Substrate treatment method and substrate treatment device
By continuously spraying water on the surface of the substrate and using the staggered moving nozzle technology, the problem of incomplete liquid film coverage in the single-piece wet cleaning/etching process is solved, and the complete liquid film coverage and defect control of the substrate surface is achieved.
WO2025055566A1 Publication Date: 2025-03-20ACM RES (SHANGHAI) INC
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Patent Information
- Application Number
- PCT/CN2024/107314
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-15
- Filing Date
- 2024-07-24
- Publication Date
- 2025-03-20
AI Technical Summary
Technical Problem
In the existing single-piece wet cleaning/etching process, the liquid film of the chemical liquid is incomplete, resulting in defects such as water marks on the surface of the substrate.
Method used
Using a substrate processing method and device, by continuously spraying water on the substrate surface and moving intertwined between the center and edge regions of the substrate using two nozzles, the substrate surface is ensured to be always covered with a water film.
Benefits of technology
The integrity of the liquid film covering on the surface of the substrate is achieved, the risk of water marks formed by exposure of bare silicon in the cavity is avoided, and the defect control ability in the substrate manufacturing process is improved.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention provides a substrate treatment method, comprising the following steps: a substrate keeps rotating; a first nozzle continuously sprays water from above the central area of the substrate; in the substrate cleaning process, the first nozzle starts to move from a first central position in the central area of the substrate to a first edge position in an edge area of the substrate, and a second nozzle starts to spray a chemical solution to the rotating substrate and move from a second edge position in the edge area of the substrate to a second central position in the central area; the first nozzle and the second nozzle move back and forth in a staggered manner between the central area and the edge area of the substrate, until the cleaning of the substrate has been completed; and upon the completion of the cleaning of the substrate, the second nozzle stops spraying the chemical solution, and the first nozzle continues to keep spraying water and returns to the central area of the substrate. According to the substrate treatment method and the substrate treatment device of the present invention, water is continuously sprayed in the substrate treatment process, ensuring the integrity of liquid film covering the surface of the substrate, and avoiding the risk of formation of water marks caused by the exposure of bare silicon in a chamber.
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