Composition and kit, and method for removing resist and method for manufacturing electronic substrate each using these

Abstract

The present invention provides a composition and the like capable of suppressing oxidation of copper wiring after resist removal.　This composition contains a basic compound, and a copper surface protective agent that contains at least one substance which is selected from the group consisting of an ammonium salt represented by formula (1), a heteroaryl salt that has a substituted or unsubstituted alkyl group having 5 to 30 carbon atoms, and a substituted or unsubstituted thiol having 5 to 30 carbon atoms. The composition has a pH of 13 or more.　In formula (1), R1 represents a substituted or unsubstituted alkyl group having 5 to 30 carbon atoms, a substituted or unsubstituted alkyl (poly)heteroalkylene group having 5 to 30 carbon atoms, or a substituted or unsubstituted aryl (poly)heteroalkylene group having 7 to 30 carbon atoms; each R2 independently represents a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms or a substituted or unsubstituted aryl group having 6 to 30 carbon atoms; and X represents a halide ion, a hydroxide ion, an organic sulfonate ion, a tetrafluoroborate anion, or a hexafluorophosphate anion.