Solder jetting head capable of reducing solder paste accumulation, and related dispensing systems and methods
By configuring the solder jetting head with a sharp-edge contact between the tappet and nozzle portions, the issue of solder paste accumulation is addressed, resulting in reduced maintenance needs and lower production costs.
WO2025060913A1 Publication Date: 2025-03-27KULICKE & SOFFA HI TECH CO LTD
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Patent Information
- Application Number
- PCT/CN2024/117679
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-19
- Filing Date
- 2024-09-09
- Publication Date
- 2025-03-27
AI Technical Summary
Technical Problem
Conventional solder jetting heads experience solder paste accumulation due to the deformation and adhesion of solder particles between the tappet and nozzle portions, leading to interference with the exiting solder paste and increased production costs.
Method used
The solder jetting head is designed with a tappet and nozzle configuration that forms a sharp-edge contact, minimizing the contact area and reducing the likelihood of solder particle deformation and accumulation.
Benefits of technology
This configuration reduces the frequency of replacing or cleaning the solder jetting head, thereby decreasing production time and costs while maintaining stable solder paste deposition.
✦ Generated by Eureka AI based on patent content.
Abstract
A solder jetting head for depositing a solder paste onto a target surface is provided. The solder jetting head comprising: a tappet portion driven to provide a striking force; and a nozzle portion for forming an enclosing contact with the tappet portion, so as to force the solder paste to exit from a nozzle opening of the nozzle portion, wherein the nozzle portion and the tappet portion are configured to have a sharp-edge contact with each other when forming the enclosing contact.
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