementing body of the optical communication method provided in the embodiments of the present application may be a first component in the optical communication system. For example, if the first component is a light source 101 and the light source 101 includes a processing chip, the optical communication method provided in the embodiments of the present application may be implemented by the processing chip. Alternatively, for example, if the first component is a service board 1 and the service board 1 includes a processing chip, the optical communication method provided in the embodiments of the present application may be implemented by the processing chip.

[0095] In another embodiment, the implementer of the optical communication method provided in the embodiment of the present application may be a second component in the optical communication system. For example, if the second component is a silicon photonic chip 103, the optical communication method provided in the embodiment of the present application may be implemented by a processing chip within the silicon photonic chip 103. The silicon photonic chip includes the OBO module, CPO assembly, NPO module, etc., as described above. Alternatively, for example, if the second component is a service board 2 and the service board 2 includes a processing chip, the optical communication method provided in the embodiment of the present application may be implemented by the processing chip.

[0096] In another possible implementation, the optical communication system further includes, in addition to the first component, the optical connection assembly, and the second component, another module having processing capabilities (abbreviated as a processing module). In this case, the entity executing the optical communication method provided in the embodiments of the present application may be the processing module. Refer to Figure 4. For example, the optical communication system 100 further includes a processing chip 104. In this case, the entity executing the optical communication method provided in the embodiments of the present application may be the processing chip 104. Refer to Figure 7. For example, the optical communication system 100 further includes, in addition to the service boards 1 and 2 shown in Figure 7, a service board 3 (not shown in Figure 7). The service board 3 has processing capabilities. The service board 3 may be connected to a backplane, similar to the service boards 1 and 2, and communicate with the service boards 1 and 2 via the backplane. In this case, the entity executing the optical communication method provided in the embodiments of the present application may be the service board 3.

[0097] In another possible implementation, the implementer of the optical communication method provided in the embodiment of the present invention may be a combination of multiple devices, modules, or chips having processing capabilities in the optical communication system.

[0098] The above-mentioned implementer is merely an example. The implementer of the optical communication method provided in the embodiments of this application may be any device, module, or chip having processing capabilities in the optical communication system, or a combination of multiple devices, modules, or chips having processing capabilities in the optical communication system. This is not limited to the embodiments of this application. In the following description, the implementer of the optical communication method will be abbreviated as processing device.

[0099] Refer to Figure 8. The optical communication method provided in the embodiments of the present invention includes, but is not limited to, the following steps.

[0100] S801: Controls the first component to transmit the first optical signal to the second component via the optical connection assembly.

[0101] From the above explanation, it can be seen that the first component is connected to the second component through an optical connection assembly. Before the first component can successfully transmit an optical signal to the second component, it is possible to first verify whether the optical path of the optical connection assembly connecting the first and second components is normal. Specifically, the processing equipment can test the optical path of the optical connection assembly by controlling the first component to transmit a test optical signal (i.e., the first optical signal) to the second component.

[0102] For example, after the first component is inserted into the optical connection assembly and the initialization of the first component is complete, the first component can transmit a first optical signal to the second component. Alternatively, for example, after receiving an instruction to transmit a high-power optical signal to the second component, the first component can first transmit a first optical signal to the second component to test the optical path. Alternatively, for example, the first component can periodically receive an optical path test instruction from a processing device, and after receiving the instruction, the first component can transmit a first optical signal to the second component via the optical connection assembly. Alternatively, for example, the first optical signal is transmitted to the first component (for example, the service board 1 shown in Figure 7) by another component (for example, an external laser source). After receiving the first optical signal, i.e., after receiving the optical path test instruction, the first component transmits a first optical signal to the second component via the optical connection assembly.

[0103] For example, a high-power optical signal may be an optical signal with an optical power greater than 10 dBm. The first optical signal may be a low-power optical signal, for example, an optical signal with an optical power of less than 10 dBm. Therefore, the first optical signal will not damage the optical communication system. Note that the optical power of the high-power and low-power optical signals is not limited to the optical power described herein. In a particular implementation, the device may allow... possibleThe high and low power value ranges may be adaptively adjusted based on the optical power. This is not limited to the present embodiment of the application.

[0104] S802: If it is determined that the optical connection assembly is abnormal based on the optical power fluctuation state of the first optical signal in the transmission process, an alarm instruction is sent.

[0105] The first component transmits a first optical signal to a second component via an optical connection assembly, and insertion loss occurs as the optical signal passes through the optical connection assembly. Furthermore, if the optical path of the optical connection assembly is contaminated with dust or other contaminants, the insertion loss increases. In possible implementations, it is possible to determine whether the optical path of the optical connection assembly is contaminated by calculating the insertion loss variation of the optical connection assembly. The insertion loss variation can indicate the optical power fluctuation state of the first optical signal during the transmission process. Embodiments of this application provide several methods for calculating the insertion loss variation of an optical connection assembly. Different cases are described below, and detailed explanations are omitted.

[0106] The processing device may determine whether the optical path of the optical connection assembly is normal by obtaining the insertion loss variation value of the optical connection assembly by calculation based on the first optical signal, and then determining whether the insertion loss variation value is within a preset range. The preset range may be smaller than a threshold. For example, the threshold may be any value between -10 and 10. In a particular implementation, the value of the threshold may be determined based on the actual situation. The value of the threshold is not limited to this embodiment of the present application.

[0107] If the insertion loss variation exceeds a preset range, it indicates that the optical path of the optical connection assembly is abnormal. The processing equipment sends an alarm instruction based on the determination result. For example, an alarm instruction may be sent to an indicator, causing the indicator to generate an alarm (e.g., a red light illuminates). Alternatively, an alarm instruction may be sent to a buzzer, causing the buzzer to sound and generate an alarm. Furthermore, if the optical communication system includes a liquid crystal display, an instruction may be sent to the liquid crystal display to display alarm information. Specific alarm methods are not limited in this application.

[0108] S803: Based on the optical power fluctuation state of the first optical signal in the transmission process, if it is determined that the optical connection assembly is normal, the first component is controlled to transmit the second optical signal to the second component. Here, the optical power of the second optical signal is greater than the optical power of the first optical signal.

[0109] If the insertion loss variation of the optical connection assembly is within a preset range, the processing equipment determines that the optical path of the optical connection assembly is normal and uncontaminated. In this case, the processing equipment may control the first component to transmit an optical signal (i.e., a second optical signal) to the second component in a normal manner. The second optical signal may be a high-power optical signal, and the optical power of the second optical signal may be greater than the optical power of the first optical signal.

[0110] In other possible implementations, if insertion loss increases due to contamination such as dust in the optical path of the optical connection assembly, the optical power of the first optical signal received by the second component decreases. In this case, whether the optical path of the optical connection assembly is contaminated may be determined based on a fluctuation state obtained by comparing the optical power of the first optical signal received by the second component with a preset received optical power, and whether the optical connection assembly is abnormal. The optical power fluctuation state may indicate the fluctuation state of the optical power of the first optical signal in the transmission process. For example, the difference between the optical power of the first optical signal received by the second component and a preset received optical power may be calculated, and it may be determined whether the difference is within a preset range.

[0111] If this difference exceeds the preset range, it indicates an abnormality in the optical path. In this case, the processing equipment sends an alarm based on the determination result.

[0112] If this difference is within the preset range, it indicates that there is no abnormality in the optical path. In this case, the processing equipment may control the first component to transmit the optical signal (i.e., the second optical signal) to the second component in the correct manner.

[0113] For example, the pre-set received optical power and preset range may be stored in the memory of the optical system.

[0114] In the embodiments of this invention, the optical path status of the optical connection assembly may be detected using a low-power optical signal. If the optical path is abnormal, an alarm is generated. If the optical path is normal, the transmission of a high-power optical signal is initiated. This allows for the recognition of an abnormality in the optical path of the optical connection assembly. without This avoids the problem of high-power signals being transmitted directly and burning out the optical path of the optical connection assembly.

[0115] Furthermore, in this embodiment of the present application, the insertion loss variation of the optical connection assembly is measured based on the power of the transmitted optical signal, and it is determined whether or not the optical path of the optical connection assembly is abnormal based on the insertion loss variation. Compared to existing solutions that use instruments to detect whether or not the optical path of the optical connection assembly is abnormal, this solution is labor-saving, low-cost, and has high detection accuracy, so abnormalities can be detected in a timely manner. discovery It is possible.

[0116] The following describes an implementation for calculating the insertion loss variation of an optical connection assembly in different cases. In this embodiment, the explanation uses an example where the optical power unit is decibel-milliwatt (dBm) and the insertion loss unit is decibel (dB).

[0117] In possible implementations, the insertion loss variation of the optical connection assembly may be calculated based on a first optical power and a second optical power. The first optical power is the optical power of the first optical signal transmitted at the first interface connecting the first component and the optical connection assembly, and the second optical power is the optical power of the first optical signal transmitted at the second interface connecting the second component and the optical connection assembly. Several specific implementations will be described below using embodiments.

[0118] In possible implementations, the first and second components include monitor detectors. The monitor detector included in the first component may be called the first monitor detector, and the monitor detector included in the second component may be called the second monitor detector.

[0119] For example, the first monitor detector and the second monitor detector may be monitor photodiodes (MPDs).

[0120] In a particular implementation, there is a single optical signal (referred to as the target optical signal). The target optical signal may be an optical signal generated by the light source of the first component, or it may be an optical signal input to the first component by another component (for example, an external laser source connected to the first component). In the first component, the target optical signal may be split into two optical signals based on power. For example, the target optical signal may be split into two optical signals using a coupler or an optical splitter.

[0121] The optical signal with the higher optical power of the two optical signals is the first optical signal, which is output from the first component to the optical connection assembly and transmitted to the second component via the optical connection assembly. The first monitor detector of the first component receives the optical signal with the lower optical power of the two optical signals (referred to as the third optical signal). The first monitor detector performs detection on the third optical signal to determine its optical power, and the optical power obtained by detection is sometimes referred to as the third optical power.

[0122] Furthermore, the first optical signal is input to the second component via an optical connection assembly. After receiving the first optical signal, the second component can split the received first optical signal into two optical signals based on their power. For example, a coupler or optical splitter may be used to split the received first optical signal into two optical signals. The second monitor detector of the second component receives the optical signal with the lower optical power of the two optical signals (referred to as the fourth optical signal). The second monitor detector performs detection on the fourth optical signal to determine its optical power, and the optical power obtained by detection is sometimes referred to as the fourth optical power.

[0123] Furthermore, the optical signal with the higher optical power obtained by splitting the received first optical signal can be used for other processing. For example, it may be input to a silicon optical modulator for optical modulation. However, the use of the optical signal with the higher optical power is not limited in this application.

[0124] Refer to Figure 9 for easier understanding. Figure 9 uses an example where the optical signal generated by the light source in the first component is the target optical signal. As shown in Figure 9, the first component 101 includes a light source chip, a first monitor detector, and a first interface. The target optical signal may be generated by the light source chip. After generating the target optical signal, the light source chip may split the target optical signal into two signals (a first optical signal and a third optical signal). The third optical signal is input to the first monitor detector, and the first optical signal is transmitted to the first interface. The first interface is connected to the optical connection assembly 102. In this case, the first optical signal may be input to the optical connection assembly 102 via the first interface and transmitted to the second component 103 via the optical connection assembly 102.

[0125] For example, the first monitor detector may be integrated into the light source chip. Alternatively, the first monitor detector and the light source chip may be bundled together in the first component.

[0126] In another possible implementation, the first component 101 may not include a light source chip, and the first optical signal may be input to the first component from another component (e.g., an external laser source connected to the first component). Similarly, after receiving the first optical signal, the first component splits the first optical signal into two signals. One signal is input to the first monitor detector. The other signal is transmitted to the first interface, transmitted to the second interface via the optical connection assembly 102, and input to the second component.

[0127] Furthermore, as shown in Figure 9, the second component 103 includes a second interface, a second monitor detector, and a processing module. The first optical signal transmitted from the first component 101 via the optical connection assembly 102 is input to the second component via the second interface. After receiving the first optical signal via the second interface, the second component splits the received first optical signal into two signals. One optical signal (the fourth optical signal) is input to the second monitor detector, and the other optical signal is sent to the processing module for processing. The processing module may be, for example, a silicon photonic modulator or other processing chip. This is not limited to this embodiment of the present application.

[0128] For example, the first optical signal, after being input via the second interface, is first input to an optical coupler, which splits the first optical signal into two optical signals. One signal is input to a second monitor detector, and the other signal is input to a processing module. The second monitor detector may be positioned closer to the optical coupler to obtain more accurate optical power measurements of the optical signal obtained by detection.

[0129] First monitor detector by Perform detection on the third optical signal. By After obtaining the third optical power, the optical power of the transmitted first optical signal at the first interface connecting the first component and the optical connection assembly is calculated based on the third optical power; that is, the first optical power is calculated. do .

[0130] For example, obtaining the third optical signal and the first optical signal by splitting the target optical signal based on power may be to obtain the third optical signal and the first optical signal by splitting the target optical signal based on a preset optical power ratio. The preset optical power ratio may be determined based on the component that splits the target optical signal. The preset optical power ratio can be represented by q. Let the optical power of the first optical signal obtained by splitting be represented by p1, and the optical power of the third optical signal obtained by splitting, that is, the third optical power, be represented by p2. Also, let the units of the optical powers p1 and p2 be milliwatt (mW). In this case, the relationship between p1 and p2 is p1 / p2 = q.

[0131] When converting the units of the optical powers p1 and p2 to dBm, p1 / p2 = q becomes 10log 10 (p1 / p2) = 10log 10 (q). Also, since q is known, 10log 10 (q) is a constant, and Q is a constant. In this case, 10log 10 (p1 / p2) = 10log 10 (q) is 10log 10 (p1) - 10log 10 (p2) = Q. 10log 10 (p1) is the optical power value of the first optical signal obtained by splitting with the optical power unit in dBm, and can be represented by P1, that is, P1 = 10log 10 (p1). Similarly, 10log 10 (p2) is the optical power value of the third optical signal obtained by splitting with the optical power unit in dBm, and can be represented by P2, that is, P2 = 10log 10 (p2). Therefore, P1 - P2 = Q.

[0132] In the above formula P1 - P2 = Q, P2 is for splitting the target optical signal KoThis is the optical power of the third optical signal output by the component. After being output from the optical splitting component, the third optical signal needs to be further transmitted to the first optical monitor detector. There is a certain power loss in this transmission process, and this loss can be represented by Q1. In this case, the third optical power obtained by performing detection on the third optical signal by the first monitor detector is P2 - Q1. That is, P2 = third optical power + Q1.

[0133] Furthermore, the first optical power is the optical power of the first optical signal transmitted through the first interface. In the process of transmitting the first optical signal obtained by division to the first interface, a certain power loss exists, and this loss can be represented as Q2. Therefore, in order to obtain the first optical power, it is necessary to subtract the power loss Q2 from the optical power calculated from the first optical signal obtained by division. That is, first optical power = P1 - Q2, and P1 = first optical power + Q2.

[0134] Based on the above explanation, P1-P2=Q can be converted to (first optical power + Q2)-(third optical power + Q1)=Q, and therefore first optical power = third optical power + (Q+Q1-Q2). Normally, the values ​​of losses Q1 and Q2 are within a specific range, and the values ​​of Q1 and Q2 can be determined by testing. In this case, if the values ​​of Q, Q1, and Q2 are known, then Q+Q1-Q2 also becomes a constant, and α is used to represent the constant, i.e., α=Q+Q1-Q2. In this case, first optical power = third optical power + α, and α may be stored in a register for later calculations.

[0135] In another embodiment, α is considered a parameter in the first component, which represents an intrinsic relationship between a first target optical power and a second target optical power in the first component. The first target optical power (e.g., third optical power) is the optical power of the first target optical signal (e.g., third optical signal) obtained by detection by a first monitor detector. The second target optical power (e.g., first optical power) is the optical power of the second target optical signal (e.g., first optical signal) transmitted in the first interface. The first and second target optical signals are two optical signals obtained by dividing a single optical signal in the first component (e.g., the target optical signal shown in Figure 9) based on power. In this case, α can also be obtained by testing, and then α may be stored in a register for later calculations.

[0136] For example, α may be stored in a register of the first component, or in a register corresponding to a processing device for performing the optical communication method provided in the embodiments of the present application. In a particular implementation, the processing device may retrieve α from the register storing α.

[0137] Based on the above explanation, in certain implementations, α is known and the third optical power can be obtained by detection by the first detector, so the first optical power can be calculated quickly.

[0138] Second monitor detector by Perform detection on the fourth optical signal. to do by The After obtaining the fourth optical power, the optical power of the transmitted first optical signal at the second interface connecting the second component and the optical connection assembly is calculated based on the fourth optical power, i.e., the second optical power is calculated. do .

[0139] For example, obtaining a fourth optical signal by dividing a received first optical signal by a second component based on power may be equivalent to obtaining a fourth optical signal by dividing the first optical signal based on a preset optical power ratio. Similarly, the preset optical power ratio may be determined based on the component dividing the first optical signal. The preset optical power ratio can be represented by k. In the second interface, the optical power of the first optical signal received by the second component, i.e., the second optical power, is represented by p3, and the optical power of the fourth optical signal obtained by division is represented by p4. The units of optical power p3 and p4 are milliwatts (mW). In this case, the relationship between p3 and p4 is p 3 / p 4 =k.

[0140] When the units of optical power p3 and p4 are converted to dBm, the formula p3 / p4=k becomes 10log 10 (p3 / p4) = 10log 10 It can be converted to (k). Also, since k is known, 10log 10 (k) is a constant, and K may be used to represent a constant. In this case, 10log 10 (p3 / p4) = 10log 10 (k) is 10log 10 (p3)-10log 10 (p4) = K. 10log 10 (p3) is the second unit of light power, with dBm as the unit. optical signals This is the optical power value, which can be expressed by P3, i.e., P3 = 10log 10 (p3) is obtained. Similarly, 10log 10 (p4) is the optical power value of the fourth optical signal obtained by division with the optical power unit being dBm, and can be represented as P4, i.e., P4 = 10log 10 (p4) Therefore, P3-P4=K and P3=P4+K.

[0141] In the above equation P3 = P4 + K, P4 divides the received optical signal. Ko This is the optical power of the fourth optical signal output by the component. After being output from the optical splitting component, the fourth optical signal is further split into the second optical signal. Mo The signal needs to be transmitted to the Nita detector. This transmission process involves a certain power loss, which can be represented by K'. That is, P4 is equal to the sum of the loss K' and the fourth optical power obtained when the second monitor detector performs detection on the fourth optical signal. Let P5 represent the fourth optical power obtained by detection. Therefore, P3 = P4 + K = P5 + K' + K.

[0142] Typically, the value of loss K' is within a specific range, and the value of K' can be determined by testing. In this case, once the values ​​of K and K' are known, K+K' also becomes a constant, and β is used to represent this constant, i.e., β = K + K'. In this case, the second optical power P3 = P5 + β, i.e., the second optical power = fourth optical power + β, and β may be stored in a register for later calculations.

[0143] In another embodiment, β is considered a parameter in the second component, which represents an intrinsic relationship between the third target optical power and the fourth target optical power in the second component. The third target optical power (e.g., the second optical power) is the optical power of the third target optical signal (e.g., the first optical signal received by the second component) at the second interface of the second component. The fourth target optical power (e.g., the fourth optical power) is the optical power of the fourth target optical signal (e.g., the fourth optical signal) obtained by detection by the second monitor detector, and the fourth target optical signal is an optical signal obtained by dividing the third target optical signal based on power. In this case, β can also be obtained by testing, and then β may be stored in a register for later calculations.

[0144] For example, β may be stored in a register of the second component, or in a register corresponding to a processing device for performing the optical communication method provided in the embodiments of the present application. In a particular implementation, the processing device may retrieve β from the register storing β.

[0145] Based on the above explanation, in certain implementations, since β is known and the fourth optical power can be obtained by detection by the second detector, the second optical power can be calculated quickly.

[0146] Based on the above explanation, the first optical power and the second optical power can be obtained. In this case, the insertion loss value of the first optical signal passing through the optical connection assembly can be calculated based on the first optical power and the second optical power. For example, the insertion loss value = first optical power - second optical power. It can be seen that the insertion loss value of the optical connection assembly includes the insertion loss of the coupling between the first interface and the optical connection assembly, the insertion loss generated by the optical connection assembly, and the insertion loss of the coupling between the second interface and the optical connection assembly.

[0147] After determining the insertion loss value, the difference between this value and the preset insertion loss value of the optical connection assembly can be calculated. This difference, or the absolute value of this difference, is the insertion loss variation value of the optical connection assembly. After determining the insertion loss variation value, it can be determined whether or not the optical path of the optical connection assembly is abnormal based on this value. For specific determination methods, please refer to the corresponding explanations in steps S802 and S803. Further details will not be explained again here.

[0148] Specifically, the insertion loss value of the optical connection assembly may be pre-stored in a register of a component such as a processing device, and the processing device may read the preset insertion loss value from the register. For example, the preset insertion loss value may be obtained by testing and stored in the register. Alternatively, the preset insertion loss value may be set and stored in the register before shipment. In possible implementations, the preset insertion loss value fluctuates within an appropriate range. For example, the fluctuation range may be ±0.5dB, ±0.8dB, ±0.3dB, etc. This is not limited to the embodiments of this application. The fluctuation range may also be stored in the register.

[0149] In possible implementations, the first optical power may be calculated based on the transmission optical power of the light source chip that generates the target optical signal. In certain implementations, the transmission optical power of the light source chip may be obtained by monitoring using a microcontroller unit (MCU), or it may be a fixed transmission power, which is pre-stored in the register of the first component. The transmission optical power is the output optical power of the light source chip that generates the target optical signal, and can be considered as the optical power of the generated target optical signal. In this case, there is also a specific relationship between the transmission optical power and the optical power of the first optical signal transmitted at the first interface, i.e., the first optical power. Specifically, if transmission optical power = Q3 + first optical power, then first optical power = transmission optical power - Q3. Similarly, in the first component, Q3 may vary within a specific range. Therefore, Q3 may be determined by testing, and the value of Q3 obtained by testing and the range of variation of Q3 may be stored in the register of the first component or processing device for subsequent use.

[0150] Similarly, by calculating the first optical power based on the transmitted optical power and the second optical power using the method described above, the insertion loss variation value of the optical connection assembly can be calculated. After determining the insertion loss variation value, it is possible to determine whether or not the optical path of the optical connection assembly is abnormal based on the insertion loss variation value. For specific determination methods, please refer to the corresponding explanations in steps S802 and S803. Further details will not be explained again here.

[0151] In another possible implementation where the insertion loss variation of the optical connection assembly can be calculated based on the first and second optical powers, the first component does not include a monitor detector, while the second component still includes a second monitor detector. In this case, please refer to the previous description for the specific implementation that obtains the second optical power. Further details will not be explained again here. Next, we will describe a specific implementation that obtains the first optical power when the first component does not include a monitor detector.

[0152] In this embodiment of the present application, the first component includes a light source chip. In this particular implementation, the light source chip generates a first optical signal. The optical power of the transmitted optical signal generated by the light source chip at the first interface connecting the first component and the optical connection assembly is related to parameters such as the temperature T, drive voltage V, and drive current I of the light source chip. Let B represent the optical power of the transmitted optical signal generated by the light source chip at the first interface connecting the first component and the optical connection assembly. See, for example, Figure 10.

[0153] In Figure 10, T1 > T2 > T3. It can be seen that the optical power B increases as the drive current I increases, as the drive voltage V increases, and as the temperature T increases. Also, the corresponding relationship curves will differ depending on the light source chip.

[0154] Based on the IVTB relationship described above, the IVTB relationship parameter table may be obtained in advance through testing. Be It may be provided by the manufacturer. The parameter table may be stored in the registers of the first component, or in the registers of the processing equipment described above, etc. For example, see the IVTB-related parameter table shown in Table 1. [Table 1]

[0155] In this case, in a specific implementation, the processing equipment may monitor the temperature T, drive voltage V, and drive current I of the light source chip in real time. Based on the monitored temperature T, drive voltage V, and drive current I, the corresponding optical power B is determined from the IVTB relation parameter table. In this case, the optical power B is the optical power at the first interface of the transmitted optical signal currently being generated by the light source chip.

[0156] For example, a thermistor may be used to monitor the temperature of the light source chip. An analog-to-digital converter (ADC) or a microcontroller unit (MCU) may be used to monitor the drive current and drive voltage of the light source chip.

[0157] Based on the above explanation, when the light source chip generates the aforementioned first optical signal, it monitors the current temperature, drive current, and drive voltage of the light source chip in real time and determines the corresponding optical power from the aforementioned relationship parameter table. The determined optical power is the first optical power.

[0158] In another possible implementation, if the drive current and drive voltage of the light source chip remain constant, the optical power B is related to the temperature T of the light source chip. Based on this correlation, a TB-relation parameter table can be derived. See, for example, Table 2. [Table 2]

[0159] In this case, when generating the first optical signal mentioned above, the current temperature of the light source chip is monitored in real time, and the optical power corresponding to the temperature is determined from the aforementioned relationship parameter table. The determined optical power is the first optical power.

[0160] In possible implementations, if the monitored current temperature of the light source chip is not found in the TB relationship parameter table, an interpolation method may be used to calculate the optical power corresponding to the monitored temperature. For example, in possible implementations, an interpolation function may be obtained by fitting based on the data in the aforementioned TB relationship parameter table. In this interpolation function, temperature T is a parameter and optical power B is a function value. In this case, the optical power may be calculated by inputting the temperature obtained by detection into the interpolation function. Similarly, if at least one of the monitored temperature, drive current, and drive voltage is not found in the aforementioned IVTB relationship parameter table, an interpolation function may be obtained by fitting based on the data in the IVTB relationship parameter table. The parameters of the interpolation function are temperature T, drive voltage V, and drive current I, and optical power B is the function value of the function. In this case, the optical power may be calculated by inputting the temperature, drive current, and drive voltage obtained by detection into the interpolation function.

[0161] Based on the above explanation, after determining the first and second optical powers, the insertion loss variation value of the optical connection assembly can be calculated. After determining the insertion loss variation value, it can be determined whether or not the optical path of the optical connection assembly is abnormal based on the insertion loss variation value. For specific determination methods, please refer to the corresponding explanations in steps S802 and S803. Further details will not be explained again here.

[0162] In possible implementations, the insertion loss variation of the optical connection assembly may be calculated without calculating the first and second optical powers. In this implementation, the first component includes a first monitor detector, and the second component includes a second monitor detector. From the above explanation, it can be seen that the first optical power = third optical power + α and the second optical power = fourth optical power + β. In this case, the current insertion loss of the optical connection assembly = first optical power - second optical power = (third optical power + α) - (fourth optical power + β).

[0163] For example, the insertion loss variation of an optical connection assembly = current insertion loss of the optical connection assembly - preset insertion loss value. Based on the formula for calculating the current insertion loss of the optical connection assembly described above, the preset insertion loss value can also be calculated according to the formula. That is, preset insertion loss value = (first preset optical power + α) - (second preset optical power + β). The first preset optical power is the optical power obtained in advance by detection by the first monitor detector based on the test optical signal in the first component. The second preset optical power is the optical power obtained in advance by detection by the second monitor detector based on the test optical signal transmitted to the second component.

[0164] Specifically, the first component may transmit a test optical signal to the second component via an optical connection assembly. Similarly, the test optical signal is split into two optical signals in the first component. One optical signal is input to the first monitor detector, and the other optical signal is output from the first interface and input to the second component via the optical connection assembly. The optical power obtained by performing detection on the input signal by the first monitor detector is the first preset optical power. The first preset optical power may be stored in a register of the first component, or in a register of the processing device, etc. The processing device may read the first preset optical power from the register.

[0165] The optical signal input to the second component is then equally divided into two optical signals. One optical signal is input to the second monitor detector of the second component, and the other optical signal is input to the processing module of the second component. The optical power obtained by performing detection on the input signal by the second monitor detector is the second preset optical power. The second preset optical power may be stored in a register of the second component, or in a register of the processing device, etc. The processing device may read the second preset optical power from the register.

[0166] Therefore, the insertion loss variation of the optical connection assembly = current insertion loss value of the optical connection assembly - preset insertion loss value. Thus, the insertion loss variation of the optical connection assembly = [(3rd optical power + α) - (4th optical power + β)] - [(1st preset optical power + α) - (2nd preset optical power + β)] = 3rd optical power - 4th optical power - 1st preset optical power + 2nd preset optical power. The 1st and 2nd preset optical powers are read from registers, the 3rd power is the optical power detected by the 1st monitor detector, and the 4th power is the optical power detected by the 2nd monitor detector. Therefore, the insertion loss variation of the optical connection assembly can be calculated based on the optical power detected by the 1st monitor detector, the optical power detected by the 2nd monitor detector, the 1st preset optical power, and the 2nd preset optical power. It is not necessary to calculate the 1st and 2nd optical powers. This implementation is easy and can improve the efficiency of optical path anomaly detection in the optical connection assembly.

[0167] Typically, in existing implementations, the third optical signal is obtained by dividing the target optical signal based on power, and the optical power of the third optical signal, obtained by detection by the first monitor detector, is used to analyze whether the optical power of the target optical signal is within the normal range. Similarly, typically, in existing implementations, the fourth optical signal is obtained by dividing the first optical signal received from the second component based on power, and the optical power of the fourth optical signal, obtained by detection by the second monitor detector, is used to analyze whether the optical power of the received first optical signal is within the normal range. However, in the embodiments of the present invention, the insertion loss variation of the optical connection assembly can be calculated based on the optical power obtained by detection by the first and second monitor detectors. That is, in the embodiments of the present invention, there is no need to add optical power detection equipment, and the insertion loss variation of the optical connection assembly can be calculated based on existing obtainable data in the optical communication system. In this way, hardware costs are reduced and existing obtainable data can be reused.

[0168] The above describes the optical communication methods provided in embodiments of the present application. To implement the corresponding functions described above, it may be understood that each device or apparatus includes a corresponding hardware structure and / or a corresponding software module for performing the functions. Combined with the exemplary units and steps described in the embodiments disclosed herein, the present application can be implemented in hardware or in combination of hardware and computer software. Whether the functions are performed in hardware or by hardware driven by computer software depends on the specific application and design constraints of the technical solution. A person skilled in the art may use different methods to implement the described functions for each specific application, but the implementation should not be considered to be beyond the scope of the present application.

[0169] In embodiments of the present application, the device may be divided into functional modules based on the examples of the methods described above. For example, each functional module corresponding to each function may be obtained through division, or two or more functions may be integrated into one module. The integrated module may be implemented in hardware form or in the form of a software functional module. It should be noted that in embodiments of the present application, module division is merely an example and represents a logical functional division. In actual implementations, other division methods may be used.

[0170] When functional module division is performed based on corresponding functions, Figure 11 shows a specific logical structure of the optical communication system 1100. The optical communication system 1100 is, A control unit 1101 is configured to control a first component and transmit a first optical signal to a second component via an optical connection assembly, wherein the first component and the second component are connected by an optical connection assembly, and the first component, the second component, and the optical connection assembly are components within an optical communication system 1100. An alarm unit 1102 is configured to send an alarm instruction when it is determined that the optical connection assembly is abnormal based on the optical power fluctuation state of the first optical signal in the transmission process, Includes, The control unit is further configured to control the first component to transmit the second optical signal to the second component if it is determined that the optical connection assembly is normal based on the optical power fluctuation state of the first optical signal in the transmission process, and the optical power of the second optical signal is greater than that of the first optical signal.

[0171] In a possible implementation, the optical communication system 1100 further includes a first acquisition unit configured to acquire the optical power fluctuation state of a first optical signal in the transmission process, the first acquisition unit specifically, The system acquires a first optical power and a second optical power, the first optical power being the optical power of the first optical signal transmitted at the first interface connecting the first component and the optical connection assembly, and the second optical power being the optical power of the first optical signal transmitted at the second interface connecting the second component and the optical connection assembly. The fluctuating state is calculated based on the first and second light powers. It is configured in this way.

[0172] In a possible implementation, the first component includes a first monitor detector, and the first acquisition unit specifically includes, It is configured to calculate the first optical power based on the third optical power and the first fixed value. The third optical power is the optical power of the third optical signal obtained by detection by the first monitor detector. The third optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power, and the first fixed value is pre-stored in a register of the optical communication system 1100.

[0173] In a possible implementation, the first fixed value is the value of the intrinsic relationship between the first target optical power and the second target optical power in the first component, the first target optical power is the optical power of the first target optical signal obtained by detection by the first monitor detector, the second target optical power is the optical power of the second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power.

[0174] In a possible implementation, the first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip within the light source, and the optical power at the first interface of the optical signal generated and transmitted by the light source chip is related to the temperature of the light source chip. The first acquired unit is, specifically, Get the current temperature of the light source chip, It is configured to determine the first optical power based on the detected temperature.

[0175] In possible implementations, the optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to the drive current and drive voltage of the light source chip. The first acquired unit is, specifically, It is configured to acquire the current drive current and current drive voltage of the light source chip. Determining the first optical power based on the detected temperature is This includes determining a first optical power based on the detected temperature, drive current, and drive voltage.

[0176] In possible implementations, the second component includes a second monitor detector. The first acquired unit is, specifically, It is configured to calculate the second optical power based on the fourth optical power and the second fixed value. The fourth optical power is the optical power of the fourth optical signal obtained by detection by the second monitor detector, the first optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power, and the second fixed value is pre-stored in the register of the optical communication system 1100.

[0177] In a possible implementation, the second fixed value is the value of the intrinsic relationship between the third target optical power and the fourth target optical power in the second component, the third target optical power is the optical power of the third target optical signal at the second interface in the second component, the fourth target optical power is the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal is the optical signal obtained by dividing the third target optical signal based on power.

[0178] In possible implementations, the first acquisition unit is specifically, The first insertion loss value of the optical connection assembly is calculated based on the first and second optical powers. The system is configured such that the insertion loss variation value of the optical connection assembly is calculated based on the first insertion loss value and the preset insertion loss value of the optical connection assembly, the preset insertion loss value is read from the register of the optical communication system 1100, and the insertion loss variation value indicates the state of variation.

[0179] In a possible implementation, the optical communication system 1100 further includes a second acquisition unit configured to acquire the optical power fluctuation state of a first optical signal in the transmission process, the second acquisition unit specifically, Based on the 5th optical power, 6th optical power, 1st preset optical power, and 2nd preset optical power, the insertion loss variation value of the optical connection assembly is calculated, and the insertion loss variation value is configured to indicate the state of variation. The fifth optical power is the optical power of the fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power. The sixth optical power is the optical power of the sixth optical signal, and the sixth optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power. The first preset optical power and the second preset optical power are read from the registers of the optical communication system 1100.

[0180] In a possible implementation, the first component includes a first monitor detector, The fifth optical power is the optical power obtained by performing detection on the fifth optical signal by the first monitor detector. The first preset optical power is the optical power obtained in advance by detection by the first monitor detector based on the test optical signal in the first component.

[0181] In possible implementations, the second component includes a second monitor detector. The sixth optical power is the optical power obtained by performing detection on the sixth optical signal by the second monitor detector. The second preset optical power is the optical power that is obtained in advance by detection by the second monitor detector based on the test optical signal transmitted to the second component.

[0182] In possible implementations, the optical connection assembly includes one or more of the following: optical fiber, optical connector, optical fiber board, optical-electric integrated connector, optical waveguide, etc.

[0183] For example, the control unit 1101, the alarm unit 1102, the first acquisition unit, or the second acquisition unit may be implemented in software form, that is, these units may be represented as corresponding program modules, which may be stored in the memory of the execution entity. The processor within the execution entity may call these program modules in memory to perform the functions described above.

[0184] Alternatively, for example, the control unit 1101, the alarm unit 1102, the first acquisition unit, or the second acquisition unit may be implemented in hardware form. In this case, the processor in the execution entity may send control commands to these hardware units so that they perform the functions described above.

[0185] Alternatively, for example, the control unit 1101, alarm unit 1102, first acquisition unit, or second acquisition unit may be implemented in the form of a combination of software and hardware. In this case, the program module implemented by software may be stored in the memory of the execution entity. The processor in the execution entity may call the program module in memory and at the same time send control instructions to the corresponding hardware module so that these units realize the functions described above.

[0186] For example, for specific configurations of processors within an execution entity, please refer to the relevant descriptions of the processing chip 104 shown in Figure 4 or the processing module 1031 shown in Figure 5. Further details will not be explained again here.

[0187] For specific operation and beneficial effects of the units within the optical communication system 1100 shown in Figure 11, please refer to the corresponding descriptions in Figure 8 and the possible embodiments of the methods shown in Figure 8. Further details will not be explained again here.

[0188] Figure 12 is a diagram of a specific hardware structure of the communication device 1200 according to the present invention. The communication device 1200 can implement the optical communication method and possible implementations thereof. The communication device 1200 includes a processor 1201, a memory 1202, and a communication interface 1203. The processor 1201, the communication interface 1203, and the memory 1202 may be connected to each other or connected to each other via a bus 1204.

[0189] For example, memory 1202 is configured to store computer programs and data for communication device 1200. Memory 1202 may include, but is not limited to, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), or compact disc read-only memory (CD-ROM).

[0190] The communication interface 1203 includes a transmit interface and a receive interface. Multiple communication interfaces 1203 may exist, and the communication interfaces 1203 are configured to support the communication device 1200 in communication, for example, in receiving or transmitting data or messages.

[0191] For example, the processor 112 may be a central processing unit, a digital signal processor, an application-specific integrated circuit, a field-programmable gate array or another programmable logic device, a transistor logic device, a hardware component, or any combination thereof. Alternatively, the processor may be a combination that implements computing functions, for example, a combination of one microprocessor, or a combination of a digital signal processor and a microprocessor. Alternatively, the processor 1201 may be a general-purpose processor, etc. The processor 1201 may be configured to read a program stored in the memory 1202, and as a result, the communication device 1200 performs the optical communication method described in Figure 8 and the possible embodiments of Figure 8.

[0192] In certain embodiments, the communication device 1200 includes an optical communication system in the embodiment of the method described above. The optical communication system includes a first component, an optical connection assembly, and a second component. The first and second components are connected by the optical connection assembly. For example, referring to Figure 13, the processor 1201 may be a processor in the execution entity of the optical communication method described above. The execution entity may be, for example, the first component in the optical communication system, the second component in the optical communication system, or a module having processing capabilities in the optical communication system other than the first component, the optical connection assembly, and the second component. The processor 1201 is configured to read a computer program stored in memory 1202, and as a result, the communication device 1200 performs the following operations: Control the first component, The first optical signal is transmitted to the second component using an optical connection assembly. Based on the optical power fluctuation state of the first optical signal during the transmission process, the insertion loss fluctuation value of the optical connection assembly is obtained, and the insertion loss fluctuation value shows the variation in the insertion loss of the optical connection assembly compared to a preset insertion loss value. If the optical connection assembly is determined to be abnormal based on the insertion loss variation, an alarm instruction is sent. If the optical connection assembly is determined to be normal based on the insertion loss variation, the first component is controlled to transmit the second optical signal to the second component, and the optical power of the second optical signal is greater than the optical power of the first optical signal.

[0193] For specific operation and beneficial effects of the units within the communication device 1200 shown in Figure 12, please refer to the corresponding descriptions in Figure 8 and the possible embodiments of the methods shown in Figure 8. Further details will not be explained again here.

[0194] Embodiments of the present invention further provide another communication system. The communication device includes an optical module as described in Figure 11 and in any of the possible embodiments of Figure 11.

[0195] The present invention further provides another communication device, the communication device comprising a first service board, a second service board, and an optical backplane. The first service board and the second service board are connected by the optical backplane. Based on the first service board, the second service board, and the optical backplane, the communication device implements embodiments of the method and any possible methods thereof as shown in Figure 8. The first service board is an embodiment of the first component and any possible methods thereof as shown in Figure 8. The second service board is an embodiment of the second component and any possible methods thereof as shown in Figure 8. The optical backplane is an embodiment of the optical connection assembly and any possible methods thereof as shown in Figure 8.

[0196] Embodiments of the present invention further provide a computer-readable storage medium. The computer-readable storage medium stores a computer program. When the computer program is executed by a processor, embodiments of the method described in Figure 8 and any possible methods thereof are carried out.

[0197] Embodiments of the present invention further provide a computer program product. When the computer program product is read and executed by a computer, embodiments of the method described in Figure 8 and any of the methods thereof can be realized.

[0198] In conclusion, this solution uses a low-power optical signal to detect optical connection assemblies. If an anomaly is detected in the optical connection assembly, an alarm is triggered. When the optical connection assembly is detected as normal, transmission of a high-power optical signal is initiated. This avoids the problem of the optical connection assembly burning out due to direct transmission of a high-power optical signal before an anomaly is recognized. Furthermore, this solution measures the insertion loss variation of the optical connection assembly based on the optical power fluctuation state of the optical signal during the transmission process, and determines whether the optical connection assembly is abnormal based on this variation. Compared to existing solutions that use instruments to detect whether the optical path of the optical connection assembly is abnormal, this solution does not require manual detection or expensive detection instruments, making it labor-saving, low-cost, and highly accurate, allowing for timely detection of anomalies.

[0199] The embodiments described above are intended solely to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the embodiments described above, those skilled in the art should understand that modifications may be made to the technical solutions described in the embodiments described above, or that some or all of their technical features may be replaced with equivalent substitutions, without departing from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical communication method, the method is applied to an optical communication system, the optical communication system includes a first component, an optical connection assembly and a second component, the first component and the second component are connected by the optical connection assembly, and the method is The steps include controlling the first component to transmit a first optical signal to the second component via the optical connection assembly, The steps include sending an alarm instruction when it is determined that the optical connection assembly is abnormal based on the optical power fluctuation state of the first optical signal in the transmission process, Steps include: controlling the first component to transmit a second optical signal to the second component if it is determined that the optical connection assembly is normal based on the optical power fluctuation state of the first optical signal in the transmission process, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal; Includes, The optical power fluctuation state of the first optical signal in the transmission process is determined by the following method: A step of acquiring a first optical power and a second optical power, wherein the first optical power is the optical power of the first optical signal transmitted at a first interface connecting the first component and the optical connection assembly, and the second optical power is the optical power of the first optical signal transmitted at a second interface connecting the second component and the optical connection assembly, A step of calculating the optical power fluctuation state based on the first optical power and the second optical power, A method obtained using [a specific method / tool].

2. The first component includes a first monitor detector, The first step in acquiring light power is, The step includes calculating the first optical power based on the third optical power and the first fixed value, The method according to claim 1, wherein the third optical power is the optical power of the third optical signal obtained by detection by the first monitor detector, the third optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on power, and the first fixed value is pre-stored in a register of the optical communication system.

3. The method according to claim 2, wherein the first fixed value is a value representing the intrinsic relationship between the first target optical power and the second target optical power in the first component, the first target optical power is the optical power of the first target optical signal obtained by detection by the first monitor detector, the second target optical power is the optical power of the second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on power.

4. The first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip within the light source, and the optical power at the first interface of the optical signal generated and transmitted by the light source chip is related to the temperature of the light source chip. The first step in acquiring light power is, The steps include obtaining the current temperature of the light source chip, A step of determining the first optical power based on the detected temperature, The method according to claim 1, including the method described in claim 1.

5. The optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to the drive current and drive voltage of the light source chip. The first step in acquiring light power is, The process further includes the step of obtaining the current drive current and current drive voltage of the light source chip, The step of determining the first optical power based on the detected temperature is: The method according to claim 4, comprising the step of determining the first optical power based on the detected temperature, drive current, and drive voltage.

6. The second component includes a second monitor detector, The step to obtaining the second light power is, The step includes calculating the second optical power based on the fourth optical power and the second fixed value, The method according to claim 1, wherein the fourth optical power is the optical power of the fourth optical signal obtained by detection by the second monitor detector, the fourth optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power, and the second fixed value is pre-stored in a register of the optical communication system.

7. The method according to claim 6, wherein the second fixed value is the value of the intrinsic relationship between the third target optical power and the fourth target optical power in the second component, the third target optical power is the optical power of the third target optical signal at the second interface of the second component, the fourth target optical power is the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal is an optical signal obtained by dividing the third target optical signal based on power.

8. The step of calculating the optical power fluctuation state based on the first optical power and the second optical power is: A step of calculating a first insertion loss value of the optical connection assembly based on the first optical power and the second optical power, A step of calculating the insertion loss variation value of the optical connection assembly based on the first insertion loss value and the preset insertion loss value of the optical connection assembly, wherein the preset insertion loss value is read from the register of the optical communication system, and the insertion loss variation value indicates the optical power fluctuation state, The method according to claim 1, including the method described in claim 1.

9. An optical communication method, the method being applied to an optical communication system, the optical communication system comprising a first component, an optical connection assembly and a second component, the first component and the second component being connected by the optical connection assembly, the method is The steps include controlling the first component to transmit a first optical signal to the second component via the optical connection assembly, The steps include sending an alarm instruction when it is determined that the optical connection assembly is abnormal based on the optical power fluctuation state of the first optical signal in the transmission process, Steps include: controlling the first component to transmit a second optical signal to the second component if it is determined that the optical connection assembly is normal based on the optical power fluctuation state of the first optical signal in the transmission process, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal; Includes, The optical power fluctuation state of the first optical signal in the transmission process is determined by the following method: A step of calculating the insertion loss variation value of the optical connection assembly based on the fifth optical power, the sixth optical power, the first preset optical power, and the second preset optical power, wherein the insertion loss variation value is obtained using a step that indicates a variation state. The fifth optical power is the optical power of the fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power. The sixth optical power is the optical power of the sixth optical signal, and the sixth optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power. A method by which the first preset optical power and the second preset optical power are read from the registers of the optical communication system.

10. The first component includes a first monitor detector, The fifth optical power is the optical power obtained by performing detection on the fifth optical signal with the first monitor detector. The method according to claim 9, wherein the first preset optical power is an optical power obtained in advance by detection by the first monitor detector based on a test optical signal in the first component.

11. The second component includes a second monitor detector, The sixth optical power is the optical power obtained by performing detection on the sixth optical signal with the second monitor detector, The method according to claim 9, wherein the second preset optical power is an optical power obtained in advance by detection by the second monitor detector based on a test optical signal transmitted to the second component.

12. The method according to any one of claims 1 to 5, 9, or 10, wherein the optical communication system includes an optical module, the first component being an external laser light source (ELS) of the optical module, and the second component being a silicon photonic chip within the optical module.

13. The method according to any one of claims 1 to 5, 9, or 10, wherein the optical communication system includes a service board, the first component being an external laser light source (ELS) of the service board, and the second component being a silicon photonic chip within the service board, and the service board being configured to process service signals.

14. The method according to any one of claims 1 to 5, 9, or 10, wherein the optical communication system includes a backplane component, the first component being a first service board within the backplane component, the second component being a second service board within the backplane component, the optical connection assembly including an optical backplane within the backplane component, the first service board and the second service board being configured to process service signals, and the optical backplane being configured to enable optical communication between the first service board and the second service board.

15. The method according to any one of claims 1 to 5, 9, or 10, wherein the optical connection assembly includes one or more of the following: optical fiber, optical connector, optical fiber board, optical-electrical integrated connector, optical waveguide, etc.

16. The method according to any one of claims 1 to 5, 9, or 10, wherein the first optical signal does not damage the optical communication system.

17. The method according to any one of claims 1 to 5, 9, or 10, wherein the optical power of the first optical signal is less than 10 dBm.

18. An optical communication system, wherein the optical communication system is A control unit configured to control a first component and transmit a first optical signal to a second component via an optical connection assembly, wherein the first component and the second component are connected by the optical connection assembly, and the first component, the second component, and the optical connection assembly are components within the optical communication system. An alarm unit configured to send an alarm instruction when it is determined that the optical connection assembly is abnormal based on the optical power fluctuation state of the first optical signal in the transmission process, Includes, The control unit is further configured to control the first component to transmit a second optical signal to the second component if it is determined that the optical connection assembly is normal based on the optical power fluctuation state of the first optical signal in the transmission process, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal. The optical communication system further includes a first acquisition unit configured to acquire the optical power fluctuation state of the first optical signal in the transmission process, the first acquisition unit specifically, The system acquires a first optical power and a second optical power, wherein the first optical power is the optical power of the first optical signal transmitted at a first interface connecting the first component and the optical connection assembly, and the second optical power is the optical power of the first optical signal transmitted at a second interface connecting the second component and the optical connection assembly. The optical power fluctuation state is calculated based on the first optical power and the second optical power. An optical communication system configured in such a way.

19. The first component includes a first monitor detector, The aforementioned first acquisition unit is, specifically, The system is configured to calculate the first optical power based on the third optical power and the first fixed value. The optical communication system according to claim 18, wherein the third optical power is the optical power of the third optical signal obtained by detection by the first monitor detector, the third optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on power, and the first fixed value is stored in advance in a register of the optical communication system.

20. The optical communication system according to claim 19, wherein the first fixed value is the value of the intrinsic relationship between the first target optical power and the second target optical power in the first component, the first target optical power is the optical power of the first target optical signal obtained by detection by the first monitor detector, the second target optical power is the optical power of the second target optical signal transmitted in the first interface, and the first target optical signal and the second target optical signal are two optical signals obtained by dividing the optical signal in the first component based on power.

21. The first component includes a light source, the light source includes a light source chip, the first optical signal is generated by the light source chip within the light source, and the optical power at the first interface of the optical signal generated and transmitted by the light source chip is related to the temperature of the light source chip. The aforementioned first acquisition unit is, specifically, The current temperature of the light source chip is obtained, The first optical power is determined based on the current temperature. The optical communication system according to claim 18, configured as described above.

22. The optical power at the first interface of the optical signal generated and transmitted by the light source chip is further related to the drive current and drive voltage of the light source chip. The aforementioned first acquisition unit is, specifically, The system is configured to acquire the current drive current and current drive voltage of the aforementioned light source chip. Determining the first optical power based on the detected temperature is: The optical communication system according to claim 21, comprising determining the first optical power based on the detected temperature, drive current, and drive voltage.

23. The second component includes a second monitor detector, The aforementioned first acquisition unit is, specifically, The system is configured to calculate the second optical power based on the fourth optical power and the second fixed value. The optical communication system according to any one of claims 18 to 22, wherein the fourth optical power is the optical power of the fourth optical signal obtained by detection by the second monitor detector, the fourth optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power, and the second fixed value is stored in advance in a register of the optical communication system.

24. The optical communication system according to claim 23, wherein the second fixed value is the value of the intrinsic relationship between the third target optical power and the fourth target optical power in the second component, the third target optical power is the optical power of the third target optical signal at the second interface of the second component, the fourth target optical power is the optical power of the fourth target optical signal obtained by detection by the second monitor detector, and the fourth target optical signal is an optical signal obtained by dividing the third target optical signal based on power.

25. The aforementioned first acquisition unit is, specifically, Based on the first optical power and the second optical power, the first insertion loss value of the optical connection assembly is calculated. Based on the first insertion loss value and the preset insertion loss value of the optical connection assembly, the insertion loss variation value of the optical connection assembly is calculated, the preset insertion loss value is read from the register of the optical communication system, and the insertion loss variation value indicates the optical power variation state. An optical communication system according to any one of claims 18 to 22, configured as described above.

26. An optical communication system, wherein the optical communication system is A control unit configured to control a first component and transmit a first optical signal to a second component via an optical connection assembly, wherein the first component and the second component are connected by the optical connection assembly, and the first component, the second component, and the optical connection assembly are components within the optical communication system. An alarm unit configured to send an alarm instruction when it is determined that the optical connection assembly is abnormal based on the optical power fluctuation state of the first optical signal in the transmission process, Includes, The control unit is further configured to control the first component to transmit a second optical signal to the second component if it is determined that the optical connection assembly is normal based on the optical power fluctuation state of the first optical signal in the transmission process, wherein the optical power of the second optical signal is greater than the optical power of the first optical signal. The optical communication system further includes a second acquisition unit configured to acquire the optical power fluctuation state of the first optical signal in the transmission process, and the second acquisition unit specifically, Based on the fifth optical power, sixth optical power, first preset optical power, and second preset optical power, the insertion loss variation value of the optical connection assembly is calculated, and the system is configured such that the insertion loss variation value indicates a state of variation. The fifth optical power is the optical power of the fifth optical signal, and the fifth optical signal and the first optical signal are two optical signals obtained by dividing the optical signal in the first component based on its power. The sixth optical power is the optical power of the sixth optical signal, and the sixth optical signal is an optical signal obtained by dividing the first optical signal transmitted to the second component based on its power. The first preset optical power and the second preset optical power are read from the registers of the optical communication system.

27. The first component includes a first monitor detector, The fifth optical power is the optical power obtained by performing detection on the fifth optical signal with the first monitor detector. The optical communication system according to claim 26, wherein the first preset optical power is an optical power obtained in advance by detection by the first monitor detector based on a test optical signal in the first component.

28. The second component includes a second monitor detector, The sixth optical power is the optical power obtained by performing detection on the sixth optical signal with the second monitor detector, The optical communication system according to claim 26 or 27, wherein the second preset optical power is an optical power obtained in advance by detection by the second monitor detector based on a test optical signal transmitted to the second component.

29. The optical communication system according to any one of claims 18 to 22, 26, or 27, wherein the optical connection assembly includes one or more of the following: optical fiber, optical connector, optical fiber board, optical-electrical integrated connector, optical waveguide, etc.

30. A communication device comprising a first service board, a second service board, and an optical backplane, wherein the first service board and the second service board are connected by the optical backplane. The communication device implements the optical communication method described in any one of claims 1 to 11 based on the first service board, the second service board, and the optical backplane. A communication device wherein the first service board is a first component in the optical communication method according to any one of claims 1 to 11, the second service board is a second component in the optical communication method according to any one of claims 1 to 11, and the optical backplane is an optical connection assembly in the optical communication method according to any one of claims 1 to 11.

Images