Copper-based metal powder
WO2025062650A1 Publication Date: 2025-03-27FUKUDA METAL FOIL & POWDER CO LTD
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Patent Information
- Application Number
- PCT/JP2023/034568
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-22
- Publication Date
- 2025-03-27
Abstract
[Problem] To provide a copper-based metal powder that can be suitably used for a conductive material, wherein a conductive paste containing the copper-based metal powder has excellent applicability as it is difficult for particles of the copper-based metal powder to agglomerate or break during application, and a baked coating film exhibiting excellent conductivity can be produced when baked at a low temperature. [Solution] The copper-based metal powder has an average particle size of 10 μm or less and a Rattler Value of 90% or more.
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