Film-forming composition and method for manufacturing semiconductor substrate

A film-forming composition with aromatic compounds and solvents forms a capping film to address surface roughness issues during annealing, enhancing the quality of semiconductor substrates for future high-performance devices.

JP7881997B2Active Publication Date: 2026-06-30JSR CORPORATION

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
JSR CORPORATION
Filing Date
2022-06-07
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing semiconductor manufacturing processes face challenges in suppressing surface roughness during high-temperature annealing, which affects the reliability and performance of semiconductor devices, particularly for wide-bandgap materials like silicon carbide and gallium nitride.

Method used

A film-forming composition containing compounds with aromatic rings and specific solvents is used to create a capping film during the annealing process, ensuring high flatness and quality of the semiconductor substrate surface.

Benefits of technology

The composition enables the formation of a capping film that imparts high flatness to the substrate surface during high-temperature annealing, resulting in high-quality semiconductor substrates suitable for advanced semiconductor devices.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007881997000001
    Figure 0007881997000001
  • Figure 0007881997000002
    Figure 0007881997000002
  • Figure 0007881997000003
    Figure 0007881997000003
Patent Text Reader

Abstract

To provide a film-forming composition capable of forming a capping film that can impart high flatness to a substrate surface during high-temperature annealing, and a method of manufacturing a semiconductor substrate using the same.SOLUTION: A film-forming composition for forming a capping film in an annealing process after an ion implantation process into a substrate in the manufacture of a semiconductor substrate includes a compound having an aromatic ring and a solvent, and the compound having an aromatic ring is a polymer having an aromatic ring in the main chain, an aromatic ring-containing compound having a molecular weight of 600 or more and 3000 or less, or a combination thereof.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art