IC inspection socket

Abstract

An IC inspection socket comprising: a pin block having a plurality of contact probes; a floating plate for guiding an IC package to be inspected; and a heat-generating body for heating the IC package. The heat-generating body is in contact with the IC package.

Description

【Technical Field】 【0001】 The present invention relates to a socket for IC (Integrated Circuit) inspection. 【Background Art】 【0002】 For the inspection of IC packages, a socket for IC inspection is used (for example, see Patent Document 1). 【0003】 The socket for IC inspection has a pin block in which a plurality of contact probes corresponding to each electrode terminal of the IC are erected, and a guide member provided above the pin block. When the IC package to be inspected is inserted into the guide member with the electrode terminals facing downward, the IC package is guided onto the contact probes in a predetermined posture. By appropriately pressing the IC package from above to below, the electrode terminals of the IC package come into contact with the contact probes, and an energization path for inspection is secured. 【Prior Art Documents】 【Patent Documents】 【0004】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 2020-17455 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0005】 The inspection of IC packages targets not only the performance at room temperature but also the performance at high temperatures, so-called high-temperature performance. In the conventional technology in which the inspection device is installed in dedicated equipment capable of reproducing a high-temperature environment such as a high-temperature chamber to perform the inspection of high-temperature performance, it has not been possible to easily inspect the high-temperature performance. 【0006】 An example of the object of the present invention is to realize a socket for IC inspection capable of performing an inspection of high-temperature performance. Other objects of the present invention will become apparent from the description herein. [Means for solving the problem] 【0007】 One aspect of the present invention comprises a pin block having a plurality of contact probes, a floating plate for guiding an IC package to be inspected, and a heating element for heating the IC package, wherein the heating element is an IC inspection socket that contacts the IC package. 【0008】 According to an aspect of the present invention, the IC testing socket can heat the IC package to be tested using a built-in heating element. Unlike conventional methods, there is no need to install the entire testing device in a high-temperature chamber or the like; the testing device can be installed in a room-temperature environment, and the IC package to be tested can be directly heated to perform high-temperature performance testing. Performance testing at room temperature is also possible if the heating element is not heated. [Brief explanation of the drawing] 【0009】 [Figure 1] This is an external view showing an example configuration of an IC testing socket. [Figure 2] This is a top view of the socket body as seen from the Z-axis positive side. [Figure 3] This is a side view of the socket body as seen from the negative Y-axis side. [Figure 4] This is a side view of the socket body as seen from the negative X-axis side. [Figure 5] This is a top view of the pin block as seen from the Z-axis positive side. [Figure 6] This is a top view of the heating element as seen from the Z-axis positive side. [Figure 7] This figure shows an example of an inner layer pattern. [Figure 8] This is a top view of the floating plate as seen from the Z-axis positive side. [Figure 9] This is a view of the bottom of the floating plate, seen from the negative Z-axis side. [Figure 10] This is a side view of the floating plate as seen from the negative Y-axis side. [Figure 11]It is a side view of the floating plate seen from the negative X-axis side. [Figure 12] It is a cross-sectional view taken along the line XII-XII of FIG. 2 in the non-inspection state. [Figure 13] It is a cross-sectional view taken along the line XII-XII of FIG. 2 in the inspection state. [Figure 14] It is a schematic diagram for explaining the heating of the IC package during inspection. [Figure 15] It is a diagram showing a modified example of the inner layer pattern. 【Mode for Carrying Out the Invention】 【0010】 Examples of preferred embodiments of the present invention will be described, but the applicable forms of the present invention are not limited to the following embodiments. Orthogonal three axes for indicating common directions in each figure are shown. The orthogonal three axes are a right-handed system with the positive Z-axis direction as the upward direction and the XY plane as the horizontal plane. The negative Z-axis direction is the downward direction. 【0011】 FIG. 1 is an external view showing a configuration example of the IC inspection socket 10 of the present embodiment. The IC inspection socket 10 includes a socket main body 30, a lid 14 disposed above the socket main body 30, and a pressurizing mechanism 16. In FIG. 1, the IC inspection socket 10 is intentionally shown shaded for easy distinction. 【0012】 The socket main body 30 is attached to the inspection apparatus main body 11 and is electrically connected to the inspection electric circuit. The lid 14 is supported so as to be swingable up and down by a lid swing axis 18 along the X-axis direction supported by a bearing portion 12, and supports the pressurizing mechanism 16 above the socket main body 30. The pressurizing mechanism 16 applies a load downward to the IC package 9 to be inspected placed in the socket main body 30. 【0013】 The lid 14 has a hook 20 on the side opposite to the lid swing axis 18. The hook 20 is swingably supported by a hook swing axis 22 along the X-axis direction. The hook 20 is biased by a coil spring 24 in the clockwise direction when viewed from the minus X-axis side around the hook swing axis 22. 【0014】 The hook 20 engages with the engaging claw 21 to maintain the state where the lid 14 covers the upper part of the socket main body 30. When the hook 20 is removed and the lid 14 is swung, the socket main body 30 is exposed and the IC package 9 can be inserted and removed. 【0015】 Figure 2 is a top view of the socket main body 30. Figure 3 is a side view of the socket main body 30 as viewed from the minus Y-axis side. Figure 4 is a side view of the socket main body 30 as viewed from the minus X-axis side. 【0016】 The socket main body 30 has, in order from the minus Z-axis side (lower side), a pin block 40, a heating element 60, and a floating plate 80, which are stacked. Their positions in the direction parallel to the XY plane are determined by positioning pins 35. 【0017】 The pin block 40 is a component corresponding to a pedestal for mounting on the inspection device main body 11 (see Figure 1). A plurality of contact probes are erected along the Z-axis direction (vertical direction) at the central part of the pin block 40 as viewed from the plus Z-axis side. The collection of the plurality of contact probes will be referred to as a contact probe array 31 and will be described below. 【0018】 The floating plate 80 is a guiding part that guides the IC package 9 to be inspected to a predetermined relative position and a predetermined relative posture with respect to the contact probe array 31. The floating plate 80 is elastically supported in the Z-axis direction (vertical direction) from the upper surface of the pin block 40 by a guide screw 32 and a floating spring 33. 【0019】 Specifically, the guide screw 32 is a vertically elongated screw that is screwed to the upper surface of the pin block 40. The neck of the guide screw 32 is fitted into the floating plate 80 such that there is a small gap in the mating portion. The floating plate 80 is guided by the guide screw 32 and can slide up and down. 【0020】 A floating spring 33 is sandwiched between the lower surface of the floating plate 80 and the upper surface of the pin block 40. The floating plate 80 is always biased upward (towards the positive Z-axis). The upward movement of the floating plate 80 is restricted because its upper surface abuts against the seating surface of the guide screw 32. 【0021】 The heating element 60 is a plate-shaped component. The heating element 60 is elastically supported vertically against the upper surface of the pin block 40 by a heating element spring 34 between the pin block 40 and the floating plate 80. The heating element 60 is constantly biased upward (towards the positive Z-axis) by the heating element spring 34. The upward movement of the heating element 60 is restricted by its upper surface abutting against the lower surface of the floating plate 80. 【0022】 Figure 5 is a top view of the pin block 40 as seen from the Z-axis positive side. The pin block 40 has, on its upper surface, probe insertion holes 41 through which the contact probe array 31 is inserted, a female threaded portion 42 for the guide screw 32, a spring receiving hole 43, a spring receiving hole 44, and a pin hole 45. The probe insertion holes 41 correspond to each of the multiple white circles enclosed by the dashed line in Figure 5. Each of these white circles is an insertion hole for each contact probe. The spring receiving hole 43 is a receiving hole for the floating spring into which the lower end of the floating spring 33 is fitted. The spring receiving hole 44 is a receiving hole for the heating element spring into which the lower end of the heating element spring 34 is fitted. The pin hole 45 is a hole into which the lower end of the positioning pin 35 is fitted. 【0023】 Figure 6 is a top view of the heating element 60 as seen from the Z-axis positive side. The heating element 60 is a plate-shaped heating component having an electrical circuit that serves as a heat source. The heating element 60 is formed from, for example, LTCC (Low Temperature Co-fired Ceramics). 【0024】 The heating element 60 has probe insertion holes 61 through which each contact probe of the contact probe array 31 is inserted in the contact portion that contacts the IC package 9. In the example of Figure 6, the contact portion is located in the center of the heating element 60. The heating element 60 has screw insertion holes 62, spring insertion holes 63, pin insertion holes 65, relief portions 66, and an inner layer pattern 68 (only a portion is shown in Figure 6). The screw insertion holes 62 are through holes through which guide screws 32 are inserted. The spring insertion holes 63 are through holes through which floating springs 33 are inserted. The pin insertion holes 65 are through holes through which positioning pins 35 are inserted. The inner layer pattern 68 is wiring formed inside the non-conductive ceramic body portion 69. The inner layer pattern 68 is provided in at least the contact portion of the heating element 60 that contacts the IC package 9. 【0025】 The relief portion 66 is a notched area where the width of the heating element 60 is partially narrowed. The relief portion 66 is the part that loosely fits with the projection 84 of the floating plate 80 (see Figure 9). 【0026】 Figure 7 shows an example of an inner layer pattern 68. The inner layer pattern 68 (thick solid line) is a metal wire provided such that at least a portion of it weaves between the probe insertion holes 61 (white circles shown with thin lines). Specifically, the inner layer pattern 68 has an outer peripheral portion 68a located outside the group of probe insertion holes 61, and an inter-hole meandering portion 68b that weaves between the probe insertion holes 61. Because the metal wire is routed so as to weave between the probe insertion holes 61, it is possible to prevent uneven heating when viewing the entire group of probe insertion holes 61. 【0027】 External wiring 67 is connected to both ends of the inner layer pattern 68. The inner layer pattern 68 is energized via the external wiring 67 from the heat source power circuit of the inspection device body 11. The inner layer pattern 68 acts as a type of heating element. 【0028】 Figure 8 is a top view of the floating plate 80 as seen from the positive Z-axis side. Figure 9 is a bottom view of the floating plate 80 as seen from the negative Z-axis side. Figure 10 is a side view of the floating plate 80 as seen from the negative Y-axis side. Figure 11 is a side view of the floating plate 80 as seen from the negative X-axis side. 【0029】 As shown in Figure 8, the floating plate 80 has a housing hole 81, a screw insertion hole 82, a positioning hole 85, and a wiring hole 87. The housing hole 81 is a through hole for housing the IC package 9 to be inspected. The screw insertion hole 82 is a through hole for inserting the guide screw 32. The positioning hole 85 is a through hole for inserting the positioning pin 35. The wiring hole 87 is a through hole for observing the state of the external wiring 67 from above. 【0030】 As shown in Figure 9, the floating plate 80 has a spring receiving hole 83, a projection 84, a wiring groove 86, and an observation groove 89 on its lower surface. The spring receiving hole 83 is a receiving hole for the floating spring 33 into which the upper end of the floating spring 33 is fitted. The projection 84 is a projection that contacts the upper surface of the pin block 40 during inspection. The wiring groove 86 is a groove for passing external wiring 67, which is connected to the heating element 60, from the outside. The wiring groove 86 can suppress displacement of the external wiring 67 and disconnection of the external wiring 67 due to the sliding of the heating element 60. The observation groove 89 is a groove provided along the X-axis direction, crossing the housing hole 81. 【0031】 The projection 84 is provided on both the negative Y-axis side and the positive Y-axis side at the center of the floating plate 80 in the X-axis direction, facing downwards towards the negative Z-axis side. The contour shape of the projection 84 in a bottom view matches the contour shape of the relief portion 66 of the heating element 60 in a top view. The outer vertical surface of the projection 84 functions as a guide when the heating element 60 slides up and down. The projection length Ht of the projection 84 (see Figure 10) is set to be greater than the thickness Wh of the heating element 60 (see Figure 4: Z-axis dimension). 【0032】 Figure 12 is a cross-sectional view of Figure 2, line XII-XII, in a non-inspection state. The contact probe array 31 is not shown. 【0033】 When not being inspected, the floating plate 80 is biased in the positive Z-axis direction relative to the pin block 40 by the floating spring 33. The floating plate 80 is maintained with its upper surface abutting the seating surface of the guide screw 32, and is floating a distance D1 above the upper surface of the pin block 40. Specifically, the seating height Hn of the guide screw 32 is set to be greater than the hole length L (see Figure 4) of the screw insertion hole 82 through which the guide screw 32 is inserted. In Figure 4, the seating height Hn is the distance from the upper surface of the pin block 40 to the lower seating surface of the guide screw 32 when the screw is fastened. The difference between the seating height Hn and the hole length L of the screw insertion hole 82 is the first distance D1. 【0034】 The heating element 60 is positioned between the floating plate 80 and the pin block 40 such that the projection 84 of the floating plate 80 fits into a notched space provided by the relief portion 66. 【0035】 The heating element 60 is biased in the positive Z-axis direction relative to the pin block 40 by a heating element spring 34. A floating plate 80 covers the heating element 60 from above. The thickness Wh of the heating element 60 is set to be smaller than the projection length Ht of the projection 84. Therefore, the heating element 60 is floating by a second distance D2 from the upper surface of the pin block 40. 【0036】 Figure 13 is a cross-sectional view taken along line XII-XII in Figure 2 during the inspection. The contact probe array 31 is not shown. 【0037】 During inspection, the pressurizing mechanism 16 (see Figure 1) presses the IC package 9 downward against the contact probe array 31. Consequently, the floating plate 80 is also pushed downward, causing the projection 84 to abut against the upper surface of the pin block 40. The distance from the lower surface of the projection 84 on the floating plate 80 to the upper surface of the pin block 40 decreases from the first distance D1 to the third distance D3. The third distance D3 is effectively zero. 【0038】 As the floating plate 80 is pushed down, the heating element 60 is also pushed downward. The second distance D2 also decreases, but since the thickness Wh of the heating element 60 is set to be smaller than the projection length Ht of the projection 84, it does not become "0" and the fourth distance D4 is secured. The fourth distance D4 is greater than zero and less than the second distance D2. 【0039】 The heating element 60 is constantly biased upward (towards the positive Z-axis) by the heating element spring 34. This ensures contact between the heating element 60 and the IC package 9. Although the pressing force from the pressurizing mechanism 16 also acts on the heating element 60, the elastic support of the heating element spring 34 appropriately releases this force, preventing damage to the heating element 60. 【0040】 Figure 14 is a schematic diagram illustrating the heating of the IC package 9 during inspection, and schematically shows the XII-XII cross section of Figure 2. 【0041】 During testing, current is passed through the inner layer pattern 68 of the heating element 60 via the external wiring 67. The inner layer pattern 68 of the heating element 60 acts as a heating element. The heating element 60 heats up, mainly around the contact portion that contacts the IC package 9. This makes it possible to easily test the high-temperature performance of the IC package 9 even in a normal temperature environment. 【0042】 Even if the heating element 60 raises the temperature and causes contact between the electrode terminals of the IC package 9 and the contact probe 39, resulting in heat conduction, the temperature drop of the IC package 9 can be suppressed. 【0043】 The heating element 60 is separated from the upper surface of the pin block 40 even during inspection. This prevents heat from the heating element 60 from being directly conducted and escaping to the pin block 40. Therefore, it achieves more efficient heat transfer characteristics compared to a configuration in which the elements are not separated. 【0044】 The IC package 9 under inspection can be viewed through the space 4 between the observation groove 89 and the heating element 60. Space 4 can also be used for routing wiring when attaching thermocouples to the IC package 9 and the heating element 60. 【0045】 (modified version) Although embodiments of the present invention have been described, the applicable forms of the present invention are not limited to those described above, and components can be added, omitted, or modified as appropriate. 【0046】 For example, the inner layer pattern 68 is not limited to the example in Figure 7, and the pattern can be changed and set according to the arrangement of the probe insertion holes 61. For example, the inner layer pattern 68B shown in Figure 15 may be used. 【0047】 Furthermore, although the above embodiment involved testing one IC package 9 with one socket, a configuration that allows testing multiple IC packages 9 with one socket is also possible. 【0048】 (Overview) The above embodiments and modifications can be summarized as follows. 【0049】 An aspect of this disclosure comprises a pin block having a plurality of contact probes, a floating plate for guiding an IC package to be inspected, and a heating element for heating the IC package, wherein the heating element is an IC inspection socket that contacts the IC package. 【0050】 According to this embodiment, the IC testing socket can heat the IC package under test using a built-in heating element. Even when performing high-temperature performance testing, it is not necessary to install the entire testing device in a high-temperature chamber or similar location; the testing device can be installed in a room-temperature environment, and the IC package under test can be directly heated to perform high-temperature performance testing. Even if heat conduction occurs due to contact between the electrode terminals of the IC package and the contact probe, the temperature drop of the IC package can be suppressed. If heating by the heating element is not performed, room-temperature performance testing can also be performed with the same socket. 【0051】 The heating element may have through holes corresponding to the plurality of contact probes, and a metal wire provided such that at least a portion of it weaves between the through holes. 【0052】 In that case, heat can be distributed more evenly across the entire heating element, preventing temperature unevenness, compared to when the metal wires are not arranged in a stitching pattern. 【0053】 The heating element may be located between the pin block and the floating plate. 【0054】 In this case, the heating element comes into direct contact with the IC package, allowing for efficient heating of the IC package. 【0055】 The heating element may be elastically supported with respect to the pin block. 【0056】 By elastically supporting the heating element, contact between the heating element and the IC package can be ensured. During inspection, the IC package is pressed against the heating element, but the pressing force acting on the heating element is appropriately released, preventing damage to both the heating element and the IC package. 【0057】 The floating plate may have a projection that contacts the pin block. 【0058】 During inspection, even if the floating plate is pushed towards the pin block, the protrusion will contact the pin block, ensuring a space equal to the protrusion's dimension. 【0059】 The length of the projection may be longer than the thickness of the heating element. 【0060】 In this case, the heating element can be housed in the space created by the contact between the protrusion and the pin block, thus protecting it from the load that pushes against the floating plate. 【0061】 The floating plate may have a wiring groove on its lower surface for passing external wiring connected to the heating element. 【0062】 In this case, it is possible to suppress wiring misalignment and wire breakage caused by the sliding of the heating element. 【0063】 The floating plate may have a groove on its lower surface that allows the IC package housed in the housing hole to be viewed from the side. 【0064】 In this case, the condition of the IC package during inspection can be visually observed, allowing for accurate inspection and reducing the risk of damage to the IC package during inspection. Furthermore, it can also be used for routing wiring when attaching thermocouples to IC packages or heating elements. [Explanation of Symbols] 【0065】 4...space 9…IC package 10…Socket for IC testing 11…Inspection device main unit 12...Bearing part 14... Lid 16…Pressurization mechanism 18... Lid pivot axis 20... Hook 21…Engaging claw 22...Hook pivot axis 24… Coil spring 30...Socket body 31… Contact probe array 32... Guide screw 33…Floating Spring 34…Spring for heating element 35…Positioning pin 39... Contact probe 40... Pin block 41…Probe insertion hole 42...Female thread section 43... Spring receiving hole for floating spring 44... Spring receiving hole for heating element spring 45…Pinhole 60… Heating element 61…Probe insertion hole 62... Screw insertion hole 63... Spring insertion hole 65…Pin insertion hole 66...Escape Club 67…External wiring 68, 68B... Inner layer pattern 68a...Outer periphery 68b... Interforamen meandering section 69...Ceramic main body 80…Floating Plate 81…Containment port 82... Screw insertion hole 83... Spring receiving hole for floating spring 84…Protrusion 85…Positioning hole 86...Wiring groove section 87…Wiring hole 89... Observation groove D1…First distance D2…Second distance D3...3rd distance D4…4th distance Hn...Seat height Ht…Protrusion length L…hole length Wh…Thickness of the heating element Wt…protrusion long

Claims

[Claim 1] A pin block having multiple contact probes, A floating plate that guides the IC package to be inspected, The IC package includes a heating element for heating the IC package, The heating element has insertion holes corresponding to the plurality of contact probes, The heating element is an IC inspection socket that contacts the IC package. [Claim 2] The IC inspection socket according to claim 1, wherein the heating element has at least a portion of a metal wire provided between the insertion holes. [Claim 3] The IC inspection socket according to claim 1, wherein the heating element has metal wires provided around at least a portion of the plurality of insertion holes. [Claim 4] A pin block having a plurality of contact probes, A floating plate that guides the IC package to be inspected, The IC package includes a heating element for heating the IC package, The heating element is located between the pin block and the floating plate and is in contact with the IC package, forming an IC inspection socket. [Claim 5] The IC inspection socket according to any one of claims 1 to 4, wherein the heating element is elastically supported with respect to the pin block. [Claim 6] The IC inspection socket according to any one of claims 1 to 5, wherein the floating plate has a projection that contacts the pin block. [Claim 7] The IC inspection socket according to claim 6, wherein the length of the projection is longer than the thickness of the heating element.

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