Sealing resin for use in compression molding and method and device for forming sealing resin

WO2025062950A1 Publication Date: 2025-03-27APIC YAMADA CORP
4 Cites 0 Cited by

Patent Information

Application Number
PCT/JP2024/030170
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-22
Filing Date
2024-08-26
Publication Date
2025-03-27
Patent Text Reader

Abstract

The present invention addresses the problem of providing: a sealing resin capable of realizing a compression molding device and a compression molding method that can prevent the occurrence of molding defects caused by uneven winding, residual gas, or dust generation during molding and that can prevent formation of thin burrs of the sealing resin in an exposed part of a molded product, and capable of facilitating handleability before resin sealing; and a method and a device for forming said sealing resin. As a solution therefor, a device (1) for forming a sealing resin (R) according to the present invention forms a sealing resin (R) for use in compression-molding a workpiece (W), and comprises a tableting mold (102) that has an upper mold (104) and a lower mold (106) to accommodate a base resin (Rm) and that executes tableting so as to form a lattice-shaped sealing resin (R) having through-holes (Rh).
Need to check novelty before this filing date? Find Prior Art