Liquid composition and electronic component
JPWO2025164748A1Pending Publication Date: 2025-08-07
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Patent Information
- Application Number
- JP2025574009
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Priority Date
- 2024-02-02
- Filing Date
- 2025-01-31
- Publication Date
- 2025-08-07
AI Technical Summary
Technical Problem
Existing metal ink compositions for circuit wiring suffer from issues such as insufficient film thickness, sagging, and poor dispersion stability due to low viscosity, leading to problems like fibrous foreign matter and clogging of printing devices.
Method used
A liquid composition comprising metal fine particles, a dispersion medium, and cellulose with alkyloxyhydroxypropyl groups, which enhances solubility, dispersion stability, and shape retention, preventing aggregation and fibrous foreign matter.
Benefits of technology
The composition achieves excellent solubility and stability, resulting in improved shape retention and wiring resistance, suitable for use as an ink for dispense application and forming high-quality electronic components.
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Abstract
[Problem] To provide a liquid composition excellent in thickener solubility and metal particle dispersion stability, in addition to being excellent in shape retention during wiring formation. [Solution] This liquid composition is characterized by containing metal particles, a dispersion medium, and cellulose having an alkyloxyhydroxypropyl group.
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