Metal material, composition, electroconductive joining material, device, and method for producing conductive joining material
JPWO2025069729A1Pending Publication Date: 2025-04-03
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Patent Information
- Application Number
- JP2025548561
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Priority Date
- 2023-09-27
- Filing Date
- 2024-08-08
- Publication Date
- 2025-04-03
AI Technical Summary
Technical Problem
Existing copper bonding pastes used for semiconductor chips to substrates exhibit insufficient bonding strength.
Method used
A metal material with a core material and convex portions, specifically metal wire portions having an arithmetic mean diameter of 10 to 200 nm and an arithmetic mean length of 0.3 to 300 μm, is used to form a conductive bonding material, ensuring a minimum of five such protrusions per core material.
Benefits of technology
The solution results in a conductive bonding material with enhanced bonding strength, electrical conductivity, and heat dissipation properties.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention addresses the problem of providing a metal material capable of forming an electroconductive joining material having high joining strength, a composition, an electroconductive joining material, a device, and a method for producing the electroconductive joining material. This metal material has a core material and protrusions present on at least a portion of the surface of the core material, wherein the arithmetic mean diameter of the metal material in a minimum enclosing sphere is 300 nm to 650 μm, the protrusions are metal wire parts having an arithmetic mean diameter of 10-200 nm and an arithmetic mean length of 0.3-300 μm, and the metal material has five or more metal wire parts per core material.
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