Composition, sheet, and metal-clad laminate

The combination of fluororesin, silica, and modified organosiloxane in the composition addresses the issue of water and moisture absorption in high-frequency printed wiring boards, enhancing stability and reducing dielectric tangent, making it suitable for high-frequency applications.

WO2025070380A1 Publication Date: 2025-04-03DAIKIN INDUSTRIES LTD
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Patent Information

Application Number
PCT/JP2024/033908
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-25
Filing Date
2024-09-24
Publication Date
2025-04-03

AI Technical Summary

Technical Problem

Existing compositions for high-frequency printed wiring boards using fluororesin with inorganic particles suffer from poor appearance and increased dielectric tangent due to water and moisture absorption, leading to changes in properties and performance.

Method used

A composition comprising fluororesin, inorganic particles, and organosiloxane is used, where the inorganic particles are preferably silica with a dielectric loss tangent of 0.0025 or less, and the organosiloxane is modified with specific organic groups to suppress water and moisture absorption, thereby reducing dielectric tangent increases.

Benefits of technology

The composition effectively suppresses water and moisture absorption, maintaining low dielectric tangent and improving the appearance and stability of sheets and laminates, suitable for high-frequency applications.

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Abstract

The present disclosure provides: a composition that inhibits water absorption and moisture absorption, especially a composition for obtaining a sheet which is inhibited from suffering an increase in dielectric loss tangent due to moisture absorption; and a sheet and a metal-clad laminate each obtained using the composition. The composition comprises a fluororesin, inorganic particles, and an organosiloxane. The sheet and the metal-clad laminate are each obtained using the composition.
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