Manufacturing method of laminates
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- DOW TORAY CO LTD
- Filing Date
- 2021-12-14
- Publication Date
- 2026-06-23
Smart Images

Figure 0007878851000002 
Figure 0007878851000001
Abstract
Claims
1. The composition as a whole has hot-melt properties, a melt viscosity at 100°C (measured by a flow tester: nozzle diameter 1 mm, pressure 2.5 MPa) of 50 Pa·s or less, and is a curable silicone composition that hardens upon irradiation with high-energy rays, wherein the curable silicone composition is (A) 100 parts by mass of an organopolysiloxane resin that is solid at 25°C and contains the components (A1) and (A2) listed below in a mass ratio of 20:80 to 90:10, with each component not having hot-melt properties on its own. (A1) An organopolysiloxane resin having a curing-reactive functional group containing a carbon-carbon double bond within the molecule, and containing at least 20 mol% or more of siloxane units represented by SiO₄ / 2 of the total siloxane units, (A2) An organopolysiloxane resin that does not have a curing-reactive functional group containing a carbon-carbon double bond in the molecule, and contains at least 20 mol% or more of siloxane units represented by SiO₄ / 2 of the total siloxane units. (B) 10 to 100 parts by mass of a linear organopolysiloxane that is liquid at 25°C and has a curing-reactive functional group containing at least two carbon-carbon double bonds within the molecule. (C) An organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule, in an amount such that the number of hydrogen atoms bonded to silicon atoms per alkenyl group bonded to silicon atoms in the entire composition is 0.5 to 20.
0. (D) A catalyst for hydrosilylation reactions that does not show activity without irradiation with high-energy rays, but shows activity in the composition upon irradiation with high-energy rays, the amount of catalyst, and (E) Curing retarder with a boiling point of 200°C or higher under atmospheric pressure A composition containing, A method for manufacturing a laminate, characterized by comprising the step of dispensing a laminate, in the form of a dispenser cartridge, pail, or drum, onto part or all of the surface of at least one substrate.
2. The method for producing a laminate according to claim 1, wherein the laminate has an uncured curable silicone composition on part or all of the surface of the substrate.
3. The method for manufacturing a laminate according to claim 1, wherein the laminate has a cured product obtained by curing a curable silicone composition on part or all of the surface of the substrate.
4. The method for manufacturing a laminate according to claim 1, comprising a layer made of a curable silicone composition or a cured product layer obtained by curing the curable silicone composition between two or more substrates.
5. A method for manufacturing a laminate according to any one of claims 1 to 4, wherein the laminate is one or more selected from electronic components, semiconductor devices, or optoelectronic devices, or precursors thereof.
6. Step (1): A step of heating a curable silicone composition in the form of a dispenser cartridge, pail, or drum to 50°C or higher to give it fluidity, and Step (2): Dispensing the curable silicone composition from step (1) onto part or all of the surface of at least one substrate using a dispenser. A method for manufacturing a laminate according to any one of claims 1 to 5, including the method described in any one of claims 1 to 5.
7. Step (1): A step of heating a curable silicone composition, in the form of a dispenser cartridge, pail, or drum, to 50°C or higher to give it fluidity. Step (2): Dispensing the curable silicone composition from step (1) onto part or all of the surface of at least one substrate using a dispenser. Step (3): Simultaneously with or after step (2), a step of irradiating the curable silicone composition dispensed from the dispenser with high-energy rays, and Step (4): A step of curing the curable silicone composition simultaneously with or after step (3). A method for manufacturing a laminate according to any one of claims 1, 3 to 5, comprising having
8. The method for manufacturing a laminate according to claim 6 or 7, wherein step 1 is a step of heating a curable silicone composition, in the form of being filled into a dispensing cartridge, pail, or drum, to 50°C or higher using a dispenser equipped with a heating unit to give it fluidity.
9. The method for manufacturing a laminate according to claim 6 or 7, wherein the outlet of the dispenser in step 2 described above is connected to a slot die heated to 50°C or higher, and the laminate is extruded in the form of a film or sheet, coating the substrate with a predetermined thickness.
10. The irradiation of high-energy rays in step (3) above is a step of irradiating the curable silicone composition with high-energy rays directly or through another substrate, and Step (5): A step performed after step (2) and before step (4) to adhere another substrate to the curable silicone composition dispensed from the dispenser. A method for manufacturing a laminate according to claim 7, comprising having the characteristics described above.
11. The method for manufacturing a laminate according to claim 10, wherein step (5) above is a step of applying external force to adhere another substrate to the curable silicone composition that has been dispensed from a dispenser onto a substrate in step (2) and is in an uncured state or a semi-cured state in which the curing reaction is in progress, and is a step that involves a change in the shape of the dispensed curable silicone composition.