Conductive one-component (1K) epoxy composition

Abstract

The present invention is directed to a conductive composition comprising: a) a resin component comprising 1) a first epoxy resin; and 2) a second epoxy resin, and / or a functionalized polybutadiene resin, and / or a functionalized butadiene-acrylonitrile copolymer; b) a curing agent for the epoxy resin; c) a conductive filler; d) a core-shell rubber toughening agent; and e) a reactive diluent component comprising 1) a monofunctional epoxy diluent, and / or 2) a multifunctional epoxy diluent; wherein when the functionalized polybutadiene resin is present in the resin component, the composition further comprises a curing agent.

Description

【Technical Field】 【0001】 The present invention relates to a conductive one - part (1K) epoxy adhesive composition, which composition comprises conductive particles, core - shell rubber particles, at least one epoxy resin, and at least one epoxy - functional reactive diluent. The conductive adhesive composition is particularly useful when bonding solar cells to each other in a shingled photovoltaic module. 【Background Art】 【0002】 A solar cell or a photovoltaic cell is an electrical device that directly converts the energy of light into electricity by the photovoltaic effect. A solar cell is a component of a photovoltaic module, also known as a solar panel. 【0003】 As shown in the attached FIG. 1, most of the solar cells (1) manufactured today consist of crystalline silicon wafers on which metal contacts, - busbars (2) and fingers (3) - are all printed, and these contacts serve to collect the current generated by the cell. For illustrative purposes only, FIG. 1a shows the basic configuration of a solar cell using three busbars (2), and FIG. 1b shows the basic configuration of a solar cell using four busbars (2). 【0004】 The arrangement of thin fingers (3) in a linear, parallel, and equally spaced manner covers only a small part of the light - receiving surface of an individual silicon solar cell (1). These finger lines (3) reduce the resistance to the photocurrent and result in smaller current losses. Further, as shown in the attached FIG. 2, the finger lines (3) collect the current from the silicon solar cell surface and transmit the current to the tabbing ribbon (5) via the busbar (2), which is a current - conducting line. The busbars (2) are arranged parallel to each other, equally spaced, and perpendicular to the arrangement of the finger lines (3). The tabbing ribbon (5) is soldered to the surface of the busbar and facilitates the transmission of current from the connected silicon solar cell to another silicon solar cell, a storage battery, or a solar inverter. 【0005】 The bus bar (2) and the finger line (3) conventionally include either a high-temperature firing paste or a low-temperature non-firing paste for heat-sensitive solar cells such as heterojunction (HJT or HIT) solar cells or tandem (perovskite-type) solar cells, and are usually realized by a one-step or two-step printing process in which these metal contacts are laid out vertically and horizontally on the solar cell. The use of two consecutive printing steps facilitates the use of different materials for the bus bar and the finger line respectively, and also reflects the need to print the bus bar with a narrower width than the finger line. When printing the front side grid continuously in two steps, usually the finger line (3) is printed first, dried, and then the bus bar (2) is printed on the finger line. In one-step printing, the bus bar and the finger line have the same height, but in two-step printing, an overlap between the two patterns is necessary to ensure contact between the finger line and the bus bar and to account for any possible misalignment between the two patterns. In the overlapping area of the finger line and the bus bar, the height is different from the area where only the finger line or the bus bar is printed. 【0006】 When ribbons (5) are attached to the bus bar (2) by a soldering process, these ribbons (5) are arranged on top of the bus bar and, when arranged on the front of the solar cell, create a shadowed area on the solar cell. This shadow results in a reduction in the efficiency of the photovoltaic module, associated with the surface area of the solar cell actually covered by the bus bar itself. 【0007】 Further problems associated with such solar cell structures include resistance losses due to high currents passing through ribbons (5) with a small cross-section; differential thermal contraction of the ribbons (5) and the silicon wafer, which can result in high stress on the metallization and the silicon; and stress and microcracks in the silicon wafer caused by local effects of heat and pressure during the soldering process, which hinder the thinning of the wafer. 【0008】 As a result of these problems, new solar module concepts have been developed using new interconnection technologies and new types of solar cells. Examples include multi-wire interconnection in busbarless cells and conductive backsheet interconnection with back-contact cells. However, the present invention is more particular about the use of conductive adhesives as an alternative to soldering, and series-connected cell module structures, especially single-cell module structures. 【0009】 Figure 3 shows a single-cell module structure, illustrating a rectangular or substantially rectangular solar strip (solar cell strip). The longer side typically corresponds to the length of a standard solar wafer side (historically 156 mm, but now increasing to 210 mm), while the shorter side is only a few centimeters long. Such solar cell strips are cut from standard-sized processing devices (but not limited to, such as 156 mm x 156 mm devices) with sufficient care to avoid structural defects such as cracks during the cutting or dicing process. Each cell has a row of busbars or interconnect pads, one on the front and one on the back along the longer side. To create a cell string, interconnect material is applied to connect the back busbar of one cell to the front busbar of the adjacent cell. The cells slightly overlap each other, and as a result, the front busbars are covered by the edge regions of adjacent cells, much like roofing panels on a roof. Considering that i) there is no spacing between cells compared to conventional modules, ii) cell areas shaded by front busbars are covered by the active areas of other cells, and iii) there are no ribbons covering the front of cells that provide shading, this single structure results in a module that, in principle, achieves very high module efficiency with a very high ratio of active area to total area. 【0010】 Adjacent cells within a string are joined to each other using a conductive material (4) which can be deposited in different patterns in the overlapping portions of the solar cells. Conductive adhesives (ECAs) as a material for joining solar cells have the advantage that the adhesive overcomes the mechanical stress that accumulates due to the mismatch in coefficients of thermal expansion (CTE) between different materials used in the photovoltaic assembly. 【0011】 Conductive adhesives (ECAs) are highly filler materials characterized by containing conductive filler particles, typically at least 40% by weight, most often more than 60% by weight, and even more than 80% by weight, which are necessary to ensure multiple penetration pathways and provide good conductivity and low contact resistance. Unfortunately, conductive filler particles do not provide reinforcing properties and do not contribute to the bonding of materials. As a result, the intrinsic mechanical strength of conductive adhesives is far inferior to that of the same material without fillers. 【0012】 The need for the polymer matrix to provide sufficient shear strength is the first and most decisive parameter in selecting a suitable adhesive. Shear modulus (G, MPa) or storage modulus (E, MPa) are further determinants: within single interconnects, the movement of solar cells is more constrained, and the joints between cells must allow some movement through deformation while withstanding a certain degree of stress. Silicone conductive adhesives are conventionally flexible (low G, low E) but typically have lower shear strength. In contrast, epoxy conductive adhesives exhibit high shear strength but tend to be somewhat rigid (high G, high E), which can cause power loss when external stress is applied to the photovoltaic module. 【0013】 Chinese Patent Application Publication No. 110894411 (Ruilibo) relates to a conductive adhesive composition useful for assembling single solar cells, wherein the adhesive composition comprises an epoxy monomer; a reinforcing resin; silver powder; a rheological agent; and a latent curing agent for the epoxy resin comprising boron tetrafluoride. 【0014】 U.S. Patent No. 6,344,157 (Cheng et al.) describes an electrically stable composition for use in microelectronic devices, the composition comprising (a) a polymer resin; (b) a conductive filler; (c) a corrosion inhibitor; (d) optionally a reactive or non-reactive diluent; (e) optionally an inert filler; and (f) optionally an adhesion promoter, wherein the corrosion inhibitor is 8-hydroxyquinoline. 【0015】 U.S. Patent No. 7,326,369 (Cheng et al.) describes a low-stress conductive film or paste adhesive, the adhesive comprising a) one or more functional acrylic copolymers or terpolymers; b) epoxy; and c) a conductive filler. Copolymer a) has a high molecular weight and preferably has hydroxyl, carboxylic acid, isocyanate, or epoxy functionality to improve compatibility with the solvent and epoxy. 【0016】 U.S. Patent No. 7,108,806 (Xiao et al.) describes a conductive adhesive composition comprising: a) an epoxy-functional amine-epoxy adduct obtained by reacting at least one epoxy resin with an aliphatic amine; b) a conductive filler; c) at least one of a corrosion inhibitor and an oxygen scavenger; d) a curing agent / curing catalyst comprising an imidazole; and e) optionally other additives, such as organic solvents, flow additives, adhesion promoters, and rheology modifiers. 【0017】 European Patent Application Publication No. 1715004 (National Starch and Chemical Investment Holding Company) discloses an adhesive composition useful for microelectronics applications, the composition comprising (a) a resin curable by free radical polymerization or hydrosilylation; (b) an epoxy compound having vinyl or allyl functionality; (c) a curing agent for resin (a); and optionally a filler. The composition is characterized in that it does not contain a curing agent for the epoxy compound. [Prior art documents] [Patent Documents] 【0018】 [Patent Document 1] Chinese Patent Application Publication No. 110894411 Specification [Patent Document 2] U.S. Patent No. 6,344,157 [Patent Document 3] U.S. Patent No. 7,326,369 [Patent Document 4] U.S. Patent No. 7,108,806 [Patent Document 5] European Patent Application Publication No. 1715004 [Overview of the project] [Problems that the invention aims to solve] 【0019】 It is recognized that photovoltaic modules are subjected to temperature changes and high mechanical stress throughout their lifecycle. These factors adversely affect the lifespan of photovoltaic modules, while also imposing requirements on the thermomechanical properties of the conductive adhesives used to bond the components of the solar cell and / or photovoltaic cell together. The adhesive must overcome the mechanical stress accumulated due to the mismatch in coefficients of thermal expansion (CTE) between the different materials used in the photovoltaic assembly, and the polymer matrix of the adhesive should preferably not pass its glass transition temperature (Tg) within the operating range of the module, and therefore be in a glassy, ​​brittle state at strong negative temperatures (below -10°C). 【0020】 Not only the properties of the cured adhesive, but also the curing profile of the adhesive is extremely important. It is important that the adhesive has a practical shelf life at room temperature; that the curing time is practical at a temperature that does not adversely affect electronic components and metallized features; that the adhesive is applicable (preferably dispensable or printable) and can be cured within industrial processes for mass production; and that adhesive bleeding from the constituent joints is negligible. [Means for solving the problem] 【0021】 According to a first aspect of the present invention, a conductive composition comprising the following is provided: a) 1) First epoxy resin; and 2) Second epoxy resin, and / or functionalized polybutadiene resin, and / or functionalized butadiene-acrylonitrile copolymer Resin components containing; b) Curing agent for epoxy resins; c) Conductive filler; d) Core shell rubber reinforcing agents; and e) 1) Monofunctional epoxy reactive diluents, and / or 2) Polyfunctional epoxy reactive diluent Reactive diluent components containing; Here, if the functionalized polybutadiene resin is present in the resin component, the composition further includes a curing agent. 【0022】 The following are examples of conductive compositions, based on the weight of the composition: The resin component comprising 4-40% by weight of a) 1) the first epoxy resin and 2) the second epoxy resin and / or the functionalized polybutadiene resin and / or the functionalized butadiene-acrylonitrile copolymer; 0.5 to 7% by weight, preferably 1 to 6% by weight, of the curing agent (b); c) the conductive filler in an amount of 55-80% by weight, preferably 60-76% by weight; d) the core-shell rubber reinforcing agent in an amount of 0.1 to 5% by weight, preferably 0.2 to 4.5% by weight; and 1-15% by weight (e) 1) Monofunctional epoxy reactive diluents, and / or 2) Polyfunctional epoxy reactive diluent The reactive diluent component comprising; Includes, Here, if the functionalized polybutadiene resin is present in the resin component, the composition further includes a curing agent. 【0023】 In one embodiment, the first epoxy resin is selected from the group consisting of: aliphatic epoxy resins; alicyclic epoxy resins; epoxy novolac resins; bisphenol-A epoxy resins; bisphenol-F epoxy resins; hydrogenated bisphenol-A epoxy resins; hydrogenated bisphenol-F epoxy resins; bisphenol-A epichlorohydrin-based epoxy resins; polyepoxy resins; propylene glycol epoxy resins; reaction products of polyether polyols and epichlorohydrin; and epoxy silicone copolymers. Preferably, the first epoxy resin is selected from the group consisting of: bisphenol A epoxy resins, bisphenol F epoxy resins, and mixtures of bisphenol A epoxy resins and bisphenol F epoxy resins. 【0024】 The second epoxy resin, if present, differs from the first epoxy resin and is preferably selected from the group consisting of: epichlorohydrin formaldehyde phenol resin; epichlorohydrin phenol novolac resin; epichlorohydrin o-cresol novolac resin; epichlorohydrin m-xylenediamine resin; epichlorohydrin diaminodiphenylmethane resin; and epichlorohydrin trimethylolpropane resin. Epichlorohydrin phenol novolac resin is preferred as the second epoxy resin. 【0025】 The functionalized polybutadiene resin, if present, is preferably selected from the group consisting of maleic anhydride-functionalized polybutadiene, vinyl-functionalized polybutadiene, maleic anhydride-grafted vinyl-functionalized polybutadiene, epoxidized polybutadiene, and mixtures thereof. One or more of maleic anhydride-functionalized polybutadiene and maleic anhydride-grafted vinyl-functionalized polybutadiene are considered preferable. 【0026】 If present, the functionalized butadiene-acrylonitrile copolymer is preferably selected from the group consisting of epoxy-modified butadiene-acrylonitrile copolymer, carboxyl-modified butadiene-acrylonitrile copolymer, amine-modified butadiene-acrylonitrile copolymer, alcohol-modified butadiene-acrylonitrile copolymer, and mixtures thereof. One or more of epoxy-modified butadiene-acrylonitrile copolymer and carboxyl-modified butadiene-acrylonitrile copolymer are preferred. 【0027】 Regardless of the above selection of resin component a), the conductive filler of the composition is selected from the group consisting of: silver; nickel; carbon; carbon black; graphite; graphene; copper; gold; platinum; aluminum; iron; zinc; cobalt; lead; tin alloy; silver-coated nickel; silver-coated copper; silver-coated graphite; silver-coated polymers, such as silver-coated acrylic polymers and / or silver-coated silicone polymers; silver-coated aluminum; silver-coated glass; silver-coated carbon; silver-coated boron nitride; silver-coated aluminum oxide; silver-coated aluminum hydroxide; nickel-coated graphite; and mixtures thereof. The use of particulate silver is particularly preferred. 【0028】 The curing agent b) of the composition is preferably either an amine-based curing agent or a nitrogen-containing epoxy adduct, and is preferably selected from the group consisting of alicyclic amines, aliphatic amines, polyetheramines, amine-epoxy adducts, imidazole-epoxy adducts, imidazoles, imidazole derivatives, polyetheramines, and mixtures thereof. A curing agent b) comprising at least one of imidazole-epoxy adducts, amine-epoxy adducts, and imidazole is considered preferable. 【0029】 According to a second aspect of the present invention, a cured product of a conductive composition as defined herein and in the appended claims is provided. 【0030】 The present invention also provides the use of any conductive composition, or cured product thereof, as defined herein and in the appended claims, in solar cells and / or photovoltaic modules, preferably as an interconnecting material for connecting solar cells within a photovoltaic module. For example, the curable composition or cured product may be used as an interconnecting material in a photovoltaic module in which the solar cells are singled or connected in series with metal ribbons. 【0031】 In a further embodiment of the present invention, a photovoltaic module is provided comprising a string of two or more solar cells connected in series in a single pattern having a conductive junction between the two or more solar cells, wherein the conductive junction is formed by either a conductive composition as defined herein and in the appended claims, or a cured product obtained therefrom. To form the module, the conductive composition is preferably applied by dispensing, jetting, or printing. 【0032】 The background of the present invention will be explained with reference to the attached drawings. [Brief explanation of the drawing] 【0033】 [Figure 1] Figure 1 shows the structure of a typical silicon solar cell. [Figure 2] Figure 2 shows a conventional photovoltaic module. [Figure 3] Figure 3 shows a single photovoltaic module. [Modes for carrying out the invention] 【0034】 <Definition> As used herein, the singular forms "a," "an," and "the" refer to multiple objects unless the context indicates otherwise. 【0035】 The terms “comprising,” “comprises,” and “comprised of,” as used herein, are synonymous with “including,” “includes,” “containing,” or “contains,” and are comprehensive or open-ended, and do not exclude additional, undescribed members, elements, or method steps. 【0036】 As used herein, the term "consisting of" excludes any unspecified elements, components, members, or method steps. 【0037】 Where quantities, concentrations, dimensions, and other parameters are expressed in the form of ranges, preferred ranges, upper limits, lower limits, or preferred upper and lower limits, any range obtained by combining any upper or preferred value with any lower or preferred value should be understood to be specifically disclosed, regardless of whether such range is explicitly mentioned in the context. 【0038】 Furthermore, according to standard understanding, the weight range expressed as "0~" specifically includes 0% by weight. The components defined by the range may or may not be present in the composition. 【0039】 The words “preferred,” “preferably,” “desirably,” and “particularly” are frequently used herein to refer to embodiments of the disclosure that may provide particular advantages under specific circumstances. However, the description of one or more preferred, preferred, desirable, or particular embodiments does not mean that other embodiments are not useful, nor is it intended to exclude those other embodiments from the scope of the disclosure. 【0040】 As used throughout this application, the word "may" is used in an acceptable sense (i.e., possible) rather than an obligatory sense. 【0041】 As used herein, room temperature is 23°C plus or minus 2°C. As used herein, “ambient conditions” means the ambient temperature and pressure on which the composition is placed, or on which the coating layer or the substrate of the coating layer is placed. 【0042】 As used herein, the term "monofunctional" means having one polymerizable site. As used herein, the term "polyfunctional" means having one or more polymerizable sites. 【0043】 As used herein, the term “equivalent (eq.)” refers to the relative number of reactive groups present in a reaction, as is common in chemical notation. 【0044】 As used herein, the term “equivalent” means the molecular weight divided by the number of the function. Thus, “epoxy equivalent” (EEW) means the weight in grams of resin containing one equivalent of epoxy. Similarly, “amine hydrogen equivalent” (AHEW) is the weight in grams of organic amine containing one amine hydrogen. 【0045】 As used herein, the term “epoxy” refers to a compound characterized by the presence of at least one cyclic ether group, i.e., a group in which an ether oxygen atom is bonded to two adjacent carbon atoms, thereby forming a cyclic structure. This term is intended to encompass monoepoxy compounds, polyepoxy compounds (having two or more epoxy groups), and epoxy-terminated prepolymers. The term “monofunctional epoxy compound” means an epoxy compound having one epoxy group. The term “polyfunctional epoxy compound” means an epoxy compound having at least two epoxy groups. The term “diepoxy compound” means an epoxy compound having two epoxy groups. 【0046】 The epoxy may be unsubstituted or may be inertly substituted. Exemplary inert substituents include chlorine, bromine, fluorine, and phenyl. 【0047】 As used herein, “(meth)acryl” is an abbreviation that refers to “acryl” and / or “methacryl”. Thus, the term “(meth)acrylamide” refers collectively to acrylamide and methacrylamide. 【0048】 As used herein, “C 1- C n alkyl” group is a monovalent group containing 1 to n carbon atoms, which is a group of alkane and includes linear and branched organic groups. Thus, “C 1- C 30 alkyl” group refers to a monovalent group containing 1 to 30 carbon atoms, which is a group of alkane and includes linear and branched organic groups. Examples of alkyl groups include, but are not limited to, the following: methyl; ethyl; propyl; isopropyl; n-butyl; isobutyl; sec-butyl; tert-butyl; n-pentyl; n-hexyl; n-heptyl; and 2-ethylhexyl. In the present invention, such alkyl groups may be unsubstituted or may be substituted with one or more substituents such as halo, nitro, cyano, amide, amino, sulfonyl, sulfinyl, sulfanyl, sulfoxy, urea, thiourea, sulfamoyl, sulfamide, and hydroxy. When applicable, the selection for a given substituent is described herein. However, generally, the selection for unsubstituted alkyl groups containing 1 to 18 carbon atoms (C 1- C 18 alkyl)-for example, unsubstituted alkyl groups containing 1 to 12 carbon atoms (C 1- C 12 alkyl), or unsubstituted alkyl groups containing 1 to 6 carbon atoms (C 1- C6 alkyl)-should be noted. 【0049】 The term "C" as used herein 1- C 18 A "hydroxyalkyl" refers to an HO-(alkyl) group having 1 to 18 carbon atoms, where the substituent bond is via an oxygen atom, and alkyl groups are defined as described above. 【0050】 "Alkoxy group" refers to a monovalent group represented by -OA where A is an alkyl group, and non-limiting examples include the methoxy group, ethoxy group, and isopropyloxy group. The term "C" as used herein 1- C 18 "Alkoxyalkyl" refers to an alkyl group having an alkoxy substituent as defined above, where the (alkyl-O-alkyl) moiety contains a total of 1 to 18 carbon atoms. Examples of such groups include methoxymethyl (-CH2OCH3), 2-methoxyethyl (-CH2CH2OCH3), and 2-ethoxyethyl. 【0051】 The term "C" as used herein 2- A "C4 alkylene" is defined as a saturated divalent hydrocarbon group having 2 to 4 carbon atoms. 【0052】 The term “C 3- C 10 "Cycloalkyl" is understood to mean an optionally substituted, saturated, monocyclic or polycyclic hydrocarbon group having 3 to 10 carbon atoms. Examples of cycloalkyl groups include: cyclopropyl; cyclobutyl; cyclopentyl; cyclohexyl; cycloheptyl; cyclooctyl; adamantane; and norbornane. 【0053】 The term "C" as used herein, either alone or as part of a larger part. 6- C 18The "aryl" group—such as "aralkyl"—means optionally substituted monocyclic, bicyclic, and tricyclic ring systems in which the monocyclic ring system is aromatic, or in which at least one ring of a bicyclic or tricyclic ring system is aromatic. Bicyclic and tricyclic ring systems include benzo-condensed 2-3 membered carbon rings. Exemplary aryl groups include: phenyl; indenyl; naphthalenyl, tetrahydronaphthyl, tetrahydroindenyl; tetrahydroanthracenyl; and anthracenyl. It should be noted that the phenyl group is preferred. 【0054】 When used herein, "C 2- C 20 "Alkenyl" refers to a hydrocarbyl group having 2 to 20 carbon atoms and at least one unit of ethylenically unsaturated carbon. Alkenyl groups can be linear, branched, or cyclic and may be optionally substituted. The term "alkenyl" also encompasses groups having "cis" and "trans" configurations, or alternatively, "E" and "Z" configurations, as understood by those skilled in the art. However, generally speaking, 2 to 10 (C 2-10 ) or 2 to 8 pieces (C 2-8 It should be noted that an unsubstituted alkenyl group containing the carbon atom of the above C is preferred. 2- C 12Examples of alkenyl groups, though not limited to these, include: -CH=CH2; -CH=CHCH3; -CH2CH=CH2; -C(=CH2)(CH3); -CH=CHCH2CH3; -CH2CH=CHCH3; -CH2CH2CH=CH2; -CH=C(CH3)2; -CH2C(=CH2)(CH3); -C(=CH2)CH2CH3; -C(CH3)=CHCH3; -C(CH3)CH=CH2; -CH=CHCH2CH2CH3; -CH2CH=CHCH2CH3; -CH2CH2CH=CHCH3; -CH2CH2CH2CH=CH2; -C(=CH2)CH2CH2CH3; -C(CH3)=CHCH2CH3; -CH(CH3)CH=CHCH; -CH(CH3)CH2CH=CH2; -CH2CH=C(CH3)2; 1-cyclopent-1-enyl; 1-cyclopent-2-enyl; 1-cyclopent-3-enyl; 1-cyclohex-1-enyl; 1-cyclohex-2-enyl; and 1-cyclohex-3-enyl. 【0055】 As used herein, “alkylaryl” means an alkyl-substituted aryl group, and “substituted alkylaryl” means an alkylaryl group having one or more substituents as defined above. Furthermore, as used herein, “aralkyl” means an alkyl group substituted with an aryl group as defined above. Exemplary (C1-C4) alkylphenyl groups include tolyl and ethylphenyl. 【0056】 As used herein, the term "hetero" refers to a group or site containing one or more heteroatoms, such as N, O, Si, and S. Therefore, for example, "heterocyclic" refers to a cyclic group having, for example, N, O, Si, or S as part of its ring structure. "Heteroalkyl" and "heterocycloalkyl" sites mean alkyl and cycloalkyl groups, as defined herein, that contain N, O, Si, or S as part of their structure, respectively. 【0057】 As used herein, the term "catalytic amount" means a quasi-stoichiometric amount of catalyst relative to the reactants, unless otherwise explicitly stated. 【0058】 As used herein, “primary amino group” refers to an NH2 group bonded to an organic group, and “secondary amino group” refers to an NH group bonded to two organic groups, which may also be part of a ring. Accordingly, the term “tertiary amine” refers to nitrogen having a site where the nitrogen atom is not bonded to a hydrogen atom. As used herein, the term “amine hydrogen” refers to the hydrogen atom of primary and secondary amino groups. 【0059】 The molecular weights referred to herein can be measured using gel permeation chromatography (GPC) with a polystyrene calibration standard, as performed in accordance with ASTM 3536. 【0060】 As used herein, "anhydrous" means that the composition in question contains less than 0.25% by weight of water. For example, the composition may contain less than 0.1% by weight of water, or may be completely water-free. 【0061】 Unless otherwise specified, the term "particle size" refers to the maximum axis of a particle. In the case of a typical spherical particle, the maximum axis is the diameter. 【0062】 As used herein, the term “average particle size” (D50) refers to the particle size where 50% of the volume of sampled particles is greater than the D50 value mentioned, and 50% of the volume of sampled particles is less than the D50 value mentioned. Similarly, as used herein, the term “D90” refers to the particle size where 90% of the volume of sampled particles is less than the D90 value mentioned, and 10% of the volume of sampled particles is greater than the D90 value mentioned. 【0063】 All references cited herein are incorporated herein by reference in their entirety. 【0064】 The conductive composition is defined herein as having certain utility as a curable adhesive composition in solar cells and photovoltaic modules. However, it should be stated that any or all of the features given to the composition may be claimed and given without being limited to use in / within the joining of photovoltaic modules, solar cells, and their components. The composition may find utility, for example, in the joining of other electronic components and devices. 【0065】 The definitions of terms are included above to enable those skilled in the art to better understand the teachings of the present invention. Certain technical and scientific terms are used to characterize the present invention, and when not defined above, these terms have the meanings generally understood by those skilled in the art to which the present invention pertains. 【0066】 <Detailed Description of the Invention> <a)i) First epoxy resin> The composition of the present invention includes a first epoxy resin a)i), and this first epoxy resin typically preferably constitutes 4 to 17% by weight of the total weight of the composition. The first epoxy resin is preferably present in an amount of 5 to 16% by weight, for example 6 to 16% by weight, based on the total weight of the composition. 【0067】 The first epoxy resin of the present invention is a liquid characterized by a viscosity of at least 1 Pa·s at 25°C and 50% relative humidity (RH), for example a viscosity of 1 to 15 Pa·s or 2.5 to 12.5 Pa·s measured at 25°C and 50% relative humidity (RH). The first epoxy resin may further be characterized by an epoxy equivalent of 100 to 700 g / eq, for example 100 to 350 g / eq. And generally, diepoxy compounds having an epoxy equivalent of less than 500 g / eq, or even less than 400 g / eq, are preferred. This is mainly from the perspective of cost because in their production, low molecular weight epoxy resins require less limited treatment in purification. 【0068】 The viscosity of the epoxy resin was measured using a TA Instruments Rheometer, either HR-1 or Q-2000, with a 2-degree cone plate geometry featuring a 2 cm diameter plate, in 15 seconds. -1 Viscosity is measured at 25°C with a shear rate of 0.5°C. The unit of viscosity is reported in Pa.s. 【0069】 In a broad sense, the first epoxy resin used herein may be selected from monofunctional epoxy resins, difunctional epoxy resins, and multifunctional or polyfunctional epoxy resins. The first epoxy resin may be saturated or unsaturated, aliphatic, alicyclic, aromatic, or heterocyclic, and may be substituted. Furthermore, the epoxy resin may be a monomer or a polymer. 【0070】 Examples of a wide range of (poly)epoxy compounds that may be included as the first epoxy resin in the present invention include: glycidyl ethers of polyhydric alcohols and polyhydric phenols; glycidyl esters of polycarboxylic acids. 【0071】 In certain embodiments, the first epoxy resin is selected from the group consisting of: aliphatic epoxy resins; alicyclic epoxy resins; epoxy novolac resins; bisphenol-A epoxy resins; bisphenol-F epoxy resins; hydrogenated bisphenol-A epoxy resins; hydrogenated bisphenol-F epoxy resins; bisphenol-A epichlorohydrin-based epoxy resins; propylene glycol epoxy resins; reaction products of polyether polyols and epichlorohydrin; polycarbonate diol-based glycidyl ethers; and epoxy silicone copolymers. Preferably, the first epoxy resin is selected from the group consisting of bisphenol A epoxy resins and bisphenol F epoxy resins. 【0072】 Exemplary commercially available epoxy resins for use as the first epoxy resin include the following: EPON® DPL-862, EPON® Resin828, EPON® Resin826, and EPON® Resin825 (manufactured by Hexion); Epo Tohto ZX 1059 (CAS No. 385801-30-9) (manufactured by Tohto Kasei Co., Ltd.); and DER® 331, DER® 383, DER® 354, and DER® 732 (manufactured by Olin). 【0073】 <a)ii) Second epoxy resin> In the present invention, the presence of the second epoxy resin is optional. However, when present in the composition, the second epoxy resin is desirably included in an amount of 0.3 to 3% by weight, preferably 0.5 to 2.5% by weight, for example 0.6 to 2.0% by weight, based on the total weight of the composition. 【0074】 Any second epoxy resin added is necessarily different from the first epoxy resin. The second epoxy resin may be solid or a liquid characterized by a viscosity of at least 1 Pa·s at 25 °C and 50% relative humidity (RH), for example a viscosity of 1 to 15 Pa·s or 2.5 to 12.5 Pa·s measured at 25 °C and 50% relative humidity (RH). Further, the second epoxy resin may be characterized by an epoxy equivalent of 100 to 700 g / eq, for example 100 to 350 g / eq. And generally, a diepoxy compound having an epoxy equivalent of less than 500 g / eq, or further less than 400 g / eq, is preferred. However, it is desirable to mention that the first epoxy resin and the second epoxy resin may have the same or different numbers of epoxy groups per molecule. 【0075】 The viscosity of the epoxy resin was measured using a 2-degree cone-plate geometry with a 2 cm diameter plate on a rheometer, Rheometer HR-1 or Q-2000, manufactured by TA Instruments, for 15 s -1It is measured at 25 °C at a shear rate. The unit of viscosity is reported in Pa·s. 【0076】 Although not intended to limit the present invention, preferably, the second epoxy resin is selected from the group consisting of: epichlorohydrin formaldehyde phenol resin; epichlorohydrin phenol novolak resin; epichlorohydrin o-cresol novolak resin; epichlorohydrin m-xylylenediamine resin; epichlorohydrin diaminodiphenylmethane resin; epichlorohydrin trimethylolpropane resin; and mixtures thereof. As the second epoxy resin, epichlorohydrin phenol novolak resin may be mentioned as preferred. 【0077】 Exemplary commercially available epoxy resins for use as the second epoxy resin include the following: Epiclon N730A (manufactured by DIC Corporation); and EPALLOY® 8240, 8250, 8280 and 8330 (manufactured by Huntsman); and BNE, CNE, DNE and PNE series (manufactured by Chang Chun Group (CCP)). 【0078】 <a)iii) Functionalized polybutadiene resin> In the present invention, the presence of at least one functionalized polybutadiene resin is optional. However, when present in the composition, the functionalized polybutadiene is desirably included in an amount of 0.1 to 15% by weight, preferably 5 to 12% by weight, for example 8 to 11% by weight, based on the total weight of the composition. 【0079】 The said or each functionalized polybutadiene resin should preferably satisfy at least one of the following conditions: a number average molecular weight (Mn) in the range of 500 to 15000 Daltons, preferably 1000 to 10000 Daltons; and a functionality of 1.5 to 11, preferably 1.5 to 7, more preferably 2 to 6. 【0080】 Without intending to limit the present invention, the functionalized polybutadiene resins are preferably selected from the following: carboxyl-functionalized polybutadiene polymers; hydroxyl-functionalized polybutadiene polymers, preferably those having terminal hydroxyl groups; epoxidized polybutadiene polymers, e.g., epoxidized, acrylicated polybutadiene polymers; vinyl-terminated polybutadiene polymers; (meth)acrylate-terminated polybutadiene polymers; terminally functionalized polybutadiene polymers that can be prepared by reacting the hydroxyl group of the corresponding hydroxyl-terminated polymer with a suitable reagent such as a carboxylic acid, an acid chloride, or an anhydride such as maleic anhydride; and mixtures of the polymers. It may be noted that the use of maleic anhydride-functionalized polybutadiene polymers, maleic anhydride-grafted vinyl-functionalized polybutadiene polymers, and mixtures thereof is preferred. 【0081】 Examples of hydroxyl-functionalized polybutadiene resins include: resins available in the PolyBD® series from Sartomer, e.g., PolyBD®R-20LM, PolyBD®R-45M, PolyBD®R-45HTLO, PolyBD®LF-1, PolyBD®LF-2, PolyBD®LF-3, PolyBD®LF-5, PolyBD®LF-6, PolyBD®LF-7, etc.; resins available in the Krasol® series from Sartomer, e.g., Krasol®HLBH-P3000, Krasol®LBH 2000, Krasol®LBH3000, Krasol®LBH 5000, Krasol® LBH10000, Krasol® LBH-P2000, Krasol® LBH-P3000, Krasol® LBH-P5000, Krasol® LBH-P10000, and Krasol® LBH2040, etc.; as well as those available in the NISSO series manufactured by Mitsubishi International Corporation, such as NISSO-PB G-1000, NISSO-PB G-2000, NISSO-PB G-3000, NISSO-PB GI-1000, NISSO-PB GI-2000, and NISSO-PB GI-3000. 【0082】 Examples of commercially available carboxy-functionalized polybutadiene polymers include: HYPRO® 2000X162CTB and HYPRO® CS 8596, available from Huntsman. 【0083】 Examples of commercially available vinyl-functionalized polybutadienes include: RICON® 100, 130, 131, 134, 142, 150, 152, 153, 154, 156, 157, 181, and 184, as well as P30D (manufactured by Total); and PolyBD® R45VT (manufactured by Total). 【0084】 Examples of (meth)acrylate-functionalized butadienes include, but are not limited to, RICACRYL® 3100, RICACRYL® 3500, and RICACRYL® 3801 (manufactured by Total); and CN-301, CN-302, CN-303, and CN-307 (manufactured by Sartomer). 【0085】 Examples of maleic anhydride-grafted vinyl-functionalized polybutadienes and alcohol condensates obtained therefrom include: RICON® 130MA8, RICON® 130MA13, RICON® 130MA20, RICON® 131MA5, RICON® 131MA10, RICON® 131MA17, RICON® 131MA20, RICON® 184MA6, and RICON® 156MA17 (manufactured by Total). 【0086】 If a functionalized polybutadiene resin is present in the composition, the composition further includes a curing agent for the resin, typically in an amount of 0.05 to 2% by weight, for example, 0.1 to 1.5% by weight, or 0.1 to 1% by weight, of the total weight of the composition. The reactive sites of this curing agent are determined by the specific functional groups present in the functionalized polybutadiene resin. In many cases, the curing agent contains at least two reactive groups that can react with the functional groups on the functionalized polybutadiene polymer. 【0087】 Exemplary curing agents may include: (poly)carboxylic acids; polyisocyanates; blocked polyisocyanates; anhydrides; aminoplast resins particularly containing amine / aldehyde condensates, preferably at least partially etherified, and more preferably completely etherified; boron trihalides, particularly boron trichloride, boron trifluoride, latent boron trifluoride chelate and latent boron trichloride chelate; and peroxides. 【0088】 Suitable polyisocyanates include any aliphatic, alicyclic, arylaliphatic, heterocyclic, or aromatic polyisocyanate, or mixtures thereof, having an average isocyanate functionality of at least 2.0 and an equivalent weight of at least 80. The isocyanate functionality of the polyisocyanate is more generally 2.2 to 4.0, for example, 2.3 to 3.5. Functionality above 4.0 may be used, but its use may cause excessive crosslinking. The equivalent weight of the polyisocyanate is typically 100 to 300, preferably 110 to 250, and more preferably 120 to 200. 【0089】 The polyisocyanate may, if necessary, be biuretized and / or isocyanurated by a common known method such as that described in British Patent No. 889,050. 【0090】 Examples of suitable polyisocyanates, but not limited to these, include: ethylene diisocyanate; 1,4-tetramethylene diisocyanate; hexamethylene diisocyanate (HDI); biuret or trimer of HDI; 1,12-dodecane diisocyanate, cyclobutane-1,3-diisocyanate, cyclohexane-1,3- and 1,4-diisocyanates, and mixtures thereof of their isomers; 1-isocyanato-3,3,5-trimethyl-5-isocyanatomethylcyclohexane; 2,4- and 2,6-hexahydrotolylene diisocyanate, and mixtures thereof of their isomers; hexahydro-3- and / or 1,4-phenylene diisocyanate Socyanates; perhydro-2,5'- and / or 4,4'-diphenylmethane diisocyanates; 1,3- and 1,4-phenylenediisocyanates; 2,4- and 2,6-tolylene diisocyanates, and mixtures thereof of their isomers; diphenylmethane-2,4'- and / or 4,4'-diisocyanates (MDI); naphthylene-1,5-diisocyanates; triphenylmethane-4,4',4'-triisocyanates; and polyphenylpolymethylene polyisocyanates of the type obtained by condensation of aniline and formaldehyde by phosgenation as described in British Patent No. 874,430 and British Patent No. 848,671. It should be noted that diisocyanates and / or polyisocyanates, including esters, urea, allophanates, carbodiimides, uretdiones and / or urethane groups, may also be used in the methods according to the present invention. 【0091】 Exemplary peroxide compounds suitable for use in the present invention are, for example, organic peroxides selected from the following: cyclic peroxides; diacyl peroxides; dialkyl peroxides; hydroperoxides; peroxycarbonates; peroxydicarbonates; peroxyesters; and peroxyketals. 【0092】 In embodiments of the present invention, the free radical initiator is of formula: [ka] [Wherein, R p is an aliphatic or aromatic group containing up to 18 carbon atoms, R q is H, or an aliphatic or aromatic group containing up to 18 carbons, Preferably, R p and R q are C1-C 12 alkyl group, C6-C 18 aryl group or C7-C 18 aralkyl group.] comprises or consists of at least one peroxide compound represented by 【0093】 Exemplary peroxide compounds that may be used alone or in combination include the following: cumene hydroperoxide (CHP); para-menthane hydroperoxide; t-butyl hydroperoxide (TBH); t-butyl perbenzoate; t-butyl peroxypivalate; di-t-butyl peroxide; t-butyl peroxyacetate; t-butyl peroxy-2-hexanoate; t-amyl hydroperoxide; 1,2,3,4-tetramethylbutyl hydroperoxide; benzoyl peroxide; dibenzoyl peroxide; 1,3-bis(t-butylperoxyisopropyl)benzene; diacetyl peroxide; butyl 4,4-bis(t-butylperoxy)valerate; p-chlorobenzoyl peroxide; t-butylcumyl peroxide; di-t-butyl peroxide; dicumyl peroxide; di(dodecanoyl) peroxide; 2,5-dimethyl-2,5-di-t-butylperoxyhexane; 2,5-dimethyl-2,5-di-t-butylperoxyhex-3-yne; and 4-methyl-2,2-di-t-butylperoxypentane. 【0094】 These peroxide compound-based curing agents achieve an ideal balance among profile, curing rate, adhesion, and electrical properties. 【0095】 <a)iv) Functionalized butadiene-acrylonitrile copolymer> In the present invention, the presence of at least one functionalized butadiene-acrylonitrile copolymer is optional. However, if present in the composition, the functionalized butadiene-acrylonitrile copolymer is preferably included in an amount of 0.1 to 5% by weight, preferably 1 to 5% by weight, for example, 2 to 5% by weight, based on the total weight of the composition. 【0096】 The above or each of the functionalized butadiene-acrylonitrile copolymers should preferably satisfy at least one of the following conditions: a number-average molecular weight (Mn) in the range of 500 to 15,000 daltons, preferably 1,000 to 10,000 daltons; and a functionality of 1.5 to 5, preferably 1.5 to 4. 【0097】 Without intending to limit the present invention, the functionalized butadiene-acrylonitrile copolymer is preferably selected from the following: epoxy-functionalized butadiene-acrylonitrile copolymer; carboxyl-functionalized butadiene-acrylonitrile copolymer; vinyl-functionalized butadiene-acrylonitrile copolymer; amine-functionalized butadiene-acrylonitrile copolymer; hydroxyl-functionalized butadiene-acrylonitrile copolymer; and mixtures thereof. It is preferable to use epoxy-functionalized butadiene-acrylonitrile copolymer, carboxyl-functionalized butadiene-acrylonitrile copolymer, or mixtures thereof. 【0098】 Exemplary functionalized butadiene-acrylonitrile copolymers include the following: As carboxyl-terminated poly(butadiene-co-acrylonitrile) polymers, HYPRO® 1300X31 CTBN, HYPRO® 1300X8 CTBN, HYPRO® 1300X13 CTBN, HYPRO® 1300X9 CTBNX, and HYPRO® 1300X18 CTBNX (manufactured by Huntsman); As vinyl and carboxyl-functionalized poly(butadiene-co-acrylonitrile) polymers, HYPRO® 1300X33 VTBNX, and HYPRO® 1300X43 VTBNX (manufactured by Huntsman); As epoxy-terminated poly(butadiene-co-acrylonitrile) polymers, HYPRO® 1300X40 ETBN (manufactured by Huntsman); As amine-terminated poly(butadiene-co-acrylonitrile) polymers, HYPRO® 1300X21 ATBN, HYPRO® 1300X16 ATBN, HYPRO® 1300X45 ATBN, HYPRO® 1300X35 ATBN, and HYPRO® 1300X42 ATBN (manufactured by Huntsman). 【0099】 The applicant has found that a resin component comprising (or optionally consisting of) 1) a first epoxy resin; and 2) a second epoxy resin and / or a functionalized polybutadiene resin and / or a functionalized butadiene-acrylonitrile copolymer gives an ideal flexibility to the cured composition according to the invention while having an ideal storage modulus. By way of comparison, for example, a combination of an epoxy resin and a cyanate ester resin results in a harder cured composition having a too high storage modulus. 【0100】 <b) Curing agent> The composition of the present invention necessarily includes a curing agent b) for epoxy compounds. The curing agent may include, or consist of, at least one compound having at least two epoxy-reactive groups per molecule. The curing agent may also include, or consist of, at least one latent curing agent that becomes reactive to the epoxy groups when a triggering event occurs. In particular, such a latent curing agent is stable at room temperature but can be activated at high temperatures. 【0101】 In one embodiment, curing agent b) may comprise one or more of the following: i) at least one compound having at least two amine hydrogens that react with the epoxy group; ii) at least one mercapto compound having at least two mercapto groups that react with the epoxy group; and iii) a Mannich base. The at least one compound having at least two amine hydrogens that react with the epoxy group preferably comprises a primary amine group and / or a secondary amine group, and has an equivalent amount of 150 g / eq. or less, more preferably 125 g / eq. or less per primary or secondary amine group. 【0102】 Suitable polyamines that can be used alone or in combination as curing agents in the present invention include, but are not limited to, the following: i) Examples of aliphatic, alicyclic, or arylaliphatic primary diamines that may be mentioned include: 2,2-dimethyl-1,3-propanediamine; 1,3-pentanediamine (DAMP); 1,5-pentanediamine; 1,5-diamino-2-methylpentane (MPMD); 2-butyl-2-ethyl-1,5-pentanediamine (C11-neodiamine); 1,6-hexanediamine (hexamethylenediamine, HMDA); 2,5-dimethyl-1,6-hexanediamine; 2,2,4- and / or 2,4,4-trimethylhexamethylenediamine; 1,7-heptanediamine; 1,8-octanediamine; 1,9-nonanediamine; 1,10-decanediamine; 1,11-undecanediamine; 1,12-dodecanediamine; 1,2-,1,3- and 1,4-diaminocyclohe Xane; bis(4-aminocyclohexyl)methane; bis(4-amino-3-methylcyclohexyl)methane; bis(4-amino-3-ethylcyclohexyl)methane; bis(4-amino-3,5-dimethylcyclohexyl)methane; bis(4-amino-3-ethyl-5-methylcyclohexyl)methane; 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane (isophoronediamine, IPDA); 2- and / or 4-methyl-1,3-diaminocyclohexane; 1,3-bis(aminomethyl)-cyclohexane; 1,4-bis(aminomethyl)cyclohexane; 2,5(2,6)-bis(aminomethyl)-bicyclo[2.2.1]heptane (norboranediamine, NBDA); 3(4),8(9)-bis(aminomethyl)tricyclo[5.2.1.0 2,6 ]-decane (TCD-diamine); 1,4-diamino-2,2,6-trimethylcyclohexane (TMCDA); 1,8-menthanediamine; 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undecane; and 1,3-bis(aminomethyl)benzene (MXDA). ii) Polyamines containing tertiary amine groups having two or three primary aliphatic amine groups, the following specific examples may be mentioned: N,N'-bis(aminopropyl)-piperazine; N,N-bis(3-aminopropyl)methylamine; N,N-bis(3-aminopropyl)ethylamine; N,N-bis(3-aminopropyl)propylamine; N,N-bis(3-aminopropyl)cyclohexylamine; N,N-bis(3-aminopropyl)-2-ethylhexylamine; tris(2-aminoethyl)amine; tris(2-aminopropyl)amine; tris(3-aminopropyl)amine; and products from double cyanoethylation and subsequent reduction of fatty amines derived from natural fatty acids, e.g., N,N-bis(3-aminopropyl)dodecylamine and N,N-bis(3-aminopropyl)fat alkylamine, which are commercially available as Triameen® Y12D and Triameen® YT (manufactured by Akzo Nobel). iii) Ether-containing aliphatic primary polyamines, the following specific examples may be mentioned: bis(2-aminoethyl) ether; 3,6-dioxaoctane-1,8-diamine; 4,7-dioxadecane-1,10-diamine; 4,7-dioxadecane-2,9-diamine; 4,9-dioxadodecane-1,12-diamine; 5,8-dioxadodecane-3,10-diamine; 4,7,10-trioxatridecane-1,13-diamine and higher oligomers of these diamines; bis(3-aminopropyl)polytetrahydrofuran and its Other polytetrahydrofranziamines; alicyclic ether-containing diamines obtained from the propoxylation and subsequent amination of 1,4-dimethylolcyclohexane, for example, materials commercially available as Jeffamine® RFD-270 (Huntsman); polyoxyalkylenes or triamines obtained as products from the amination of polyoxyalkylenes and triols, which are commercially available under the names Jeffamine® (Huntsman), polyetheramines (BASF), or PC Amines® (Nitroil). It may be noted that the use of Jeffamine® D-230, Jeffamine® D-400, Jeffamine® D-600, Jeffamine® D-2000, Jeffamine® D-4000, Jeffamine® T-403, Jeffamine® T-3000, Jeffamine® T-5000, Jeffamine® EDR-104, Jeffamine® EDR-148, and Jeffamine® EDR-176, as well as the corresponding amines manufactured by BASF or Nitroil, is particularly preferred. iv) Examples that may be mentioned are primary diamines having secondary amine groups: 3-(2-aminoethyl)aminopropylamine, bis(hexamethylene)triamine (BHMT); diethylenetriamine (DETA); triethylenetetramine (TETA); tetraethylenepentamine (TEPA); pentaethylenehexamine (PEHA); higher homologs of linear polyethyleneamines, e.g., polyethylene polyamines having 5-7 ethyleneamine units (so-called "higher ethylene polyamines" HEPA); multiple cyanoethylation or cyanobutylation of primary diamines and polyamines having at least two primary amine groups and thereafter Products from the hydrogenation of these, for example, dipropylenetriamine (DPTA), N-(2-aminoethyl)-1,3-propanediamine (N3-amine), N,N'-bis(3-aminopropyl)ethylenediamine (N4-amine), N,N'-bis(3-aminopropyl)-1,4-diaminobutane, N5-(3-aminopropyl)-2-methyl-1,5-pentanediamine, N3-(3-aminopentyl)-1,3-pentanediamine, N5-(3-amino-1-ethylpropyl)-2-methyl-1,5-pentanediamine, or N,N'-bis(3-amino-1-ethylpropyl)-2-methyl-1,5-pentanediamine. v) Examples of polyamines having one primary amino group and at least one secondary amino group may be mentioned: N-butyl-1,2-ethanediamine; N-hexyl-1,2-ethanediamine; N-(2-ethylhexyl)-1,2-ethanediamine; N-cyclohexyl-1,2-ethanediamine; 4-aminomethyl-piperidine; N-(2-aminoethyl)piperazine; N-methyl-1,3-propanediamine; N-butyl-1,3-propanediamine N-(2-ethylhexyl)-1,3-propanediamine; N-cyclohexyl-1,3-propanediamine; 3-methylamino-1-pentylamine; 3-ethylamino-1-pentylamine; 3-cyclohexylamino-1-pentylamine; aliphatic diamines, e.g., N-cocoalkyl-1,3-propanediamine; primary aliphatic diamines and acrylonitrile, maleic acid diester or fumaric acid diester, citraconic acid diester, acrylic acid Products from Michael-type addition reactions in which lylic acid esters and methacrylic acid esters, acryl acid amides and methacrylic acid amides, and itaconic acid diesters are reacted in a 1:1 molar ratio; products from partial reductive alkylation of primary polyamines with aldehydes or ketones, in particular N-monoalkylation products of the aforementioned polyamines having two primary amine groups, especially 1,6-hexanediamine, 1,5-diamino-2-methylpentane, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 1,3-bis(aminomethyl)benzene, BHMT, DETA, TETA, TEPA, DPTA, N3-amines, and N4-amines, where preferred alkyl groups are benzyl, isobutyl, hexyl, and 2-ethylhexyl; and partially styrene-modified polyamines, such as those commercially available as Gaskamine® 240 (manufactured by Mitsubishi Gas Chemical). vi) N,N'-dialkylation products of secondary diamines and, in particular, polyamines having two primary amine groups, especially N,N'-dialkylation products of 1,6-hexanediamine, 1,5-diamino-2-methylpentane, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)-cyclohexane, 1,3-bis(aminomethyl)benzene, BHMT, DETA, TETA, TEPA, DPTA, N3-amine or N4-amine, where preferred alkyl groups are 2-phenylethyl, benzyl, isobutyl, hexyl, and 2-ethylhexyl. vii) Aromatic polyamines that may be mentioned include: m- and p-phenylenediamine; 4,4'-,2,4'- and 2,2'-diaminodiphenylmethane; 3,3'-dichloro-4,4'-diaminodiphenylmethane (MOCA); 2,4- and 2,6-tolylenediamine; mixture of 3,5-dimethylthio-2,4- and -2,6-tolylenediamine (manufactured by Albermarle, available as Ethacure® 300); mixture of 3,5-diethyl-2,4- and -2,6-tolylenediamine (DETDA); 3,3',5,5'-tetraethyl-4,4'-diaminodiphenylmethane (M-DEA); 3,3',5,5'-tetraethyl-2,2'-dichloro- 4,4'-Diaminodiphenylmethane (M-CDEA); 3,3'-Diisopropyl-5,5'-Dimethyl-4,4'-Diaminodiphenylmethane (M-MIPA); 3,3',5,5'-Tetraisopropyl-4,4'-Diaminodiphenylmethane (M-DIPA); 4,4'-Diaminodiphenyl-sulfone (DDS); 4-Amino-N-(4-Aminophenyl)benzenesulfonamide; 5,5'-Methylenedianthranilic acid; Dimethyl-(5,5'-Methylenedianthranilate); 1,3-Propylene-bis(4-aminobenzoate); 1,4-Butylene-bis(4-aminobenzoate); Polytetramethylene oxide-bis(4-aminobenzoate) (Air Available from Products under the Versalink® trademark; 1,2-bis(2-aminophenylthio)ethane, 2-methylpropyl-(4-chloro-3,5-diaminobenzoate); and Tert.butyl-(4-chloro-3,5-diaminobenzoate). viii) Polyamidoamines whose indicating members include the reaction product of a monovalent or polyvalent carboxylic acid or its ester or anhydride (especially dimer fatty acids) with an aliphatic polyamine, alicyclic polyamine, or aromatic polyamine, such as a polyalkyleneamine such as DETA or TETA. Examples of commercially available polyamidoamines include: Versamid® 100, 125, 140 and 150 (manufactured by Cognis); Aradur® 223, 250 and 848 (manufactured by Huntsman); Euretek® 3607 and 530 (manufactured by Huntsman); and Beckopox® EH651, EH654, EH655, EH661 and EH663 (manufactured by Cytec). 【0103】 Among the polyamines having at least two primary aliphatic amine groups, preferred ones are: isophoronediamine (IPDA); hexamethylenediamine (HMDA); 1,3-bis(aminomethyl)cyclohexane; 1,4-bis(aminomethyl)cyclohexane; bis(4-amino-cyclohexyl)methane; bis(4-amino-3-methylcyclohexyl)methane; NBDA; and ether-containing polyamines having a number-average molecular weight (Mn) of up to 500 g / mol. Among the ether-containing polyamines, Jeffamine® D-230 and D-600 (manufactured by Huntsman) are particularly preferred. 【0104】 The use of imidazoles and their derivatives is also conceivable. Exemplary imidazole derivatives may include: 2-methylimidazole; 1-methylimidazole; 2-ethyl-4-methylimidazole; 2-ethyl-5-methylimidazole; 2-heptadecylimidazole; 2-phenylimidazole; 2-phenyl-4,5-dihydroxymethylimidazole; 2-phenyl-4-methyl-5-hydroxymethylimidazole; 2-phenyl-4-benzyl-5-hydroxymethylimidazole; and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole. Commercially available imidazoles are sold by Shikoku under the name CUREZOL. 【0105】 This specification further considers that modified amines may be used as curing agents. Such modified amines include, but are not limited to,: epoxy-amine adducts obtained by the reaction of epoxy compounds with a stoichiometric excess of polyamines (epoxy-amine adducts are the Ajicure MY series (e.g., Ajicure MY-25, Ajicure MY-24, Ajicure MY-H, manufactured by Ajinomoto)); epoxyimidazole adducts as described in U.S. Patent No. 3,375,695 (Klaren et al.); and commercially available products such as EPIKURE® P-100 and P-101, manufactured by Hexion, or the Ajicure PN series (e.g., Ajicure PN-50, Ajicure PN-31, Ajicure PN-H, Ajicure PN-23), manufactured by Ajinomoto. 【0106】 As described above, the compositions of the present invention may optionally contain at least one compound having at least two reactive mercapto groups per molecule. Suitable mercapto group-containing compounds that can be used alone or in combination include, but are not limited to, the following: Liquid mercaptan-terminated polysulfide polymers, commercial examples include: Thiokol® polymers (manufactured by Morton Thiokol), particularly of types LP-3, LP-33, LP-980, LP-23, LP-55, LP-56, LP-12, LP-31, LP-32 and LP-2; and Thioplast® polymers (manufactured by Akzo Nobel), particularly of types G10, G112, G131, G1, G12, G21, G22, G44 and G4. A mercaptan-terminated polyoxyalkylene ether obtained by reacting a polyoxyalkylene diol or triol with epichlorohydrin or alkylene oxide, followed by a reaction with sodium hydrogen sulfide. • Mercaptan-terminated compounds in the form of polyoxyalkylene derivatives, known by the trade name Capcure® (manufactured by Cognis), particularly those of types WR-8, LOF, and 3-800. Specific examples include the following: thiocarboxylic acid polyesters: pentaerythritol tetramercaptoacetate (PETMP); trimethylolpropane trimercaptoacetate (TMPMP); glycol dimercaptoacetate; and esterification products of polyoxyalkylenediols and triols, ethoxylated trimethylolpropane and polyester diols with thiocarboxylic acids such as thioglycolic acid and 2- or 3-mercaptopropionic acid. 2,4,6-trimercapto-1,3,5-triazine, 2,2'-(ethylenedioxy)-diethanethiol (triethylene glycol dimercaptan) and / or ethanedithiol. 【0107】 The use of thiocarboxylic acid polyesters, particularly at least one of pentaerythritol tetramercaptoacetate (PETMP), trimethylolpropane trimercaptoacetate (TMPMP), and glycol dimercaptoacetate, is considered appropriate. 【0108】 As described above, the curing agent may contain at least one Mannich base. Such a compound may be characterized by containing at least one phenalkamine, in particular cardanol (CAS number: 37330-39-5), a phenalkamine obtained from the condensation of an aldehyde and an amine. The reactant amine in the condensation reaction is preferably ethylenediamine or diethyltriamine. 【0109】 Mannich bases and phenalkamines are known in the art, and suitable examples include commercially available phenalkamines such as Cardolite® NC-541, NC-557, NC-558, NC-566, Lite2001 and Lite2002 (manufactured by Cardolite), Aradur® 3440, 3441, 3442 and 3460 (manufactured by Huntsman), and Beckopox® EH614, EH621, EH624, EH628 and EH629 (manufactured by Cytec). 【0110】 In a very preferred embodiment, imidazole, imidazole-epoxy adducts, and amine-epoxy adducts are used as curing agents. 【0111】 These exemplary curing agents offer an ideal balance between profile, curing speed, adhesion, and electrical properties. For example, dicyanoamide-based curing agents tend to result in higher volume resistivity and are therefore not considered for use in the inventions according to the present invention. 【0112】 The compositions of the present invention typically contain 0.5 to 10% by weight of curing agent b) based on the weight of the composition. Preferably, the composition contains 0.5 to 7.5% by weight, for example, 1 to 6% by weight or 1 to 5% by weight of curing agent b) based on the weight of the composition. 【0113】 In an alternative representation of the composition of the present invention, which is not intended for the given composition ranges (in wt%) of component a) or component b) to be mutually exclusive, the overall composition preferably features a molar ratio of epoxy-reactive groups to epoxy groups of 1:0.95 to 1:5, for example 1:0.95 to 1:4. And, to be complete, the total of the epoxy-reactive groups includes the potential reactive groups present in the composition. In particular, a molar ratio of epoxy-reactive groups to epoxy groups of 1:1 is included within these stated ranges and represents a very preferred molar ratio per se. 【0114】 <c) Conductive particles> The composition of the present invention contains conductive particles. The composition may contain, for example, 55 to 80 wt%, or 60 to 80 wt% of conductive particles based on the weight of the composition. In certain important embodiments, it is desirable for the conductive particles to be included in the composition in an amount of 60 to 76 wt% based on the total weight of the composition. Preferably, the composition contains 67 to 75 wt% of conductive particles based on the total weight of the composition. 【0115】 If the amount of conductive particles is less than 55 wt% based on the weight of the composition, the composition may not provide the desired conductivity. Conversely, if the amount of the conductive filler exceeds 80 wt% based on the weight of the composition, the composition is no longer cost-effective and may have an adverse overall weight. Furthermore, an amount exceeding 80 wt% based on the weight of the composition increases the viscosity of the composition, which causes application difficulties when using typical industrial processes such as high-speed printing and dispensing processes. Additionally, an amount exceeding 80 wt% based on the weight of the composition results in a higher storage modulus, and this additional rigidity is detrimental to the reliability performance of the composition. 【0116】 Broadly speaking, there is no particular intention to limit the shape of the particles used as conductive fillers; needle-shaped, spherical, elliptical, cylindrical, bead-shaped, cubic, or plate-shaped particles may be used individually or in combination. The conductive filler may be, for example, a mixture of spherical and flake-shaped particles. Furthermore, it is conceivable that aggregated particles of two or more particle types may be used. 【0117】 Similarly, there is no particular intention to limit the size of the particles used as conductive fillers. However, conventionally, such conductive particles have an average volume particle size of 300 nm to 50 μm, for example, 500 nm to 40 μm, or 500 nm to 30 μm, as measured by laser diffraction / scattering. In the above measurement method, particle size is measured by a particle size analyzer, and particle shape is analyzed by a scanning electron microscope. That is, the scattering of laser light from the particles is detected by an array of detectors. Theoretical calculations are performed to fit the measured distribution of scattered light intensity. During the fitting process, the particle size distribution is estimated, and in particular, the D10, D50, and D90 values ​​are calculated as appropriate. 【0118】 For the sake of certainty, it should be noted that the conductive particles suitable for use in the present invention may be a mixture of particles having a small particle size and particles having a large particle size. 【0119】 In independent characterization of particles, with or without supplementing the aforementioned particle size distribution, conductive particles are measured according to ISO 3953 at 25 cm². 3 Measured using a graduated glass cylinder, 0.5–6.0 g / cm³ 3 Preferably 0.5 to 5.5 g / cm³ 3 , more preferably 0.5~5.0 g / cm³ 3 It is preferable to have a tap density. The principle of the specified method is to tap a specific amount of powder in a container using a tapping device until no further decrease in the volume of the powder is observed. The tap density is obtained by dividing the mass of the powder by its volume after the test. 【0120】 Suitable conductive particles are selected from the group consisting of: silver; nickel; carbon; carbon black; graphite; graphene; copper; gold; platinum; aluminum; iron; zinc; cobalt; lead; tin alloys; silver-coated nickel; silver-coated copper; silver-coated graphite; silver-coated polymers, such as silver-coated acrylic polymers and / or silver-coated silicone polymers; silver-coated aluminum; silver-coated glass; silver-coated carbon; silver-coated boron nitride; silver-coated aluminum oxide; silver-coated aluminum hydroxide; nickel-coated graphite; and mixtures thereof. 【0121】 Preferably, the conductive filler is selected from the group consisting of: silver; carbon black; graphite; graphene; copper; silver-coated nickel; silver-coated copper; silver-coated graphite; silver-coated polymer; silver-coated aluminum; silver-coated glass; silver-coated carbon; silver-coated boron nitride; silver-coated aluminum oxide; silver-coated aluminum hydroxide; nickel-coated graphite; and mixtures thereof. 【0122】 More preferably, the conductive particles are selected from the group consisting of: silver, silver-coated copper; silver-coated graphite; silver-coated polymer; silver-coated aluminum; silver-coated glass; and mixtures thereof. Silver is particularly preferred due to its good electrical properties. Conversely, silver-coated particles may be preferred because they are less expensive than silver itself. However, in such silver-coated or silver-plated particles, it is desirable that the silver coating or silver plating substantially, preferably completely coats the underlying particle material. Alternatively, or in addition to that requirement, the amount of silver in the silver-coated particles is preferably 10 to 70% by weight, for example 10 to 65 or 60% by weight, based on the total weight of the conductive particles. 【0123】 While not limited to the above, commercially available conductive fillers suitable for use in the present invention include, but are not limited to, the following: AA3462, AA-5124, AA-192N, C-1284P, C-0083P, EA3105, P888-6 and P543-14 silver particles (manufactured by Metalor); KP84, KP74, KP29, SF7 AT, SF15 ED, SF40, SF78, SF98, SF102 and SF134 silver particles (manufactured by Ames Goldsmidth); silver particles (manufactured by Ames Goldsmidth); CGF-DAB-121B silver-coated copper particles (manufactured by Dowa); AgCu0810 or AgCu0305 silver-coated copper particles (manufactured by Ames Goldsmidth); CONDUCT-O-FIL® SG15F35 silver-coated glass (manufactured by Potters Industries). Silver-coated polymers Spherica® Ag-30-01, Spherica® Ag-20-01, Spherica® Ag-10-01, and Spherica® Ag-4-01 (manufactured by Conpart AS); silver-coated graphite P594-5 (manufactured by Metalor); and silver-coated aluminum CONDUCT-O-FIL® SA325S20 (manufactured by Potters Industries Inc.). 【0124】 <d)コア-シェルゴム> The composition of the present invention comprises core-shell rubber particles. The composition may contain, for example, 0.1 to 5.0% by weight, or 0.1 to 4.5% by weight, of core-shell rubber particles based on the weight of the composition. In certain important embodiments, it is desirable that the core-shell rubber particles be included in the composition in an amount of 0.2 to 4.5% by weight, for example, 0.3 to 4.0% by weight, based on the total weight of the composition. 【0125】 The term "core-shell rubber" or CSR is used in accordance with its standard meaning in the art to refer to a rubber particle core formed by a polymer mainly composed of an elastomer or rubber-like polymer, and a shell layer formed by a polymer graft-polymerized onto the core. The shell layer partially or completely covers the surface of the rubber particle core during the graft polymerization process. By weight, the core preferably constitutes at least 50% by weight, for example, 50% to 95% by weight, of the core-shell rubber particles. 【0126】 The core polymer material is preferably a glass transition temperature (Tg) of 0°C or lower, preferably -20°C or lower, more preferably -40°C or lower, and even more preferably -60°C or lower. The shell polymer is a non-elastomer thermoplastic or thermosetting polymer having a glass transition temperature (Tg) above room temperature, preferably above 30°C, and more preferably above 50°C. 【0127】 For completeness, the core-shell rubber particle may comprise three or more layers. For example, a central core of a first rubbery material may be surrounded by a second core of a second different rubbery material. Alternatively, a single core may be surrounded by at least two shells having different compositions and different glass transition temperatures or hardnesses. In exemplary embodiments, the core-shell rubber particle used comprises a single core and at least two concentric shells having different chemical compositions and / or properties. 【0128】 Without intending to limit the present invention, the core may include: diene homopolymers, e.g., homopolymers of butadiene or isoprene; diene copolymers, e.g., copolymers of butadiene or isoprene with one or more ethylenically unsaturated monomers, e.g., vinyl aromatic monomers, (meth)acrylonitrile or (meth)acrylate; polymers based on (meth)acrylic acid ester monomers, e.g., polybutyl acrylate; and polysiloxane elastomers, e.g., polydimethylsiloxane and crosslinked polydimethylsiloxane. 【0129】 Similarly, without intent to limit the present invention, the shell may comprise a polymer or copolymer of one or more monomers selected from: (meth)acrylates, e.g., methyl methacrylate; vinyl aromatic monomers, e.g., styrene; vinyl cyanide, e.g., acrylonitrile; unsaturated acids and anhydrides, e.g., acrylic acid; and (meth)acrylamide. The polymer or copolymer used in the shell may have acid groups that are ionically crosslinked by metal carboxylate formation, particularly by the formation of salts of divalent metal cations. The shell polymer or copolymer may also be covalently crosslinked by monomers having two or more double bonds per molecule. Furthermore, the polymer or copolymer constituting the shell may have one or more different types of functional groups—in this specification, for example, epoxy groups—that can interact with other components of the composition of the present invention. 【0130】 Preferably, some of the included core-shell rubber particles have an average particle size (d50) of 10 nm to 1000 nm, for example, 50 nm to 550 nm or 50 nm to 400 nm. The particle size represents the diameter or maximum dimension of the particles in the particle distribution and is measured via dynamic light scattering. For completeness, this application does not exclude the presence of two or more types of core-shell rubber (CSR) particles with different particle size distributions in the composition to result in a balance of key properties of the resulting cured product, including shear strength, peel strength, and resin fracture toughness. 【0131】 The method for preparing the core-shell rubber particles as defined above in this specification is documented in the art. Representative documents that may be mentioned include: U.S. Patent No. 4,419,496; U.S. Patent No. 4,778,851; U.S. Patent No. 5,981,659; U.S. Patent No. 6,111,015; U.S. Patent No. 6,147,142; and U.S. Patent No. 6,180,693. Using such methods, rubber particles having a core-shell structure can be prepared as a masterbatch in which the rubber particles are dispersed in one or more resins; in an aqueous medium; or in an aqueous emulsion. Such dispersions or emulsions may be combined with the desired resin and any water or other volatile substances removed by distillation or the like. 【0132】 The core-shell rubber can be selected from commercially available products, examples of which include: Paraloid EXL 2650A, EXL 2655, and EXL 2691A (manufactured by Dow Chemical Company); Clearstrength® XT100 (manufactured by Arkema Inc.); Kane Ace™ MX series (manufactured by Kaneka Corporation), particularly MX 120, MX 125, MX 130, MX 135, MX 136, MX 551, MX 553; and METABLEN SX-006 (manufactured by Mitsubishi Rayon). 【0133】 <e)i) Monofunctional epoxy reactive diluent> The compositions of the present invention may include a monofunctional epoxy reactive diluent, which is distinct from a first epoxy resin and, if present, a second epoxy resin, which are included in the composition as component (a). As used herein, the term “monofunctional epoxy reactive diluent” means a liquid having one reactive epoxy functional group, which, when added to a material or compound—for example, a first epoxy resin—forms a composition having reduced viscosity. Hereinafter, the reactive diluent enables the epoxy resin to accept a higher solid load. The monoepoxy reactive diluent is preferably characterized by a viscosity of 0.005 to 0.75 Pa.s at 25°C, for example, less than 0.6 Pa.s or less than 0.5 Pa.s as measured at 25°C. 【0134】 The viscosity of the monofunctional epoxy reactive diluent was measured using a TA Instruments rheometer, either Rheometer HR-1 or Q-2000, with a 2-degree cone-plate geometry featuring a 2 cm diameter plate, for 15 seconds. -1 Viscosity is measured at 25°C with a shear rate of 0.5°C. The unit of viscosity is reported in Pa.s. 【0135】 If present, the composition is preferably comprising 1 to 7% by weight, preferably 2 to 6% by weight, and more preferably 3 to 5% by weight of the monofunctional epoxy reactive diluent, based on the weight of the composition. 【0136】 Without intending to limit the present invention, exemplary monoepoxide compounds include: alkylene oxides; epoxy-substituted alicyclic hydrocarbons, e.g., cyclohexene oxide, cyclooctene oxide, cyclododecene oxide, vinylcyclohexene monooxide, (+)-cis-limonene oxide, (+)-cis,trans-limonene oxide, (-)-cis,trans-limonene oxide, and α-pinene oxide; epoxy-substituted aromatic hydrocarbons; monoepoxy-substituted alkyl ethers of monohydric alcohols or phenols, such as glycidyl ethers of aliphatic, alicyclic, and aromatic alcohols; lipids Monoepoxy-substituted alkyl esters of monocarboxylic acids, such as glycidyl esters of aliphatic, alicyclic, and aromatic monocarboxylic acids; monoepoxy-substituted alkyl esters of polycarboxylic acids, in which other carboxyl groups are esterified with alkanols; alkyl and alkenyl esters of epoxy-substituted monocarboxylic acids; epoxy alkyl ethers of polyhydric alcohols, in which other OH groups are esterified or etherified with carboxylic acids or alcohols; and monoesters of polyhydric alcohols and epoxy monocarboxylic acids, in which other OH groups are esterified or etherified with carboxylic acids or alcohols. 【0137】 As an example, the following glycidyl ethers can be mentioned as monoepoxy reactive dilutions particularly suitable for use herein: methyl glycidyl ether; ethyl glycidyl ether; propyl glycidyl ether; butyl glycidyl ether; pentyl glycidyl ether; hexyl glycidyl ether; cyclohexyl glycidyl ether; octyl glycidyl ether; 2-ethylhexyl glycidyl ether; aryl glycidyl ether; benzyl glycidyl ether; phenyl glycidyl ether; 4-tert-butylphenyl glycidyl ether; 1-naphthyl glycidyl ether; 2-naphthyl glycidyl ether; 2-chlorophenyl glycidyl ether; 4-chlorophenyl glycidyl ether; 4-bromophenyl glycidyl ether; 2,4,6-trichlorophenyl glycidyl ether; 2,4,6-tribromophenyl glycidyl ether; pentafluorophenyl glycidyl ether; o-cresyl glycidyl ether; m-cresyl glycidyl ether; and p-cresyl glycidyl ether. 4-14 It may be mentioned that aliphatic monoglycidyl ethers containing alkyl chains are preferred. 【0138】 In one embodiment, the monoepoxy reactive diluent is given by the following formula (I): [ka] [In the formula, R w , R x , R y and R z These may be the same or different, and independently, hydrogen, halogen atoms, and C 1- C 28 Alkyl alkyl group, C 3- C 10 Cycloalkyl groups, C 2- C 12 Alkenyl group, C 6- C 18 Aryl group, or C 7- C 18 Selected from aralkyl groups, however R y and R z At least one of them is not hydrogen. It conforms to the rules. 【0139】 R w , R x , and R y is hydrogen, R z is a phenyl group, or C 1- C 20 Preferably, it is an alkyl group, more preferably C 1- C 18 It is an alkyl group. For example, R z is C 4- C 18 , or C 8- C 16 It can be an alkyl group. 【0140】 In this embodiment, exemplary monoepoxides include: ethylene oxide; 1,2-propylene oxide (propylene oxide); 1,2-butylene oxide; cis-2,3-epoxybutane; trans-2,3-epoxybutane; 1,2-epoxypentane; 1,2-epoxyhexane; 1,2-1,2-epoxyheptane; 1,2-epoxydecane; 1,2-epoxydodecane; 1,2-epoxytetradecane; 1,2-epoxyhexadecane; 1,2-epoxyoctadecane; 1,2-epoxyeicosane; butadiene oxide; isoprene oxide (3,4-epoxy-2-methyl-1-butene); and styrene oxide (phenylethylene oxide). Examples of commercially available monofunctional epoxy reactive diluents for use herein include the Vikolox® series of 1,2-epoxyalkanes, particularly Vikolox® 10, Vikolox® 12, Vikolox® 14, Vikolox® 16, Vikolox® 18, Vikolox® 20, Vikolox® 11-14, Vikolox® 15-18, Vikolox® 20-24, and Vikolox® 24-28 (manufactured by Arkema). 【0141】 Setting aside the above, the composition, in a particular embodiment, is given by the following formula: [Chemical formula] [wherein, each R is independently selected from methyl or ethyl; and, n is from 1 to 10] may include a glycidoxyalkylalkoxysilane having 【0142】 Exemplary silanes include, but are not limited to, the following: γ-glycidoxypropyltrimethoxysilane, γ-glycidoxyethyltrimethoxysilane, γ-glycidoxymethyltrimethoxysilane, γ-glycidoxymethyltriethoxysilane, γ-glycidoxyethyltriethoxysilane, γ-glycidoxypropyltriethoxysilane; and, 8-glycidoxyoctyltrimethoxysilane. When present, the epoxy-functional silane preferably constitutes less than 10 wt%, preferably less than 5 wt%, or less than 2 wt% based on the total weight of the epoxy compounds in the composition. 【0143】 <e)ii) Polyfunctional epoxy-reactive diluent> The composition of the present invention may include a polyfunctional epoxy-reactive diluent, which is different from the first epoxy resin included in the composition as component (a) and, if present, the second epoxy resin. As used herein, the term "polyfunctional epoxy-reactive diluent" means a liquid having two or more reactive epoxy-functional groups and added to a material or compound - for example, the first epoxy resin - to form a composition having a reduced viscosity. Herein, the reactive diluent enables the epoxy resin to accept a higher solid loading. Desirably, the polyfunctional epoxy-reactive diluent is characterized by having a viscosity of 0.050 to 0.750 Pa·s at 25°C, for example, less than 0.600 Pa·s or less than 0.500 Pa·s measured at 25°C. 【0144】 The viscosity of the polyfunctional epoxy reactive diluent was measured using a TA Instruments rheometer, either Rheometer HR-1 or Q-2000, with a 2-degree cone plate geometry featuring a 2 cm diameter plate, for 15 seconds. -1 Viscosity is measured at 25°C with a shear rate of 0.5°C. The unit of viscosity is reported in Pa.s. 【0145】 If present, the composition is preferably comprising 2-8% by weight, preferably 3-7% by weight, and more preferably 4-6% by weight of the polyfunctional epoxy reactive diluent, based on the weight of the composition. 【0146】 Without intending to limit the present invention, exemplary polyfunctional epoxy reactive diluents include: diglycidyl ethers of aliphatic glycols, e.g., 1,4-butanediol diglycidyl ether (BDDGE), 1,6-hexanediol diglycidyl ether (HDDGE), neopentyl glycol diglycidyl ether, and diglycidyl ether of 1,4-cyclohexanedimethanol; polyalkylene glycol diglycidyl ethers, particularly polypropylene glycol diglycidyl ether; diglycidyl ethers of bisphenol-A epichlorohydrin epoxy resins; diglycidyl ethers of bisphenol-A polyether epoxy adducts; and polycarbonate diol glycidyl ethers. Other suitable diepoxys that may be mentioned include: biunsaturated fatty acids C1-C 18 Alkyl ester diepoxy; diglycidyl dimer acid; vinylcyclohexene diepoxy; and limonene diepoxy. 【0147】 Examples of commercially available polyfunctional epoxy reactive diluents for use herein include: HELOXY® Modifiers 32, 67, 68, HD, and 107 (manufactured by Momentive Specialty Chemicals, Inc.), as well as DER 732 P (manufactured by Olin), Epiclon EXA-4850 (manufactured by DIC), Erisys GE 30, GE 31, GE 35, GE 36, GE 38, GE 40, and Erisys GS 110 (manufactured by Huntsman). 【0148】 <Additives and auxiliary components> The compositions obtained in the present invention typically further include auxiliary agents and additives that can impart improved properties to these compositions. Such auxiliary agents and additives include plasticizers; stabilizers including UV stabilizers; non-epoxy cyclic comonomers; non-epoxy functionalized flexible agents; reinforcing agents other than core-shell rubber particles; adhesion promoters; conductivity promoters; corrosion inhibitors; bleed inhibitors; rheological auxiliary agents such as particulate silica, modified silica, alumina, and / or modified alumina; wetting agents; surfactants; antioxidants; radical scavengers; drying agents; bactericides; flame retardants; coloring pigments or coloring pastes; and / or optionally small amounts of non-reactive diluents (solvents). 【0149】 In one embodiment, the composition according to the present invention comprises a conductivity enhancer. Preferably, the conductivity enhancer for use in the present invention is selected from OH-functionalized diacides such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanediic acid, and dodecanediic acid, and OH-functionalized quinolines such as 2-hydrodiquinoline, 4-hydrodiquinoline, 6-hydrodiquinoline, 8-hydrodiquinoline, and mixtures thereof. 【0150】 Such auxiliary agents and additives may be used in any desired combination and ratio, provided that they do not adversely affect the properties and essential characteristics of the composition. While exceptions may exist, it is preferable that these auxiliary agents and additives, as a whole, not exceed 20% by weight of the total composition, and more preferably not exceed 15% by weight or 10% by weight of the composition. 【0151】 The present invention also prevents the curable composition from further comprising one or more cyclic monomers selected from the group consisting of: oxetanes; cyclic carbonates; cyclic anhydrides; and lactones. The following disclosures of referenced literature may be useful in disclosing suitable cyclic carbonate-functional compounds: U.S. Patent No. 3,535,342; U.S. Patent No. 4,835,289; U.S. Patent No. 4,892,954; British Patent No. GB-A-1,485,925; and European Patent Application Publication No. 0119840. However, it is desirable that such cyclic comonomers constitute less than 10% by weight, preferably less than 7.5% by weight, or less than 5% by weight, based on the total weight of the epoxy compound. 【0152】 As described above, the compositions of the present invention may contain a non-epoxy functionalized flexuring agent to adjust either or both the viscosity of the uncured resin and the crosslinking density of the cured resin, and can impart desirable mechanical properties such as flexibility and thermal shock resistance to the cured composition, particularly when the composition can experience a temperature transition range below -40°C. When included for these purposes, it is preferable that the amount of the flexuring agent does not exceed 25% by weight based on the weight of component a) of the composition. 【0153】 Suitable flexible agents may include: polyol compounds having long-chain aliphatic groups, e.g., ε-caprolactone triol (Union Carbide Corporation), available as TONE 0301, 0305, and 0310; phenoxy functional modifiers; polysulfones, e.g., available under product names UDEL and RADEL (BP-Amoco Chemical); polyetherimides, e.g., available under product name ULTEM (General Electric Plastics); polyamideimides; poly(alylene ether); polyesters; polyarylates; polycarbonates; and polyurethanes. Conventionally, the molecular weight (Mn) of these flexible agents is preferably in the range of 400 to 20,000 daltons, more preferably 500 to 5,000 daltons. 【0154】 The “plasticizer” for the purposes of the present invention is a substance that reduces the viscosity of a composition and thus facilitates its processability. Here, the plasticizer may constitute up to 10% by weight or up to 5% by weight based on the total weight of the composition, and is preferably selected from the group consisting of: diurethane; monofunctional, linear or branched C4-C 16 Alcohols, ethers, e.g., Cetiol OE (Cognis Deutschland GmbH, Duesseldorf); esters of abietic acid, butyric acid, thiobutyric acid, acetic acid, propionic acid, and citric acid; esters based on nitrocellulose and polyvinyl acetate; fatty acid esters; dicarboxylic acid esters; esters of OH group-containing fatty acids; glycolic acid esters; benzoic acid esters; phosphate esters; sulfonic acid esters; trimellitic acid esters; polyether plasticizers, e.g., end-cap polyethylene or polypropylene glycol; polystyrene; hydrocarbon plasticizers; paraffin chloride; and mixtures thereof. In principle, phthalate esters can be used as plasticizers, but it should be noted that these are undesirable due to their toxicological potential. 【0155】 For the purposes of the present invention, “stabilizer” is understood to mean an antioxidant, ultraviolet stabilizer, heat stabilizer, or hydrolysis stabilizer. Herein, the stabilizer may constitute up to 10% by weight, or up to 5% by weight, based on the total weight of the composition. Standard commercially available examples of stabilizers suitable for use herein include: sterically hindered phenols; thioethers; benzotriazoles; benzophenones; benzoates; cyanoacrylates; acrylates; hindered amine light stabilizer (HALS) type amines; phosphorus; sulfur; and mixtures thereof. 【0156】 The presence of a non-CSR reinforcing agent in an amount of up to 5% by weight, based on the weight of the composition, can further improve the durability of the curable composition. In this regard, elastomer-containing adducts may be used separately or in combination of two or more specific adducts. Furthermore, each adduct may be independently selected as a solid or liquid adduct at room temperature. Typically, useful adducts are characterized by a weight ratio of epoxy to elastomer of 1:5 to 5:1, for example, 1:3 to 3:1. A useful reference for suitable epoxy / elastomer adducts is U.S. Patent Application Publication No. 2004 / 0204551. Furthermore, exemplary commercially available epoxy / elastomer adducts used herein, but not limited to these, include: HYPDX RK8-4 (manufactured by CVC Chemical); and B-Tough A3 (manufactured by Croda Europe Limited). 【0157】 To improve the adhesion of the epoxy resin to the substrate, an adhesion promoter may be added to the composition. The adhesion promoter may function by forming a new layer at the interface where it strongly bonds to both the substrate and the adhesive composition. As a result, the interface region may become more resistant to chemical attacks from the environment. 【0158】 The choice of adhesion promoter may be determined by the type of surface to which the composition is applied. In other words, the most common commercially available adhesion promoters are organosilanes, of which certain types of epoxy-functional organosilanes are described herein. Further types of adhesion promoters for which usefulness may be found herein include: organometallic compounds such as titanates and zirconates, specifically isopropyltri(N-ethylaminoethylamino)titanate, tetraisopropyldi(dioctylphosphine)titanate, neoalkoxytrisneodecanoylzirconate, and zirconium propionate; divalent phenol compounds such as catechol and thiodiphenol; hydroxylamines such as tris(hydroxymethyl)aminomethane; polyvalent phenols such as pyrogallol, gallic acid, or tannic acid; and plastisols, which are suspensions of polyvinyl chloride particles in a plasticizer. 【0159】 As will be recognized by those skilled in the art, the amounts of rheological additives, reactive diluents, and non-reactive diluents in a composition determine the viscosity of the conductive composition and can therefore be adjusted according to the application method of the selected composition. The viscosity acceptable for stencil or screen printing may be slightly higher than, for example, the viscosity required by the dispensing method. That being said, if the viscosity of the composition is too high—for example, if the viscosity at 25°C is 15°C— -1 If the rheometer measurement exceeds 100 Pa·s, the application of conductive adhesive compositions becomes problematic in any high-speed process. 【0160】 In one embodiment, the present invention relates to a conductive composition comprising the following: a) Resin components including the following: 1) First epoxy resin; and 2) Second epoxy resin and / or functionalized polybutadiene resin and / or functionalized butadiene-acrylonitrile copolymer; b) Epoxy resin curing agent ; c) conductive filler ; d) Core shell rubber reinforcing agents; and e) Reactive diluent components including the following: 1) Monofunctional epoxy reactive diluent and / or 2) Polyfunctional epoxy reactive diluents; A conductive composition comprising, Herein, if the functionalized polybutadiene resin is present in the resin component, the composition further comprises a curing agent, wherein the composition is a conductive composition. 【0161】 In another embodiment, the present invention relates to a conductive composition comprising: a) Resin components including the following: 1) First epoxy resin; and 2) Second epoxy resin and / or functionalized polybutadiene resin and / or functionalized butadiene-acrylonitrile copolymer; b) Epoxy resin curing agent ; c) conductive filler ; d) Core shell rubber reinforcing agents; and e) Reactive diluent components including the following: 1) Monofunctional epoxy reactive diluent and / or 2) Polyfunctional epoxy reactive diluents; A conductive composition comprising, Herein, if the functionalized polybutadiene resin is present in the resin component, the composition further comprises a curing agent, wherein the composition is a conductive composition. 【0162】 <Method and Use> To form a composition, the above components are brought together and mixed. As is conventional in the art, to form a one-component (1K) curable composition, the elements of the composition are brought together and mixed homogeneously. Thus, it is often preferable that the curable elements are mixed in predetermined amounts under anhydrous conditions without intentional heating or light irradiation, using a machine—for example, a static mixer or a dynamic mixer—rather than being mixed by hand. 【0163】 According to the broadest process embodiment of the present invention, the above composition is applied to a substrate and then cured in situ. Before applying the composition, it is often desirable to pre-treat the relevant surface to remove any foreign matter. Where applicable, this step can facilitate the subsequent adhesion of the composition thereto. Such treatments are known in the art and can be carried out, for example, in one-step or multi-step methods consisting of one or more of the following: etching with an acid and optionally an oxidizing agent suitable for the substrate; ultrasonic treatment; plasma treatment, including chemical plasma treatment, corona treatment, atmospheric pressure plasma treatment, and flame plasma treatment; immersion in an aqueous alkaline degreasing bath; treatment with an aqueous cleaning emulsion; treatment with a cleaning solvent such as carbon tetrachloride or trichloroethylene; and rinsing with water, preferably deionized water or pure water. Of these examples, when using an aqueous alkaline degreasing bath, it is desirable to remove any remaining degreasing agent from the surface by rinsing the substrate surface with deionized water or pure water. 【0164】 In some embodiments, adhesion of the composition of the present invention to a substrate can be facilitated by applying a primer thereto. In some embodiments, the substrate may be pre-treated. Those skilled in the art can select a suitable primer, and useful references for primer selection include, but are not limited to, U.S. Patent No. 3,671,483; U.S. Patent No. 4,681,636; U.S. Patent No. 4,147,685; and U.S. Patent No. 6,231,990. 【0165】 Next, the conductive composition is applied to the surface of an optionally undercoated substrate by conventional application methods, including: contact dispensing, non-contact jet dispensing, non-contact dynamic drop dispensing, and true-positive displacement dispensing, including time / pressure dispensing (TPD), semi-positive displacement dispensing, and true-positive displacement dispensing; and printing methods. It may be noted that application by printing, particularly by screen printing or stencil printing, is preferred. 【0166】 The composition is recommended to be applied to the surface with a wet thickness of 10–3000 μm, for example, 20–2000 μm, or 30–1000 μm, or 30–500 μm, or 35–250 μm. Applying thinner features within this range is more economical and reduces the possibility of harmful thick cured areas occurring. However, when applying thinner coatings, good control is necessary to prevent the formation of discontinuous cured films or linear features. 【0167】 The curing of the coating composition of the present invention typically occurs at temperatures in the range of 30°C to 200°C, preferably 30°C to 180°C, and particularly 40°C to 160°C. The appropriate temperature depends on the specific compounds present and the desired curing rate and can be determined on a case-by-case basis by those skilled in the art, using simple preliminary tests as necessary. Of course, curing at lower temperatures within the aforementioned range is advantageous because it eliminates the need to substantially heat or cool the mixture from the normally dominant ambient temperature. However, where applicable, the temperature of the mixture formed from each element of the composition may be raised above the mixing temperature and / or coating temperature using conventional means, including microwave induction. 【0168】 In one embodiment, a conductive adhesive composition as defined herein may be applied to at least one of a solar cell or a conductive ribbon (5), wherein the ribbon (5) and the cell are optionally brought into contact under pressure, and the conductive composition is cured. This process may allow the conductive ribbon to be used to connect two or more solar cells, thereby forming a photovoltaic module. 【0169】 In one embodiment, the present invention provides a method for manufacturing a single solar module, the method comprising the steps of: i) assembling a plurality of rectangular silicon solar cells arranged in a row with their ends on the long sides overlapping in a roof-like manner; and ii) at least partially curing the conductive adhesive composition defined above, and placing the composition between the overlapping ends of adjacent rectangular silicon solar cells, thereby joining the adjacent overlapping rectangular silicon solar cells to each other and electrically connecting them in series. The curing step may be carried out by applying heat and optionally pressure to the overlapping rectangular silicon solar cells. 【0170】 The multiple rectangular silicon solar cells provided in step i) of the above embodiment may be obtained from a so-called supercell. Scribe lines defining the multiple rectangular cells are formed on the supercell using a laser, and the cells are then separated along these scribe lines. The cells may be separated by cutting or dicing, but in a more exemplary separation process, a vacuum is applied between the bottom surface of the supercell and a curved support surface to bend the supercell against the curved support surface, thereby cutting open one or more silicon solar cells along the scribe lines. A conductive adhesive may be applied to the supercell in areas adjacent to the scribe lines before separating the individual silicon cells. 【0171】 As described in step ii) of this method, it may be possible to form an intermediate structure by partial curing of the conductive composition only. However, if the module is formed in this way by partial curing of the adhesive composition, the method includes a step of completing the curing of the conductive adhesive material by applying heat and optionally pressure to the intermediate structure. 【0172】 The following examples illustrate the present invention and are not intended to limit its scope. [Examples] 【0173】 In the examples, the following materials and their abbreviations were used. TIFF0007872777000004.tif244168 【0174】 The formulations listed in Table 1 below were prepared by homogenizing the listed components using a centrifuge or a propeller or double planetary mixer. The formulations were then stored in a freezer at -40°C. 【0175】 [Table 1] 【0176】 The following test methods were used in the examples. i) Viscosity: Viscosity was measured using a TA Instruments Rheometer HR-1 or Q-2000, with a plate-to-plate geometry featuring a 2cm diameter plate, using a 200-micron gap and 15s of saturation time. -1 The measurement was performed at the shear rate. Viscosity is reported in Pa.s units. 【0177】 ii) Volume resistivity (VR) was measured as follows: Samples were prepared using compositions according to the experimental examples described above, deposited onto glass plates (by stretching strips of the material onto the surface of a glass slide with strip dimensions of approximately 5 cm in length, 5 mm in width, and 50 μm in thickness), and cured and dried (depending on the requirements of the resin used). The glass plates were cooled to room temperature before measurement. The volume resistivity was calculated using the formula VR = (sample width (cm) × sample thickness (cm) × resistance (ohms)) / sample length (cm). Here, the resistance, expressed in ohms, was measured using a Keithley 2010 multimeter and a four-point resistance probe. The volume resistivity is reported in ohms.cm. 【0178】 iii) Electrical contact resistance (CR) Electrical contact resistance was measured by dispensing a conductive adhesive in a transmission line method (TLM) structure onto 1.0 mm wide busbars on a c-Si wafer. The TLM structure was obtained by contacting a 10Ag-plated Cu ribbon (1.2 mm wide) to the test layer. Here, the distance between adjacent contact tabs was approximately 13 mm. The resistance between adjacent contact tabs, and the resistance between the first tab and n+1 (where n is the ordinal number after the first tab) tabs were measured using a Keithley 4-point probe and a Keithley 2750 multimeter and plotted as a function of distance. The contact resistance value is half the intercept from the curve obtained from such plots. The average contact resistance (arithmetic mean) is reported in mohm (milliohms). If a linear relationship is not observed due to poor ohmic contact, meaning an rsq value of less than 0.95, it is referred to as "not fit". TIFF0007872777000006.tif4671 【0179】 The stability of electrical contact resistance was measured by accelerated degradation testing (85°C, 85% relative humidity, and -40°C, 85°C thermal cycling) using the TLM test setup described above. 【0180】 Thermal cycling (TC) between -40°C and 85°C was performed for at least 200 cycles in accordance with IEC 61215 10.11. A moist heat (DH) test was also performed for at least 2000 hours in accordance with IEC 61215 10.13. 【0181】 iii) DSC was measured using a TA Instruments Dynamic Scanning Calorimetry Q2000. The fundamental principle underlying this technique is that when a sample undergoes a phase transition, more or less heat is required to maintain the reference and the sample at the same temperature. Whether less or more heat should flow to the sample depends on whether the process is exothermic or endothermic. The weight of the uncured material to be analyzed in the sample pan is 5-20 mg. A sealed aluminum sample pan is used, and the sample is subjected to dynamic heating, where the sample is heated from room temperature to 250°C at a heating rate of 10°C / min under a continuous nitrogen flow of 50 mL / min. This allows tracking of the curing behavior, which is an exothermic reaction. The peak temperature of the exothermic reaction is reported in °C. 【0182】 iv) Storage modulus (MPa) and glass transition temperature (Tg) Dynamic mechanical analysis (DMA) was performed using a TA Instruments DMA Q800 to measure the storage modulus (E-modulus), which is the elastic response of the material. The storage modulus is reported in MPa. 【0183】 -The glass transition temperature (Tg) of the epoxy resin, which was cured and dried according to the requirements of the resin used, was determined by the tan delta of a DMA scan. 【0184】 Thin film samples measuring 5 mm in width, 13–15 mm in length, and 150–200 μm in thickness were measured using a film tension clamp. The samples were cured in a box oven at 150°C for 15 minutes, then placed in the DMA's film tension clamp, preheated to 85°C for 10 minutes, and then gradient-temperature from -60°C to 200°C at a rate of 10°C / min. Both Tg and E modulus were measured during the final heating step. 【0185】 v) Coefficient of thermal expansion (CTE) The coefficient of thermal expansion was measured by thermomechanical analysis (TMA) using a TA Instruments Q400 instrument, in accordance with ASTM E831 Standard Test Method for Linear Thermal Expansion of Solid Materials by Thermomechanical Analysis. -Epoxy resin, cured and dried according to the requirements of the resin used, was cut into 4x4x1mm pieces. 【0186】 The performance results of the above tests for the curable preparations of Examples 1 and 2 are recorded in Table 2 below. 【0187】 [Table 2] 【0188】 The combination of mechanical and electrical properties of the ECA is crucial and determines module performance in reliability testing. First, to maximize the module's electrical output, low electrical resistivity within the ECA bulk and low contact resistivity between the ECA and the cell busbar surface are required. Furthermore, the ECA needs to be flexible enough to withstand the mechanical stresses associated with standard tests, and a small difference between the coefficient of thermal expansion (CTE) and Tg is desirable to avoid imposing further stress on the joint lines during thermal cycling. For example, very rigid materials will perform well in thermal cycling tests, but generally cannot release stresses related to weight and pressure, and cells joined with such materials will be more prone to cracking under load. In contrast, more flexible materials can distribute mechanical stress better, but generally lack sufficient stability during thermal cycling tests. A further method for evaluating module performance is to measure the power loss (%) after a mechanical load test (MLT conducted according to IEC 61215 16.1), which refers to the actual standard for photovoltaic module product certification that simulates a combined load of wind, snow, and dust at a static load (Pa). Following static mechanical load testing, it is also desirable that the present invention have low power loss after dynamic mechanical loading, such as as described in IEC TS 62782:2016 or IEEE 1262, or IEC 61215:2016. 【0189】 Thus, VR, CR, Tg, Emod at room temperature, and ΔCTE Tg Such ECA parameters are extremely important to the present invention. In this regard, the compositions according to the present invention have sufficiently low Emod and low ΔCTE at room temperature. Tg In combination with other materials, it provides low bulk resistance and contact resistivity. The good mechanical and electrical properties of the composition according to the present invention inevitably result in low power loss values. The composition according to the present invention is shown to have a power loss of less than 7%. 【0190】 Considering the above description and examples, it will be apparent to those skilled in the art that equivalent modifications can be made without departing from the scope of the claims. Preferred embodiments of this specification include at least the following: [1] a)1) Primary epoxy resin; and 2) Second epoxy resin, and / or functionalized polybutadiene resin, and / or functionalized butadiene-acrylonitrile copolymer Resin components containing; b) Curing agent for epoxy resins; c) Conductive filler; d) Core shell rubber reinforcing agents; and e) 1) Monofunctional epoxy reactive diluents, and / or 2) Polyfunctional epoxy reactive diluent Reactive diluent components containing; A conductive composition comprising, Herein, if the functionalized polybutadiene resin is present in the resin component, the composition further comprises a curing agent, wherein the composition is a conductive composition. [2] The first epoxy resin is selected from the group consisting of aliphatic epoxy resins, alicyclic epoxy resins, epoxy novolac resins, bisphenol-A epoxy resins, bisphenol-F epoxy resins, hydrogenated bisphenol-A epoxy resins, hydrogenated bisphenol-F epoxy resins, bisphenol-A epichlorohydrin-based epoxy resins, polyepoxy resins, propylene glycol epoxy resins, reaction products of polyether-polyols and epichlorohydrin, epoxy silicone copolymers, and mixtures thereof. Preferably, the first epoxy resin is selected from the group consisting of bis-phenol A epoxy resin, bis-phenol F epoxy resin, and a mixture of bis-phenol A epoxy resin and bis-phenol F epoxy resin, as described in [1]. [3] The conductive composition according to [1] or [2], wherein the first epoxy resin is present in an amount of 4 to 17% by weight, preferably 5 to 16% by weight, and more preferably 6 to 16% by weight of the total weight of the composition. [4] If present, the second epoxy resin is selected from the group consisting of epichlorohydrin formaldehyde phenol resin, epichlorohydrin phenol novolac resin, epichlorohydrin o-cresol novolac resin, epichlorohydrin m-xylenediamine resin, epichlorohydrin diaminodiphenylmethane resin, epichlorohydrin trimethylolpropane resin, and mixtures thereof. Preferably, the second epoxy resin is an epichlorohydrin phenol novolac resin; If present, the functionalized polybutadiene resin is selected from the group consisting of maleic anhydride-functionalized polybutadiene, vinyl-functionalized polybutadiene, maleic anhydride-grafted vinyl-functionalized polybutadiene, epoxidized polybutadiene, and mixtures thereof, preferably selected from maleic anhydride-functionalized polybutadiene, vinyl-functionalized polybutadiene, and mixtures thereof, and If present, the functionalized butadiene-acrylonitrile copolymer is selected from the group consisting of epoxy-modified butadiene-acrylonitrile copolymer, carboxyl-modified butadiene-acrylonitrile copolymer, amine-modified butadiene-acrylonitrile copolymer, alcohol-modified butadiene-acrylonitrile copolymer, and mixtures thereof; preferably, the conductive composition according to any one of [1] to [3], which is epoxy-modified butadiene-acrylonitrile copolymer, carboxyl-modified butadiene-acrylonitrile copolymer, or a mixture thereof. [5] The conductive composition according to any one of [1] to [4], wherein, if present, the second epoxy resin is present in an amount of 0.3 to 3% by weight, preferably 0.5 to 2.5% by weight, more preferably 0.6 to 2% by weight of the total weight of the composition; if present, the functionalized polybutadiene resin is present in an amount of 0.1 to 15% by weight, preferably 5 to 12% by weight, more preferably 8 to 11% by weight of the total weight of the composition; and, if present, the functionalized butadiene-acrylonitrile copolymer is present in an amount of 0.1 to 5% by weight, preferably 1 to 5% by weight, more preferably 2 to 5% by weight of the total weight of the composition. [6] The curing agent b) is an amine-based curing agent or a nitrogen-containing epoxy adduct, preferably selected from the group consisting of alicyclic amines, aliphatic amines, polyetheramines, amine-epoxy adducts, imidazole-epoxy adducts, imidazoles, imidazole derivatives, polyetheramines, and mixtures thereof, more preferably selected from the group consisting of imidazole-epoxy adducts or amine-epoxy adducts, imidazoles, and mixtures thereof; and, The conductive composition according to any one of [1] to [5], wherein the curing agent b) is preferably present in an amount of 0.5 to 7% by weight, more preferably 1 to 6% by weight, and even more preferably 2 to 5% by weight of the total weight of the composition. [7] The conductive filler c) is selected from the group consisting of silver; nickel; carbon; carbon black; graphite; graphene; copper; gold; platinum; aluminum; iron; zinc; cobalt; lead; tin alloy; silver-coated nickel; silver-coated copper; silver-coated graphite; silver-coated polymers, such as silver-coated acrylic polymers and / or silver-coated silicone polymers; silver-coated aluminum; silver-coated glass; silver-coated carbon; silver-coated boron nitride; silver-coated aluminum oxide; silver-coated aluminum hydroxide; nickel-coated graphite; and mixtures thereof; Preferably, the conductive particles are silver, and The conductive composition according to any one of [1] to [6], preferably comprising 55 to 80% by weight, more preferably 60 to 76% by weight, and even more preferably 67 to 75% by weight of the total weight of the composition. [8] The core-shell rubber reinforcing agent is selected from the group consisting of rubber-modified bisphenol-A epoxy resin, rubber-modified bisphenol-F epoxy resin, rubber-modified butadiene-acrylonitrile copolymer, rubber-modified acrylonitrile, and mixtures thereof, preferably the core-shell rubber reinforcing agent is rubber-modified bisphenol-F epoxy resin; and, The conductive composition according to any one of [1] to [7], wherein the core-shell rubber is preferably present in an amount of 0.1 to 5% by weight, more preferably 0.2 to 4.5% by weight, and even more preferably 0.3 to 4.0% by weight of the total weight of the composition. [9] The monofunctional epoxy reactive diluent is selected from the group consisting of aliphatic monoglycidyl ethers containing C4-14 alkyl chains, aromatic monoglycidyl ethers containing benzene rings, epoxidized alphaolefins having C8-C16 linear alkyl chains, epoxidized alphaolefins having C8-C16 branched alkyl chains, and mixtures thereof, preferably the monofunctional epoxy diluent is an epoxidized alphaolefin having C8-C16 linear alkyl chains; and, The conductive composition according to any one of [1] to [8], wherein the monofunctional epoxy reactive diluent is preferably present in an amount of 1 to 7% by weight, more preferably 2 to 6% by weight, and even more preferably 3 to 5% by weight of the total weight of the composition.

[10] The polyfunctional epoxy reactive diluent is selected from the group consisting of 1,4-bis(2,3-epoxypropyloxy)butane, epoxypropoxypropyl-terminated dimer acids, epoxypropoxypropyl-terminated polydimethylsiloxanes, polyglycol chain diepoxys, and mixtures thereof, preferably the polyfunctional epoxy reactive diluent is a polyglycol chain diepoxy; and, The conductive composition according to any one of [1] to [9], wherein the polyfunctional epoxy reactive diluent is preferably present in an amount of 2 to 8% by weight, more preferably 3 to 7% by weight, and even more preferably 4 to 6% by weight of the total weight of the composition.

[11] If present, the curing agent is an organic peroxide, preferably selected from the group consisting of dicumyl peroxide, tert-amyl peroxypivalate, tert-amyl peroxy-2-ethylhexanoate, tert-butyl peroxy-2-ethylhexanoate, 1,1-di-(tert-amyl peroxy)cyclohexane, 1,1-di-(tert-butyl peroxy)cyclohexane, tert-butyl peroxy-3,5,5-trimethylhexanoate, tert-butyl peroxyacetate, tert-butyl peroxybenzoate, ethyl-3,3-di-(tert-amyl peroxy)butyrate, di-tert-butyl peroxide, di-tert-amyl peroxide, tert-butyl hydroperoxide, and mixtures thereof, more preferably the curing agent is dicumyl peroxide; and, The conductive composition according to any one of [1] to

[10] , wherein, if present, the curing agent is present in an amount of 0.05 to 2% by weight, preferably 0.1 to 1.5% by weight, and more preferably 0.1 to 1% by weight of the total weight of the composition.

[12] A cured product of any of the conductive compositions described in [1] to

[11] .

[13] Use of any of the conductive compositions described in [1] to

[11] or the cured product described in

[12] on and / or within a photovoltaic module, preferably as an interconnecting material for connecting the solar cell to the photovoltaic module.

[14] as an interconnecting material in a photovoltaic module, wherein the solar cells are singled or connected in series with a metal ribbon, as used in

[13] .

[15] A photovoltaic module comprising a string in which two or more solar cells are connected in series in a single pattern, wherein the conductive coupling is formed of a conductive composition according to any of [1] to

[11] or a cured product according to

[12] .

[16] The photovoltaic module according to

[15] , wherein the conductive composition is applied by dispensing, jetting, or printing.

Claims

[Claim 1] a) 1) First epoxy resin; and 2) Second epoxy resin, and / or functionalized polybutadiene resin, and / or functionalized butadiene-acrylonitrile copolymer Resin components containing; b) Curing agents for epoxy resins; c) Conductive filler; d) Core-shell rubber reinforcing agents; and e) 1) Monofunctional epoxy reactive diluents, and / or 2) Polyfunctional epoxy reactive diluent Reactive diluent components including; A conductive composition comprising, Here, The first epoxy resin is selected from the group consisting of bisphenol-A epoxy resin, bisphenol-F epoxy resin, hydrogenated bisphenol-A epoxy resin, hydrogenated bisphenol-F epoxy resin, and mixtures thereof. The second epoxy resin is selected from the group consisting of epichlorohydrin formaldehyde phenol resin, epichlorohydrin phenol novolac resin, epichlorohydrin o-cresol novolac resin, epichlorohydrin m-xylenediamine resin, epichlorohydrin diaminodiphenylmethane resin, epichlorohydrin trimethylolpropane resin, and mixtures thereof. The monofunctional epoxy reactive diluent is selected from the group consisting of aliphatic monoglycidyl ethers containing C4-14 alkyl chains, aromatic monoglycidyl ethers containing benzene rings, epoxidized alphaolefins having C8-C16 linear alkyl chains, epoxidized alphaolefins having C8-C16 branched alkyl chains, and mixtures thereof. The polyfunctional epoxy reactive diluent is selected from the group consisting of 1,4-bis(2,3-epoxypropyloxy)butane, epoxypropoxypropyl-terminated dimer acids, epoxypropoxypropyl-terminated polydimethylsiloxanes, polyglycol chain diepoxys, and mixtures thereof. The conductive filler is present in an amount of 55 to 80% by weight of the total weight of the composition. When the functionalized polybutadiene resin is present in the resin component, the composition further comprises a curing agent for the functionalized polybutadiene resin, and is a conductive composition. [Claim 2] The conductive composition according to claim 1, wherein the first epoxy resin is selected from the group consisting of bis-phenol A epoxy resin, bis-phenol F epoxy resin, and a mixture of bis-phenol A epoxy resin and bis-phenol F epoxy resin. [Claim 3] The conductive composition according to claim 1 or 2, wherein the first epoxy resin is present in an amount of 4 to 17% by weight of the total weight of the composition. [Claim 4] The second epoxy resin is an epichlorohydrinphenol novolac resin; If present, the functionalized polybutadiene resin is selected from the group consisting of maleic anhydride-functionalized polybutadiene, vinyl-functionalized polybutadiene, maleic anhydride-grafted vinyl-functionalized polybutadiene, epoxidized polybutadiene, and mixtures thereof, and The conductive composition according to any one of claims 1 to 3, wherein, if present, the functionalized butadiene-acrylonitrile copolymer is selected from the group consisting of epoxy-modified butadiene-acrylonitrile copolymer, carboxyl-modified butadiene-acrylonitrile copolymer, amine-modified butadiene-acrylonitrile copolymer, alcohol-modified butadiene-acrylonitrile copolymer, and mixtures thereof. [Claim 5] The conductive composition according to any one of claims 1 to 4, wherein, if present, the second epoxy resin is present in an amount of 0.3 to 3% by weight of the total weight of the composition; if present, the functionalized polybutadiene resin is present in an amount of 0.1 to 15% by weight of the total weight of the composition; and, if present, the functionalized butadiene-acrylonitrile copolymer is present in an amount of 0.1 to 5% by weight of the total weight of the composition. [Claim 6] The curing agent b) is an amine-based curing agent or a nitrogen-containing epoxy adduct; and, The conductive composition according to any one of claims 1 to 5, wherein the curing agent b) is present in an amount of 0.5 to 7% by weight of the total weight of the composition. [Claim 7] The conductive filler c) is selected from the group consisting of silver; nickel; carbon; carbon black; graphite; graphene; copper; gold; platinum; aluminum; iron; zinc; cobalt; lead; tin alloy; silver-coated nickel; silver-coated copper; silver-coated graphite; silver-coated polymer; silver-coated aluminum; silver-coated glass; silver-coated carbon; silver-coated boron nitride; silver-coated aluminum oxide; silver-coated aluminum hydroxide; nickel-coated graphite; and mixtures thereof; And, The conductive composition according to any one of claims 1 to 6, wherein the conductive filler is present in an amount of 60 to 76% by weight of the total weight of the composition. [Claim 8] The conductive composition according to any one of claims 1 to 7, wherein the core-shell rubber reinforcing agent comprises 0.1 to 5% by weight of core-shell rubber particles of the total weight of the composition. [Claim 9] The monofunctional epoxy reactive diluent is an epoxidized alphaolefin having a C8-C16 linear alkyl chain; and, The conductive composition according to any one of claims 1 to 8, wherein the monofunctional epoxy reactive diluent is present in an amount of 1 to 7% by weight of the total weight of the composition. [Claim 10] The aforementioned polyfunctional epoxy reactive diluent is a polyglycol chain diepoxy; and, The conductive composition according to any one of claims 1 to 9, wherein the polyfunctional epoxy reactive diluent is present in an amount of 2 to 8% by weight of the total weight of the composition. [Claim 11] If present, the curing agent for the functionalized polybutadiene resin is an organic peroxide; and, The conductive composition according to any one of claims 1 to 10, wherein, if present, the curing agent for the functionalized polybutadiene resin is present in an amount of 0.05 to 2% by weight of the total weight of the composition. [Claim 12] A cured product of the conductive composition according to any one of claims 1 to 11. [Claim 13] Use of the conductive composition according to any one of claims 1 to 11, or use of the cured product according to claim 12, on a solar cell or within a photovoltaic module. [Claim 14] The use of an interconnecting material in a photovoltaic module, wherein the solar cells are single or connected in series with a metal ribbon, as described in claim 13. [Claim 15] A photovoltaic module comprising a string in which two or more solar cells are connected in series in a single pattern, wherein the conductive coupling is formed of a conductive composition according to any one of claims 1 to 11, or a cured product according to claim 12. [Claim 16] A method for manufacturing a photovoltaic module according to claim 15, wherein the conductive composition is applied by dispensing, jetting, or printing.

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