Micro-led and micro-led chip

By using an atomic layer deposition layer and platinum-titanium stacks to block metal diffusion and oxidation in micro LEDs, the reflectivity and reliability of reflective mirror layers are maintained, addressing issues in existing micro LED technologies.

TW202633214APending Publication Date: 2026-08-01JADE BIRD DISPLAY (SHANGHAI) LTD
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Patent Information

Application Number
TW115102966
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-26
Filing Date
2026-01-26
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Micro light-emitting diodes (LEDs) face issues with metal diffusion and oxidation in reflective mirror layers, which affect reflectivity and can cause short circuits, particularly with silver-based reflective materials.

Method used

Incorporating an atomic layer deposition layer on the reflector layer facing the light-emitting mesa to block metal diffusion, combined with alternating stacks of platinum and titanium layers as barrier layers to prevent oxidation and diffusion, and optimizing the epitaxial layer structure to increase surface area and thickness.

Benefits of technology

The solution effectively suppresses metal diffusion and oxidation, maintaining reflectivity and preventing short circuits, thereby enhancing the performance and efficiency of micro LEDs.

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Abstract

The present disclosure provides a micro-LED, including: a light-emitting mesa configured to emit light; and a reflective mirror layer configured to reflect light from the light-emitting mesa, wherein a side of the reflective mirror layer facing the light-emitting mesa has an atomic layer deposition layer, and the atomic layer deposition layer is configured to block metal diffusion in the reflective mirror layer. Through the present disclosure, metal diffusion and oxidation in the reflective mirror layer can be effectively suppressed.
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