Electronic component and electronic module
JPWO2024014149A5Pending Publication Date: 2025-03-25
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Patent Information
- Application Number
- JP2024533551
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Filing Date
- 2024-11-05
- Publication Date
- 2025-03-25
AI Technical Summary
Technical Problem
Existing electronic components and modules face reliability issues due to inadequate bonding wire adhesion, particularly during bonding wire bonding, leading to potential peeling and reduced contact area.
Method used
The electronic component design includes a second upper electrode with unevenness formed by a second intermediate electrode on a second lower electrode, which increases frictional force and contact area for bonding wires, preventing peeling and enhancing adhesion.
Benefits of technology
This configuration improves the reliability of electronic components by ensuring strong bonding wire adhesion and preventing peeling during bonding, thereby enhancing the overall performance and durability of the components.
✦ Generated by Eureka AI based on patent content.
Abstract
An electronic component (1) includes: a lower electrode (51); intermediate electrodes (52) disposed on the lower electrode so as to form projections and recesses together with the lower electrode; and an upper electrode (53) having raised sections (57) formed at portions covering the intermediate electrodes and recessed sections (58) recessed toward the lower electrode with respect to the raised sections and formed at portions covering the lower electrode.
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