Coil assembly

WO2025063762A1 Publication Date: 2025-03-27LG ELECTRONICS INC
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Patent Information

Application Number
PCT/KR2024/014234
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-09-13
Filing Date
2024-09-20
Publication Date
2025-03-27
Patent Text Reader

Abstract

A coil assembly is disclosed. The coil assembly comprises a plurality of heating portions disposed on a substrate. The plurality of heating portions are formed in a rotating pattern and electrically connected to each other through at least two layers. The pattern of the plurality of heating portions forms a plurality of spirals in one layer, inter-spiral regions are formed between the plurality of spirals, and at least one sensing coil is disposed in the inter-spiral regions of the other layer. Accordingly, a space for a plurality of sensing coils and a temperature sensor may be ensured.
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