Plasma source with multiple extraction apertures
The plasma source with multiple non-co-planar extraction apertures addresses the inefficiencies of existing systems by enabling symmetric 3D feature processing in a single pass, achieving high angles and flux.
WO2025064053A1 Publication Date: 2025-03-27APPLIED MATERIALS INC
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Patent Information
- Application Number
- PCT/US2024/039571
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-19
- Filing Date
- 2024-07-25
- Publication Date
- 2025-03-27
AI Technical Summary
Technical Problem
Existing plasma sources for semiconductor processing often require multiple scanning passes and rotations to symmetrically process 3D features, which is time-consuming and inefficient, and struggle to achieve high angles with small angle distribution and high flux.
Method used
A plasma source with multiple extraction apertures, where the apertures are not co-planar, allowing a workpiece to be scanned and processed from two different directions simultaneously, thereby enabling symmetric processing of 3D features during a single pass.
Benefits of technology
This configuration allows for efficient symmetric processing of 3D features in a single scan pass, achieving high angles with small angle distribution and high flux, thereby improving processing throughput and efficiency.
✦ Generated by Eureka AI based on patent content.
Abstract
A plasma source having two extraction apertures is disclosed. The extraction apertures are not co-planar, allowing a scanned workpiece to be impacted by particles or ions from two different directions during a single scan pass. The chamber housing of the plasma source may be cylindrical or may have a polygonal cross-section. In some embodiments, external plates are mounted to the chamber housing to provide defining apertures which serve to further collimate the particles or ions that exit each extraction aperture. Various different plasma generators may be utilized with this plasma source, including internal antenna elements, external coils, cathodes, filaments and other mechanisms.
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