Heat dissipation assembly

By designing multi-substrate structure heat dissipation components in electronic devices, efficient heat dissipation and sealing performance in small spaces is achieved using the through-hole structure and sealing cover, and the problem of insufficient heat dissipation performance in electronic devices is solved.

WO2025066212A1 Publication Date: 2025-04-03ZTE CORP
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Patent Information

Application Number
PCT/CN2024/095500
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-27
Filing Date
2024-05-27
Publication Date
2025-04-03

AI Technical Summary

Technical Problem

Under the requirements of small space and high sealing packaging of electronic devices, how to achieve better heat dissipation performance is a difficult problem.

Method used

A heat dissipation assembly is designed, adopting a multi-substrate structure, including a heat dissipation substrate and a through-hole structure. The through-hole structure consists of a hole column, a first sealing cover and a second sealing cover. The connector connects the first and second substrates through the hole column, and the sealing cover ensures the sealing of the connection area.

Benefits of technology

Efficient heat dissipation and sealing performance are achieved in a small space, avoiding sealing problems caused by poor contact between the pole and the substrate, and meeting the packaging requirements of electronic equipment.

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Abstract

Provided in the present application is a heat dissipation assembly, which is applied to an electronic device, the electronic device comprising a first substrate and a second substrate arranged opposite to the first substrate, and first components on the first substrate being connected to second components of the second substrate by means of connectors. The heat dissipation assembly comprises a heat dissipation substrate and through hole structures. The heat dissipation substrate is in contact with the first substrate, is used for dissipating heat of the first substrate and is provided with through holes corresponding to the connectors. Each through hole structure comprises a hole pillar corresponding to a through hole, a first sealing cover extending from one end of the hole pillar and a second sealing cover extending from the other end of the hole pillar, the connectors being connected to the first components and the second components by means of the through holes and the hole pillars. Each first sealing cover hermetically coats the connecting area of a connector and a first component, and each second sealing hermetically coats the connecting area of a connector and a second component.
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